JP2001300902A - Apparatus for removing chip of cutter with laser oscillator - Google Patents

Apparatus for removing chip of cutter with laser oscillator

Info

Publication number
JP2001300902A
JP2001300902A JP2000120535A JP2000120535A JP2001300902A JP 2001300902 A JP2001300902 A JP 2001300902A JP 2000120535 A JP2000120535 A JP 2000120535A JP 2000120535 A JP2000120535 A JP 2000120535A JP 2001300902 A JP2001300902 A JP 2001300902A
Authority
JP
Japan
Prior art keywords
laser oscillator
cutting
holder
brush
circular saw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000120535A
Other languages
Japanese (ja)
Other versions
JP2001300902A5 (en
Inventor
Shigeharu Ushiwatari
繁春 牛渡
Ryuichi Imamura
隆一 今村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Holdings Co Ltd
Original Assignee
Hitachi Koki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Koki Co Ltd filed Critical Hitachi Koki Co Ltd
Priority to JP2000120535A priority Critical patent/JP2001300902A/en
Publication of JP2001300902A publication Critical patent/JP2001300902A/en
Publication of JP2001300902A5 publication Critical patent/JP2001300902A5/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PROBLEM TO BE SOLVED: To remove chips sticking to an irradiation part of a laser oscillator with which a cutting position of a cutting edge is accurately irradiated. SOLUTION: The laser oscillator 30 is supported on a front face of a holder 5, and a brush 35 is provieded at an air emission opening 8b from which air flows out backward to a lower part of a circular part 8, and the circular part 8. In a process wherein the circular saw part 8 is transferred from an upper limit position to a low limit position, the brush 35 comes in contact with an irradiation part 30a of the laser oscillator 30, besides a cooling wind from a motor 13 is allowed to blow against the brush and the irradiation part 30a of the laser oscillator 30 to remove the chips sticking to the irradiation part 30a of the laser oscillator 30.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はレーザー発振器を備
えた卓上丸のこ等のレーザー発振器付切断機の切り屑除
去装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip removing device for a cutting machine with a laser oscillator, such as a desktop circular saw having a laser oscillator.

【0002】[0002]

【従来の技術】切断材料に切断刃物の切断位置を示すレ
ーザー光を照射するレーザー発振器を設けた切断機があ
る。
2. Description of the Related Art There is a cutting machine provided with a laser oscillator which irradiates a cutting material with laser light indicating a cutting position of a cutting blade.

【0003】[0003]

【発明が解決しようとする課題】切断作業を繰り返して
いると、切り屑がレーザー発振器の照射部に直接飛散し
て付着したり、空気中を浮遊する切り屑がレーザー発振
器の照射部に付着する場合がある。切り屑が付着した部
分のレーザー光は、光が薄くなったり、遮られたり、ま
たは切り屑によりレーザー光が屈折し真直な線にならな
い場合があった。この結果切断刃物の切断位置を正確に
示すことができなくなる問題があった。
When the cutting operation is repeated, chips are scattered and adhere directly to the irradiated portion of the laser oscillator, and chips floating in the air adhere to the irradiated portion of the laser oscillator. There are cases. In some cases, the laser light in the portion where the chips were attached was thinned or blocked, or the laser light was refracted by the chips and did not become a straight line. As a result, there has been a problem that the cutting position of the cutting blade cannot be accurately indicated.

【0004】本発明の目的は、上記した従来技術の問題
点を解消し、レーザー光を用いて切断刃物の切断位置を
正確に照射できるようにすることである。
An object of the present invention is to solve the above-mentioned problems of the prior art, and to accurately irradiate a cutting position of a cutting blade using a laser beam.

【0005】[0005]

【課題を解決するための手段】上記目的は、切断材料を
支持するベース部にホルダを立設し、ホルダにベース部
に向けて上下移動可能な切断刃物部および切断材料の上
面を照射するレーザー発振器を設けた切断機において、
前記レーザー発振器の前面に空気を吹き付けることによ
り達成される。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a cutting tool which can be moved up and down toward a base, and a laser for irradiating an upper surface of the cutting material. In a cutting machine equipped with an oscillator,
This is achieved by blowing air on the front surface of the laser oscillator.

