JP2001297933A - Method of manufacturing chip inductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a chip inductor by which a chip inductor mounted precisely by flattening the mounting surface of its outer packaging section can be manufactured. SOLUTION: This method includes a conductive layer forming step of forming a conductive layer 4 on the outer peripheral surface 2 and end faces 3 of the main body 1 of the chip inductor; a coil section forming step of forming a coil section 7 having linear conductor sections 5 and grooved sections 6, while the cut dusts 10 of the conductive layer 4 are scattered when making grooves on the conductive layer 4 on the outer peripheral surface 2 of the main body 1 in a coil-like state; and an etching step of etching the main body 1 carrying the formed coil section 7. This method also includes an insulating resin coating step of forming the outer packaging section 8 by coating the conductive layer 4 on the outer peripheral surface 2 side of the etched main body 1 with an insulating resin 13, and an electrode forming step of forming electrode sections 9 at both ends of the coil section 7 and, at the same time, electrically connecting the sections 9 to the conductive layer 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip inductor for use in various consumer appliances and the like.

[0002]

2. Description of the Related Art A conventional method for manufacturing a chip inductor will be described below with reference to the drawings.

FIG. 7 is a manufacturing process diagram of a conventional chip inductor, FIG. 8 is a sectional view of the chip inductor, and FIG. 9 is a perspective view of the chip inductor.

7 to 9, a conventional method for manufacturing a chip inductor includes a step of forming a conductive layer 22 on a prismatic body 0.5 mm square and about 1 mm long made of an insulating material; The conductive layer 22 is grooved in a coil shape, and the coil portion 2 having a coil-shaped linear conductor portion 23 and a grooved portion 24 is formed.
5 and a step of forming a laser 2 at both ends of the coil portion 25.
7, the step of forming the electrode part 26 and the step of covering the coil part 25 with the insulating resin 28 and drying to form the exterior part 29 are provided.

At this time, in a fourth step, a main body 21 having a coil portion 25 formed on a tape on which an insulating resin 28 is adhered.
Is rotated in the direction (A), the insulating resin 28 is applied to the coil portion 25, and the insulating resin 28 is applied to the entire circumference of the coil portion 25.

Then, the insulating resin 28 is dried to form an exterior part 29.

[0007]

In the above conventional method,
Since the insulating resin 28 is applied to the coil portion 25 while rotating the main body 21 on which the coil portion 25 is formed on the tape to which the insulating resin 28 is adhered, as shown in FIG. The insulating resin 28 has a circular outer shape while surrounding the prismatic main body 21 due to surface tension.

In particular, since the main body 21 has a very small external size of 0.5 mm square and a length of about 1 mm, it is easily affected by the surface tension of the insulating resin 28.

As a result, there has been a problem that the mounting surface of the exterior part 29 becomes round, and it becomes impossible to mount the package properly on a mounting board or the like.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a method of manufacturing a chip inductor which can flatten a mounting surface of an exterior portion and mount the chip inductor accurately.

[0011]

To achieve the above object, the present invention has the following manufacturing method.

[0012] The invention described in claim 1 of the present invention is, in particular,
In the insulating resin coating step, the body having the coil portion formed therein is immersed in a liquid bath of the insulating resin for electrodeposition, and an electric field is applied between the linear conductor portion of the coil portion and the liquid bath to form the insulating resin for electrodeposition. Is deposited on at least the surface of the linear conductor portion of the coil portion, and the insulating resin is electrodeposited on the coil portion. In the conductive layer forming step, the conductive layer is formed on both end surfaces of the main body. And a step of cutting the surface of the conductive layer formed on the both end faces of the main body in the electrode forming step.

According to the above method, the insulating resin is coated on the coil portion by depositing the insulating resin for electrodeposition on the linear conductor portion, instead of applying the insulating resin. The outer shape of the outer part does not become circular due to the surface tension of the resin, but the outer shape reflects the outer shape of the conductive layer almost as it is. can do.

