JP2001274529A - Electronic unit in plate shape - Google Patents

Electronic unit in plate shape

Info

Publication number
JP2001274529A
JP2001274529A JP2000086129A JP2000086129A JP2001274529A JP 2001274529 A JP2001274529 A JP 2001274529A JP 2000086129 A JP2000086129 A JP 2000086129A JP 2000086129 A JP2000086129 A JP 2000086129A JP 2001274529 A JP2001274529 A JP 2001274529A
Authority
JP
Japan
Prior art keywords
electronic component
printed circuit
circuit board
plate
electronic unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000086129A
Other languages
Japanese (ja)
Inventor
Yoshinori Usami
嘉教 宇佐美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000086129A priority Critical patent/JP2001274529A/en
Publication of JP2001274529A publication Critical patent/JP2001274529A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To thin a plate-shaped electronic unit. SOLUTION: This plate-shaped electronic unit is provided with a printed board 11 in an almost quadrilateral shape for which small-sized electronic components 12 and 13 are respectively mounted on a front surface and a back surface, and a large-sized electronic component 15 mounted on the printed board 11. The printed board 11 is provided with a hole 16 for making the large- sized electronic component 15 pass through, and the large-sized electronic component 15 is inserted to the hole 16 for about a half and attached. In such a manner, the plate-shaped electronic unit is thinned.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、パソコンなどに接
続して用いられる板体状電子ユニットに関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate-shaped electronic unit used by connecting to a personal computer or the like.

【0002】[0002]

【従来の技術】以下、従来の板体状電子ユニットについ
て説明する。
2. Description of the Related Art A conventional plate-shaped electronic unit will be described below.

【0003】従来の板体状電子ユニットは、図5に示す
ように小型の電子部品1が装着されたプリント基板2
と、このプリント基板2に装着された大型の電子部品3
とで構成されていた。
As shown in FIG. 5, a conventional plate-shaped electronic unit includes a printed circuit board 2 on which a small electronic component 1 is mounted.
And a large electronic component 3 mounted on the printed circuit board 2.
And consisted of

【0004】そしてこの板体状電子ユニットには実装密
度を上げるためにプリント基板2の裏面にも小型の電子
部品4が装着されていた。
A small electronic component 4 is also mounted on the back surface of the printed circuit board 2 to increase the mounting density of the plate-shaped electronic unit.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、このよ
うな従来の構成では、表面に大型の電子部品3を装着す
るのでどうしても薄型化することが困難であった。
However, in such a conventional configuration, it is difficult to reduce the thickness because the large electronic component 3 is mounted on the surface.

【0006】すなわち、図6に示すようにプリント基板
2の表面と裏面に夫々電子部品1,3,4を装着すると
電子ユニットの厚さは、プリント基板2の表面に装着し
た大型の電子部品3の高さ5と、裏面に装着した小型の
電子部品4の高さ7とプリント基板2の厚さの和とな
り、表面に装着した大型の電子部品3の高さ5が、その
まま電子ユニットの厚さを決める要因となって全体の厚
みを薄くすることが困難であった。なお6は小型の電子
部品1の高さを示している。
That is, as shown in FIG. 6, when the electronic components 1, 3, and 4 are mounted on the front and back surfaces of the printed circuit board 2, respectively, the thickness of the electronic unit is reduced. Is the sum of the height 5 of the small electronic component 4 mounted on the back surface and the thickness of the printed circuit board 2, and the height 5 of the large electronic component 3 mounted on the front surface is the same as the thickness of the electronic unit. It was difficult to reduce the overall thickness as a factor in determining the thickness. Reference numeral 6 denotes the height of the small electronic component 1.

【0007】本発明は、このような問題点を解決するも
ので、薄型化された板体状電子ユニットを提供すること
を目的としたものである。
An object of the present invention is to solve such a problem, and an object of the present invention is to provide a thin plate-shaped electronic unit.