【0006】[0006]

【発明の実施の形態】本発明の一実施形態を図1〜図9
により説明する。本実施形態では、切断機を卓上丸のこ
として説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention is shown in FIGS.
This will be described below. In the present embodiment, the cutting machine is described as a desk circle.

【0007】ベース1の中央にターンテーブル2を水平
方向へ回動可能に埋設し、ターンテーブル2の上面がベ
ース1の上面と同一面となるようにしている。ベース1
およびターンテーブル2の上面には木材等の切断材料4
0が載置される。ベース1上面に切断材料40の側面を
支持するフェンス3が固定されている。ターンテーブル
2後端にはホルダシャフト4を介してホルダ5を立設
し、ホルダシャフト4の軸心をターンテーブル2上面と
ほぼ一致するように位置させることで、ホルダ5はホル
ダシャフト4を支点にかつターンテーブル2の上面を中
心に左右傾斜可能に支持される。
A turntable 2 is embedded in the center of the base 1 so as to be rotatable in the horizontal direction, so that the upper surface of the turntable 2 is flush with the upper surface of the base 1. Base 1
And a cutting material 4 such as wood on the upper surface of the turntable 2.
0 is placed. A fence 3 supporting the side surface of the cutting material 40 is fixed to the upper surface of the base 1. At the rear end of the turntable 2, a holder 5 is erected via a holder shaft 4, and the axis of the holder shaft 4 is positioned so as to substantially coincide with the upper surface of the turntable 2. And is tiltable left and right about the upper surface of the turntable 2.

【0008】図7に示すように、ホルダ5の後部にはホ
ルダシャフト4を中心とする長穴5aが形成され、長穴
5aにクランプレバー6を貫通させ、クランプレバー6
の先端に形成したねじ部がターンテーブル2背面に形成
したねじ穴部にねじ嵌合している。クランプレバー6を
緩めると、ホルダ5はホルダシャフト4を支点に長穴5
aの範囲内で傾斜し、クランプレバー6を締め付ける
と、ホルダ5はターンーブル2とクランプレバー6間に
締め付けられ、任意位置で固定される。なお、長穴5a
はホルダ5が左右45度傾斜できる範囲内に形成されて
いる。
As shown in FIG. 7, an elongated hole 5a centering on the holder shaft 4 is formed at the rear portion of the holder 5, and a clamp lever 6 is passed through the elongated hole 5a.
The threaded portion formed at the tip of is screwed into the threaded hole formed on the back of the turntable 2. When the clamp lever 6 is loosened, the holder 5 is
When the clamp lever 6 is tightened by tilting within the range of a, the holder 5 is tightened between the turntable 2 and the clamp lever 6 and fixed at an arbitrary position. In addition, the long hole 5a
Is formed in a range in which the holder 5 can be tilted by 45 degrees left and right.

【0009】ホルダ5上方にはシャフト7を介してベー
ス1上面に対し上下揺動可能に本発明切断刃物本体を構
成する丸のこ部8を軸支している。ホルダ5と丸のこ部
8の間には、丸のこ部8を上方に付勢するスプリング9
が設けられている。
Above the holder 5, a circular saw part 8 constituting the cutting blade body of the present invention is pivotally supported via a shaft 7 so as to be vertically swingable with respect to the upper surface of the base 1. A spring 9 for urging the circular saw 8 upward is provided between the holder 5 and the circular saw 8.
Is provided.

【0010】丸のこ部8は、スピンドル16、のこ刃1
0、のこ刃10の上半部を覆うのこカバー11、のこ刃
10を駆動するモータ13、モータ13の冷却用ファン
27を固着したモータ軸14、伝達ベルト23およびハ
ンドル26等により構成されている。
The circular saw portion 8 includes a spindle 16 and a saw blade 1.
0, a saw cover 11 covering the upper half of the saw blade 10, a motor 13 for driving the saw blade 10, a motor shaft 14 to which a cooling fan 27 of the motor 13 is fixed, a transmission belt 23, a handle 26, and the like. Have been.

