JP2001301878A - Transportation container for semiconductor wafer package container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transportation container for a semiconductor wafer package container to be used in transportation of containers of semiconductor wafers wherein the semiconductor wafers can be stably held for transportation even if the containers are stacked in multiple stages for transportation. SOLUTION: The transportation container houses and transports a plurality of package containers which house the semiconductor wafers, wherein the container is molded by reaction-injection-molding of polydicyclopentadiene and comprises reinforcement ribs 121, 142, 151, 152, 161, 162.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container used for transporting packaging containers containing semiconductor wafers in containers.

[0002]

2. Description of the Related Art When a semiconductor wafer is transported from a wafer maker to a device maker, the semiconductor wafer is packed in a container having an airtight structure, and the packing container is placed in an aluminum alloy container in a plurality of rows in front, rear, left and right. The container is packed in a plurality of stages and packed with a styrofoam intermediate between the packaging container and the inner surface of the container and between the packaging containers, and transported by container. Various structures have been proposed for the packaging container. For example, for example, a large number of semiconductor wafers are vertically accommodated in a wafer carrier with a gap therebetween, and a peripheral edge of a wafer group exposed from the wafer carrier is supported. A wafer retainer for supporting the part, the container retainer and the lid are conjugated to each other, and the container body and the lid are hermetically sealed with a gasket and fastened by nap fitting to correspond to the circular shape of the semiconductor wafer. Because of its nature, the upper and lower sides of the container are mirror-finished, and the carrier, the retainer, the container body and the lid are made of plastic such as polypropylene, polycarbonate and polyester.

[0003]

The above containers are often transported in two or three stages in order to increase the efficiency of transportation. However, the conventional aluminum alloy container has a large weight, is disadvantageous in terms of transportation efficiency, and is required to be reduced in weight. Recently, a reaction injection molded product of polydicyclopentadiene having a short molding time, excellent productivity, and excellent impact resistance has been put to practical use for parts of industrial machines and the like. It is considered that this reaction injection molded article of polydicyclopentadiene is effective.

[0004] Since polydicyclopentadiene is a plastic, its bending rigidity [EI] is smaller than that of the above-mentioned aluminum alloy. When the container receives an external load, a stress is generated in the styrofoam intermediate, and the stress is transmitted to the wafer packaging container. The transmitted force f is represented by w, the external load, and the bending synthesis of the container wall [E
I], assuming that the Young's modulus of the foamed styrol intermediate is [E], the deflection of the container wall, (wf) A / [EI] (A is a coefficient determined by the dimensions and shape of the container wall)
And the strain of the inclusion, fB / [E] (B is a coefficient determined by the size of the inclusion, etc.)

F = w / {1+ (B [EI] / A [E])} (1) holds, and the transmission force to the wafer packaging container can be generally grasped from Expression (1).

[0005] Thus, simply replacing the aluminum alloy container with the reaction injection molded article of polydicyclopentadiene makes the polydicyclopentadiene reaction injection molded container [EI] less than the aluminum alloy container [EI]. The load w acting on the outer surface of the container during transportation
The ratio f / w of the load f transmitted to the semiconductor wafer packaging container is larger in the reaction injection molded container of polydicyclopentadiene.

[0006] Since a semiconductor wafer is a thin slice of a single crystal such as silicon, it is brittle and is liable to be contaminated by contact friction. It is necessary to manufacture the wafer packaging container firmly so as to prevent sliding friction at the contact portion between the carrier and the retainer and the wafer and to keep the gasket airtight. Therefore, the cost of the wafer packaging container must be increased.

An object of the present invention is to provide a semiconductor wafer packaging container transport container which can stably hold and transport semiconductor wafers even when containers are transported in a multi-tiered container in a container used for transporting semiconductor wafers in containers. Is to do.

