JPH0999679A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH0999679A JPH0999679A JP7284424A JP28442495A JPH0999679A JP H0999679 A JPH0999679 A JP H0999679A JP 7284424 A JP7284424 A JP 7284424A JP 28442495 A JP28442495 A JP 28442495A JP H0999679 A JPH0999679 A JP H0999679A
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- circuit board
- card
- frame
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Credit Cards Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ICカードのパネ
ルの組立構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card panel assembly structure.
【0002】[0002]
【従来の技術】図8は、従来のICカードを示す斜視図
であり、図9は図8のIX−IX断面図である。図8,
9において、1はICカード、2は半導体素子3等を登
載した電気回路基板、4はこの電気回路基板2を包含し
支持するフレーム、5a,5bはこのフレーム4に嵌合
し、前記半導体素子3等を両面より保護する表パネル及
び裏パネルである。また、6は前記フレーム4の設けら
れた穴部4aに位置し、表パネル5aと裏パネル5bと
を電気的に接続している同電位用バネである。2. Description of the Related Art FIG. 8 is a perspective view showing a conventional IC card, and FIG. 9 is a sectional view taken along line IX-IX in FIG. Figure 8,
In FIG. 9, 1 is an IC card, 2 is an electric circuit board on which a semiconductor element 3 and the like are mounted, 4 is a frame that includes and supports the electric circuit board 2, 5a and 5b are fitted to the frame 4, and the semiconductor element A front panel and a back panel that protect 3 etc. from both sides. Reference numeral 6 is a spring for the same potential, which is located in the hole 4a provided in the frame 4 and electrically connects the front panel 5a and the back panel 5b.
【0003】次に、上記ICカードのパネル構造につい
て説明する。先の図8で、表パネル5a及び裏パネル5
bはフレーム4に両面テープ等の接着シートまたは接着
剤によって固定されている。Next, the panel structure of the IC card will be described. The front panel 5a and the back panel 5 shown in FIG.
b is fixed to the frame 4 by an adhesive sheet such as a double-sided tape or an adhesive.
【0004】また、ICカード1内の半導体素子3等の
静電気に対する耐力向上のために表パネル5aと裏パネ
ル5bの導電が必要であるが、これに対してはフレーム
4に穴部4aを設け、この穴部4aに同電位用バネ6を
挿入し、この同電位用バネにより電気的導電をなしてい
る。Further, the front panel 5a and the back panel 5b need to be electrically conductive in order to improve the resistance to static electricity of the semiconductor element 3 and the like in the IC card 1. For this, a hole 4a is provided in the frame 4. The same-potential spring 6 is inserted into the hole 4a, and the same-potential spring is electrically conductive.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、フレー
ム4とパネル5a,5bの固定は接着のみしかよらず、
強度的にも十分とはいえなかった。また表パネル5aと
裏パネル5bの導電に関して、同電位用バネ6を用いて
いるために部品点数及び組立作業工程の増加等問題があ
った。However, the frame 4 and the panels 5a and 5b are fixed only by adhesion,
It was not enough in terms of strength. Further, regarding the conduction of the front panel 5a and the back panel 5b, since the same potential spring 6 is used, there are problems such as an increase in the number of parts and an assembly work process.
【0006】そこで、本発明の目的は、ICカードの剛
性を向上させると共に、表裏パネルを導電させる同電位
用バネをなくし、部品点数の減少及び組立作業の簡易化
を目的とする。Therefore, an object of the present invention is to improve the rigidity of an IC card and to eliminate the same potential spring for conducting the front and back panels, thereby reducing the number of parts and simplifying the assembling work.
【0007】[0007]
【課題を解決するための手段】本発明は、半導体素子及
びその他の回路素子を登載した電気回路基板と、この回
路基板を囲む様に、かつ、回路基板に実装された半導体
素子等に干渉しない位置に設けられたリブを有するフレ
ームと、このフレームに固定され、前記電気回路を両面
より覆う金属製の表及び裏パネルと、これらパネルを互
いに機械的に結合させる結合部材とを有するICカード
である。According to the present invention, an electric circuit board on which a semiconductor element and other circuit elements are mounted and a semiconductor element mounted on the circuit board and surrounding the circuit board do not interfere with each other. An IC card having a frame having ribs provided at positions, metal front and back panels fixed to the frame and covering the electric circuit from both sides, and a coupling member for mechanically coupling these panels to each other. is there.
【0008】[0008]
【発明の実施の形態】本発明の請求項1の発明によれ
ば、半導体素子等を登載した電気回路基板と、前記電気
回路基板を囲む様に配置され、前記電気回路基板に実装
された半導体素子に干渉しない位置に設けられたリブを
有するフレームと、前記フレームに固定され前記電気回
路を両面より覆う金属製の表及び裏パネルと、前記パネ
ルを互いに結合させる結合部材とを有するICカードに
おいて、前記結合部材は、少なくとも表パネル、裏パネ
ルを機械的に結合させたので、ICカードの剛性を向上
させることができる。According to a first aspect of the present invention, an electric circuit board on which a semiconductor element or the like is mounted, and a semiconductor which is arranged so as to surround the electric circuit board and is mounted on the electric circuit board. In an IC card having a frame having ribs provided at positions not interfering with elements, metal front and back panels fixed to the frame and covering the electric circuit from both sides, and a coupling member for coupling the panels to each other. Since the coupling member mechanically couples at least the front panel and the back panel, the rigidity of the IC card can be improved.
