JP2001302423A - Mold removing agent composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mold removing agent composition exhibiting high mold removing effect. SOLUTION: The mold removing agent composition contains (A) one or more substances selected from hypochlorous acid salts and hypochlorous acid, (B) one or more substances selected from ampholytic surfactants and cationic surfactants and (C) a pH regulator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a fungicide composition.

[0002]

2. Description of the Related Art Claddospo removes black spots on bathroom ceilings, tile joints, plastic walls and kitchen corners.
It is caused by the pigment produced by molds such as rium genus.In addition, if the flush toilet is used continuously for a long time, the inner surface of the toilet and the pool surface,
In particular, colored stains are deposited on the water seal portion, and these stains are mainly inorganic substances such as calcium phosphate and iron oxide, organic excretions such as crude proteins and bile decomposed products, microorganisms and metabolites thereof.

Since it is difficult to remove these hard surface stains only with a cleanser or a surfactant, a liquid or spray bleach or a detergent using a chlorine bleach containing sodium hypochlorite or the like is currently used. It is used. For example, JP-A-59-93799 discloses a liquid detergent for cleaning mold stains containing hypochlorite, caustic alkali and amine oxide.

[0004]

Generally, chlorine-based detergents, mold removers, bleaching agents and the like using hypochlorite are used as alkaline compositions. However, although the alkaline composition has excellent cleaning performance, further improvement is required in terms of safety during handling.

[0005]

Means for Solving the Problems The present invention relates to one or more kinds of (A) selected from hypochlorite and hypochlorous acid (hereinafter referred to as "A").
Component (A)] and at least one kind selected from amphoteric surfactants and cationic surfactants (B) [hereinafter, (B)
Component) and a pH adjuster (C) (hereinafter, referred to as component (C)).

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION As the hypochlorite of the component (A), alkali metal hypochlorites such as potassium hypochlorite and sodium hypochlorite, calcium hypochlorite, and hypochlorite Alkaline earth metal hypochlorites such as magnesium oxychloride and the like, and alkali metal hypochlorites are preferable,
Particularly, sodium hypochlorite is preferable. The component (A)
The effective chlorine concentration of the composition is preferably 1 to 5000 pp
m, more preferably 10 to 1000 ppm, even more preferably 50 to 500 ppm.

Examples of the amphoteric surfactant of the component (B) include amine oxides such as alkyldimethylamine oxide, betaines such as alkyldimethylamino fatty acid betaine and alkylcarboxymethylhydroxyethyl imidazolium betaine. Above all, carbon number 8-1
Alkyl dimethylamine oxide having an alkyl group of 8 is preferred. Examples of the cationic surfactant of the component (B) include a primary amine salt, a secondary amine salt, a tertiary amine salt, and a quaternary ammonium salt. Is particularly preferred. As the quaternary ammonium salt, at least one of the four substituents is an alkyl or alkenyl group having 8 to 28 carbon atoms in total, and the remainder is a benzyl group, an alkyl group having 1 to 5 carbon atoms, and an alkyl group having 1 to 5 carbon atoms. And a compound which is a group selected from a hydroxyalkyl group. An alkyl or alkenyl group having a total of 8 to 28 carbon atoms may be an alkoxyl group,
An alkenyloxy group, an alkanoylamino group, an alkenoylamino group, a composition of the present invention which may be substituted with an alkanoyloxy group or an alkenoyloxy group,
It is preferred that the component (B) be contained in an amount of 1 ppm to 5% by weight, more preferably 5 ppm to 1% by weight, particularly preferably 10 to 5000 ppm.

In the composition of the present invention, the weight ratio of the component (A) to the component (B) is (A) / (B) = 10/1 to 1
/ 10, and more preferably 5/1 to 1/10.
It is 1/5, particularly preferably 5/1 to 1/2.