[0008]

A container for transporting a semiconductor wafer packaging container according to the present invention is a container for accommodating and transporting a plurality of packaging containers accommodating semiconductor wafers,
It is formed by reaction injection molding of polydicyclopentadiene, and has a reinforcing rib, and comprises a container body and a lid bonded to a four-sided flange of the container body opening. A reinforcing rib is formed on the back side wall, and a fork insertion groove of a lift is provided on one of the four side flanges of the container body opening,
Reinforcing ribs are formed on the wall surface of the container body supported by the fork, and furthermore, the corners of the square outer surface of the container body and the outer surfaces of the three-way wall other than the bottom wall and the inner side wall in the longitudinal direction extend in the longitudinal direction. Reinforcing ribs can be formed.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a perspective view showing an example of the container body of the semiconductor wafer packaging container transport container according to the present invention, FIG. 1B is a cross-sectional view taken along the line B in FIG. (C) is a sectional view taken along the line c-b of FIG. FIG. 2 (A) is FIG. 1 (A)
, FIG. 2 (B) shows a rear view in FIG. 1 (A), and FIG. 2 (C) shows a side view in FIG. 1 (A). The container body 11 and a lid described later are both formed by reaction injection molding of polydicyclopentadiene. That is, A comprising a dicyclopentadiene monomer, a metal catalyst and an additive (filler)
A reactive undiluted solution of a solution, a dicyclopentadiene monomer, an activator (triethylaluminum), a reaction retarder, and an additive is passed through a mixing chamber under high pressure and injected and injected into a closed mold. The agent is used to control the progress of the exothermic reaction, and is molded while exposing the liquid-passing system to a nitrogen gas atmosphere to prevent oxidation and moisture.

The inner side wall 12 of the container body 11 has a structure shown in FIG.
(B), a grid-like rib 121 (a concave groove-like rib as shown in (a) of FIG. 3 showing an II section of (b) of FIG. 2) is provided. Fig. 1
(A), a four-way flange 13 is formed, and the four-way flange 13 and the grid-like rib 121 of the rear side wall 12 are mainly subjected to a vertical load (arrow A in (a) of FIG. 1). In contrast, it has a reinforcing effect. As shown in FIG. 1 (b), a concave portion 141 for receiving a fork of a lift is formed on the back surface side of the bottom wall 14 of the container body, and (a) of FIG. As shown in FIG.
2 (projected ribs as shown in (b) of FIG. 3 showing a cross section of (b) of FIG. 2). As shown in FIGS. 1 (a) and 1 (c), the upper edge of the lower flange 131 in the four-sided flange and the bottom wall upper surface 140 are flush with each other to ensure smooth entry / exit of articles. As shown in FIG. 1 (c), the lower edge of the flange 131 and the lower end of the grid-like rib 142 are at the same level to ensure smooth support by the fork of the lift. In FIGS. 1 (a) and 1 (b), 151, 151, 152 and 152 are longitudinal ribs formed by increasing the thickness along the corners of the square outer surface of the container body, 161,. Are ribs formed in the longitudinal direction on the outer surfaces of the three walls except for the bottom wall 14 and the rear side wall 12, and the ribs (increase in the load in the direction B in FIG. It has a reinforcing effect together with the meat portions 151 and 152.

FIGS. 4A and 4B are cross-sectional views taken along line B-B of FIG. 4A showing a packing structure for transporting a semiconductor wafer packaging container using the container according to the present invention. ing. In FIG. 4, reference numeral 11 denotes a container body. 11
Reference numeral 0 denotes a lid which is connected to the four-sided flange 13 of the opening of the container main body by bolts and nuts 130,..., Similarly to the container main body 11, manufactured by reaction injection molding of polydicyclopentadiene. A groove for fork insertion is formed. Reference numerals 2,... Denote packaging containers accommodating semiconductor wafers. For example, a plurality of semiconductor wafers are vertically supported with a gap therebetween in a wafer carrier having a plurality of vertically parallel wafer support grooves. A wafer retainer is brought into contact with the exposed peripheral portion of the wafer group, and these are held together by a container body and a lid having a mirror-finished container structure. The space between the container body and the lid is hermetically sealed with a gasket, and a knuck fitting is performed. It can be fastened by wearing. In addition, the upper and lower disk portions are integrated by mirror-symmetrical side walls on both sides, and a large number of semiconductor wafers are supported in a multistage horizontal direction in a wafer cassette provided with a large number of horizontal support grooves on the inner surface of the side wall. It is also possible to use a horizontal type in which an arc-shaped lid provided with a number of horizontal support grooves is in contact with both openings (wafer access ports) of the cassette via gaskets, and the two are fastened by knucking. It is. Reference numerals 31 to 33 denote styrofoam intervening bodies, in which the above-mentioned wafer packaging container 2 is arranged in a plurality of rows in front and rear, right and left, and in multiple stages (in the illustrated example,
When housed in a container in three rows on the left and right, two rows on the front and back, three rows of 18), they are interposed between the packaging containers and between the packaging container and the inner surface of the container.

