JP2001150401A - Apparatus for removing chips of cutter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately irradiate a cutting position of a cutting blade with laser beams. SOLUTION: A laser oscillator 30 is supported in front of a holder 5, a brush 35 is provided on the cutting blade main body 8, and chips stuck to an irradiation part 30a of the laser oscillator 30 is swept out by the brush 35 in a process wherein the cutting blade main body 8 is moved from an upper limit position to a lower limit position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip removing device using a laser oscillator of a cutting machine such as a band saw or a table circular saw.

[0002]

2. Description of the Related Art There is a cutting machine provided with a laser oscillator which irradiates a cutting material with laser light indicating a cutting position of a cutting blade.

[0003]

When the cutting operation is repeated, chips may be scattered and adhere directly to the irradiation part of the laser oscillator, or chips floating in the air may adhere to the irradiation part of the laser oscillator. . In some cases, the laser light in the portion where the chips were attached was thinned or blocked, or the laser light was refracted by the chips and did not become a straight line. As a result, there is a problem that the cutting position of the cutting blade cannot be accurately indicated.

An object of the present invention is to solve the above-mentioned problems of the prior art and to accurately irradiate a cutting position of a cutting blade using a laser beam.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a cutting tool which can be moved up and down toward a base, and a laser for irradiating an upper surface of the cutting material. In a cutting machine provided with an oscillator, it is attained by providing a chip removing member in contact with an irradiation part of a laser oscillator in a cutting blade portion while the cutting blade portion moves from an upper limit position to a lower limit position.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a desk circular saw will be described as an example of a cutting machine.

In the figure, a turntable 2 is embedded in the center of a base 1 so as to be rotatable in a horizontal direction, and the upper surface of the turntable 2 is flush with the upper surface of the base 1. On the upper surfaces of the base 1 and the turntable 2, a cutting material 40 such as wood is placed. In the present invention, the base portion is a member on which the cutting material 40 is placed. In the present embodiment, the base portion is the base 1 and the turntable 2. A fence 3 supporting the side surface of the cutting material 40 is fixed to the upper surface of the base 1. At the rear end of the turntable 2, a holder 5 is erected via a holder shaft 4, and the axis of the holder shaft 4 is positioned so as to substantially coincide with the upper surface of the turntable 2. , And pivotally supported on the upper surface of the turntable 2 so as to be tiltable left and right.

As shown in FIG. 7, an elongated hole 5a centering on the holder shaft 4 is formed from the rear portion of the holder 5, a clamp lever 6 is passed through the elongated hole 5a, and a screw formed at the tip of the clamp lever 6 is formed. The portion is screwed into a screw hole formed on the back of the turntable 2. Clamp lever 6
Is loosened, the holder 5 tilts within the range of the elongated hole 5a with the holder shaft 4 as a fulcrum, and when the clamp lever 6 is tightened, the holder 5 is tightened between the turntable 2 and the clamp lever 6 and fixed at an arbitrary position. . In addition, the long hole 5a
Is formed within a range in which the holder 5 can be tilted by 45 degrees left and right.

Above the holder 5, a cutting blade body 8 is pivotally supported via a shaft 7 so as to be vertically swingable with respect to the upper surface of the base 1. A spring 9 for urging the cutting blade body 8 upward is provided between the holder 5 and the cutting blade body 8.

The cutting blade body 8 includes a cutting blade shaft 16, a cutting blade 10 such as a circular saw, a saw cover 11 for covering the upper half of the cutting blade 10, and a motor 1 for driving the cutting blade 10 to rotate.
3, the motor shaft 14 of the motor 13, the transmission belt 23,
It is composed of a motor 13 and a handle 26.

As shown in FIG. 8, a cutting blade 16 is provided below the gear case 12 in a horizontal direction.
6 is rotatably supported by bearings 17 and 18, and the cutting blade 10 is fixed to one end of the cutting blade shaft 16 by bolts 19;
A pulley 20 for transmitting power to the cutting blade shaft 16 is provided. A motor housing 15 is provided above the gear case 12, and a motor 13 for rotating and driving the cutting blade 10 is provided therein. A pulley 22 is provided at a tip of a motor shaft 14 of the motor 13 rotatably supported by a bearing 21 so as to be located above the pulley 20. A transmission belt 23 is stretched between the pulleys 20 and 22. The power of the motor 13 is transmitted by the transmission belt 23 from the motor shaft 14 to the pulley 22 and the transmission belt 2.
3, transmitted to the cutting blade 10 via the pulley 20 and the cutting blade shaft 16.

A V-shaped projection 5b is mounted on the front surface of the holder 5, and stopper bolts 24, 25 are located on the rear of the upper surface of the turntable 2 so as to be located on the movement locus of the projection 5b.
Are screw-fitted at right angles. When the holder 5 is tilted, the protrusion 5b is brought into contact with the stopper bolt 24 at a predetermined tilt angle.
Alternatively, the cutting blade main body 8 is engaged with the head of the stopper bolt 25 to set the inclined position of the cutting blade body 8. Usually, the stopper bolt 24,
Reference numeral 25 is provided so as to engage with the protrusion 5b when the holder 5 is inclined at a position of 45 degrees in the left-right direction.

