JP2001302743A - Resin composition, solder-resist resin composition and their curing materials - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition suitable for a colder-resist and an insulation layer between layers in a flexible printed circuit board, which is excellent in flexibility of a curing material and resistances to soldering heat, thermal deterioration, and nonelectrolytic gold plating, and can be developed in an organic solvent or a diluted alkaline solution. SOLUTION: The resin composition contains; a specific carboxyl group- containing oligomer (A); at least one dihydrobenzooxazine ring-containing compound (B); a diluent (C); and a photopolymerization initiator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a resin composition containing a specific carboxyl group-containing oligomer (A) and a specific dihydrobenzoxazine ring-containing compound (B), and useful as a resin composition for printed wiring boards. It relates to the cured product. More specifically, it is useful as a solder resist for a flexible printed wiring board, a plating resist, and an interlayer electrical insulating material for a multilayer printed wiring board. It has excellent developability, and its cured film has adhesiveness, flexibility (flexibility), Solder heat resistance,
The present invention relates to a resin composition that gives a cured product excellent in chemical resistance, gold plating resistance, and the like, and a cured product thereof.

[0002]

2. Description of the Related Art A wiring (circuit) pattern formed on a substrate by screen printing or the like is not required in a soldering process performed when protecting a wiring (circuit) pattern from an external environment or mounting electronic components on a printed wiring board. In order to protect solder from adhering to any part, a protective layer called a cover coat or a solder mask is coated on a printed wiring board. Heretofore, as a solder resist ink used for such an application, a polyfunctional epoxy resin-based ink has been mainly used, but the resulting cured film has a problem that heat resistance is good but flexibility is low. Was. Therefore, such a solder resist ink is used for a rigid board which does not require the flexibility (flexibility) of a cured film, and the use thereof is limited, and a flexible printed wiring board (FPC) which has been increasingly used in recent years is used.
Is difficult to use.

Under the circumstances described above, many proposals have recently been made as resist inks having flexibility. For example, JP-A-2-269166 discloses a thermosetting solder resist ink comprising polyparabanic acid, an epoxy resin and a polar solvent, and JP-A-6-41485 discloses a thermal drying method comprising polyparabanic acid and a phenoxy resin as essential components. Molded solder resist inks have been proposed.
However, since these solder resists form a resist pattern by screen printing, it is difficult to respond to fine image formation associated with today's high density, for example, the line width of the screen is limited. . For this reason, in recent years, there has been proposed a photo-developing type as disclosed in JP-A-2-173949, JP-A-2-173750, JP-A-2-173951, and the like, but still has sufficient flexibility. It has not been done yet.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a fine image capable of coping with the high density of today's printed circuits, having excellent sensitivity to active energy rays, exposure and organic solvents, water or diluted alkaline aqueous solutions. The cured film obtained by heat-curing in a post-curing (post-curing) step is rich in flexibility, and has excellent solder heat resistance, heat deterioration resistance, electroless gold plating resistance, acid resistance, and water resistance. It is an object of the present invention to provide a resin composition suitable for an organic solvent, water or alkali developing type resist ink for a flexible printed wiring board which forms an excellent film, and a cured product thereof.

[0005]

Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have developed a specific carboxyl group-containing oligomer (A) and at least one dihydrobenzoxazine ring-containing compound (B) in the molecule. It has been found that the above object can be achieved by using a resin composition containing (1), and the present invention has been completed. That is, according to the present invention, (1) a polyimide precursor (a) having a terminal anhydride group represented by the general formula (1)

[0006]

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(Wherein, R1 represents a tetravalent organic group having 2 to 30 carbon atoms, R2 represents a divalent organic group having 2 to 240 carbon atoms, and n is 0 or an integer of 1 or more. And a carboxyl group-containing oligomer (A) obtained by reacting a hydroxyl group-containing ethylenically unsaturated compound (b) with a polyol compound (c) as an optional component, and at least one dihydrobenzoxazine ring in the molecule. A resin composition comprising the compound (B), a diluent (C) and a photopolymerization initiator (D); (2) an epoxy resin having two or more epoxy groups in one molecule (e) (1) The polycarboxylic acid resin (E) containing an unsaturated group, which is a reaction product of a monocarboxylic acid compound (f) having an ethylenically unsaturated group and a polybasic acid anhydride (g). Resin composition, (3) one molecule Epoxy resin (e) an expression having two or more epoxy groups (2)

[0008]

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(In the formula (2), X is -CH2- or -C
(CH3) 2-, n is an integer of 1 or more, and M represents a hydrogen atom or the following formula (G).

[0010]

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However, when n is 1, M represents the equation (G),
When n is greater than 1, at least one of M is of the formula (G)
And the rest show a hydrogen atom. (4) The resin composition according to item (2), which is an epoxy resin (e) represented by (4):
The resin composition according to any one of (1) to (3), which is used for a solder resist or an interlayer insulating layer of a printed wiring board, and the resin composition according to any one of (5) (1) to (4). And (6) an article having a cured product layer according to (5), and (7) an article according to (6), which is a printed wiring board.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The resin composition of the present invention is a mixture of a carboxyl group-containing oligomer (A) and at least one dihydrobenzoxazine ring-containing compound (B) in a molecule. The carboxyl group-containing oligomer (A) used here has a weight average molecular weight of 1,
000-500,000, and the acid value is 1
0-300 mgKOH / g is preferred.

As described above, the carboxyl group-containing oligomer (A) used in the present invention comprises, as described above, a polyimide precursor (a) having a terminal anhydride group represented by the general formula (1) and a hydroxyl group-containing ethylenically unsaturated monomer. It is a reaction product of the compound (b) and a polyol compound (c) as an optional component.

The polyimide precursor having a terminal anhydride group as the component (a) can be represented by the general formula:
The component (a) is, for example, general (3)

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(Wherein, R1 is 4 of 2-30 carbon atoms)
Dicarboxylic acid or a derivative thereof (a1) represented by the following general formula (4):

[0016]

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Wherein R2 represents a divalent organic group having 2 to 240, preferably 2 to 60, more preferably 2 to 30 carbon atoms in an organic solvent. Can be manufactured.

