JP2001305311A - Light-shielding film for formation of black matrix and sputtering target for formation of lightshielding film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-shielding film to form a black matrix to be deposited in the process of manufacturing a color panel of a liquid crystal display or the like and to provide a sputtering target to form the light-shielding film. SOLUTION: The light-shielding film to form a black matrix and the sputtering target to form the light-shielding film have the composition containing 5 to 50% of Nb and 1 to 6% of Mo, and if necessary, one or two kinds of Cu and V by 1 to 10 % in total, and the balance Ni and inevitable impurities.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-shielding film for forming a black matrix to be laminated in a step of manufacturing a color panel such as a liquid crystal display, and a sputtering target for forming the light-shielding film.

[0002]

2. Description of the Related Art In general, a color panel used for a liquid crystal display is provided with three primary color filters of red, blue and green on a transparent plate such as a glass plate or a transparent resin plate. A black matrix is formed in a grid pattern for partitioning the color filters. This black matrix separates the color pixels of the three primary colors of the color filter to prevent mixing of the three primary colors, thereby achieving high contrast and high quality image quality. It is trying to make it. The black matrix is formed by forming a light-shielding film formed by vapor deposition or sputtering to form a resist pattern by photolithography, and forming a resist pattern using the mask as a mask to form a lattice-shaped pattern film having minute openings. The most important characteristics of the light-shielding film are that it can perform pattern etching and has corrosion resistance, and that it has a light-shielding property that can sufficiently shield unnecessary light from a light source.

[0003] Three primary color filter layers of red, blue and green are formed by offset printing or the like at the minute openings defined by the lattice pattern film of the black matrix formed as described above. A color panel is formed by forming a top coat layer on the black matrix and further forming a transparent electrode film such as ITO (indium tin oxide) on the top coat layer.

If the reflectance of the light-shielding film for forming the black matrix is high, the reflected light from the outside lowers the contrast of the displayed image, so that the transparent plate such as glass and the light-shielding film are provided to make the image more visible. Cr between
In some cases, a low reflection film made of a thin film of a compound such as O or CrN is formed. Conventionally, metal Cr or Cr
A vapor-deposited or sputtered film of a base alloy is used, and a light-shielding film made of this metal Cr or a Cr-based alloy is
It has excellent corrosion resistance and light shielding properties.

However, a light-shielding film made of metallic Cr or a Cr-based alloy generates hexavalent chromium which is harmful when a lattice-shaped putter film is formed by etching. Spills into the environment can lead to environmental problems. Therefore, in recent years, a thin film made of a Ni-based alloy containing no Ni or Cr has been used as a light-shielding film for forming a black matrix. As the thin film made of the Ni-based alloy containing no Cr, Ni: Ta: 0.5
A thin film composed of a Ni-based alloy having a composition containing about 35 wt% has been proposed (see Japanese Patent Application Laid-Open No. H11-80936).

[0006]

However, the conventional Ta:
A light-shielding film containing 0.5 to 35 wt%, the balance being composed of a Ni-based alloy consisting of Ni and unavoidable impurities, does not have sufficient light-shielding properties, and also has insufficient corrosion resistance to an ITO etching solution and cleaning solution. Did not.

[0007]

Means for Solving the Problems Accordingly, the present inventors have:
As a result of conducting research to obtain a light-shielding film for forming a black matrix having excellent corrosion resistance to an ITO etching solution and a cleaning solution and further excellent light-shielding properties, (a) containing Nb: 5 to 50%, And M
o: A light-shielding film composed of a Ni-based alloy containing 1 to 6% and the balance of Ni and unavoidable impurities is more excellent in light-shielding properties. (b) N in (a)
Research results have shown that a light-shielding film composed of a Ni-based alloy further containing 1 to 10% of one or two of Cu and VCu and V in the i-based alloy further improves corrosion resistance. It was done.

The present invention has been made on the basis of the results of such research, and (1) by mass% (hereinafter,% is mass%
), A light-shielding film for forming a black matrix containing Nb: 5 to 50% and Mo: 1 to 6%, and having the balance of Ni and unavoidable impurities,
(2) Nb: 5 to 50%, Mo: 1 to 6%, and one or two of Cu and V in total of 1 to 2
A light-shielding film for forming a black matrix having a composition of 10% and a balance of Ni and unavoidable impurities.

Further, the present invention also includes a sputtering target for forming the light shielding film. Therefore, the present invention provides (3) Nb: 5 to 50%,
Mo: a sputtering target for forming a light-shielding film for forming a black matrix having a composition of 1 to 6% and a balance of Ni and unavoidable impurities,
(4) Nb: 5 to 50%, Mo powder: 1 to 6%, one or two of Cu and V are contained in a total of 1 to 10%, and the remainder is Ni and unavoidable impurities. A sputtering target for forming a light-shielding film for forming a black matrix having a composition composed of a powder.

The reason why the composition of the light-shielding film for forming the black matrix and the sputtering target for forming the light-shielding film of the present invention is limited as described above will be described. Nb: Nb has an effect of increasing the light-shielding property and also increasing the corrosion resistance. However, if the Nb content is less than 5%, sufficient light-shielding properties and corrosion resistance cannot be obtained, which is not preferred. If the content exceeds the above range, the corrosion resistance becomes too high to form a lattice pattern by etching, which is not preferable. Therefore, the content of Nb is 5 to
It was set to 50%. A more preferred range of the Nb content is 1
8 to 42%, and an even more preferred range is 24 to 3%.
2%.

