JP2001284409A - Electronic component element mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic component element mounting equipment which can fix a base with stability and mount an electronic component element surely with stability as well. SOLUTION: The electronic component element mounting equipment consists of a means for holding an electronic component element 1 having a bump electrode 1a on the lower plane, a fusion generating means for heat fusion or supersonic waves fusion of the bump electrode 1a to the base 2, a tool 7 having a pressing means, and a work fixing part 4 fixing the basic 2 mounted with the electronic component element. An elastic sheet 3 composed of a silicone resin is arranged on the base fixing plane of the work fixing part 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component device mounting apparatus for mounting an electronic component device such as an IC chip having bump electrodes on a substrate such as a circuit board or a package by thermocompression bonding or ultrasonic compression bonding. is there.

[0002]

2. Description of the Related Art A flip chip mounting method is frequently used as a method for mounting electronic components such as an IC chip on a base such as a circuit board at a high density. Generally, in the flip chip mounting method, a bump is formed on an input / output electrode on a mounting surface (lower surface) of an electronic component element, and the bump electrode is brought into contact with a bonding electrode on a circuit board to melt a part of the bump. It was joined by wearing. Solder, Au, Cu,
Various bumps such as Ag are known. Specific joining methods include joining with a thermosetting conductive resin, joining with a thermosetting anisotropic conductive resin, joining by solder melting, thermocompression joining, and ultrasonic joining.

[0003]

In recent years, there has been an increasing demand for downsizing of electronic devices, and circuit boards and package bases on which electronic component elements are mounted have been reduced in size and have complicated structures.

[0004] Conventionally, a work fixing portion having a heating means is exemplified in JP-A-11-220249. However, when the size of the base held by the work fixing portion is reduced,
The area where the surface of the substrate can be fixed is reduced, and the substrate cannot be stably held. Further, there is a problem that the fixing means itself interferes with the tool having the fusion generating means.

As an example of fixing a miniaturized base, as described in JP-A-11-74315, clamping in the lateral direction of the base has been considered.

[0006] However, in such a fixing method, the base is mechanically fixed, so that the base itself is slightly chipped.

Furthermore, if the chips or individual pieces become impure foreign substances and enter the fixing surface of the base, the flatness of the surface of the base (the bonding surface with the bump electrode) deteriorates, and the electronic component element cannot be stably bonded. .

Further, as described above, since the base is downsized and the structure is complicated, the parallelism between the surface of the base and the bump electrode of the electronic component element is deteriorated, and the bump electrode is stably bonded to the bonding electrode. There was a problem that it became impossible.
For example, it is caused by warpage of the base. In particular, when the bonding method uses thermocompression bonding or ultrasonic thermocompression bonding, the bump electrodes of the same electronic component element are mixed, and the bumps that are excessively crushed and the bumps that are not sufficiently contacted are mixed, and are stable. However, there is a problem that it is not possible to make a joint.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to stably fix a base irrespective of the shape and structure of the base and to stabilize an electronic component element. Another object of the present invention is to provide an electronic component device mounting apparatus capable of reliably mounting.

Another object of the present invention is to provide an electronic component device mounting apparatus excellent in mass productivity.

[0011]

SUMMARY OF THE INVENTION The present invention provides a holding means for holding an electronic component element having a bump electrode on a lower surface, and a fusion generating means for heating or ultrasonically fusing the bump electrode to a substrate. And a tool having a load supply unit for pressing the electronic component element against the base, and a work fixing unit for fixing the base, and the electronic component element held by the holding means of the tool is fixed to the work. The bump electrode is moved to a predetermined position on the base fixed to the portion to contact the bump electrode with the upper surface of the base, and then the bump electrode is melted while pressing the electronic component element against the base by the fusion generating means and the load supply means. Thereby, in the electronic component element mounting apparatus for mounting the electronic component element on the base, an elastic sheet made of silicone resin is provided on the base fixing surface of the work fixing portion. And has an electronic component element mounting apparatus.

Further, there is provided an electronic component device mounting apparatus in which a suction hole for suction-fixing a base is formed in an elastic sheet of the work fixing portion.

[0013] Further, the work fixing part comprises a storage tray for storing a plurality of substrates, and a stage for mounting the tray, and the electronic component mounting apparatus is capable of separating the storage tray and the stage. It is.