The tetracarboxylic dianhydride represented by the general formula (3) is not particularly limited. Examples thereof include pyromellitic acid, 3,3 ′, 4,4′-benzophenonetetracarboxylic acid, and 3,3 ′. , 4,4'-biphenyltetracarboxylic acid, 2,3 ', 3,4'-biphenyltetracarboxylic acid, 2,3', 4,4'-biphenyltetracarboxylic acid, 3,3 ', 4,4' -Diphenylethertetracarboxylic acid, 1,2,5,6-naphthalenetetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid,
1,4,5,8-naphthalenetetracarboxylic acid, 3,
3 ′, 4,4′-diphenylsulfonetetracarboxylic acid, m-terphenyl-3,3 ′, 4,4′-tetracarboxylic acid, 1,1,1,3,3,3, -hexafluoro-2 , 2-bis (2,3- or 3,4-dicarboxyphenyl) propane, 2,2-bis (2,3- or 3,4
-Dicarboxyphenyl) propane, 2,2-bis [4 '-(2,3- or 3,4-dicarboxyphenoxy) phenyl] propane, 1,1,1,3,3,3,-
Hexafluoro-2,2-bis [4 ′-(2,3- or 3,4-dicarboxyphenoxy) phenyl] propane, 2,3,6,7-anthracenetetracarboxylic acid,
1,2,7,8-phenanthrenetetracarboxylic acid,
4,4'-bis (2,3-dicarboxyphenoxy) diphenylmethane dianhydride of an aromatic tetracarboxylic acid such as ethylene glycol bis (anhydrotrimellitate), the following general formula (5)

[0019]

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(Wherein R5 and R6 are monovalent hydrocarbon groups, preferably C1-10 hydrocarbon groups, more preferably C1-5 alkyl groups or C6-10 aryl groups. (Phenyl group, tolyl group, naphthyl group), which may be the same or different, and liter is an integer of 1 or more), an aromatic tetracarboxylic dianhydride, cyclobutenetetracarboxylic acid, Aliphatic tetracarboxylic dianhydrides such as butanetetracarboxylic acid, 2,3,5,6-pyridinetetracarboxylic acid, and 3,4,9,10-pesolenetetracarboxylic acid; Alternatively, they are used in combination of two or more.

The diamine represented by the general formula (4) is not particularly limited. For example, 2,2-bis [4-
(4'-aminophenoxy) phenyl] propane, 2,
2-bis [3- (4-aminophenoxy) phenyl] propane, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfone, 2,2-bis [ 4- (4-aminophenoxy) phenyl] hexafluoropropane, 2,2
-Bis [4- (3-aminophenoxy) phenyl] hexafluoropropane, bis [4- (4-aminophenoxy)] biphenyl, bis [4- (3-aminophenoxy)] biphenyl, bis [1- (4- Aminophenoxy)] biphenyl, bis [1- (3-aminophenoxy)] biphenyl, bis [4- (4-aminophenoxy) phenyl] methane, bis [4- (3-aminophenoxy) phenyl] methane, bis [4 -(4-aminophenoxy) phenyl] ether, bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy)] benzophenone, bis [4- (3-
Aminophenoxy)] benzophenone, bis [4- (4
-Aminophenoxy)] benzanilide, bis [4-
(3-aminophenoxy)] benzanilide, 9,9-
Bis [4- (4-aminophenoxy) phenyl] fluorene, 9,9-bis [4- (3-aminophenoxy) phenyl] fluorene, 4,4 ′-(or 3,4′-,
3,3′-, 2,4′-, 2,2′-) diaminodiphenyl ether, 4,4′- (or 3,4′-, 3,3 ′)
-, 2,4'-, 2,2'-) diaminodiphenyl metal, 4,4'- (or 3,4'-, 3,3'-, 2,
4'-, 2,2'-) diaminodiphenyl sulfone,
4,4'- (or 3,4'-, 3,3'-, 2,4 '
-, 2,2 '-) diaminodiphenyl sulfide, P-
Phenylenediamine, m-phenylenediamine, P-xylylenediamine, m-xylylenediamine, O-tolidine, O-tolidine sulfone, 4,4'-methylene-bis- (2,6-diethylaniline), 4,4 '-Methylene-bis- (2,6-diisopropylaniline), 2,
4-diaminomesitylene, 1,5-diaminonaphthalene, 4,4′-benzophenonediamine, 1,1,1,
3,3,3-hexafluoro-2,2-bis (4-aminophenyl) propane, 3,3′-dimethyl-4,4 ′
-Diaminophenylmethane, 3,3'-5,5'tetramethyl-4,4'-diaminophenylmethane, 2,2-
Bis (4-aminophenyl) propane, benzidine,
2,6-dianopyridine, 3,3′-dimethoxybenzidine, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene,
4,4 ′-[1,4-phenylenebis (1-methylethylidene)] bisaniline, 4,4 ′-[1,3-phenylenebis (1-methylethylidene)] bisaniline,
Aromatic diamine such as 3,5-diaminobenzoic acid, ethylenediamine, tetramethylenediamine, hexamethylenediamine, 1,2-diaminocyclohexane, the following general formula (6)

[0022]

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(Wherein R7 and R8 each have 1 to 1 carbon atoms)
0 represents a divalent hydrocarbon, which may be the same or different, R9 and R10 represent a monovalent hydrocarbon group (preferably having 1 to 10 carbon atoms), and may be the same or different, m is an integer of 1 or more), diaminopolysiloxane, 1,3-bis (aminomethyl) cyclohexane, Jeffamine D-230, D-400, D-200 manufactured by San Techno Chemical Co., Ltd. D
-4000, ED-600, ED-900, ED-20
01, aliphatic diamines such as polyoxyalkylene diamines such as EDR-148 and the like. These are used alone or in combination of two or more.

The polyimide precursor having a terminal anhydride group, which is the component (a), can be produced by various known methods. For example, it can be obtained by reacting the tetracarboxylic anhydride with a diamine in an organic solvent used as required.