【0008】[0008]

【課題を解決するための手段】この目的を達成するため
に本発明の板体状電子ユニットは、略四角形状をすると
ともに表面と裏面に夫々小型の電子部品が装着されたプ
リント基板と、このプリント基板に装着された大型の電
子部品とを備え、前記プリント基板には前記大型の電子
部品が貫通して装着される孔を設けると共に、この孔に
前記大型の電子部品を略半分まで挿入して取り付けたも
のである。
In order to achieve this object, a plate-shaped electronic unit according to the present invention comprises a printed circuit board having a substantially square shape and having small electronic components mounted on the front and back surfaces, respectively. A large electronic component mounted on a printed circuit board, and the printed circuit board is provided with a hole through which the large electronic component is mounted, and the large electronic component is inserted into this hole approximately half. It is attached.

【0009】これにより薄型の板体状電子ユニットを実
現することができる。
Thus, a thin plate-shaped electronic unit can be realized.

【0010】[0010]

【発明の実施の形態】本発明の請求項1に記載の発明
は、略四角形状をするとともに表面と裏面に夫々小型の
電子部品が装着されたプリント基板と、このプリント基
板に装着された大型の電子部品とを備え、前記プリント
基板には前記大型の電子部品が貫通して装着される孔を
設けると共に、この孔に前記大型の電子部品を略半分ま
で挿入して取り付けられた板体状電子ユニットであり、
このように大型の電子部品はプリント基板に設けられた
孔に挿入されるので、プリント基板の厚みと裏面に装着
された小型の電子部品厚み(高さ)の分、板体状電子ユ
ニットの薄型化が可能となる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a printed circuit board having a substantially rectangular shape and having small electronic components mounted on the front and back surfaces, respectively, and a large printed circuit mounted on the printed circuit board. The printed circuit board is provided with a hole through which the large-sized electronic component is penetrated and mounted, and a plate-shaped body in which the large-sized electronic component is inserted into the hole by approximately half and attached. An electronic unit,
Since such large electronic components are inserted into the holes provided in the printed circuit board, the thickness of the printed circuit board and the thickness (height) of the small electronic components mounted on the back surface are reduced by the thickness of the plate-shaped electronic unit. Is possible.

【0011】請求項2に記載の発明は、大型の電子部品
の片面を覆う金属製の取り付け金具で、前記大型の電子
部品をプリント基板に固定すると共に、この取り付け金
具を前記プリント基板のグランドに接続した請求項1に
記載の板体状電子ユニットであり、このように大型の電
子部品を金属製の取り付け金具で被って取り付けるの
で、大型の電子部品を確実にしっかりとプリント基板に
装着することができる。
According to a second aspect of the present invention, there is provided a metal mounting bracket for covering one side of a large-sized electronic component. The large-sized electronic component is fixed to a printed circuit board, and the mounting metal is mounted on a ground of the printed circuit board. The plate-shaped electronic unit according to claim 1, wherein the large-sized electronic component is covered with a metal mounting bracket and attached, so that the large-sized electronic component is securely and firmly mounted on a printed circuit board. Can be.

【0012】又、この取り付け金具をプリント基板に設
けられたグランドに接続しているので、外部からこの大
型の電子部品にノイズが入ることを防ぐと共に、この大
型の電子部品から発生するノイズが外部に悪影響を与え
ることも無い。
Further, since the mounting bracket is connected to the ground provided on the printed circuit board, noise is prevented from entering the large-sized electronic component from the outside, and noise generated from the large-sized electronic component is reduced to the outside. There is no adverse effect on

【0013】請求項3に記載の発明は、取り付け金具に
は大型の電子部品を押圧固定する第一の爪を設けると共
に、プリント基板の表面と裏面に夫々当接して固定する
第二の爪と鍔とを設けた請求項2に記載の板体状電子ユ
ニットであり、このように大型の電子部品は第一の爪で
固定されるので、例えはんだ付けしなくとも大型の電子
部品は取り付け金具にしっかりと固定される。
According to a third aspect of the present invention, the mounting bracket is provided with a first claw for pressing and fixing a large electronic component, and a second claw for abutting and fixing the front and back surfaces of the printed circuit board, respectively. The plate-shaped electronic unit according to claim 2, further comprising a flange, wherein the large-sized electronic component is fixed by the first claw, so that the large-sized electronic component can be attached to the mounting bracket without soldering. It is fixed firmly.

