JP2001308277A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a time required to inspect insulation of terminal pads only by completing one procedure for checking the insulation between terminal pads. SOLUTION: Internal circuits 10, 20, 30, 40 that can make each external connection-use terminal a high impedance condition are provided and the terminal pads 11, 21, 31, 41 that are aligned and arranged by connecting to the external connection-use terminals of the internal circuits 10, 20, 30, 40 are provided. In addition, besides the terminal pads 11, 21, 31, 41, the terminal pads 1, 2 for inspection are provided, switching circuits 10, 30 wherein one ends are connected to the terminal pad 1 for inspection and the other ends are connected to the terminal pads 11, 31 are provided, and the switching circuits 20, 40 that one ends are connected to the terminal pad 2 for inspection and the other ends are connected to the terminal pads 21, 41 are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a large number of external terminals, such as a liquid crystal driver integrated circuit.

[0002]

2. Description of the Related Art FIG. 3 is a schematic diagram showing a configuration of a conventional semiconductor device. 3, reference numeral 11 denotes a terminal pad of the semiconductor device, 10 denotes an internal circuit in which the external connection terminal 13 is connected to the terminal pad 11, 21 denotes a terminal pad of another node adjacent to the terminal pad 11, and 20 denotes a terminal pad 21. An internal circuit to which the external connection terminal 23 is connected; 31 is a terminal pad of a semiconductor device of another node adjacent to the terminal pad 21;
0 is an internal circuit in which the external connection terminal 33 is connected to the terminal pad 31, 41 is a terminal pad of another node adjacent to the terminal pad 31, 40 is an external connection terminal 4
Reference numeral 3 denotes a connected internal circuit.

[0005] Reference numeral 3 denotes a control signal line connected to every other internal circuit 10, 30, and reference numeral 4 denotes a control signal line connected to every other internal circuit 20, 40 which is different from the above.

Hereinafter, the same configuration as described above is repeatedly arranged. FIG. 3 shows the same configuration repeated twice. The same applies to FIGS. 1 and 2 described below.

The operation and inspection procedure of the semiconductor device configured as described above will be described below.

In the above-described semiconductor device, the first state is obtained when the control signals on the control signal lines 3 and 4 are set to specific logic states, for example, "H". At this time, the internal circuits 10 and 30 are in a state of transmitting an internal potential or a signal from the external connection terminals 13 and 33 to the terminal pads 11 and 31, respectively, and the internal circuits 20 and 40 are similarly transmitted from the external connection terminals 23 and 43. The internal potential or signal is transmitted to the terminal pads 21 and 41.

Next, the second state is the control signal lines 3 and 4
Each of the above control signals has a logic state opposite to the first state,
For example, it is obtained when "L" is set. At this time, the internal circuits 10 and 30 enter a high output impedance state in which internal potentials or signals are not transmitted from the external connection terminals 13 and 33 to the terminal pads 11 and 31, respectively.
0 and 40 are the terminal pads 2 from the external connection terminals 23 and 43.
1 and 41 are in a high output impedance state in which no internal potential or signal is transmitted.

Accordingly, in the second state, the terminal pads 11, 21, 31, and 41 are all in a high impedance state, and directly from the outside, the terminal pads 11, 21, 31,.
A potential or signal can be given to 41. That is, even if a potential or a signal is directly applied to the terminal pads 11, 21, 31, and 41, the potential or the signal does not affect the internal circuits 10, 20, 30, and 40.

Next, terminal pads 11, 21, 31, 4
An inspection procedure for confirming insulation between adjacent ones will be described. First, by setting both the control signals 3 and 4 to "L", for example, the terminal pads 11 and 21 are both set to a high impedance state. Next, a ground potential is applied to the terminal pad 21 from the inspection device (not shown) side, and a power supply and an ammeter that provide a potential different from the ground potential are connected in series to the terminal pad 11. Measure the current value based on this. A current is detected when the terminal pads 11 and 21 are not insulated.

Next, instead of the terminals 11 and 21, a ground potential is applied to the terminal pad 31 from an inspection device (not shown), and a power supply and an ammeter for applying a potential different from the ground potential to the terminal pad 21 are provided. They are connected in series, and the current value is measured based on the ammeter in this state. A current is detected when the terminal pads 21 and 31 are not insulated.