The amounts of the tetracarboxylic dianhydride represented by the general formula (3) and the diamine represented by the general formula (4) are 1.0 / 0.5 to 1.0 / 0.99. (Mol), particularly preferably 1.0 / 0.0.
5 to 1.0 / 0.9 (mole). The weight average molecular weight of the polyamide precursor (a) used in the present invention is 50
0 to 100,000 is preferred.

The organic solvent used in the reaction for producing the polyimide precursor used in the present invention includes, for example, γ-
Lactones such as butyrolactone, γ-valerolactone, γ-caprolactone, γ-heptalactone, α-acetyl-γ-butyrolactone, ε-caprolactone; dioxane, 1,2-dimethoxymethane, diethylene glycol dimethyl (or diethyl, dipropyl, dibutyl) Ethers such as ether, triethylene glycol dimethyl (or diethyl, dipropyl, dibutyl) ether and tetraethylene glycol (or diethyl, dipropyl, dibutyl) ether; carbonates such as ethylene carbonate and propylene carbonate; methyl ethyl ketone, methyl isobutyl ketone; Cyclohexane non,
Ketones such as acetophenone; phenols such as phenol, cresol and xylenol; esters such as ethyl acetate, butyl acetate, ethyl cellosolve acetate and butyl cellosolve acetate; hydrocarbons such as toluene, xylene, diethylbenzene and cyclohexane; trichloroethane, tetrachloroethane And halogenated hydrocarbons such as monochlorobenzene can be used, but lactones and carbonates can be preferably used.

The amount of the organic solvent to be used is preferably 1 to 10 times (weight ratio) the produced polyimide precursor.

Examples of the hydroxyl group-containing ethylenically unsaturated compound (b) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycerol di (meth) acrylate,
-Hydroxybutyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, caprolactone-modified 2-hydroxyethyl (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) Acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate and the like can be mentioned, and they can be used alone or in combination of two or more.

Examples of the polyol compound (c) include alkyl polyols, polyester polyols, polyether polyols, acrylic polyols, polybutadiene polyols, polysiloxane polyols, phenolic polyols and / or flame-retardant polyols. Examples of the alkyl polyol include 1,4-butanediol, 1,6-hexanediol, 1,8-octanediol, neopentyl glycol, cyclohexanedimethanol, trimethylolpropane, and pentaerythritol.

Examples of the polyester polyol include a condensation type polyester polyol, an addition-polymerized polyester polyol, and a polycarbonate polyol. As the condensation type polyester polyol, ethylene glycol, propylene glycol, ethylene glycol,
1,4-butanediol, neopentyl glycol,
Diol compounds such as 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,9-nonanediol, 1,4-hexanedimethanol, dimer acid diol, and polyethylene glycol, and adipic acid, isophthalic acid, and terephthalic acid It is obtained by a condensation reaction with an organic polybasic acid such as acid or sebacic acid, and has a molecular weight of 100 to 100,00.
0 is preferred.

Examples of the addition-polymerized polyester polyol include polycaprolactone having a molecular weight of 100 to 100.
100,000 is preferred. Polycarbonate polyol is synthesized by direct phosgenation of polyol, transesterification with diphenyl carbonate, and the like, and preferably has a molecular weight of 100 to 100,000.

As the polyether polyol, PEG
, PPG-based, and PTG-based polyols. P
The EG-based polyol is obtained by subjecting ethylene oxide to addition polymerization using a compound having active hydrogen as a reaction initiator, and preferably has a molecular weight of 100 to 100,000. PP
The G-based polyol is obtained by subjecting propylene oxide to addition polymerization using a compound having active hydrogen as a reaction initiator, and preferably has a molecular weight of 100 to 100,000. PT
The G-based polyol is synthesized by cationic polymerization of tetrahydrofuran, and preferably has a molecular weight of 100 to 100,000.

Examples of the polyether polyol other than the above-mentioned polyether polyol include an ethylene oxide adduct or a propylene oxide adduct of bisphenol A, and the molecular weight is preferably 100 to 100,000.

As other polyols, (meth) acryl polyol, which is a copolymer of a hydroxyl group-containing (meth) acrylate and another (meth) acrylate, and a copolymer of butadiene, having a hydroxyl group at the terminal. Homo or copolymer having, polybutadiene polyol, polysiloxane polyol, phenolic polyol containing a phenol molecule in the molecule, epoxy polyol, phosphorus atom, flame-retardant polyol containing a halogen atom and the like, the molecular weight is 100
~ 100,000 is preferred. These polyol compounds can be used alone or in combination of two or more.

The carboxyl group-containing oligomer (A) used in the present invention can be produced, for example, as follows. First, a first method of reacting a polyamide precursor (a) having a terminal anhydride group represented by the general formula (1) with a hydroxyl group-containing ethylenically unsaturated compound (b) to obtain an oligomer (A), When the polyol compound (c) which is an optional component is used, the polyamide precursor (a) represented by the general formula (1) is reacted with the polyol compound (c), and finally, the second component is reacted with the component (b). Law, (a),
There is a third method of simultaneously reacting the components (c) and (b), but the first method or the second method is preferable.

In the first method, the hydroxyl group-containing ethylenically unsaturated compound (b) has a hydroxyl group content of 0.95 to 1.50 equivalents based on 1 equivalent of the anhydride group of the polyamide precursor (a) having a terminal anhydride group. Is preferably reacted, and particularly preferably 0.98 to 1.10 equivalents. The reaction temperature of this esterification reaction is preferably from 60 ° C to 150 ° C, and the reaction time is preferably from 1 to 10 hours. In order to prevent polymerization during the reaction, it is preferable to add 0.01 to 1.0% by weight of a polymerization inhibitor (for example, P-methoxyphenol, methylhydroquinone, phenothiazine, etc.) to the reaction mixture.

In the second method, the anhydride group 1 of the component (a)
The hydroxyl group of the polyol compound (c) is 0.5
~ 0.99 equivalents are preferred, particularly preferably 0.5 ~
0.9 equivalent is reacted to obtain a reaction product of the component (a) and the component (c) each having a terminal anhydride group. Next, it is preferable to react 0.95 to 1.50 equivalents of the hydroxyl group of the component (b) with one equivalent of the anhydride group of the reaction product of the component (a) and the component (c), and particularly preferably 0.98. ~ 1.10 equivalents are reacted to obtain a carboxyl group-containing oligomer (A). The reaction temperature of these esterification reactions is preferably 60 to 150 ° C., and the reaction time is preferably 1 to 10 hours. It is preferable to add the above-mentioned polymerization inhibitor during the reaction.