The component (C) includes an alkali metal hydroxide, an alkaline earth metal hydroxide, an inorganic acid or a salt thereof, an organic acid or a salt thereof, and the like. Examples of alkali metal hydroxides and alkaline earth metal hydroxides include sodium hydroxide, potassium hydroxide, calcium hydroxide and the like. Inorganic acids or salts thereof include hydrochloric acid, sulfuric acid,
Sodium sulfate, sodium nitrate, sodium chloride, sodium carbonate, potassium bicarbonate, sodium bicarbonate, potassium bicarbonate, magnesium sulfate, magnesium nitrate, magnesium chloride, magnesium carbonate, trisodium phosphate, tripotassium phosphate, dihydrogen phosphate Sodium, dipotassium hydrogen phosphate, sodium dihydrogen phosphate, potassium dihydrogen phosphate, sodium polyphosphate and the like. Examples of the organic acid or a salt thereof include malonic acid, succinic acid, glutaric acid, adipic acid, a saturated dibasic acid such as sebacic acid or a salt thereof, and fumaric acid or an unsaturated dibasic acid such as maleic acid or a salt thereof. No. Preferably, it is a saturated dibasic acid or a salt thereof, more preferably a saturated dibasic acid having 3 to 10 carbon atoms or a salt thereof, and particularly preferably succinic acid or a salt thereof.

The composition of the present invention has a pH (20 ° C.) of 3 to
8, more preferably 5 to 8, particularly preferably 5 to 7.
The component (C) is preferably used in such an amount that the pH falls within this range.

In the composition of the present invention, an excellent mold-removing effect can be obtained by a low-concentration, short-time treatment as compared with a conventional mold-removing agent, but this is due to the high oxidizing power of hypochlorite. It is thought to be due to the synergistic effect of the decomposition of the components and the high osmotic power of the amphoteric surfactant or the cationic surfactant.
In addition, since the oxidation-reduction potential of hypochlorite is generally higher in the neutral region than in the alkaline region, the composition of the present invention maintains cleaning performance even when used in a more safe neutral region. It is considered to be.

Further, the composition of the present invention can be further stably compounded with hypochlorous acid and / or a salt thereof, and anionic surfactant (D) [hereinafter referred to as (D) )
A component). Examples of anionic surfactants include higher fatty acid salts, higher alcohol sulfates, higher alcohol sulfonates, sulfated fatty acid salts, sulfonated fatty acid salts, phosphate ester salts, fatty acid ester sulfates, and fatty acid ester sulfones. Acid ester salt, higher alcohol ether sulfate ester salt, higher alcohol ether sulfonic acid ester salt,
Acetates substituted with higher alcohol ethers, condensates of fatty acids and amino acids, alkylolated sulfates of fatty acid amides, alkylated sulfonates of fatty acid amides, sulfosuccinates, alkylbenzene sulfonates,
Alkyl phenol sulfonate, alkyl naphthalene sulfonate, alkyl benzimidazole sulfonate, amide ether carboxylic acid or salt thereof, ether carboxylic acid or salt thereof, N-acyl-N-methyltaurine or salt thereof, amide ether sulfate or its salt Salt, N-acylglutamic acid or a salt thereof, N-amidoethyl-N-hydroxyethylacetic acid or a salt thereof, acyloxyethanesulfonic acid or a salt thereof, N-acyl-β-alanine or a salt thereof, N-acyl-N-carboxyethyl Examples include taurine or a salt thereof, N-acyl-N-carboxyethylglycine or a salt thereof, and alkyl or alkenylaminocarbonylmethyl sulfate or a salt thereof. The compounding amount of the anionic surfactant is 1 ppm to 5% by weight, more preferably 10 ppm to 0.5% by weight, particularly 50 to 500 ppm in the composition.
Is preferred.

[0013]

According to the present invention, a fungicide composition exhibiting an excellent mold removing and cleaning effect can be obtained by using the same fungicide as a normal fungicide.

[0014]

EXAMPLES Examples 1 to 5 and Comparative Examples 1 to 3 The following tests were carried out using compositions having the components shown in Table 1. Table 1 shows the results. The effective chlorine concentration in Table 1 is measured according to JIS K-0101 “Iodine method”.

Each composition is prepared by mixing a predetermined amount of an aqueous solution of sodium hypochlorite (effective chlorine concentration: 60,000 ppm) with the component (B) or the component (D) to an ion concentration of twice the final compounding concentration. It was obtained by mixing equal amounts of a mixture diluted with exchanged water and a mixture of succinic acid diluted with ion-exchanged water to twice the final compounding concentration.

