JPH0999679A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the rigidity of an IC card, to eliminate a spring for the same potential for conducting front and rear panels, to reduce the number of components and to simplify the assembling operation by coupling the front and rear panels of metal covering an electric circuit from both the surfaces by a coupling member. SOLUTION: A recess 21a is provided on a front panel 20a, so formed in depth as not protrude the head of a clamping screw 30 to the exterior, and a hole 22a through which the screw 30 is passed is provided at the center. A recess 21b is provided on a rear panel 20b, and a burring part 22b in which the threaded part of the screw 30 is engaged is provided. The panels 20a and 20b are fixed to a frame 25 with adhesive, and coupled by the screw 30 thereby to improve the rigidity of an IC card. The frame 20 for enclosing and supporting an electric circuit board 2 has engaging parts 63a, 63b to be engaged with the lugs 61a, 61b of a connector 60. A rib 27 for improving the rigidity is provided in the frame.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card panel assembly structure.

[0002]

2. Description of the Related Art FIG. 8 is a perspective view showing a conventional IC card, and FIG. 9 is a sectional view taken along line IX-IX in FIG. Figure 8,
In FIG. 9, 1 is an IC card, 2 is an electric circuit board on which a semiconductor element 3 and the like are mounted, 4 is a frame that includes and supports the electric circuit board 2, 5a and 5b are fitted to the frame 4, and the semiconductor element A front panel and a back panel that protect 3 etc. from both sides. Reference numeral 6 is a spring for the same potential, which is located in the hole 4a provided in the frame 4 and electrically connects the front panel 5a and the back panel 5b.

Next, the panel structure of the IC card will be described. The front panel 5a and the back panel 5 shown in FIG.
b is fixed to the frame 4 by an adhesive sheet such as a double-sided tape or an adhesive.

Further, the front panel 5a and the back panel 5b need to be electrically conductive in order to improve the resistance to static electricity of the semiconductor element 3 and the like in the IC card 1. For this, a hole 4a is provided in the frame 4. The same-potential spring 6 is inserted into the hole 4a, and the same-potential spring is electrically conductive.

[0005]

However, the frame 4 and the panels 5a and 5b are fixed only by adhesion,
It was not enough in terms of strength. Further, regarding the conduction of the front panel 5a and the back panel 5b, since the same potential spring 6 is used, there are problems such as an increase in the number of parts and an assembly work process.

Therefore, an object of the present invention is to improve the rigidity of an IC card and to eliminate the same potential spring for conducting the front and back panels, thereby reducing the number of parts and simplifying the assembling work.

[0007]

According to the present invention, an electric circuit board on which a semiconductor element and other circuit elements are mounted and a semiconductor element mounted on the circuit board and surrounding the circuit board do not interfere with each other. An IC card having a frame having ribs provided at positions, metal front and back panels fixed to the frame and covering the electric circuit from both sides, and a coupling member for mechanically coupling these panels to each other. is there.

[0008]

According to a first aspect of the present invention, an electric circuit board on which a semiconductor element or the like is mounted, and a semiconductor which is arranged so as to surround the electric circuit board and is mounted on the electric circuit board. In an IC card having a frame having ribs provided at positions not interfering with elements, metal front and back panels fixed to the frame and covering the electric circuit from both sides, and a coupling member for coupling the panels to each other. Since the coupling member mechanically couples at least the front panel and the back panel, the rigidity of the IC card can be improved.

According to the invention of claim 2, an electric circuit board on which a semiconductor element or the like is mounted, and a position which is arranged so as to surround the electric circuit board and does not interfere with the semiconductor element mounted on the electric circuit board. A frame having ribs provided on the front and rear panels, a metal front and back panel fixed to the frame and covering the electric circuit from both sides, a cover member that covers at least one side of the circuit board separately from the panel, and the panel In the IC card having a connecting member for connecting the cover member to the cover member, since at least the front panel and the back panel are mechanically connected to the cover, the connecting member can improve the rigidity of the IC card. it can.

[0010] According to the invention of claim 3, according to claim 1 of the present invention.
Further, in the invention of claim 2, since the front panel and the back panel are electrically connected to each other through the members to be coupled, the resistance to static electricity is improved.

Furthermore, according to the invention of claim 4, in the invention of claim 3, since the members to be joined are brought into surface contact with each other to establish conduction between the front panel and the back panel, the resistance to static electricity is improved.

[0012]

【Example】

(First Embodiment) An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a perspective view showing an IC card according to the present invention. 10 is an IC card, 20 is a metal panel, and 30 is a panel.
Is a screw that connects the front and back panels, 25 is a frame, 6
Reference numeral 0 is a card connector that is connected to a slot of a personal computer, for example.