The use ratio of the carboxyl group-containing oligomer (A) in the resin composition of the present invention is preferably from 5 to 80% by weight, particularly preferably from 10 to 60% by weight.

In the present invention, at least one dihydrobenzoxazine ring-containing compound (B) is used in the molecule. Specific examples of the dihydrobenzoxazine ring-containing compound (B) include, for example, formaldehyde 1 which is obtained by heating a mixture of 1 equivalent of a hydroxyl group of a compound having a phenolic hydroxyl group and about 1 equivalent of an anomi group of a primary amine to 70 ° C. or more.
70 to 110 ° C., preferably 9
The reaction is carried out at 0 to 100 ° C for 20 to 120 minutes,
It can be synthesized by drying under reduced pressure at a temperature of not more than ° C. It is preferable that all the phenolic hydroxyl groups of the compound having a phenolic hydroxyl group react with the primary amine and formaldehyde to form a dihydrobenzoxazine ring. The compound having a phenolic hydroxyl group is not particularly limited, and examples thereof include compounds such as bisphenol A, bisphenol F, biphenol, trisphenol, and tetraphenol, and phenol resins. As the phenol resin, a novolak resin obtained by reacting a formaldehyde with a phenol compound such as a monovalent phenol compound such as alkylphenol such as phenol or xylenol, t-butylphenol and octylphenol, resorcinol and bisphenol A is used. Alternatively, primary amines such as a resol resin, a phenol-modified xylene resin, a melamine phenol resin, and a polybutadiene-modified phenol resin are not particularly limited, and examples thereof include methylamine, cyclohexylamine, aniline, and substituted aniline. Formaldehyde may be used in the form of formalin or polyformaldehyde.

The dihydrobenzoxazine ring-containing compound (B) can be prepared by a known method (for example, DE-A-2217).
No. 099, H, Ishida, J. et al. Polym. Sc
i. , Part A32, 1121 (1994 etc.).

The proportion of the dihydrobenzoxazine ring-containing compound (B) used is determined by the total amount of the carboxyl group-containing oligomer (A) or the carboxyl group-containing oligomer (A) and the unsaturated group-containing polycarboxylic acid resin (E) described below. 5 to 40 parts by weight per 100 parts by weight is preferred.

In the present invention, a diluent (C) is used. Specific examples of the diluent (C) include, for example, the above-mentioned organic solvent, butanol, octyl alcohol, ethylene glycol, glycerin, diethylene glycol monomethyl (or monoethyl) ether, triethylene glycol monomethyl (or monoethyl) ether, and tetraethylene glycol monomethyl. Organic solvents (C-1) such as alcohols such as (or monoethyl) ether, carbitol (meth) acrylate, phenoxyethyl (meth) acrylate, acryloylmorpholine, trimethylolpropane tri (meth) acrylate, pentaerythritol tri ( Reactive diluents such as (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate (C-2)
Is raised.

The proportion of the diluent (C) used in the resin composition of the present invention is preferably 3 to 50% by weight, particularly preferably 5 to 50% by weight.
４０40% by weight.

In the present invention, a photopolymerization initiator (D) is used. Specific examples of the photopolymerization initiator (D) include, for example, benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, diethoxyacetophenone, 1-hydroxycyclohexylphenyl ketone, 2-methyl- Acetophenones such as 1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one; 2-ethylanthraquinone;
Anthraquinones such as 2-t-butylanthraquinone, 2-chloroanthraquinone and 2-amylanthraquinone; thioxanthones such as 2,4-diethylthioxanthone, 2-isopropylthioxanthone and 2-chlorothioxanthone; acetophenone dimethyl ketal, benzyldimethyl ketal and the like Ketals; benzophenone, 4,4-bismethylaminobenzophenone, [4
-(Methylphenylthio) phenyl] phenylmethanone, and phosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide.

These can be used alone or as a mixture of two or more. Further, tertiary amines such as triethanolamine and methyldiethanolamine can be used. N-dimethylaminobenzoic acid ethyl ester; It can be used in combination with an accelerator such as a benzoic acid derivative such as N-dimethylaminobenzoic acid isoamyl ester.

The photopolymerization initiator (D) has a total amount of component (A), component (B), component (C) and component (E) described below of 10%.
0.5 to 20 parts by weight relative to 0 parts by weight, preferably 2 to 20 parts by weight
A ratio of 15 parts by weight is preferable.

In the present invention, an unsaturated group-containing polycarboxylic acid resin (E) may be used. As described above, the unsaturated group-containing polycarboxylic acid resin (E) includes an epoxy resin (e) having two or more epoxy groups in one molecule and a monocarboxylic acid compound (f) having an ethylenically unsaturated group. It is a reaction product with a polybasic acid anhydride (g).

The epoxy resin (e) having two or more epoxy groups in one molecule includes, for example, the above-mentioned general formula (2)
Epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, phenol
Glycidyl ethers such as novolak type epoxy resin, cresol / novolak type epoxy resin, trisphenol methane type epoxy resin, brominated epoxy resin, biquilenol type epoxy resin and biphenol type epoxy resin; 3,4-epoxy-6-thylcyclohexyl Alicyclic epoxy resins such as methyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 1-epoxyethyl-3,4-epoxycyclohexane Glycidyl esters such as diglycidyl phthalate, diglycidyl tetrahydrophthalate and glycidyl dimer; glycidylamines such as tetraglycidyl diaminodiphenylmethane ; The like heterocyclic epoxy resins such as triglycidyl isocyanurate, epoxy resins are preferably represented by the general formula (2).
Note that n in the general formula (2) is calculated from the epoxy equivalent.