Mo: Mo has the effect of improving the corrosion resistance, further improving the light-shielding properties of the light-shielding film, and further reducing the magnetism of Ni to increase the magnetron sputtering rate. On the other hand, even if Mo exceeds 6%, no particular improvement in corrosion resistance and no reduction in magnetism can be obtained. Therefore, the Mo contained in the light-shielding film for forming the black matrix of the present invention and the sputtering target for forming the light-shielding film was set to 1 to 6%. A more preferred range of the Mo content is 1.4 to 5%, and an even more preferred range is 2.5 to 3.5%.

Cu, V: These components are added as necessary in order to improve the etching property in pattern etching, and the amount of addition is one or two of Cu and V in total less than 1%. In such a case, the desired action cannot be obtained. On the other hand, if the content exceeds 10%, the corrosion resistance decreases, which is not preferable. Therefore, one of Cu and V
Species or two were determined at a total of 1-10%.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Having the component composition shown in Table 1,
Ni-based alloy ingots having a diameter of 180 mm were prepared, and these ingots were cut into slices, and then machined to prepare disk-shaped sputtering targets having a diameter of 150 mm and a thickness of 5 mm. The target was set in a DC magnetron sputtering apparatus, and the light-shielding film 1 of the present invention having a thickness of about 110 nm was formed on the surface of a # 7059 glass substrate manufactured by Corning.
-8, comparative light-shielding films 1-4 and conventional light-shielding films 1-2, and the component compositions of the obtained light-shielding films were measured. The results are shown in Table 1.

[0014]

[Table 1]

The light-shielding films 1 to 5 of the present invention thus obtained.
8. For the comparative light-shielding films 1 to 4 and the conventional light-shielding films 1 and 2, the following transmission test and corrosion test were performed.

(A) Transmission test The intensity I of the incident light and the intensity I _{0 of the} transmitted light are measured to determine the transmittance I / I _0, and the value defined by −log (I / I ₀ ) (optical density value, This is hereinafter referred to as OD value), and the results are shown in Table 2.

(B) Corrosion test As test solutions, an aqueous solution of potassium hydroxide of 10% by mass KOH and an aqueous solution of hydrochloric acid of 10% by mass of HCl were prepared, and further, ITO containing 35% by mass of FeCl _{3 and} 5% by mass of HCl was dissolved. An aqueous solution having the same component composition as the aqueous solution used for etching (hereinafter referred to as an ITO etching solution) is prepared,
The film was immersed in these aqueous solutions for 10 minutes, and the amount of change in the thickness of the light-shielding film before and after immersion was measured. As the amount of change in the film thickness increases, the film thickness decreases due to corrosion, and an evaluation that the corrosion resistance is inferior is obtained.

[0018]

[Table 2]

[0019]

According to the results shown in Tables 1 and 2, the light-shielding films 1 to 8 of the present invention comprising a Ni-based alloy containing 5 to 50% of Nb and 1 to 6% of Mo are comparative examples. Light shielding film 1-4
Further, as compared with the conventional light-shielding films 1 and 2, the amount of change in the film thickness is small.
It has excellent corrosion resistance to the TO etching solution, and also has excellent light-shielding properties due to its high OD value. Therefore, the present invention can improve the quality of liquid crystal panels and reduce costs, and greatly contributes to the development of the display industry. What you get.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hideo Kitamura 1-5-1 Marunouchi, Chiyoda-ku, Tokyo Quality Assurance and Development Department, Non-Ferrous Materials Company, Mitsubishi Materials Corporation (72) Inventor Norifumi Kaneko Kaminichi Okegawa-shi, Saitama 1230 Deya Mitsubishi Materials Corporation Okegawa Works (72) Inventor Katsuo Sugawara 1-297 Kitabukurocho, Omiya City, Saitama Prefecture Mitsubishi Materials Corporation General Research Laboratory F-term (reference) BB24 BB42 2H091 FA02Y FA35Y FB08 LA30 4K029 AA09 AA24 BA25 BC07 BD00 CA05 DC04 DC08 DC12

Claims (4)

[Claims] (1) In% by mass (hereinafter,% indicates mass%),
b: 5 to 50%, Mo: 1 to 6%, the balance being Ni
And a light-shielding film for forming a black matrix, which has a composition comprising unavoidable impurities. 2. It contains Nb: 5 to 50% and Mo: 1 to 6%, further contains one or two of Cu and V in a total of 1 to 10%, and the remainder is Ni and inevitable. A light-shielding film for forming a black matrix, characterized by having a composition composed of impurities. 3. A light-shielding film forming sputtering for forming a black matrix, characterized in that it contains Nb: 5 to 50% and Mo: 1 to 6% and the balance has a composition of Ni and unavoidable impurities. target. 4. Nb: 5 to 50%, Mo powder: 1 to 6%
To form a black matrix, characterized in that the composition further comprises 1 to 10% of one or two of Cu and V in total and the balance is composed of Ni and unavoidable impurity powder. Sputtering target for forming a light-shielding film.