【0014】又、この金具でプリント基板に取り付ける
ので、例えはんだ付け無しでこのプリント基板を裏返し
たとしても、鍔と第二のプリント基板に固定されており
大型の電子部品がプリント基板から落下することは無
い。
Also, since the printed circuit board is mounted with the metal fittings, even if the printed circuit board is turned over without soldering, a large-sized electronic component is fixed to the flange and the second printed circuit board and falls from the printed circuit board. There is nothing.

【0015】請求項4に記載の発明は、大型の電子部品
に面実装部品を用いると共に、この面実装部品の底面に
設けられた電極端子とプリント基板のランドとを電気的
に接続する接続部材を取り付け金具と一体に形成し、こ
の接続部材で前記電極端子と前記プリント基板のランド
とを接続し、前記接続部材を前記取り付け金具から分割
部で切り離した請求項3に記載の板体状電子ユニットで
あり、接続部材を取り付け金具と一体に形成しているの
で、接続部材として別に用意する必要が無く、低コス
ト、低価格化が実現できると共に、一体形成しているの
でその取り付け工数も少なくて済む。
According to a fourth aspect of the present invention, there is provided a connecting member which uses a surface mount component for a large-sized electronic component and electrically connects an electrode terminal provided on a bottom surface of the surface mount component to a land of a printed circuit board. 4. The plate-shaped electronic device according to claim 3, wherein the connecting member is formed integrally with the mounting bracket, the electrode terminal is connected to the land of the printed circuit board by the connecting member, and the connecting member is separated from the mounting bracket by a dividing portion. It is a unit, and the connecting member is formed integrally with the mounting bracket, so there is no need to separately prepare it as a connecting member, and low cost and low cost can be realized. I can do it.

【0016】請求項5に記載の発明の分割部には、外側
に向かって開いたV溝が設けられた請求項4に記載の板
体状電子ユニットであり、このようにV溝を設けること
により接続部材を取り付け金具から容易に切り離すこと
ができる。
According to a fifth aspect of the present invention, there is provided the plate-shaped electronic unit according to the fourth aspect, wherein the dividing portion is provided with a V-groove which is open outward. Thereby, the connecting member can be easily separated from the mounting bracket.

【0017】又、V溝は外側に向かって開いているので
接続部材を切り離した後、そのバリは外側には出ず、仕
上りが綺麗なものとなる。
Further, since the V-groove is open outward, after the connecting member is cut off, the burr does not come out to the outside, so that the finish is beautiful.

【0018】請求項6に記載の発明の取り付け金具に
は、銅合金を用いた請求項4に記載の板体状電子ユニッ
トであり、この様に剛性の高い銅合金を用いることで取
り付け金具の薄板化が図れると共に、大型の電子部品及
び、基板とのはんだ付けも容易に行なうことができる。
According to a sixth aspect of the present invention, there is provided the plate-shaped electronic unit according to the fourth aspect, wherein a copper alloy is used as the mounting bracket of the invention. It can be thinned, and can be easily soldered to a large-sized electronic component and a substrate.

【0019】以下、本発明の実施の形態について、図面
を用いて説明する。図1は本発明の一実施の形態におけ
る板体状電子ユニットの斜視図である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a plate-shaped electronic unit according to an embodiment of the present invention.

【0020】図1において、11はプリント基板であ
り、このプリント基板11の表面には小型の電子部品1
2が装着されている。又、このプリント基板11には裏
面にも小型の電子部品13が装着される。なお、プリン
ト基板11の一方の端に装着されたコネクタ14は、こ
の板体状電子ユニットをパソコンなどに接続するための
ものである。
In FIG. 1, reference numeral 11 denotes a printed circuit board.
2 is installed. Also, small electronic components 13 are mounted on the back surface of the printed circuit board 11. The connector 14 attached to one end of the printed circuit board 11 is for connecting the plate-shaped electronic unit to a personal computer or the like.