On the upper surface of the turntable 2, a blade plate (not shown) having a groove at the center into which the cutting blade 10 enters is fixed. When cutting the cutting material 40, the lower end of the cutting blade 10 is higher than the upper surface of the turntable 2. When it descends, it penetrates into the groove of the blade plate, and serves to prevent the cutting material 40 from fuzzing on the finished surface.

In FIG. 3, a support member 32 is fixed to the front surface of the holder 5 and a laser oscillator 30 is housed therein.
When the cutting blade body 8 is at the upper limit position,
The laser oscillator 30 is provided so that part or all of the laser light L passes below the cutting blade 10. The laser beam L is emitted from the irradiation unit 30a of the laser oscillator 30, and the laser beam L indicates the cutting position of the cutting blade 10 when the cutting blade body 8 is swung downward. In the present embodiment, the irradiation part 30a of the laser beam L of the laser oscillator 30 is located on an extension of the cutting edge 10a of the cutting blade 10. Although not shown, the laser oscillator 30 is provided with a switch for irradiating the laser beam L.

A brush 35, which projects toward the laser oscillator 30 side, is attached to the lower part of the cutting blade main body 8 by a large number of soft fibers (for example, nylon or the like) serving as a chip removing member.

In the above configuration, when the cutting blade body 8 is at the upper limit position, the laser beam L emitted from the laser oscillator 30 passes below the cutting edge 10a of the cutting blade 10, so that the laser beam L is obstructed by the cutting blade 10. The upper surface of the cutting material 40 is irradiated with the laser light L without any trouble. A black line (not shown) indicating a cutting position is written on the upper surface of the cutting material 40, and the cutting material 40 is moved right and left so that the black line matches the laser beam L. As a result, the cutting edge 10a of the cutting blade 10 and the black line coincide.

Next, the handle 26 of the cutting blade main body 8 is gripped, and the cutting blade main body 8 is swung downward to cut the cutting material 40. In this process, as shown in FIG. 2, the chips 41 scatter toward the irradiation part 30 a of the laser oscillator 30 with the laser light L, so that the chips 41 may adhere to the irradiation part 30 a of the laser oscillator 30. When the cutting blade body 8 is lowered, the brush 3 attached to the cutting blade body 8 is removed.
5 approaches the irradiation unit 30a of the laser oscillator 30 (FIG. 4), the brush 35 comes into contact with the irradiation unit 30a (FIG. 5), and the brush 35 is pressed against the irradiation unit 30a. 41 is swept away (FIG. 6).

Next, an embodiment in which the present invention is applied to an oscillating band sawing machine will be described with reference to FIG. Cutting material 40
A support member 43 is fixed to a front surface of a holder 42 provided on a base 41 for supporting the laser oscillator 44, and a laser oscillator 44 is housed therein. A brush 47 projecting toward the laser oscillator 44 is attached to a lower rear portion of the band saw body 46 having the band saw 45. At the time of the cutting operation, as in the case of the tabletop circular saw, when the band saw body 46 is lowered, the brush 47 attached to the band saw body 46 comes into contact with the irradiation section 44a of the laser oscillator 44. The chips attached to the surface are swept away.

[0019]

According to the present invention, when the cutting blade main body is lowered, the brush attached to the cutting blade main body comes into contact with the irradiation portion of the laser oscillator, so that the attached chips are swept away and the chips of the irradiation portion are removed. Is removed, so that the position of the cutting blade can always be accurately irradiated.

[Brief description of the drawings]

FIG. 1 is an overall side view of a desk circle showing an embodiment of the present invention.

FIG. 2 is an overall side view during cutting.

FIG. 3 is a partial front view of the desk circle.

FIG. 4 is a partial side view around a laser oscillator.

FIG. 5 is a partial side view around a laser oscillator.

FIG. 6 is a partial side view around a laser oscillator.

FIG. 7 is a partial rear view of the desk circle.

FIG. 8 is a sectional view taken along line AA of FIG. 1;

FIG. 9 is an overall side view of a band saw machine according to a second embodiment of the present invention.

[Explanation of symbols]

5, 42: holder, 8: cutting blade body, 10: cutting blade, 30, 44: laser oscillator, 30a: irradiation unit, 3
5, 47 ... brush, 40 ... cutting material, 41 ... chips, 46
... Body saw body, L ... Laser light.

Claims (2)

[Claims] 1. A cutting machine provided with a holder standing on a base part supporting a cutting material, a cutting blade part movable up and down toward the base part, and a laser oscillator for irradiating an upper surface of the cutting material. A chip removing device for a cutting machine, wherein a chip removing member that comes into contact with an irradiation unit of a laser oscillator is provided in the cutting blade in a process in which the cutting blade moves from an upper limit position to a lower limit position. 2. The chip removing device for a cutting machine according to claim 1, wherein said chip removing member is a brush projecting toward a laser oscillator.