FIG. 2 is an exploded perspective view of an IC card according to this embodiment, in which 20a is a front panel and 21a is this front panel 20.
In the concave portion provided in a, the head of the fastening screw 30 has a depth that does not project outside, and a hole 22a through which the fastening screw 30 is inserted is provided at the center thereof. 20b
Is a back panel, 21b is a recess provided in the back panel 20b, and a burring portion 22b into which the screw portion of the fastening screw 30 is screwed is provided. 2 is a card connector 6
0 at the end of the board, and a plurality of semiconductor elements 3 mounted on at least one side of the electric circuit board, the recess 21a, 21
There is a hole 62 at a location corresponding to b. Reference numeral 25 denotes a frame that includes and supports the electric circuit board 2. The frame includes an engaging portion 63a that engages with the ear portions 61a and 61b of the connector 60,
The rib 27 is provided at a position that does not interfere with the semiconductor element 3 mounted on the electric circuit board 2 and that has a rib 27 for improving the rigidity of the frame integrally with the frame 25.

FIG. 3 shows the front panel 20a and the back panel 20.
FIG. 10 is a partial cross-sectional view of a fastening portion of an IC card assembled by using b, 10 is an IC card, 2 is an electric circuit board on which a semiconductor element 3 and the like are mounted, and 25 includes the electric circuit board 2. It is a supporting frame, and the front panel 20a and the back panel 20b are fixed to the frame 25 by an adhesive 26. Then, the front panel 20a and the back panel 20b are joined by the fastening screw 30 to improve the rigidity of the IC card. Further, the front panel 20a and the back panel 20b have a flat surface portion 23a of the concave portion and a flat surface portion 23 of the concave portion.
The b's are joined in face-to-face contact and the front and back panels are made to be conductive. (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals.

FIG. 4 shows the front panel 20a and the back panel 20.
FIG. 3 is a partial cross-sectional view of a fastening portion of an IC card assembled by using b, where 10 is an IC card, 2 is an electric circuit board on which a semiconductor element 3 and the like are mounted, and 25 includes the electric circuit board 2. It is a supporting frame, and the front panel 20a and the back panel 20b are fixed to the frame 25 by an adhesive 26. Further, the front panel 20a and the back panel 20b are connected by the fastening screw 30 via the electric circuit board 2. The front panel 20a and the back panel 20b
Is coupled so that the flat surface portion 23a of the concave portion and the flat surface portion 23b of the concave portion are in surface contact with the electric circuit board 2, respectively, and the contact surface of the electric circuit board 2 with the panel becomes conductive due to snow holes. As a result, the front and back panels are firmly connected. With this configuration, the electric circuit board 2 and the front and back panels 20 are joined together, so that the mechanical rigidity of the IC card is improved. (Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals. FIG. 5 is a partial sectional view of a fastening portion of an IC card assembled by using the front panel 20a and the back panel 20b. The card 2 is an electric circuit board on which the semiconductor element 3 and the like are mounted, and 25 is a frame that includes and supports the electric circuit board 2. The front panel 20a and the back panel 20b are fixed to the frame 25 by an adhesive 26. To be done. In addition, reinforcing ribs 27 are provided on the frame 25 at locations that do not interfere with the semiconductor element 3 mounted on the electric circuit board 2.
Are provided integrally with the frame 25. In the first and second embodiments, the positions of the fastening portion and the rib 27 are set so as not to interfere with each other, but in the present embodiment, the position of the rib 27 is moved so that the front panel 20a and the back panel 20b are electrically connected. The circuit board 2 and the ribs 27 are coupled by fastening screws 30. Since the frame 25 is usually made of plastic, the rib 27 is provided with a metal tongue piece 28 for conducting the upper surface and the lower surface. The front panel 20a and the back panel 20b are connected to each other by the contact surface, the contact surface, the tongue piece 28, and the tongue piece 28 of the circuit board whose front and back surfaces are electrically connected to each other by the flat surface portion 23a of the recess and the snowhole. Flat part 2 of the convex part
3b and 3b are respectively brought into contact with each other at their surfaces, so that the front and back panels are firmly brought into conduction. In this configuration, the electric circuit board 2, the frame 25, and the front and back panels 20 are
Since a and 20b are combined, the mechanical rigidity of the IC card is further improved. Further, one end of the metal tongue piece 28 is not limited to this structure as long as it is electrically connected to the contact surface of the circuit board. (Fourth Embodiment) Recently, various developments have been made in the IC card as well, and an IC card as shown in FIG. 6 is proposed which is longer in the longitudinal direction and partially thick in the thickness direction than the conventional IC card. There is. Applications of this IC card include communication cards and card type cameras.
Although such an IC card has the same structure as the above-mentioned IC card, it cannot be formed of a metal plate because it is partially thick, and another cover member is provided. In this embodiment, the card rigidity and the resistance to static electricity in such a case are improved.

Next, a fourth embodiment of the present invention will be described with reference to FIG.