The container for transporting semiconductor wafer packaging containers according to the present invention is a reaction injection-molded product of polydicyclopentadiene, is light in weight, is easy to handle, and has excellent impact resistance of the polydicyclopentadiene reaction-injection molded product. Due to its strength, it is safe to handle it under harsh conditions, and high-speed and efficient collection of empty containers can be achieved. Further, even if the containers accommodating the semiconductor wafer packaging containers are transported in a multi-stage stack, an excessive load (in the illustrated case, a load for 36 sets of the semiconductor wafer packaging containers) acts on the lowermost container. Due mainly to the reinforcing effect of the rib on the back side wall and the four-sided flange, [EI] in the expression (1) can be made sufficiently large, and the load f acting on the semiconductor wafer packaging container in the lowermost container can be made small. . Therefore, the contamination of the wafer due to the friction between the semiconductor wafer of the packaging container in the lowermost container and the carrier or the retainer, and the deterioration of the wafer due to the decrease in airtightness due to the deformation of the gasket of the packaging container can be reliably prevented. . Further, when the container is transported by the lift, the bottom wall can be stably held by the rib on the back surface of the bottom wall, and the lift transport can be performed safely and smoothly. Furthermore, even when the container is handled with the lid facing upward, the container strength against the load can be well guaranteed by the corners on the square outer surface of the container body and the ribs formed in the longitudinal direction on the three wall outer surfaces,
Even in such a direction, the container can be transported mechanically and safely.

[0013]

The container for transporting semiconductor wafer packaging containers according to the present invention is a reaction injection-molded product of polydicyclopentadiene, but is not limited to the general features of light weight and impact resistance. Originally, the load transmission to the semiconductor wafer packaging container in the lowermost container can be suppressed well, so that the semiconductor wafer packaging container can be efficiently and safely transported in a multi-tiered container. Further, forklift transportation can be performed safely, and transportation and transportation efficiency can be dramatically improved. In addition, since it is a reaction injection molded product, unlike conventional aluminum alloy containers, there is no need to weld or bolt together members, it can be a simple structure of integral molding, and the appearance design is adjusted by curvature adjustment etc. There is also an advantage that the desired shape can be easily obtained.

[Brief description of the drawings]

FIG. 1A is a perspective view showing a container body of a container for transporting a semiconductor wafer packaging container according to the present invention;
1B is a cross-sectional view taken along the line I-A in FIG. 1A, and FIG. 1C is a cross-sectional view taken along the line I-A in FIG.

FIG. 2A is a bottom view of FIG. 1A;
FIG. 2B is a rear view of FIG. 1A, and FIG. 1C is a side view of FIG.

3A is a sectional view taken along line II in FIG. 2B and FIG. 3C, and FIG. 3B is a sectional view taken along line II in FIG.

FIG. 4 is a drawing showing a packing structure in the semiconductor wafer packaging container transport container according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Container 11 Container main body 110 Container lid 12 Back side wall 121 Rib 13 Four-sided flange 131 Lower flange 14 Bottom wall 141 Fork insertion concave part 142 Rib 151 Longitudinal reinforcement rib 152 Longitudinal reinforcement rib

Claims (4)

[Claims] A container for accommodating and transporting a plurality of packaging containers accommodating semiconductor wafers, wherein the container is molded by reaction injection molding of polydicyclopentadiene and has reinforcing ribs. For container. 2. The semiconductor wafer packaging container according to claim 1, further comprising a container body, and a lid connected to a four-sided flange of the container body opening, wherein a reinforcing rib is formed on an inner side wall of the container body. Shipping container. 3. A fork insertion groove for a lift is provided in one flange of the four-sided flange of the container body opening, and a reinforcing rib is formed on a wall surface of the container body supported by the fork. A container for transporting a semiconductor wafer packaging container according to the above. 4. The semiconductor wafer packaging container according to claim 3, wherein longitudinal corner reinforcing ribs are formed in the longitudinal direction on the corners of the square outer surface of the container body and on the outer surfaces of the three-sided wall other than the bottom wall and the rear side wall. Shipping container.