According to the present invention, the elastic sheet made of silicone resin is provided on the fixing surface of the work fixing portion for holding the base on which the electronic component element is mounted, that is, on the bottom surface of the recess for housing the base. Therefore, even if the base is downsized and the structure is complicated, the base may be warped, the accommodation in the work fixing portion may vary, and the surface (mounting surface) of the base may not be parallel to the bonding surface of the electronic component element. In actual bonding, when a load is supplied from the electronic component element to the base, the elastic sheet at the portion where the load is excessively absorbed absorbs the excessive load. As a result, bonding at a predetermined position between the bump electrode formed on the bonding surface of the electronic component element and the base can be performed stably and reliably.

In addition, a through hole for a tick for sucking the lower surface of the base is formed on the bottom surface of the work fixing portion including the elastic sheet. That is, the base fixed in the work fixing portion is stably fixed. In addition, since the base is downsized and only suction is performed from the lower surface side of the base, there is no need to cross the tools or break the base as in the related art.

Further, the work fixing portion includes a storage tray for storing a plurality of bases and a stage, and the storage tray can be divided, that is, detachable. Therefore, when mounting the electronic component element on the base, the mounting process can be performed for each tray body in which a plurality of bases are accommodated, so that mass productivity is improved.

In addition, an elastic sheet is provided on the bottom surface of the storage tray body, and suction holes are formed for sucking the respective substrates. By moving the tool in the XY direction or the stage in the XY direction, the mounting process can be performed with very high productivity.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component element mounting apparatus according to the present invention will be described with reference to the drawings.

FIG. 1 is a side view showing a partial cross section of an electronic component element mounting apparatus according to the present invention, and FIG. 2 is a top view of a main part of a work fixing portion. FIG. 3 is a cross-sectional view of a main part of the work fixing part, and FIG. 4 is a cross-sectional view of a state where the base in the work fixing part is mounted.

In FIG. 1, reference numeral 1 denotes an electronic component element such as an IC chip on which bump electrodes are formed. For example, an aluminum input / output electrode is formed on the lower surface of the electronic component element, and an Au bump is formed on the surface of the electrode by an Au wire bonding method. That is, an Au wire is bonded and bonded on an aluminum input / output electrode, and the wire is cut off, leaving a ball portion at the tip, thereby forming a bump electrode.
1a is formed.

The electronic component element 1 is held on the tool 7 by suction on the upper surface side. That is, the tool 7 is provided with holding means for the electronic component element 1. In the figure, a suction tube 8 penetrating the tool 7 is formed, and the lower surface of the tool 7 is a nozzle. And
Although not shown, the upper end side of the suction tube 8 is connected to a vacuum pump. The lower surface of the tool 7 is substantially the same as the upper surface area of the electronic component element 1. Thereby, the electronic component element 1 held by the tool 7
As shown in FIG. 1, the bump electrode 1a is located on the lower surface side.

The tool 7 has a fusion generating means and a pressurizing means. That is, the tool 7 is integrated with the ultrasonic wave generating element 10 and the bonding head 15 via the transducer 9. In addition, the bonding head 15
Is a θ rotation shaft 11, a Z-axis drive unit 12, an XY drive unit 13.
It is integrated with. Thereby, the position of the tip of the tool 7 can be arbitrarily controlled, and a predetermined load can be applied to the tip of the tool 7 downward by the operation of the Z-axis drive unit 12.

That is, the tool 7 can be freely operated in the XY and Z directions while the electronic component element 1 is sucked and held by the suction means at the tip thereof. 7 can be supplied with ultrasonic vibration.

Reference numeral 2 denotes a base such as a ceramic package on which the electronic component element 1 such as an IC chip is mounted. On the upper surface side of the base 2, a bonding electrode (omitted in the figure) to which the bump electrode 1a of the electronic component element 1 is connected is formed.

The base 2 is fixed to the work fixing section 4. The work fixing part 4 has a concave part 5 for holding the base 2.
1 and a stage 6.