In each of the tests below, the compositions of Table 1
The test aqueous solution diluted so as to have an effective chlorine concentration of 1 was used.

(1) Mold removal test (1-1) Preparation of mold stain plate Mold (fungus, Aspergillus niger IFO634) was used as a test bacterium.
1) was cultured at 25 ° C. for 7 days using a PDA medium.
After the obtained cells were homogenized using a glass ball method, foreign substances were removed with sterile gauze to obtain a bacterial solution (about 10 ⁵ cell / m 2).
l).

0.5 ml of this bacterial solution is inoculated on an ABS resin plate (length 76 mm × width 26 mm × thickness 1 mm).
After culturing at 30 ° C. and 90% RH for 3 days, a mold stained plate was obtained.

(1-2) Mold stain cleaning power 1 ml of an aqueous solution (temperature: 25 ° C.) obtained by further diluting the composition comprising the components shown in Table 1 with sterilized ion-exchanged water was inoculated into a mold stain plate, and after 15 minutes, washed with water. After air-drying, the state of the plate was visually observed and evaluated according to the following five grades. Table 1 shows the results. 5 ... Mold stain is completely removed. 4: Mold stains are almost removed. 3: About half of mold stains are removed. 2: Mold stains are hardly removed. 1: No mold stains are removed.

(1-3) Bactericidal activity A predetermined area of a plate (10 mm × 1) inoculated with the diluted aqueous solution (temperature: 25 ° C.), washed with water and air-dried in the above (1-2).
0 mm) was wiped off with a sterile cotton swab, and the cotton swab was immersed in 1 ml of sterile water to suspend the adhered substance.
DA medium (containing 3.3% sodium thiosulfate) was inoculated. After culturing at 25 ° C. for 7 days, it was visually observed whether or not the mold had grown. Table 1 shows the results.

[0021]

[Table 1]

(1): The value in parentheses indicates the effective chlorine concentration. (2): Amphitol 20N (manufactured by Kao Corporation, effective component 3)
5%) so that the concentration of the active ingredient became the value in Table 1. (3): Sanizole C (manufactured by Kao Corporation, effective content 50%)
The concentration of the effective component was adjusted to the value shown in Table 1 by using. (4): Emar 20C (manufactured by Kao Corporation, effective component 25)
%), The concentration of the active ingredient was adjusted to the value shown in Table 1. (5): Using Emulgen 106 (manufactured by Kao Corporation), the effective component concentration was adjusted to the value shown in Table 1.

Example 6, Comparative Example 4 Of the so-called electrolytic oxidized water obtained by the diaphragm method, hypochlorous acid water (pH (25 ° C.) 2.7, effective chlorine concentration 50 ppm) generated on the anode side was used. The pH was adjusted to 11 with an aqueous 0.1 mol / L sodium hydroxide solution to obtain a composition of Comparative Example 4 in Table 2. In addition, the above hypochlorous acid solution is
After adjusting the pH to 5 with an aqueous sol / L disodium succinate solution, the mixture was added so that the concentration of lauryl dimethylamine oxide (the same as in Example 1) became 25 ppm to obtain the composition of Example 6 in Table 2. Using them, a test of mold stain cleaning power and sterilization power was performed in the same manner as in Example 1. Table 2 shows the results
Shown in

[0024]

[Table 2]

Continued on the front page (72) Inventor Tetsuya Okano 1334 Minato, Wakayama-shi, Wakayama Pref. Inside the Kao Research Institute (72) Inventor Shigeru Tamura 1334 Minato, Wakayama-shi, Wakayama Pref. BA05 BA06 BB04 BB18 BC06 BC18 DA13 DD05 DE17

Claims (5)

[Claims] 1. A pH adjuster comprising at least one kind selected from hypochlorite and hypochlorous acid (A), at least one kind selected from amphoteric surfactants and cationic surfactants (B), and a pH adjuster (C) A mold remover composition comprising: 2. The fungicide composition according to claim 1, which has a pH of 3 to 8 at 20 ° C. 3. The fungicide composition according to claim 1, wherein the pH adjuster (C) is at least one selected from organic acids and salts thereof. 4. The fungicide composition according to claim 1, further comprising an anionic surfactant (D). 5. The mold remover composition according to claim 1, which comprises an amine oxide as the component (B).