Next, instead of the terminals 21 and 31, a ground potential is applied to the terminal pad 41 from an inspection device (not shown) side, and a power supply and an ammeter for applying a potential different from the ground potential to the terminal pad 31 are provided. They are connected in series, and the current value is measured based on the ammeter in this state. A current is detected when the terminal pads 31 and 41 are not insulated.

When there are N terminal pads, the above procedure is repeated N-1 times, thereby completing the inspection of insulation between adjacent two terminals in all terminal pads.

[0013]

In the above-described conventional configuration, a terminal pad for applying a ground potential for performing an insulation test between two adjacent terminal pads and a potential different from the ground potential are applied. Since it is necessary to switch the terminal pad for measuring the current value by connecting the power supply and the ammeter in series for each measurement, the same procedure is performed when there are N terminal pads. There is a problem that the time required for the inspection increases in proportion to the number of terminal pads.

An object of the present invention is to solve the above-mentioned conventional problems, and the procedure for inspecting the insulation between the terminal pads is completed only once, and the time required for the insulation inspection of the terminal pads can be reduced. It is to provide a semiconductor device.

[0015]

In order to achieve this object, a semiconductor device according to a first aspect of the present invention comprises: an internal circuit group capable of setting external connection terminals to a high impedance state; A terminal pad group connected to the external connection terminals of the circuit group and aligned, a pair of inspection terminal pads provided separately from the terminal pad group, and one end connected to one of the pair of inspection terminal pads. A first switch circuit group having the other end connected to every other terminal pad in the terminal pad group, and a first switch circuit having one end connected to the other of the pair of inspection terminal pads. A second switch circuit group having the other end connected to every other terminal pad other than the terminal pad connected to the circuit group.

According to this configuration, each of the external connection terminals of the internal circuit group is set to a high impedance state, the first and second switch circuit groups are set to a conductive state, and one of the pair of inspection terminal pads is grounded. On the other hand, by connecting a power supply different from the ground potential and an ammeter in series, if at least one of two adjacent terminal pads of the terminal pad group is electrically connected, the ammeter measures the current. Will be detected. That is, the procedure of inspecting the insulation between all two adjacent terminal pads in the terminal pad group is completed only once, and as a result, the time required for the insulation inspection of the terminal pads is reduced. Can be.

According to a second aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein the pair of inspection terminal pads is also used as the pair of power supply terminal pads.

According to this configuration, since the pair of inspection terminal pads is also used as the pair of power supply terminal pads, there is no need to separately provide a pair of inspection terminal pads for insulation inspection, and the number of terminal pads in the semiconductor device is reduced. Can be reduced by at least two. In addition, the leakage current between the pair of power supply terminal pads and the insulation between the terminal pads can be inspected together.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic diagram showing a configuration of a semiconductor device according to an embodiment of the present invention. 1, reference numeral 11 denotes a terminal pad of a semiconductor device, 10 denotes an internal circuit in which an external connection terminal 13 is connected to the terminal pad 11, and 21 denotes a terminal pad.
1, a terminal pad of another node adjacent to 1; 20, an internal circuit in which a terminal pad 21 is connected to an external connection terminal 23;
Is a terminal pad of a semiconductor device of another node adjacent to the terminal pad 21;
Is an internal circuit connected to the terminal pad 31, a terminal pad of another node adjacent to the terminal pad 31, and 40 is an internal circuit in which the terminal pad 41 is connected to an external connection terminal 43.

Reference numeral 3 denotes a control signal line connected to every other internal circuit 10, 30, and reference numeral 4 denotes a control signal line connected to every other internal circuit 20, 40 different from the above. These have the same configuration as the conventional example.