Here, in the electronic component element mounting apparatus of the present invention, the elastic sheet 3 made of silicone resin or the like is disposed on the base fixing surface which is the bottom surface of the concave portion 51.
The plane size of the concave portion 51 of the storage tray body 5 is larger than the size of the base 2 by 0.1 mm on both the long side and the short side. The elastic sheet 3 has a rubber hardness of 50 (J, for example).
(Measurement method according to IS K6301), a 0.3 mm thick silicone resin sheet or the like is used and attached to the bottom surface of the concave portion 51.

The base 2 placed on the elastic sheet 3 in the recess 51 is provided with a fixing means, that is, a suction hole 3 formed in the thickness direction of the storage tray 5 and the elastic sheet 3.
Via 1 and 52, it is adsorbed and fixed under reduced pressure.

The openings of the suction holes 31 and 52 on the elastic sheet side differ depending on the shape and structure of the base 2, that is, when the base 2 is placed on the elastic sheet 3, stable suction can be performed. It is formed at the diameter and position. Usually, the opening position is the central portion of the elastic sheet 3.

Further, at the four corners of the concave portion 51 in plan view, a substantially quarter circular concave portion 51a is formed so that the base 2 can be stably accommodated in the concave portion 51. .

FIG. 4 shows a state in which the base 2 (ceramic package having a predetermined structure) is disposed in the recess 51 of the storage tray body 5. The work fixing unit 4 includes a stage 6 provided with a heating unit and a vacuum suction unit, in addition to the storage tray body 5 described above. Here, the storage tray body 5 has a detachable structure with the stage 6. That is, the electronic component element 1 can be mounted on any shape of the base 2 by preparing the storage tray body 5 having the different shape of the concave portion 51 even if the base 2 has a different shape. .

Further, the work fixing section 4 is fixed on the XY table 14. Thus, the above-mentioned tool 7
In addition, position control in the plane direction can be performed on the work fixing unit 4 side.

In such an electronic component element mounting apparatus, first, the base 2 is supplied into the recess 51 of the storage tray 5. Then, the substrate 2 is adsorbed under reduced pressure from the bottom surface of the substrate 2 to fix the substrate 2 in the concave portion 51.

Further, the I-shaped electrode on which the bump electrode 1a is formed in advance
The electronic component element 1 such as a C chip is vacuum-adsorbed and picked up by the operation of the XY-axis drive unit 13 and the Z-axis drive unit 12 using a bonding head at the tip of the tool 7.

Thereafter, the electronic component element 1 held by the tool 7 is moved to the mounting position of the base 2 by a predetermined drive of the Z-axis drive unit 12 and the XY-axis drive unit 13.

In the image recognizing process, predetermined positions are corrected by the operation of the XY table 14 and the θ-rotation axis 11, and the bump electrode 1a of the electronic component element 1 and the bonding electrode of the base 2 are brought into contact. Then, bonding is performed by, for example, an ultrasonic thermocompression bonding method.

In this bonding method, a load is applied from the electronic component element 1 side to the base 2 side via the tool 7, and thereafter, ultrasonic vibration is applied. During this time, the base 2 is preliminarily heated by the heating means of the work fixing unit 4. As a result, stable mounting can be achieved in a short time by the ultrasonic vibration with small energy.

Here, the base 2 is preheated to about 200 ° C. by the heating means in the stage 6 of the work fixing section 4. The load is controlled so as to gradually increase with the joining process, and a maximum of 46 gf / bump is given.

In the present invention, the elastic sheet 3 is interposed on the bottom surface of the concave portion 51 for accommodating the base 2. Therefore, even if the base 2 is warped or the height of the bump electrodes 1a is uneven, the elastic force absorbs the unevenness and substantially reduces the contact state between the electronic component element 1 and the base 2. A parallel relationship between the two can be achieved. That is, the elastic sheet 3 can easily absorb the variation of about 3 to 30 μm, and can substantially improve the flatness of the upper surface of the base 2.

Thus, even in the electronic component element 1 on which a plurality of bump electrodes 1a are formed, ultrasonic waves can be uniformly applied from the electronic component element 1 to the base 2 via the bump electrodes 1a. Stable and reliable mounting is possible.

The base 2 is fixed by suction in the recess 51 on the lower surface of the base 2 (fixed surface of the base). Moreover, it is adsorbed via the elastic sheet 3. That is, unlike the related art, there is no mechanical fixation by crack-up or the like, so that the base 2 is not damaged. Also,
Since it is adsorbed and fixed via the elastic sheet 3, even if the fixing surface of the base 2 has some irregularities due to its shape,
It can be stably adsorbed.