Further, since a step of cutting the surfaces of the conductive layers formed on both end faces of the main body is provided, when the insulating resin for electrodeposition is deposited on the surface of the linear conductor part of the coil part, both end faces of the main body are cut off. Insulating resin also precipitates on the conductive layer formed in
Alternatively, even if the insulating resin deposited on the surface of the linear conductor portion flows to the end face of the main body and the conductive layer formed on the end face is covered, the insulating resin can be cut.

Thus, even if the electrode portion is formed on the end face side of the main body, the electrical connectivity between the electrode portion and the conductive layer is not degraded, and the electrode portion is formed only by the amount of the insulating resin attached. The reliability can be improved and the size can be reduced without increasing the size.

The second aspect of the present invention is the first aspect of the present invention.
In the invention described in the above, in particular, in the electrode forming step, the cutting depth for cutting the surfaces of the conductive layers formed on both end faces of the main body is a cutting depth that does not expose the both end faces of the main body.

According to the above method, since the conductive layers are formed on both end faces of the main body, when the electrode portions are provided on both end face sides of the main body, the conductive layers on both end faces and the electrode sections are electrically connected. And connection reliability can be improved.

The third aspect of the present invention provides the first aspect.
In the invention described above, in particular, in the electrode forming step, the surface of the conductive layer formed on both end faces of the main body is cut by a laser.

According to the above method, the surface of the conductive layer can be accurately cut, and when the electrode portions are provided at both ends of the main body,
Electrical connection between the conductive layers on both end faces and the electrode portion can improve connection reliability.

The invention according to claim 4 of the present invention is the invention according to claim 3.
In the described invention, in particular, the laser is a method of scanning the surface of the conductive layer a plurality of times.

According to the above method, the surface of the conductive layer can be cut more accurately. When the electrode portions are provided at both ends of the main body, the conductive layers on both end surfaces and the electrode portions are electrically connected to each other, and the connection reliability is improved. Can be improved.

The fifth aspect of the present invention is the first aspect of the present invention.
In the invention described above, in particular, in the electrode forming step, a method is used in which a surface of the conductive layer formed on both end surfaces of the main body and a surface of the conductive layer formed on the end of the outer peripheral surface of the main body are cut by a laser.

According to the above method, the surface of the conductive layer can be accurately cut, and when the electrode portions are provided at both ends of the main body,
Electrical connection between the conductive layers on both end faces and the electrode portion can improve connection reliability.

In particular, since the surface of the conductive layer formed at the end of the outer peripheral surface of the main body is also cut, the connection reliability can be further improved.

The present invention according to claim 6 of the present invention is directed to claim 5
In the described invention, in particular, the laser is a method of scanning the surface of the conductive layer a plurality of times.

According to the above method, the surface of the conductive layer can be cut more accurately, and the connection reliability can be improved when the electrode portion is provided at both ends of the main body.

[0027]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention;

FIG. 1 is a manufacturing process diagram of a chip inductor according to an embodiment of the present invention, FIG. 2 is a process diagram of electrodeposition coating in a manufacturing process of the chip inductor, FIG. 3 is a sectional view of the chip inductor, and FIG. FIG. 5 is a sectional view of the chip inductor, and FIG. 5 is a perspective view of the chip inductor.

Referring to FIGS. 1 to 5, a method of manufacturing a chip inductor according to an embodiment of the present invention includes a prismatic 0.5 mm square main body 1 made of an insulating material and having a length of about 1 mm.
A conductive layer forming step of forming a conductive layer 4 on the outer peripheral surface 2 and the end surface 3 of the main body 1, and forming a groove on the conductive layer 4 formed on the outer peripheral surface 2 of the main body 1 in a coil shape to form a linear conductor portion 5 and a groove. A coil part forming step of forming a coil part 7 having a cut part 6, an etching step of etching the main body 1 on which the coil part 7 is formed, and a step of etching the conductive layer 4 on the outer peripheral surface 2 side of the etched main body 1. An insulating resin coating step of forming the exterior part 8 by coating with the insulating resin 13, and an electrode forming step of forming the electrode parts 9 at both ends of the coil part 7 and electrically connecting the electrode parts 9 and the conductive layer 4. And