Reference numeral 1 denotes a terminal pad for inspection of a semiconductor device provided separately from the terminal pads 11, 21, 31, and 41. Reference numeral 2 denotes a terminal pad 1 for inspection and terminal pads 11, 21, and 3.
Inspection terminal pads of the semiconductor device provided separately from 1 and 41. A switch circuit 12 has one end connected to the inspection terminal pad 1 and the other end connected to the terminal pad 11.
2 is a switch circuit having one end connected to the test terminal pad 2 and the other end connected to the terminal pad 21; 32 is a switch circuit having one end connected to the test terminal pad 1 and the other end connected to the terminal pad 31; 42 is an inspection terminal pad 2 at one end.
And the other end is connected to the terminal pad 41.

Here, the internal circuits 10, 20, 30, 40
Constitute an internal circuit group capable of setting each of the external connection terminals to a high impedance state. Terminal pads 11, 2
1, 31, and 41 are connected to the external connection terminals of the internal circuit group to constitute a group of terminal pads arranged and arranged. The switch circuits 10 and 30 constitute a first switch circuit group in which one end is connected to one of a pair of inspection terminal pads and the other end is connected to every other terminal pad in the terminal pad group.
The switches 20 and 40 have one end connected to the other of the pair of inspection terminal pads, and the other end connected to every other terminal pad of the terminal pad group other than the terminal pad connected to the first switch circuit group. To form a second switch circuit group.

Hereinafter, the same configuration as described above is repeatedly arranged.

The operation and inspection procedure of the semiconductor device having the above-described configuration will be described below.

In the above-mentioned semiconductor device, the first state is that the control signals on the control signal lines 3 and 4 are set to specific logical states, for example, "H", respectively, and the switch circuits 12 and 2
It is obtained when all 2, 32, and 42 are in the cutoff state. At this time, the internal circuits 10 and 30 are connected to the external connection terminal 1.
3 and 33 to the terminal pads 11 and 31 to transmit internal potentials or signals, respectively.
0 and 40 are the terminal pads 2 from the external connection terminals 23 and 42.
1 and 41 are transmitted to the internal potential or signal.

At this time, since the switch circuits 12 and 32 are in the cutoff state, no potential or signal is transmitted from the terminal pad 1 to the terminal pads 11 and 31.
Similarly, since the switch circuits 22 and 42 are in the cut-off state, the terminal pads 2 and 4
No potential or signal is transmitted to 1.

Next, the second state is the control signal lines 3 and 4
Each of the above control signals has a logic state opposite to the first state,
For example, it is set to "L" and the switch circuits 12, 22, 3
It is obtained when all the switches 2, 42 are in the cutoff state. At this time, the internal circuits 10, 30 are connected to the external connection terminals 13, 33.
From the terminal pads 11 and 31 to a high output impedance state in which no internal potential or signal is transmitted, respectively.
The internal circuits 20 and 40 enter a high output impedance state in which no internal potential or signal is transmitted from the external connection terminals 23 and 43 to the terminal pads 21 and 41, respectively.

At this time, since the switch circuits 12 and 32 are in the cut-off state, no potential or signal is transmitted from the terminal pad 1 to the terminal pads 11 and 31.
Similarly, since the switch circuits 22 and 42 are in the cut-off state, the terminal pads 2 and 4
No potential or signal is transmitted to 1.

Therefore, in the second state, the terminal pads 11, 21, 31, and 41 are all in a high impedance state, so that the terminal pads 11, 21, 31, and
A potential or signal can be given to 41. That is, even if a potential or a signal is directly applied to the terminal pads 11, 21, 31, and 41, the potential or the signal does not affect the internal circuits 10, 20, 30, and 40.

Next, the third state is the control signal lines 3 and 4
Each of the above control signals has a logic state opposite to the first state,
For example, it is set to "L" and the switch circuits 12, 22, 3
It is obtained when all of the elements 2, 42 are made conductive. At this time, the terminal pad 1 is in a state of conduction with the terminal pads 11 and 31, the terminal pad 2 is in a state of conduction with the terminal pads 21 and 41, and the terminal pad 1 is externally inspected for insulation between the terminal pads. , 2 can be given a potential.

Next, the terminal pads 11, 21, 31, 4
An inspection procedure for confirming insulation between adjacent ones will be described. First, both the control signals 3 and 4 are set to “L”, for example, and the switch circuits 12, 22, 3
The third state is established by bringing all of the elements 2 and 42 into conduction.