【0011】図9に示すように、ギヤケース12の下方
には、水平方向に延びたスピンドル16を設け、スピン
ドル16は軸受17、18に回転可能に支持され、スピ
ンドル16の先端にボルト19を介してのこ刃10を固
定し、スピンドル16に動力を伝達するプーリ20が設
けられている。ギヤケース12上方にはモータハウジン
グ15が設けられ、その内部にのこ刃10を駆動するモ
ータ13が設けられている。軸受21に回転可能に支持
されたモータ13のモータ軸14の先端に、プーリ22
がプーリ20の上方に位置するように設けられている。
プーリ20、22間に伝達ベルト23を張り渡してい
る。伝達ベルト23によりモータ13の回転は、モータ
軸14からプーリ22、伝達ベルト23、プーリ20、
スピンドル16を介してのこ刃10に伝達される。冷却
用ファン27を固着したモートル軸14の回転により発
生した冷却風は丸のこ部8の風路8aを介して丸のこ部
8下部後方の排出口8bへ流出する。
As shown in FIG. 9, below the gear case 12, a horizontally extending spindle 16 is provided. The spindle 16 is rotatably supported by bearings 17 and 18, and a tip of the spindle 16 is provided with a bolt 19 via a bolt 19. A pulley 20 for fixing the lever blade 10 and transmitting power to the spindle 16 is provided. A motor housing 15 is provided above the gear case 12, and a motor 13 for driving the saw blade 10 is provided therein. A pulley 22 is attached to the tip of the motor shaft 14 of the motor 13 rotatably supported by the bearing 21.
Are provided above the pulley 20.
A transmission belt 23 is stretched between the pulleys 20 and 22. The rotation of the motor 13 by the transmission belt 23 causes the pulley 22, the transmission belt 23, the pulley 20,
The power is transmitted to the saw blade 10 via the spindle 16. The cooling air generated by the rotation of the motor shaft 14 to which the cooling fan 27 is fixed flows out to the outlet 8 b behind the circular saw 8 through the air passage 8 a of the circular saw 8.

【0012】ホルダ5の前面にはV字状の突起部5bが
装着され、ターンテーブル2上面後方には突起部5bの
移動軌跡上に位置するストッパボルト24、25が直角
方向にねじ嵌合している。ホルダ5を傾斜させると、所
定の傾斜角度で突起部5bがストッパボルト24または
ストッパボルト25の頭部に係合し、丸のこ部8の傾斜
位置を設定する。通常、ストッパボルト24、25は、
ホルダ5が左右方向に45度の位置に傾斜した時に突起
部5bに係合するように設けられている。
A V-shaped projection 5b is mounted on the front surface of the holder 5, and stopper bolts 24 and 25 located on the movement locus of the projection 5b are screwed in a right angle direction on the rear of the upper surface of the turntable 2. ing. When the holder 5 is inclined, the protrusion 5b engages with the head of the stopper bolt 24 or the stopper bolt 25 at a predetermined inclination angle, and sets the inclined position of the circular saw 8. Usually, the stopper bolts 24 and 25 are
The holder 5 is provided so as to engage with the protrusion 5b when the holder 5 is inclined at a position of 45 degrees in the left-right direction.

【0013】ターンテーブル2の上面には、中央にのこ
刃10が侵入する溝部を有する図示しない刃口板が固定
され、切断材料40の切断時、のこ刃10の下端がター
ンテーブル2上面よりも下降した時、刃口板の溝部に侵
入し、切断材料40の仕上面へのけば立ちを防止するよ
うにしている。
On the upper surface of the turntable 2, a blade plate (not shown) having a groove at the center into which the saw blade 10 enters is fixed, and when the cutting material 40 is cut, the lower end of the saw blade 10 is placed on the upper surface of the turntable 2. When the cutting material 40 descends further, it penetrates into the groove portion of the blade plate to prevent the cutting material 40 from fuzzing on the finished surface.