In the insulating resin coating step, the main body 1 on which the coil portion 7 is formed is immersed in a liquid tank 11 of an epoxy electrodeposition insulating resin while being held by the holding member 14, and the linear conductor of the coil portion 7 is formed. Between the part 5 and the liquid tank 11,
An electric field is applied by a power supply 12 connected to the electrode plate 15 and the holding member 14, and an insulating resin for electrodeposition is deposited on at least the surface of the linear conductor portion 5 of the coil portion 7, and the insulating resin 13 is coated on the coil portion 7 by electrodeposition. In the conductive layer forming step, a step of forming the conductive layer 4 on both end faces 3 of the main body 1 is provided, and in the electrode forming step, the surface of the conductive layer 4 formed on the both end faces 3 of the main body 1 is formed. A cutting step is provided.

In this electrode forming step, both end faces 3 of the main body 1 are formed.
The surface of the conductive layer 4 formed on the substrate is cut by scanning a plurality of times with a laser, and the cutting depth for cutting the surface of the conductive layer 4 is set to a depth that does not expose both end surfaces 3 of the main body 1.

According to the above-mentioned method, the insulating resin 13 is coated on the coil portion 7 by depositing the insulating resin for electrodeposition on the linear conductor portion 5 instead of applying the insulating resin 13. However, the outer shape of the exterior portion 8 does not become circular due to the surface tension of the insulating resin 13, the outer shape reflects the outer shape of the conductive layer 4 as it is, and the exterior portion 8 can be flattened. The mountability on a substrate or the like can be improved.

Further, since a step of cutting the surface of the conductive layer 4 formed on both end surfaces 3 of the main body 1 is provided, the insulating resin for electrodeposition is deposited on the surface of the linear conductor portion 5 of the coil portion 7. The insulating resin 13 is also deposited on the conductive layers 4 formed on both end faces 3 of the main body 1, or the insulating resin 13 deposited on the surface of the linear conductor portion 5 flows on the end face 3 of the main body 1 and forms on the end face 3. Even if the conductive layer 4 is covered, the insulating resin 13 can be cut.

Thus, the electrode portion 9 is provided on the end face 3 side of the main body 1.
Is formed, the electrical connectivity between the electrode portion 9 and the conductive layer 4 is not degraded, and the shape of the electrode portion 9 is not increased by the amount of the insulating resin 13 attached. In addition, the reliability can be improved and the size can be reduced.

The cutting depth for cutting the surface of the conductive layer 4 formed on both end faces 3 of the main body 1 is such that the end faces 3 of the main body 1 are not exposed. When provided on both end faces 3, the conductive layer 4 and the electrode section 9 on both end faces 3
Can be electrically connected to each other, and the connection reliability can be improved.

In particular, since the surface of the conductive layer 4 formed on both end surfaces 3 of the main body 1 is cut by scanning the laser a plurality of times, the surface of the conductive layer 4 can be cut accurately and the connection reliability can be improved. Performance can be improved.

As described above, according to the embodiment of the present invention, even if the external dimensions are extremely small, the external shape of the exterior part 8 does not become circular due to the surface tension of the insulating resin 13 and the conductive layer 4 The outer shape reflects the outer shape almost as it is, the outer portion 8 can be flattened, and the mountability on a mounting board or the like can be improved.

Further, the connection reliability between the conductive layer 4 formed on both end surfaces 3 of the main body 1 and the electrode portion 9 can be improved, and the size can be reduced.

According to one embodiment of the present invention, in the electrode forming step, the surface of the conductive layer 4 formed on both end faces 3 of the main body 1 is cut with a laser. The surface of the conductive layer 4 formed at the end of the surface 2 may be cut by laser, and when the electrode portions 9 are provided at both ends of the main body 1,
Connection reliability can be further improved.