【0021】15は大型の電子部品であり、この大型の
電子部品15はプリント基板11に形成された孔16に
略半分まで挿入され、取り付け金具17で取り付けられ
るようになっている。
Reference numeral 15 denotes a large-sized electronic component. The large-sized electronic component 15 is inserted into a hole 16 formed in the printed circuit board 11 by approximately half, and is attached by a mounting bracket 17.

【0022】図2はこの板体状電子ユニットの側面図で
ある。すなわち、大型の電子部品15を孔16に貫通し
て取り付けているので、大型の電子部品15の厚さ方向
は、プリント基板11の表面及び裏面にも露出すること
になり、全体としての薄型化が可能となるものである。
FIG. 2 is a side view of the plate-shaped electronic unit. That is, since the large-sized electronic component 15 is attached through the hole 16, the thickness direction of the large-sized electronic component 15 is also exposed on the front and back surfaces of the printed circuit board 11, and the overall thickness is reduced. Is possible.

【0023】図2において、小型の電子部品12の厚さ
19と、裏面の装着された小型の電子部品13の厚さ2
0と、プリント基板11の厚さを21とすると、この板
体状電子ユニットの厚さは19と20と21の和にな
り、これだけの厚さがどうしても必要である。
In FIG. 2, the thickness 19 of the small electronic component 12 and the thickness 2 of the small electronic component 13 mounted on the back surface are shown.
Assuming that 0 and the thickness of the printed circuit board 11 are 21, the thickness of the plate-shaped electronic unit is the sum of 19, 20, and 21, and this thickness is absolutely necessary.

【0024】一方、大型の電子部品15の厚さ18が先
ほどの19,20,21の合計の厚さよりも小さいなら
ば、この大型の電子部品15によって板体状電子ユニッ
トの厚さが厚くなることは無い。
On the other hand, if the thickness 18 of the large electronic component 15 is smaller than the total thickness of the above-mentioned 19, 20, and 21, the large electronic component 15 increases the thickness of the plate-shaped electronic unit. There is nothing.

【0025】すなわち、従来に比べて裏面に装着された
小型の電子部品13の厚さ20とプリント基板11の厚
さ21の分だけ、例え大型の電子部品15を装着したと
しても薄くすることができる。
That is, as compared with the conventional case, the thickness of the small electronic component 13 mounted on the back surface and the thickness 21 of the printed circuit board 11 can be reduced even if the large electronic component 15 is mounted. it can.

【0026】大型の電子部品15の厚さ18が夫々の厚
さ19,20,21の合計の厚さよりも大きい場合に
は、表面かあるいは裏面に設けられた小型の電子部品1
2に、あるいは13のどちらかの厚さに一方を合わせた
ほうが薄型になる。
When the thickness 18 of the large electronic component 15 is larger than the total thickness of the respective thicknesses 19, 20, and 21, the small electronic component 1 provided on the front surface or the rear surface is provided.
It is thinner if one is adjusted to either 2 or 13 thickness.

【0027】大型の電子部品15の厚さ18が夫々の厚
さ19,20,21の合計の厚さよりも小さい場合に
は、そのどちらにも突出しないように丁度中間に置くこ
とが薄くする上で重要である。
When the thickness 18 of the large electronic component 15 is smaller than the total thickness of the respective thicknesses 19, 20, and 21, it is preferable to place the electronic component 15 just in the middle so as not to protrude to either of them. Is important.

【0028】図3は大型の電子部品15に取り付け金具
17を嵌合させた要部斜視図である。
FIG. 3 is a perspective view of a main part in which a mounting bracket 17 is fitted to a large-sized electronic component 15.

【0029】図3においてこの大型の電子部品15は面
実装部品である誘電体フィルタを用いている。従ってこ
の大型の電子部品15の底面に端子電極22が形成され
ている。
In FIG. 3, the large electronic component 15 uses a dielectric filter which is a surface mount component. Therefore, the terminal electrode 22 is formed on the bottom surface of the large electronic component 15.