【0014】図3において、ホルダ5の前面に支持部材
32を固定し、レーザー発振器30が収納されている。
支持部材32は丸のこ部8が上限位置にある時、レーザ
ー光Lの一部または全部がのこ刃10の下方を通過する
ようにレーザー発振器30を設けている。レーザー光L
は、レーザー発振器30の照射部30aから照射され、
丸のこ部8を下方に揺動した時ののこ刃10の切断位置
を示す。また本実施形態では、レーザー発振器30の照
射部30aは、のこ刃10の刃先10aの延長線上に位
置している。なお、レーザー発振器30には、図示を省
略したが、レーザー光Lを照射するためのスイッチを設
けている。
In FIG. 3, a support member 32 is fixed to the front surface of the holder 5 and a laser oscillator 30 is housed therein.
The support member 32 is provided with a laser oscillator 30 so that part or all of the laser light L passes below the saw blade 10 when the circular saw portion 8 is at the upper limit position. Laser light L
Is irradiated from the irradiation unit 30a of the laser oscillator 30,
The cutting position of the saw blade 10 when the circular saw 8 is swung downward is shown. In the present embodiment, the irradiation unit 30a of the laser oscillator 30 is located on an extension of the cutting edge 10a of the saw blade 10. Although not shown, the laser oscillator 30 is provided with a switch for irradiating the laser beam L.

【0015】丸のこ部8下部後方には切り屑除去部材を
構成する多数の軟質繊維(例えばナイロン等)からなり
レーザー発振器30側に向かって突出するブラシ35が
取り付けられている。
A brush 35 made of a number of soft fibers (for example, nylon) constituting a chip removing member and protruding toward the laser oscillator 30 is attached to a lower rear portion of the circular saw portion 8.

【0016】上記構成において、丸のこ部8が上限位置
にある時、レーザー発振器30から照射されたレーザー
光Lは、のこ刃10の刃先10aよりも下方を通過する
ので、のこ刃10に邪魔されることなく切断材料40の
上面を照射する。切断材料40の上面に切断位置を示す
図示しない墨線を記し、切断材料40を左右に移動させ
て、墨線をレーザー光Lに一致させる。これにより、の
こ刃10の刃先10aと墨線が一致したことになる。
In the above configuration, when the circular saw portion 8 is at the upper limit position, the laser beam L emitted from the laser oscillator 30 passes below the cutting edge 10a of the saw blade 10, so that the saw blade 10 Irradiates the upper surface of the cutting material 40 without being disturbed. A black line (not shown) indicating a cutting position is written on the upper surface of the cutting material 40, and the cutting material 40 is moved right and left so that the black line matches the laser beam L. As a result, the blade edge 10a of the saw blade 10 and the black line coincide.

【0017】次に、丸のこ部8のハンドル26を握り、
丸のこ部8を下方に揺動させ、切断材料40を切断す
る。この過程で図2に示すように、切り屑41aはレー
ザー発振器30の照射部30aに向かって飛散するた
め、切り屑41が照射部30aに付着する場合がある。
丸のこ部8を下降させると、丸のこ部8下部後方の空気
排出口8bと丸のこ部8に取り付けられたブラシ35が
レーザー発振器30の照射部30aに近づき(図4)、
ブラシ35が照射部30aに接触し(図5)、また、ブ
ラシ35が照射部30aに押し付けられることで、照射
部30aに付着した切り屑41が掃き取られる(図
6)。更に丸のこ部8の風路8aを介して丸のこ部8下
部後方の空気排出口8bから流出する冷却風がブラシ3
5及び照射部30aに吹き付けられ、切り屑41が吹き
飛ばされる。
Next, grasp the handle 26 of the circular saw portion 8,
The circular saw 8 is swung downward to cut the cutting material 40. In this process, as shown in FIG. 2, the chips 41a are scattered toward the irradiation unit 30a of the laser oscillator 30, so that the chips 41 may adhere to the irradiation unit 30a.
When the circular saw 8 is lowered, the air outlet 8b at the lower rear of the circular saw 8 and the brush 35 attached to the circular saw 8 approach the irradiation part 30a of the laser oscillator 30 (FIG. 4).
When the brush 35 contacts the irradiation unit 30a (FIG. 5), and the brush 35 is pressed against the irradiation unit 30a, the chips 41 attached to the irradiation unit 30a are swept away (FIG. 6). Further, the cooling air flowing out of the air outlet 8b behind the lower part of the circular saw 8 through the air passage 8a of the circular saw 8
5 and the irradiating section 30a, and the chips 41 are blown off.