The epoxy resin (e) represented by the general formula (2) can be obtained by reacting an alcoholic hydroxyl group of a starting epoxy compound in which M is a hydrogen atom with an epihalohydrin such as epichlorohydrin in the general formula (2). Can be. Raw material epoxy compounds are commercially available, for example, Epicoat series (Epicoat 1009,
1031: Yuka Shell Epoxy Co., Ltd.), Epicron Series (Epiclon N-3050, N-7050: Dainippon Ink & Chemicals, Inc.), DER Series (DE
Bisphenol A type epoxy resin such as R-642U, DER-673MF: manufactured by Dow Chemical Co., Ltd.), YD
Bisphenol F type epoxy resins such as F series (YDF-2004, 2007: manufactured by Toto Kasei Co., Ltd.) and the like.

The reaction between the starting epoxy compound and epihalohydrin is preferably carried out in the presence of dimethyl sulfoxide.
Done. The epihalohydrin may be used in an amount of 1 equivalent or more based on 1 equivalent of the alcoholic hydroxyl group in the raw material epoxy compound. However, when the amount exceeds 15 equivalents to 1 equivalent of the alcoholic hydroxyl group, the effect of increasing the amount is almost negligible, but the volumetric efficiency deteriorates.

In carrying out the reaction, an alkali metal hydroxide is used. As the alkali metal hydroxide, for example, caustic soda, caustic potash, lithium hydroxide, calcium hydroxide and the like can be used, but caustic soda is preferable. The amount of the alkali metal hydroxide used is determined based on the M
Is approximately 1 equivalent to 1 equivalent of an alcohol hydroxyl group to be epoxidized in a raw material epoxy compound in which is a hydrogen atom. When the entire amount of the alcoholic hydroxyl group of the raw material epoxy compound in which M of the compound represented by the formula (2) is a hydrogen atom is epoxidized, it may be used in excess, but 2 equivalents are used per equivalent of the alcoholic hydroxyl group. If it exceeds, the polymer tends to be slightly polymerized.

The reaction temperature is preferably from 30 to 100 ° C.
When the reaction temperature is lower than 30 ° C., the reaction becomes slow and a long-time reaction is required. If the reaction temperature exceeds 100 ° C., many side reactions occur, which is not preferable.

After completion of the reaction, excess epihalohydrin and dimethyl sulfoxide are distilled off under reduced pressure, and then the resulting resin is dissolved in an organic solvent, and a dehydrohalogenation reaction can be carried out with an alkali metal hydroxide.

The monocarboxylic acid compound (f) having an ethylenically unsaturated group includes, for example, (meth) acrylic acid, acrylic acid dimer, etc., of which (meth) acrylic acid is preferred.

The epoxy resin (e) is reacted with the monocarboxylic acid (f) having an ethylenically unsaturated group to obtain an epoxy (meth) acrylate compound. It is preferable to react 0.3 to 1.2 equivalents of the total amount of the carboxyl group of the component (f) to 1 equivalent of the epoxy group of the epoxy resin, and particularly preferably 0.9 to 1.05 equivalent. .

During or after the reaction, as a diluting solvent, aromatic hydrocarbons such as toluene and xylene; ethyl acetate;
Esters such as butyl acetate; ethers such as 1,4-dioxane and tetrahydrofuran; ketones such as methyl ethyl ketone and methyl isobutyl ketone; glycol derivatives such as butyl cellosolve acetate, carbitol acetate, diethylene glycol dimethyl ether, propylene glycol monomethyl ether acetate; cyclohexanone And one or more solvents such as alicyclic hydrocarbons such as cyclohexanol and petroleum solvents such as petroleum ether and petroleum naphtha.

During or after the reaction, one or more of the following reactive diluents (B-2) can be used.

Further, it is preferable to use a catalyst for accelerating the reaction. Examples of the catalyst include triethylamine, benzylmethylamine, methyltriethylammonium chloride, triphenylstibine, triphenylphosphine and the like. The amount used is preferably from 0.1 to 10% by weight based on the reaction raw material mixture,
Particularly preferably, it is 0.3 to 5% by weight.

During the reaction, a polymerization inhibitor is preferably used to prevent polymerization of the ethylenically unsaturated group. Examples of the polymerization inhibitor include methoquinone, hydroquinone, methylhydroquinone, phenothiazine and the like. The amount used is preferably from 0.01 to 1% by weight, particularly preferably from 0.05 to 1% by weight, based on the reaction raw material mixture.
0.5% by weight. The reaction temperature is from 60 to 150 ° C, particularly preferably from 80 to 120 ° C. The reaction time is preferably 5 to 60 hours.

Next, the polybasic acid anhydride (g) is reacted. Examples of the polybasic acid anhydride (g) include succinic anhydride, maleic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 3-methyl-
Examples include tetrahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride and the like. The amount of the polybasic anhydride to be used is preferably 0.1 to 1 equivalent of the hydroxyl group in the epoxy (meth) acrylate.
The reaction is carried out in an amount of from 0.5 to 1.00 equivalent. The reaction temperature is 60 to 1
The temperature is 50 ° C, particularly preferably 80 to 100 ° C.

The amount used is (A) + (B) +
A suitable ratio is 0 to 300 parts by weight, preferably 20 to 200 parts by weight, based on 100 parts by weight of the total amount of the component (C).

Further, in the present invention, the aforementioned (A) to
Various additives other than the component (E), if necessary, for example,
Fillers such as talc, barium sulfate, calcium carbonate, magnesium carbonate, barium titanate, aluminum hydroxide, aluminum oxide, silica, clay and the like; thixotropic agents such as aerosil; phthalocyanine blue;
Coloring agents such as phthalocyanine green and titanium oxide, silicones, fluorine-based leveling agents and defoaming agents; polymerization inhibitors such as hydroquinone and hydroquinone monomethyl ether can be added for the purpose of enhancing various performances of the composition.

The resin composition of the present invention can be prepared, for example, by using an organic solvent (C) used as a diluent (C) on a polymer film (for example, a film made of polyethylene terephthalate, polypropylene, or polyethylene) as a support. -1) can be evaporated and laminated to use as a photosensitive film.