【0030】又、取り付け金具17には接続部材23が
設けられていて、この接続部材23は一方を端子電極2
2に接続されると共に他方をプリント基板11のランド
24に接続される。そして接続部材23が繋ぎ部材25
を介して取り付け金具17と一体に形成されている。
Further, a connection member 23 is provided on the mounting bracket 17, and one of the connection members 23 is connected to the terminal electrode 2.
2 and the other is connected to the land 24 of the printed circuit board 11. The connecting member 23 is connected to the connecting member 25.
And are formed integrally with the mounting bracket 17 through the through hole.

【0031】そしてこの繋ぎ部材25と接続部材23と
取り付け金具17との間には、外側に向かって開いたV
溝26が形成されている。
V between the connecting member 25, the connecting member 23 and the mounting member 17
A groove 26 is formed.

【0032】このように接続部材23は取り付け金具1
7と一体に形成されているので、大型の電子部品15に
取り付け金具17を取り付けたその状態で端子電極22
と接続部材23をリフローはんだ付けする事ができる。
As described above, the connecting member 23 is attached to the mounting bracket 1.
7 is formed integrally with the terminal electrode 22 in a state where the mounting bracket 17 is attached to the large-sized electronic component 15.
And the connection member 23 can be reflow-soldered.

【0033】又、はんだ付けが終わった状態において、
繋ぎ部材25を折り曲げる事によって簡単に繋ぎ部材2
5を取り外す事ができ、取り付け金具17と接続部材2
3は電気的に分離されるわけである。
In the state where soldering is completed,
By bending the connecting member 25, the connecting member 2 can be easily formed.
5 can be removed, the mounting bracket 17 and the connecting member 2 can be removed.
3 is electrically separated.

【0034】図4はプリント基板11に大型の電子部品
15を取り付けたときの側面図である。
FIG. 4 is a side view when a large-sized electronic component 15 is mounted on the printed circuit board 11.

【0035】取り付け金具17には第一の爪27を設
け、この第一の爪27で大型の電子部品15を包み込む
ように固定している。
The mounting bracket 17 is provided with a first claw 27, and the first claw 27 is fixed so as to surround the large electronic component 15.

【0036】又、プリント基板11の上面には鍔28を
設け、この鍔28と保持部材29に形成された第二の爪
30とでプリント基板11を挟んで固定するものであ
る。
Further, a flange 28 is provided on the upper surface of the printed board 11, and the printed board 11 is fixed between the flange 28 and a second claw 30 formed on the holding member 29.

【0037】[0037]

【発明の効果】以上のように本発明によれば、プリント
基板には大型の電子部品が貫通して装着される孔を設け
ると共に、この孔に前記大型の電子部品を略半分まで挿
入して取り付けられているので、大型の電子部品はプリ
ント基板の表面にも裏面にも突出する事になり全体とし
て電子ユニットの薄型化を図る事ができる。
As described above, according to the present invention, a printed circuit board is provided with a hole through which a large-sized electronic component is mounted, and the large-sized electronic component is inserted into this hole by approximately half. Since the electronic components are attached, the large-sized electronic components protrude from the front surface and the rear surface of the printed circuit board, so that the electronic unit can be made thinner as a whole.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態による板体状電子ユニッ
トの斜視図
FIG. 1 is a perspective view of a plate-shaped electronic unit according to an embodiment of the present invention.

【図2】同、側面図FIG. 2 is a side view of the same.

【図3】同、要部斜視図FIG. 3 is a perspective view of a main part of the same.

【図4】同、要部断面図FIG. 4 is a sectional view of a main part of the same.

【図5】従来の板体状電子ユニットの斜視図FIG. 5 is a perspective view of a conventional plate-shaped electronic unit.

【図6】同、側面図FIG. 6 is a side view of the same.