【0018】[0018]

【発明の効果】本発明によれば、切断刃物本体を下降さ
せると、切断刃物本体に取り付けられたブラシがレーザ
ー発振器の照射部に接触すると共に切断刃物本体下部後
方の空気排出口から流出する空気がブラシ及びレーザー
発振器の照射部に吹き付けられ、これらに付着した切り
屑は除去されるので、常に切断刃物の位置を正確に照射
することができる。
According to the present invention, when the cutting blade body is lowered, the brush attached to the cutting blade body comes into contact with the irradiating portion of the laser oscillator and the air flows out of the air outlet at the lower rear of the lower portion of the cutting blade body. Is sprayed onto the irradiating portion of the brush and the laser oscillator, and the chips attached thereto are removed, so that the position of the cutting blade can always be accurately irradiated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明切断機を卓上丸のこに適用した一実施形
態を示す側面図。
FIG. 1 is a side view showing an embodiment in which the cutting machine of the present invention is applied to a desk circular saw.

【図2】図1の切断時を示す側面図。FIG. 2 is a side view showing the state of FIG. 1 at the time of cutting;

【図3】図1の卓上丸のこの正面の一部を示す図1の右
側面図。
FIG. 3 is a right side view of FIG. 1 showing a part of the front of the desk circle of FIG. 1;

【図4】レーザー発振器周辺を示す部分側面図。FIG. 4 is a partial side view showing the periphery of a laser oscillator.

【図5】レーザー発振器周辺を示す部分側面図。FIG. 5 is a partial side view showing the periphery of a laser oscillator.

【図6】レーザー発振器周辺を示す部分側面図。FIG. 6 is a partial side view showing the periphery of a laser oscillator.

【図7】図1の卓上丸のこの背面の一部を示す図1の左
側面図。
7 is a left side view of FIG. 1 showing a part of the back surface of the desk circle of FIG. 1;

【図8】図1のA−A線断面図。FIG. 8 is a sectional view taken along line AA of FIG. 1;

【図9】図1のB−B線断面図。FIG. 9 is a sectional view taken along line BB of FIG. 1;

【符号の説明】[Explanation of symbols]

5はホルダ、8は切断刃物本体(丸のこ部)、10はの
こ刃、12はギヤケース、12bは空気排出口、30は
レーザー発振器、30aは照射部、35はブラシ、40
は切断材料、41は切り屑、Lはレーザー光。
5 is a holder, 8 is a cutting blade main body (circular saw part), 10 is a saw blade, 12 is a gear case, 12b is an air outlet, 30 is a laser oscillator, 30a is an irradiation part, 35 is a brush, 40
Is a cutting material, 41 is a chip, and L is a laser beam.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 切断材料を支持するベース部にホルダを
立設し、ホルダにベース部に向けて上下移動可能な切断
刃物部及び切断材料の上面を照射するレーザー発振器を
設けた切断機において、 前記レーザー発振器の前面に空気を吹き付けて切り屑を
除去するようにしたことを特徴とするレーザー発振器付
切断機の切り屑除去装置。
1. A cutting machine in which a holder is erected on a base portion supporting a cutting material, and a cutting blade portion movable up and down toward the base portion and a laser oscillator for irradiating an upper surface of the cutting material are provided on the holder. A chip removing device for a cutting machine with a laser oscillator, characterized in that chips are removed by blowing air onto the front surface of the laser oscillator.
【請求項2】 前記切断刃物部が上限位置から下限位置
へ移動する過程で、レーザー発振器の照射部に接触する
切屑除去部材を切断刃物部に設けたことを特徴とする請
求項1項記載のレーザー発振器付切断機の切り屑除去装
置。
2. The cutting blade unit according to claim 1, wherein a chip removing member that comes into contact with an irradiation unit of the laser oscillator is provided on the cutting blade unit during the process of moving the cutting blade unit from the upper limit position to the lower limit position. Chip removal device for cutting machine with laser oscillator.
【請求項3】 前記切屑除去部材をレーザー発振器側に
向かって突出するブラシとしたことを特徴とする請求項
2項記載のレーザー発振器付切断機の切り屑除去装置。
3. A chip removing device for a cutting machine with a laser oscillator according to claim 2, wherein said chip removing member is a brush projecting toward a laser oscillator.
JP2000120535A 2000-04-21 2000-04-21 Apparatus for removing chip of cutter with laser oscillator Pending JP2001300902A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000120535A JP2001300902A (en) 2000-04-21 2000-04-21 Apparatus for removing chip of cutter with laser oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000120535A JP2001300902A (en) 2000-04-21 2000-04-21 Apparatus for removing chip of cutter with laser oscillator