FIG. 7 shows a VI of the card type camera in FIG.
6 and 7 are cross-sectional views taken along the line I-VII. In FIG. 6 and FIG. 7, 40 is a card type camera, 2 is an electric circuit board on which the semiconductor element 3 and the like are mounted, 50a is a front panel and has ears 51a, and 50b. Has a recess 51b on the back panel which has a depth such that the head of the fastening member 41 does not project outside. 42 is an image pickup block including a CCD arranged on the electric circuit board, and 45 is a frame including and supporting the electric circuit board 2, the front panel 50a and the back panel 50b.
Is fixed to the frame 45 with an adhesive 46. Further, an opening 47 having a size that does not limit the luminous flux of the image pickup block 42 is also provided. Reference numeral 43 is a cover that covers the imaging block 42, is fixed to the frame, and is provided with a female screw portion 44 into which the screw portion of the fastening screw is screwed. In addition, the front panel 50a and the back panel 50
b is joined to the cover 43 by fastening screws 41. The connection between the front panel 50a and the back panel 50b is
The ear portion 51a having a flat surface portion and the flat surface portion 52b of the concave portion 51b are joined so as to come into surface contact with each other, so that the front and back panels are firmly conducted.

Further, in the present embodiment, it has been described that only the front and back panels are fastened with the fastening screws, but the effect of improving the rigidity of the card can be obtained even with the constructions of the above-mentioned second and third embodiments. Can be generated.

[0020]

As described above, according to the first aspect of the present invention.
According to the invention, a frame having an electric circuit board on which a semiconductor element and the like are mounted, and a rib arranged so as to surround the electric circuit board and provided at a position not interfering with the semiconductor element mounted on the electric circuit board. And an IC card having a metal front and back panel fixed to the frame and covering the electric circuit from both sides, and a coupling member for coupling the panels to each other, the coupling member includes at least a front panel and a back panel. Since they are mechanically coupled, the rigidity of the IC card can be improved.

According to the second aspect of the invention, an electric circuit board on which a semiconductor element or the like is mounted, and a position which is arranged so as to surround the electric circuit board and does not interfere with the semiconductor element mounted on the electric circuit board. A frame having ribs provided on the front and rear panels, a metal front and back panel fixed to the frame and covering the electric circuit from both sides, a cover member that covers at least one side of the circuit board separately from the panel, and the panel In the IC card having a connecting member for connecting the cover member to the cover member, since at least the front panel and the back panel are mechanically connected to the cover, the connecting member can improve the rigidity of the IC card. it can.

According to the invention of claim 3, claim 1
Further, in the invention of claim 2, since the front panel and the back panel are electrically connected to each other through the members to be coupled, the resistance to static electricity is improved.

Further, according to the invention of claim 4, in the invention of claim 3, since the front panel and the back panel are electrically connected by bringing the members to be joined into surface contact with each other, the resistance to static electricity is improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a main configuration of an IC card according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the main configuration of the IC card according to the first embodiment of the present invention.

FIG. 3 is a partial cross-sectional view showing the main structure of the IC card according to the first embodiment of the present invention.

FIG. 4 is a partial sectional view of an IC card according to a second embodiment of the present invention.

FIG. 5 is a partial sectional view of an IC card according to a third embodiment of the present invention.

FIG. 6 is a perspective view of an IC card according to a fourth embodiment of the present invention.

7 is a sectional view taken along line VII-VII in FIG.

FIG. 8 is a perspective view showing a conventional IC card.

9 is a sectional view taken along line IX-IX in FIG.

[Explanation of symbols]

 10, 40 IC card 2 Electric circuit board 3 Semiconductor element 20a, 20b, 50a, 50b Panel 25, 45 Frame 26 Adhesive 27 Rib 42 Imaging block 43 Cover

Claims (4)

[Claims] 1. An electric circuit board on which electronic components such as semiconductor elements are mounted, and the electric circuit board is arranged so as to surround the electric circuit board.
A frame having ribs provided at positions not interfering with semiconductor elements mounted on the electric circuit board, metal front and back panels fixed to the frame and covering the electric circuit from both sides, and the panels are coupled to each other. An IC card having a coupling member for allowing the coupling member to couple at least a front panel and a back panel. 2. An electric circuit board on which electronic parts such as semiconductor elements are mounted, and the electric circuit board is arranged so as to surround the electric circuit board.
A frame having ribs provided at positions not interfering with semiconductor elements mounted on the electric circuit board, front and back panels made of metal fixed to the frame and covering the electric circuit from both sides, and the panel separately. In an IC card having a cover member that covers at least one surface of the circuit board and a coupling member that couples the panel to the cover member, the coupling member couples at least a front panel and a back panel to the cover. An IC card characterized by 3. The IC card according to claim 1, wherein the coupling member electrically connects the front and back panels via the coupling member. 4. The IC card according to claim 3, wherein the coupling member electrically connects the front and back panels by bringing the coupling members into surface contact with each other.