In particular, if the surface of the conductive layer 4 is scanned a plurality of times with a laser, the surface of the conductive layer 4 can be cut more accurately. Can be improved.

Further, in one embodiment of the present invention, the grooved portion 6 of the coil portion 7 does not reach the main body 1, but may reach the main body 1.

[0042]

As described above, according to the present invention, the insulating resin is coated on the coil by depositing the insulating resin for electrodeposition on the linear conductor instead of applying the insulating resin. Is very small, the outer shape of the outer part does not become circular due to the surface tension of the insulating resin, the outer shape reflects the outer shape of the conductive layer almost as it is, and the outer part can be flattened and mounted. A method for manufacturing a chip inductor with improved mountability on a substrate or the like can be provided.

[Brief description of the drawings]

FIGS. 1A to 1F are process diagrams of manufacturing a chip inductor according to an embodiment of the present invention;

FIGS. 2 (a) to 2 (c) are electrodeposition coating process diagrams in a manufacturing process of the chip inductor, respectively.

FIGS. 3A and 3B are cross-sectional views of the chip inductor, respectively.

FIG. 4 is a sectional view of the chip inductor.

FIG. 5 is a perspective view of the chip inductor.

FIG. 6 is a sectional view of another chip inductor.

FIGS. 7A to 7D are manufacturing process diagrams of a conventional chip inductor, respectively.

FIG. 8 is a sectional view of the chip inductor.

FIG. 9 is a perspective view of the chip inductor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main body 2 Outer peripheral surface 3 End surface 4 Conductive layer 5 Linear conductor 6 Groove cutting part 7 Coil part 8 Exterior part 9 Electrode part 10 Cutting waste 11 Liquid tank 12 Power supply 13 Insulating resin 14 Holding member 15 Electrode plate

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kenichi Yamada 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E062 FF01 5E070 AA01 AB10 CC03 EA01

Claims (6)

[Claims] 1. A conductive layer forming step of forming a conductive layer on at least an outer peripheral surface of a pillar-shaped main body made of an insulating material, and a groove is formed in the conductive layer formed on the outer peripheral surface of the main body in a coil shape to form a wire. Forming a coil portion having a conductor-like portion and a groove cut portion, etching the main body having the coil portion formed therein, and insulating at least the coil portion of the etched main body. An insulating resin coating step of forming an exterior part by coating with a resin, and forming an electrode part at both ends of the coil part, and an electrode forming step of electrically connecting the electrode part and the conductive layer, The insulating resin coating step, while immersing the main body formed with the coil portion in a liquid tank of insulating resin for electrodeposition, applying an electric field between the linear conductor portion of the coil portion and the liquid tank, Depositing an insulating resin for electrodeposition on at least the surface of the linear conductor portion of the coil portion and electrodepositing the insulating resin on the coil portion; and forming the conductive layer on both end surfaces of the main body. A method of manufacturing a chip inductor, further comprising: a step of forming the conductive layer; and, in the electrode forming step, a step of cutting a surface of the conductive layer formed on both end surfaces of the main body. 2. The chip inductor according to claim 1, wherein, in the electrode forming step, a cutting depth for cutting the surfaces of the conductive layers formed on both end faces of the main body is a cutting depth that does not expose the both end faces of the main body. Production method. 3. The method according to claim 1, wherein in the electrode forming step, the surfaces of the conductive layers formed on both end faces of the main body are cut by a laser. 4. The method according to claim 3, wherein the laser scans the surface of the conductive layer a plurality of times. 5. The chip inductor according to claim 1, wherein in the electrode forming step, a surface of the conductive layer formed on both end surfaces of the main body and a surface of the conductive layer formed on an end of the outer peripheral surface of the main body are cut by a laser. Production method. 6. The method according to claim 5, wherein the laser scans the surface of the conductive layer a plurality of times.