The resin composition (liquid or film form) of the present invention is useful as an insulating material between layers of electronic parts, as a resist ink such as a solder resist for printed circuit boards, and in addition to a triad material, a paint, and a coating. It can also be used as an agent, adhesive or the like. The cured product of the present invention is obtained by curing the above-described resin composition of the present invention by irradiation with energy rays such as ultraviolet rays. Curing by irradiation with energy rays such as ultraviolet rays can be performed by a conventional method. For example, when irradiating ultraviolet rays, low-pressure mercury lamp, high-pressure mercury lamp, ultra-high-pressure mercury lamp,
An ultraviolet generator such as a xenon lamp or an ultraviolet light emitting laser (such as an excimer laser) may be used. The cured product of the resin composition of the present invention can be used as an interlayer insulating material for a permanent resist or a build-up method, for example, as an electric or conductive material such as a printed circuit board.
Used for electronic components. The thickness of the cured product layer is 0.5 to
It is about 160 μm, preferably about 1 to 60 μm.

The printed wiring board of the present invention can be obtained, for example, as follows. That is, when a liquid resin composition is used, the present invention is applied to a substrate for printed wiring with a film thickness of 5 to 160 μm by a method such as a screen printing method, a spray method, a roll coating method, an electrostatic coating method, and a curtain coating method. Is applied, and the coating film is dried at a temperature of 60 to 110 ° C., preferably 60 to 100 ° C., whereby a tack-free coating film can be formed. Then, (placed on the coating film in a state where no or contact) a photomask formed with an exposure pattern directly in contact with the coating film such as a negative film, irradiated with ultraviolet light at 10 to 2000 mJ / cm on ² medium strong Then, the unexposed portion is developed using a developing solution described later, for example, by spraying, rocking immersion, brushing, scrubbing, or the like. Then, if necessary, further irradiate ultraviolet rays, then 100 to 200 ° C., preferably 140 to 18
By performing heat treatment at a temperature of 0 ° C., excellent flexibility, heat resistance, solvent resistance, acid resistance, adhesiveness,
A printed wiring board having a permanent protective film satisfying various characteristics such as electric characteristics can be obtained.

Examples of the organic solvent used in the development include halogens such as trichloroethane, aromatic hydrocarbons such as toluene and xylene; esters such as ethyl acetate and butyl acetate; 1,4-dioxane and tetrahydrofuran. Ethers of methyl ethyl ketone,
Ketones such as methyl isobutyl ketone; lactones such as γ-butyrolactone; glycol derivatives such as butyl cellosolve acetate, carbitol acetate, dimethylene glycol dimethyl ether, propylene glycol monomethyl ether acetate; alicyclic hydrocarbons such as cyclohexanone and cyclohexanol; Solvents such as petroleum solvents such as petroleum ether and petroleum naphtha,
As the water and the aqueous alkali solution, an aqueous alkali solution such as potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, and amines can be used. Further, as an irradiation light source for photocuring, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is appropriate. In addition, a laser beam or the like can be used as the active light for exposure.

[0067]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but it goes without saying that the present invention is not limited to the following Examples. In the following, “parts” means “parts by weight” unless otherwise specified.

(Synthesis Example of Polyimide Precursor (a) Having Terminal Anhydride Group) Synthesis Example 1 3,2.8 (0.08 mol) 2,2-bis [4- (4-aminophenoxy) phenyl] propane Jeffer 40. Min D-2000 (trade name of San Techno Chemical Co., Ltd., polyoxyalkylenediamine, molecular weight 2000)
0 (0.02 mol) and 134.3-γ-butyrolactone
After charging g, the mixture was heated to 45 ° C., and while maintaining the temperature at 43-50 ° C., 61.5 g (0.15 mol) of ethylene glycol bis (anhydrotrimellitate) was added little by little. After the addition, the reaction was continued at 45 ° C. for about 5 hours, then cooled to room temperature, and the solid content acid value (mg KOH / g) 167, nonvolatile content 50%, terminal anhydride group-containing polyimide precursor solution (a- 1) was obtained.

(Synthesis example of carboxy group-containing oligomer (A)) Synthesis Example 2 268.6 g of terminal anhydride group-containing polyimide precursor solution (a-1) obtained in Synthesis Example 1 and 11.6 g of 2-hydroxyethyl acrylate , Carbitol acetate 11.6g
And 0.1 g of P-methoxyphenol at 85 ° C.
For about 10 hours, and when the anhydride group disappears, the reaction is terminated, and the weight-average molecular weight of the solid content is about 6000.
(According to the GPC method) the acid value of the solid is 115 mg KOH
/ G of a carboxyl group-containing oligomer (A-1) having a solid content of 50%.

Synthesis Example 3 268.6 g of the terminal anhydride group-containing polyimide precursor solution (a-1) obtained in Synthesis Example 1, polytetramethylene glycol (hydroxyl value: 172.6 mg KOH / g, molecular weight 65)
0) 32.5 g and Calbitol acetate 44.1
g, and reacted at 85 ° C. for 10 hours. Then, 11.6 g of 2-hydroxyethyl acrylate and 0.1 g of P-methoxyphenol were charged and reacted at 85 ° C. for about 10 hours. When the anhydride group disappeared, the reaction was terminated. A carboxyl group-containing oligomer (A-2) having a weight-average molecular weight of about 10,000 (GPC method) and an acid value of 108 mgKOH / g and a solid content of 50% was obtained.

(Synthesis Example of Dihydrobenzoxazine Ring-Containing Compound (B)) Synthesis Example 4 <Synthesis of Phenol Volak Resin> Phenol 190
g, 100 g of formalin (37% aqueous solution) and 0.4 g of oxalic acid, and reacted at a reflux temperature for about 6 hours. Subsequently, the internal pressure was reduced, and then unreacted phenol and condensed water were removed. The obtained resin had a softening point of 84 ° C. and a 3 to polynuclear / binuclear ratio: 82/18 (peak area ratio by GPC).

<Introduction of dihydrobenzoxazine ring> 170 g of phenol novolak resin synthesized as described above
(Corresponding to 1.6 moles of hydroxyl groups) to 140 g (1.6
Mol.) And dissolved at 80 ° C to prepare a uniform mixed solution. This mixed solution was heated to 90 ° C formalin 25.
It was added to 9 g in 30 minutes. After completion of the addition, the mixture was maintained at the reflux temperature for 3 hours, and then decompressed at 100 ° C. for about 2 hours to remove the condensed water, thereby obtaining a compound (B-1) in which a dihydrobenzoxazine ring was introduced into all of the reacted hydroxyl groups. Synthesized. Excess aniline and formalin were removed during drying, and the yield of this compound was 300 g. This indicates that, among the hydroxyl groups of the phenol novolak resin, 1.4 moles reacted and dihydrobenzoxazine was cyclized.