Next, a ground potential is applied to, for example, the terminal pad 1 from an inspection apparatus (not shown) side, and a power supply and an ammeter for providing a potential different from the ground potential are connected in series to the terminal pad 2 so that the current value is Is measured. Thus, insulation between two adjacent terminal pads among all the terminal pads 11, 21, 31, and 41 can be confirmed by one measurement. If there is a terminal pad that is not insulated, current is detected.

As described above, according to the present embodiment, even in a configuration in which the configuration of FIG. 1 is repeated, all the terminal pads 11, 21, 31, 41 in the inspection procedure described above.
The procedure for inspecting the insulation between them is completed only once, and there is no increase in inspection time due to an increase in the number of terminal pads.

That is, the internal circuits 10, 20, 30, 4
0 each of the external connection terminals 13, 23, 33, 43 is set to a high impedance state, and the switch circuits 12, 2
2, 32, and 42 are made conductive, the inspection terminal pad 1 is grounded, and a power supply having a different ground potential and an ammeter are connected in series to the inspection terminal pad 2 so that the terminal pad 1 is electrically connected.
If at least one of the two terminal pads adjacent to one of the terminals 1, 21, 31, and 41 is conductive, a current is detected by the ammeter. That is, the terminal pads 11, 21, 3
The procedure for inspecting the insulation between all two adjacent terminal pads out of all the terminal pads 1, 41 is completed only once, and as a result, the insulation inspection of the terminal pads 11, 21, 31, 41 is required. Time can be reduced.

As shown in FIG. 2, the terminal pad 3 and the terminal pad 4 may be commonly used as a power terminal and a ground terminal, respectively (other embodiments). In this case, the number of terminal pads provided for inspection can be reduced by at least two, and the leakage current between the power supply terminals and the insulation between the terminals can be inspected at once.

[0037]

As described above, according to the semiconductor device of the first aspect of the present invention, each external connection terminal of the internal circuit group is set to a high impedance state, and the first and second switch circuit groups are set. To a conductive state, one of the pair of inspection terminal pads is grounded, and the other is connected in series to a power supply and an ammeter different from the ground potential, so that all adjacent two of the terminal pad group are connected. The procedure to inspect the insulation between terminal pads is completed only once, and as a result,
The time required for the insulation inspection of the terminal pads can be reduced.

Further, according to the semiconductor device of the present invention, since the pair of inspection terminal pads are also used as the pair of power supply terminal pads, it is not necessary to separately provide a pair of inspection terminal pads for insulation inspection. The number of terminal pads in the semiconductor device can be reduced by at least two. In addition, the leakage current between the pair of power supply terminal pads and the insulation between the terminal pads can be inspected together.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of an embodiment of a semiconductor device of the present invention.

FIG. 2 is a schematic view showing a configuration of another embodiment of the semiconductor device of the present invention.

FIG. 3 is a schematic diagram illustrating a configuration of a conventional semiconductor device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 terminal pad for inspection 2 terminal pad for inspection 3 control signal line 4 control signal line 10 internal circuit 11 terminal pad 12 switch circuit 20 internal circuit 21 terminal pad 22 switch circuit 30 internal circuit 31 terminal pad 32 switch circuit 40 internal circuit 41 terminal Pad 42 switch circuit

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AA07 AG09 AH04 2G014 AA01 AB21 AB59 2G032 AA01 AK11 AK15 5F038 BE05 BE09 DF11 DT04 DT12 EZ20 9A001 BB05 KK05 LL05

Claims (2)

[Claims] 1. An internal circuit group capable of setting an external connection terminal to a high impedance state, a terminal pad group connected to each external connection terminal of the internal circuit group and aligned, and the terminal A pair of inspection terminal pads provided separately from the pad group, one end is connected to one of the pair of inspection terminal pads,
A first switch circuit group having the other end connected to every other terminal pad of the terminal pad group, and one end connected to the other of the pair of inspection terminal pads;
And a second switch circuit group having the other end connected to every other terminal pad of the terminal pad group other than the terminal pad connected to the first switch circuit group. 2. The semiconductor device according to claim 1, wherein the pair of inspection terminal pads is also used as a pair of power supply terminal pads.