The above-mentioned joining method is an example in which ultrasonic welding is performed. In place of the transducer 9 and the ultrasonic vibrator 10 which are means for applying ultrasonic vibration, a heater is provided at the tip of the tool 7. By using the chip, heat fusion is also possible. Further, in addition to the bonding in which a part of the metal constituting the bump electrode 1a is bonded by fusion, in the case of bonding via a thermosetting adhesive, the heat fusing means may be used as it is.

As described above, the storage tray 5 having the recess 51 may be made detachable, and the storage tray 5 may be provided with a plurality of recesses 51.

FIG. 5 shows a storage tray body 20 provided with a plurality of recesses 53. Respective recessed portions 53 are provided on the bottom surface,
The elastic body sheet 3 is adhered, and an opening of a suction hole 54 for sucking and fixing the base 2 is formed in a central portion thereof.

Incidentally, suction means corresponding to the plurality of suction holes 54 may be provided also on the stage 6 side on which the storage tray body 20 is mounted. In addition, a suction hole in which one or a plurality of suction pipes 42 are gathered may be provided at a thick portion on the bottom surface of the storage tray body 20 and the suction means of the stage 6 may be connected.

By using the storage tray body 20 having such a plurality of recesses 53, the base 2 can be supplied by the tray itself, and another storage tray body can be prepared. 1 can be efficiently performed, and the mounting efficiency and the mounting tact time are dramatically improved.

Further, the heating means of the stage 6 may be arranged in the thick portion of the bottom surface of the storage tray body 20 and only the power supply electrode pad may be provided on the stage 6 side. Thereby, the heating efficiency for the base 2 is improved,
Preheating time can also be shortened.

In the above embodiment, the electronic component element 1
Has been described using an IC chip, but a small circuit board having bumps formed on the back surface may be used.

[0047]

As described above, the elastic sheet is provided on the bottom surface of the accommodation recess of the work fixing portion. Therefore, even if the substrate has irregularities or warpage, and the height of the bump electrode varies,
At the time of load of joining, the elasticity of the sheet can absorb the elasticity of the sheet, so that an electronic component element mounting device capable of stable mounting can be obtained.

Further, the substrate is vacuum-adsorbed in the concave portion,
Since it is securely held, the electronic component element having the bump electrode can be satisfactorily bonded to the base with good positional accuracy.

Further, since the storage tray body of the work fixing portion has a detachable structure and a plurality of recesses are formed in the storage tray body, mounting can be performed continuously, and production efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a side view in a partially sectioned state showing an electronic component element mounting apparatus according to the present invention.

FIG. 2 is a top view of a main part of a work fixing unit according to the present invention.

FIG. 3 is a cross-sectional view of a main part of a work fixing unit according to the present invention.

FIG. 4 is a cross-sectional view of a state where a base is accommodated in a work fixing portion according to the present invention.

FIG. 5 is a top view of a storage tray used in the present invention.

[Explanation of symbols]

 1. Electronic component element 2. Base 3. Elastic sheet 4. Work fixing part 6. Stage 7. Tool

Claims (3)

[Claims] 1. A holding means for holding an electronic component element having a bump electrode on a lower surface, a fusion generating means for heating or ultrasonically fusing the bump electrode to a base, and an electronic component element on the base. A tool having a load supply unit for pressing; and a work fixing unit for fixing the base, wherein the electronic component element held by the holding unit of the tool is provided on the base fixed to the work fixing unit. The electronic component device is moved to a predetermined position so that the bump electrode is brought into contact with the upper surface of the substrate, and then the electronic component device is melted while pressing the electronic component element against the substrate by the fusion generating means and the load supply means. An electronic component device mounting apparatus for mounting an elastic body sheet made of silicone resin on a base fixing surface of the work fixing portion. Electronic component mounting device. 2. The electronic component element mounting apparatus according to claim 1, wherein a suction hole for suction-fixing the base is formed in the elastic sheet of the work fixing portion. 3. The work fixing section comprises a storage tray for storing a plurality of substrates, and a stage for mounting the tray, wherein the storage tray and the stage are separable. Item 3. The electronic component element mounting apparatus according to Item 2.