Publications (2)

Publication Number Publication Date
JP2001300902A true JP2001300902A (en) 2001-10-30
JP2001300902A5 JP2001300902A5 (en) 2005-04-07

Family

ID=18631328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000120535A Pending JP2001300902A (en) 2000-04-21 2000-04-21 Apparatus for removing chip of cutter with laser oscillator

Country Status (1)

Country Link
JP (1) JP2001300902A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004154872A (en) * 2002-11-01 2004-06-03 Makita Corp Power tool
JP2007290235A (en) * 2006-04-25 2007-11-08 Makita Corp Cutting machine
CN100445005C (en) * 2004-03-26 2008-12-24 日立工机株式会社 Miter saw having circular saw blade section pivotally movable upward and downward and tiltable leftward and rightward
JP2009072911A (en) * 2008-12-27 2009-04-09 Makita Corp Power tool
US8004664B2 (en) 2002-04-18 2011-08-23 Chang Type Industrial Company Power tool control system
CN102328332A (en) * 2011-09-30 2012-01-25 芜湖宏春木业集团有限公司 Protective cover of sawing machine

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8004664B2 (en) 2002-04-18 2011-08-23 Chang Type Industrial Company Power tool control system
JP2004154872A (en) * 2002-11-01 2004-06-03 Makita Corp Power tool
JP4656806B2 (en) * 2002-11-01 2011-03-23 株式会社マキタ Electric tool
CN100445005C (en) * 2004-03-26 2008-12-24 日立工机株式会社 Miter saw having circular saw blade section pivotally movable upward and downward and tiltable leftward and rightward
US8061250B2 (en) 2004-03-26 2011-11-22 Hitachi Koki Co., Ltd. Miter saw having circular saw blade section pivotally movable upward and downward and tiltable leftward and rightward
JP2007290235A (en) * 2006-04-25 2007-11-08 Makita Corp Cutting machine
JP2009072911A (en) * 2008-12-27 2009-04-09 Makita Corp Power tool
CN102328332A (en) * 2011-09-30 2012-01-25 芜湖宏春木业集团有限公司 Protective cover of sawing machine

Similar Documents

Publication Publication Date Title
JP3925046B2 (en) Tabletop circular saw
US6755107B2 (en) Miter saw having a light beam alignment system
JPH0518082Y2 (en)
US8011283B2 (en) Desk-top cutting machine
JP2004284108A (en) Bench circular saw
JP2003039401A (en) Cutter
JP2001300902A (en) Apparatus for removing chip of cutter with laser oscillator
JP2001150401A (en) Apparatus for removing chips of cutter
JP2008073920A (en) Table cutter
JP2784424B2 (en) Table cutting machine lower limit position setting device
JP4225116B2 (en) Cutting machine
JP2001300819A (en) Portable band saw machine
JP2012157931A (en) Desk top cutting machine
JP2000246703A (en) Dust collection mechanism for cutter
US20080121347A1 (en) Wafer protection tape cutting apparatus, back lapping equipment, and wafer protection tape cutting method using the same
JP2001300902A5 (en) Cutting machine with laser oscillator
JP4300583B2 (en) Cutting machine
JP4300585B2 (en) Cutting machine
JPH09277201A (en) Cutting machine having link mechanism
JP2002178220A (en) Cutting material positioning device for cutting machine
JP3674372B2 (en) Tabletop cutting machine
JP2004314518A (en) Wood processing apparatus
JPH0428721Y2 (en)
JPH11170214A (en) Chip guiding device for slide type table cutter
JP2004284092A (en) Cutter

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040428

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040428

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050906

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051024

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20060117