Synthesis Example 5 91.2 g (0.4 mol) of bisphenol A, 130 g (1.6 mol) of 37% formalin, P-anisidine 9
8.5 g (0.8 mol) of toluene (250 ml) was charged and reacted at 80 ° C. for 5 hours with stirring. After allowing the reaction product to stand and separating the aqueous layer, the organic layer was washed twice with 2 liters of water. Thereafter, the aqueous layer was separated, and the triene was distilled off under reduced pressure to obtain 200 g of a yellow solid. By recrystallizing the reaction product from acetone, the melting point becomes 1
At 50.8 ° C., the structural formula was a compound (B-2) having the following dihydrobenzoxazine ring.

[0074]

Embedded image

(Unsaturated group-containing polycarboxylic acid resin (E)
Synthesis Example 6 Synthesis Example 6 In the above general formula (2), X is -CH2-, M is a hydrogen atom, and average degree of polymerization n is 6.2.
After dissolving 380 parts of an epoxy compound of the type (epoxy equivalent: 950 g / eq, softening point: 85 ° C.) and 925 parts of epichlorohydrin in 462.5 parts of dimethyl sulfoxide, 60.9 parts of 98.5% NaOH (70%) was stirred at 70 ° C. (0.5 mol) was added over 100 minutes. After the addition, the reaction was further performed at 70 ° C. for 3 hours. After the completion of the reaction, 250 parts of water was added and washed. After oil-water separation, most of the dimethyl sulfoxide and excess unreacted epichlorohydrin were recovered by distillation under reduced pressure from the oil layer, and then dimethyl sulfoxide was distilled off.
The reaction product containing by-produced salt is treated with methyl isobutyl ketone 75
0 parts, and further add 10 parts of 30% NaOH,
The reaction was performed at 0 ° C. for 1 hour. After the reaction is completed, add 2 parts with 200 parts of water.
Washing was performed once. After oil-water separation, methyl isobutyl ketone was recovered by distillation from the oil layer, and the epoxy equivalent was 310 g / e.
q, an epoxy resin (e) having a softening point of 69 ° C. was obtained. When the obtained epoxy resin (e) was calculated from the epoxy equivalent, about 5 out of 6.2 alcoholic hydroxyl groups in the starting bisphenol F type epoxy compound were epoxidized. This epoxy resin (e) 3
Charge 10 parts and 251 parts of carbitol acetate,
The mixture was heated and stirred at 90 ° C. and dissolved. 60 ° C.
Cooled to 60 parts of acrylic acid, dimer acid (acid value (m
gKOH / g) = 196) 97 parts, methylhydroquinone 0.8 parts and triphenylphosphine 2.5 parts were added,
The mixture was heated and dissolved at 80 ° C. and reacted at 98 ° C. for 35 hours to obtain an epoxy acrylate having an acid value of 0.5 mg KOH / g and a solid content of 65%. Next, 718.5 parts of this epoxy acrylate, 100 parts of succinic anhydride, and 54 parts of carbitol acetate were charged and reacted at 90 ° C. for 6 hours.
An unsaturated group-containing polycarboxylic acid resin (E-1) having a solid content acid value of 99 mgKOH / g and a solid content of 65% was obtained. Examples 1 to 4, Comparative Example 1 (A-1) and (A-2) obtained in Synthesis Examples 2 to 6,
(B-1), (B-2), and (E-1) were mixed at the compounding ratio shown in Table 1, and then a photopolymerization initiator (D) (Irgacure 907, manufactured by Ciba-Geigy); 2-methyl -1-
[4- (methylthio) phenyl] -2-morpholinopropan-1-one 10 parts and getylthioxanthone 1.2 parts), reactive diluent (C-2) (Nippon Kayaku Co., Ltd.)
KAYARAD DPMA; 16 parts of mixture of dipentaerythritol penta and hexaacrylate), 10 parts of filler (fine silica), cyanine green (pigment)
1.5 parts, silicone defoamer (KS-KS, KS
-66) 1.0 part was blended in the combinations shown in Table 1 and kneaded using a three-roll mill to prepare a solder resist composition.

Table 1 Example Comparative Example 1 2 3 4 1 Oligomer (A-1) obtained in Synthesis Example 2 200 60 40.2 Oligomer (A-2) obtained in Synthesis Example 3 200 Dihydrobenzo obtained in Synthesis Example 4 Oxazine ring-containing compound (B-1) 30 40 40 Dihydrobenzoxazine ring-containing compound (B-2) obtained in Synthesis Example 5 30 40 Unsaturated group-containing polycarboxylic acid resin (E- 1) 108 123 154 Developability ○ ○ ○ ○ ○ Solder heat resistance ○ ○ ○ ○ ○ Flexibility ○ ○ ○ ○ × Heat deterioration ○ ○ ○ ○ × Electroless gold plating resistance ○ ○ ○ ○ ○

Evaluation method: Each of the obtained resist compositions was evaluated as follows. That is, the resist compositions of Examples and Comparative Examples shown in Table 1 were applied to a printed circuit board (a laminate of an imide film and a copper foil) by screen printing, and dried at 80 ° C. for 20 minutes. Thereafter, a negative film is applied to the substrate, irradiated with ultraviolet rays at an integrated exposure amount of 500 mJ / cm 2 using an exposure machine according to a predetermined pattern, developed with an organic solvent or a 1 wt% aqueous solution of Na 2 CO 2, and further developed at 150 ° C. for 50 minutes. A test substrate was prepared by heat curing. With respect to the obtained test substrate, characteristics such as alkali developability, solder heat resistance, flexibility, heat deterioration resistance, and electroless gold plating resistance were evaluated. Table 1 shows the results. The evaluation method and evaluation criteria are as follows.