【符号の説明】[Explanation of symbols]

11 プリント基板 12 小型の電子部品 13 小型の電子部品 15 大型の電子部品 16 孔 17 取付金具 DESCRIPTION OF SYMBOLS 11 Printed circuit board 12 Small electronic component 13 Small electronic component 15 Large electronic component 16 Hole 17 Mounting bracket

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 略四角形状をするとともに表面と裏面に
夫々小型の電子部品が装着されたプリント基板と、この
プリント基板に装着された大型の電子部品とを備え、前
記プリント基板には前記大型の電子部品が貫通して装着
される孔を設けると共に、この孔に前記大型の電子部品
を略半分まで挿入して取り付けられた板体状電子ユニッ
ト。
1. A printed circuit board having a substantially square shape and having small electronic components mounted on its front and back surfaces, respectively, and a large electronic component mounted on the printed circuit board. A plate-shaped electronic unit in which a hole through which the electronic component is mounted is provided, and the large-sized electronic component is inserted into this hole by approximately half.
【請求項2】 大型の電子部品の片面を覆う金属製の取
り付け金具で、前記大型の電子部品をプリント基板に固
定すると共に、この取り付け金具を前記プリント基板の
グランドに接続した請求項1に記載の板体状電子ユニッ
ト。
2. The large-sized electronic component according to claim 1, wherein the large-sized electronic component is fixed to a printed circuit board with a metal fitting that covers one surface of the large-sized electronic component, and the fitting is connected to a ground of the printed circuit board. Plate-shaped electronic unit.
【請求項3】 取り付け金具には大型の電子部品を押圧
固定する第一の爪を設けると共に、プリント基板の表面
と裏面に夫々当接して固定する第二の爪と鍔とを設けた
請求項2に記載の板体状電子ユニット。
3. The mounting bracket includes a first claw for pressing and fixing a large-sized electronic component, and a second claw and a flange for contacting and fixing the front and back surfaces of the printed circuit board, respectively. 3. The plate-shaped electronic unit according to 2.
【請求項4】 大型の電子部品に面実装部品を用いると
共に、この面実装部品の底面に設けられた電極端子と、
プリント基板のランドとを電気的に接続する接続部材を
取り付け金具と一体に形成し、この接続部材で前記電極
端子と前記プリント基板のランドとを接続し、前記接続
部材を前記取り付け金具から分割部で切り離した請求項
3に記載の板体状電子ユニット。
4. A large-sized electronic component using a surface-mounted component, and an electrode terminal provided on a bottom surface of the surface-mounted component;
A connecting member for electrically connecting the land of the printed circuit board is formed integrally with the mounting bracket, the connecting member connects the electrode terminal and the land of the printed circuit board, and the connecting member is separated from the mounting bracket by a dividing portion. The plate-shaped electronic unit according to claim 3, wherein the plate-shaped electronic unit is separated.
【請求項5】 分割部には外側に向かって開いたV溝が
設けられた請求項4に記載の板体状電子ユニット。
5. The plate-shaped electronic unit according to claim 4, wherein the divided portion is provided with a V-groove that opens outward.
【請求項6】 取り付け金具には銅合金を用いた請求項
4に記載の板体状電子ユニット。
6. The plate-shaped electronic unit according to claim 4, wherein a copper alloy is used for the mounting bracket.
JP2000086129A 2000-03-27 2000-03-27 Electronic unit in plate shape Pending JP2001274529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000086129A JP2001274529A (en) 2000-03-27 2000-03-27 Electronic unit in plate shape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000086129A JP2001274529A (en) 2000-03-27 2000-03-27 Electronic unit in plate shape

Publications (1)

Publication Number Publication Date
JP2001274529A true JP2001274529A (en) 2001-10-05

Family

ID=18602343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000086129A Pending JP2001274529A (en) 2000-03-27 2000-03-27 Electronic unit in plate shape

Country Status (1)

Country Link
JP (1) JP2001274529A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006048097A (en) * 2004-07-30 2006-02-16 Key Tranding Co Ltd Portable terminal
JP2019215897A (en) * 2013-10-08 2019-12-19 ジョイソン セイフティ システムズ アクイジション エルエルシー Pressure-responsive touch interface with integrated multi-sensory feedback

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006048097A (en) * 2004-07-30 2006-02-16 Key Tranding Co Ltd Portable terminal
JP2019215897A (en) * 2013-10-08 2019-12-19 ジョイソン セイフティ システムズ アクイジション エルエルシー Pressure-responsive touch interface with integrated multi-sensory feedback

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