(1) Developability: The coating film was dried at 80 ° C. for 60 minutes, and the developability by spray development with a 1% aqueous sodium carbonate solution at 30 ° C. was evaluated.・: No residue is visually observed. ×: There is a residue visually.

(2) Solder heat resistance: A rosin-based flux was applied to a test substrate, immersed in molten solder at 260 ° C. for 10 seconds, and evaluated by the state of the cured film when peeled off with a cellophane adhesive tape. ○ ・ ・ ・ ・ ・ ・ No abnormality. ×: There is peeling.

(3) Flexibility: Judgment was made in a state where the test substrate was folded at 180 degrees. ○ ・ ・ ・ ・ No crack. △ ・ ・ ・ ・ Slight cracks. C: Cracks were formed in the bent portion and the cured film was separated.

(4) Heat deterioration resistance: After leaving the test substrate at 125 ° C. for 5 days, it was judged in a state of 180 ° solid bending. ○ ・ ・ ・ ・ No crack. △ ・ ・ ・ ・ Slight cracks. C: Cracks were formed in the bent portion and the cured film was separated.

(5) Electroless Gold Plating Resistance: The gold plating was performed on the test substrate as described below, and the state was determined by peeling with a cellophane adhesive tape. ○ ・ ・ ・ ・ No abnormality. Δ: Some peeling was observed. ×: No peeling.

Electroless gold plating method: A test substrate was acid-degreased at 30 ° C. (Metex, manufactured by Nippon MacDermid Co., Ltd.).
L-5B (20 Vol /% aqueous solution) for 3 minutes to degrease, then dipped in running water for 3 minutes and washed with water. Next, the test substrate is immersed in a 14.3 wt% ammonium persulfate aqueous solution at room temperature for 3 minutes, soft-etched, and then placed in running water for 3 minutes.
It was immersed for minutes and washed with water. After the test substrate was immersed in a 10 Vol% sulfuric acid aqueous solution at room temperature for 1 minute, it was immersed in running water for 30 seconds to 1 minute and washed with water. Next, the test substrate was immersed in a 30 ° C. catalyst solution (10 vol% aqueous solution of a metal plate activator 350, manufactured by Meltex Co., Ltd.) for 7 minutes to give a catalyst, and then immersed in running water for 3 minutes and washed with water. . The test substrate to which the catalyst was applied was immersed in a 20 vol% aqueous solution of a nickel plating solution at 85 ° C., pH 4.6) for 20 minutes to perform electroless nickel plating. After the test substrate was immersed in a 10 Vol% sulfuric acid aqueous solution at room temperature for 1 minute, it was immersed in running water for 30 seconds to 1 minute and washed with water. Next, the test substrate was subjected to a 95 ° C. gold plating solution (manufactured by Meltex Co., Ltd., Aulectroless UP15Vol% and potassium cyanide 3V).
immersed in running water for 3 minutes, washed with hot water at 60 ° C. for 3 minutes, and washed with hot water. After sufficient washing with water, the water was thoroughly removed, dried, and a test board electrolessly gold-plated was obtained. As is clear from the results shown in Table 1, the resin composition of the present invention shows good alkali developability, and is a cured film excellent in solder heat resistance, flexibility, heat deterioration resistance and electroless gold plating property. give.

[0084]

According to the present invention, the cured product is excellent in flexibility, solder heat resistance, heat deterioration resistance, and electroless gold plating resistance, can be developed with an organic solvent or a dilute alkali solution, and is used for a solder resist and an interlayer insulating layer. Thus, a resin composition suitable for was obtained. This resin composition is suitable for a solder resist and an interlayer insulating layer of a printed wiring board, particularly a flexible printed wiring board.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 TF term (Reference) 4J011 PA43 PB30 QA02 QA03 QA22 QA23 QA24 QB17 QB18 QB19 SA01 SA02 SA03 SA04 SA06 SA07 SA12 SA21 SA22 SA24 SA25 SA31 SA34 SA51 SA63 SA64 SA84 TA01 UA01 4J027 AD04 AE01 AE02 AE03 AE04 AE05 BA06 BA08 BA09 BA23 BA24 BA25 BA26 CA25 CA29 CB10 CC05 CD06 CD10 4J036 AB07 AB07 AD08 AF06 AF07 AF07 AG07 AF07 AG08 JA08 5E314 AA27 AA32 BB02 CC07 DD08 FF06 5E346 AA12 CC02 CC09 CC10 CC32 CC38 DD03 DD12 DD23 DD47 HH11 HH13

Claims (7)

[Claims] 1. A polyimide precursor (a) having a terminal anhydride group represented by the general formula (1): (In the formula, R1 represents a tetravalent organic group having 2 to 30 carbon atoms, R2 represents a divalent organic group having 2 to 240 carbon atoms, and n is 0 or an integer of 1 or more.) And a carboxyl group-containing oligomer (A) obtained by reacting a hydroxyl group-containing ethylenically unsaturated compound (b) with a polyol compound (c) as an optional component, and a chemical compound containing at least one dihydrobenzoxazine ring in the molecule ( A resin composition comprising (B), a diluent (C) and a photopolymerization initiator (D). 2. A reaction product of an epoxy resin (e) having two or more epoxy groups in one molecule, a monocarboxylic acid compound (f) having an ethylenically unsaturated group, and a polybasic anhydride (g). The resin composition according to claim 1, which contains an unsaturated group-containing polycarboxylic acid resin (E). 3. An epoxy resin (e) having two or more epoxy groups in one molecule is represented by the formula (2): (In the formula (2), X represents -CH2- or -C (CH3) 2-
And n is an integer of 1 or more, and M represents a hydrogen atom or the following formula (G). Embedded image However, when n is 1, M indicates the formula (G), and when n is greater than 1, at least one of M indicates the formula (G) and the rest indicate a hydrogen atom. (E) an epoxy resin represented by
The resin composition according to claim 2, which is 4. The printed wiring board according to claim 1, which is used for a solder resist or an interlayer insulating layer.
Item 14. The resin composition according to Item. 5. A cured product of the resin composition according to any one of claims 1 to 4. 6. An article having the cured product layer according to claim 5. 7. The article according to claim 6, which is a printed wiring board.