【0009】また、請求項2の発明によれば、半導体素
子等を登載した電気回路基板と、前記電気回路基板を囲
む様に配置され、前記電気回路基板に実装された半導体
素子に干渉しない位置に設けられたリブを有するフレー
ムと、前記フレームに固定され前記電気回路を両面より
覆う金属製の表及び裏パネルと、前記パネルとは別に前
記回路基板の少なくとも片面を覆うカバー部材と、前記
パネルを前記カバー部材に結合させる結合部材を有する
ICカードにおいて、前記結合部材は、前記カバーに対
して、少なくとも表パネル、裏パネルを機械的に結合さ
せたので、ICカードの剛性を向上させることができ
る。According to the invention of claim 2, an electric circuit board on which a semiconductor element or the like is mounted, and a position which is arranged so as to surround the electric circuit board and does not interfere with the semiconductor element mounted on the electric circuit board. A frame having ribs provided on the front and rear panels, a metal front and back panel fixed to the frame and covering the electric circuit from both sides, a cover member that covers at least one side of the circuit board separately from the panel, and the panel In the IC card having a connecting member for connecting the cover member to the cover member, since at least the front panel and the back panel are mechanically connected to the cover, the connecting member can improve the rigidity of the IC card. it can.
【0010】また、請求項3の発明によれば、請求項1
及び請求項2の発明において、結合させる部材を介して
表パネルと裏パネルとの導通を図るので、静電気に対す
る耐力が向上する。[0010] According to the invention of claim 3, according to claim 1 of the present invention.
Further, in the invention of claim 2, since the front panel and the back panel are electrically connected to each other through the members to be coupled, the resistance to static electricity is improved.
【0011】さらに、請求項4の発明によれば、請求項
3の発明において、結合させる部材を面接触させること
により表パネルと裏のパネルとの導通を図るので、静電
気に対する耐力が向上する。Furthermore, according to the invention of claim 4, in the invention of claim 3, since the members to be joined are brought into surface contact with each other to establish conduction between the front panel and the back panel, the resistance to static electricity is improved.
【0012】[0012]
(第1の実施例)以下、この発明の一実施例を図1〜図
3において説明する。(First Embodiment) An embodiment of the present invention will be described below with reference to FIGS.
【0013】図1は本発明によるICカードを示す斜視
図で、10はICカード、20は金属製のパネル、30
は表裏のパネルを結合させるビス、25はフレーム、6
0はたとえばパソコンのスロットに結合するカードコネ
クタである。FIG. 1 is a perspective view showing an IC card according to the present invention. 10 is an IC card, 20 is a metal panel, and 30 is a panel.
Is a screw that connects the front and back panels, 25 is a frame, 6
Reference numeral 0 is a card connector that is connected to a slot of a personal computer, for example.
【0014】図2は本実施例を示すICカードの分解斜
視図で、20aは表パネル、21aはこの表パネル20
aに設けられた凹部で、締結用ビス30の頭部が外部に
出っ張らない深さになっており、その中心には締結用ビ
ス30が貫入される穴22aが設けられている。20b
は裏パネル、21bはこの裏パネル20bに設けられた
凹部で、締結用ビス30のねじ部がねじ込まれるバーリ
ング部22bが設けられている。2はカードコネクタ6
0を基板の端部に有し、複数の半導体素子3を少なくと
も片面に実装された電気回路基板で、凹部21a,21
bに対応した場所に穴部62を有す。25は電気回路基
板2を包含し、支持するフレームでフレームにはコネク
タ60の耳部61a,61bと係合する係合部63a,
63bを有すると共に、電気回路基板2に実装された半
導体素子3に干渉しない位置に設けられ、フレームの剛
性を向上させるためのリブ27がフレーム25に一体的
に設けられている。FIG. 2 is an exploded perspective view of an IC card according to this embodiment, in which 20a is a front panel and 21a is this front panel 20.
In the concave portion provided in a, the head of the fastening screw 30 has a depth that does not project outside, and a hole 22a through which the fastening screw 30 is inserted is provided at the center thereof. 20b
Is a back panel, 21b is a recess provided in the back panel 20b, and a burring portion 22b into which the screw portion of the fastening screw 30 is screwed is provided. 2 is a card connector 6
0 at the end of the board, and a plurality of semiconductor elements 3 mounted on at least one side of the electric circuit board, the recess 21a, 21
There is a hole 62 at a location corresponding to b. Reference numeral 25 denotes a frame that includes and supports the electric circuit board 2. The frame includes an engaging portion 63a that engages with the ear portions 61a and 61b of the connector 60,
The rib 27 is provided at a position that does not interfere with the semiconductor element 3 mounted on the electric circuit board 2 and that has a rib 27 for improving the rigidity of the frame integrally with the frame 25.
【0015】図3は前記表パネル20aと裏パネル20
bを用いて組み立てられたICカードの締結部の部分断
面図を示したもので、10はICカード、2は半導体素
子3等を登載した電気回路基板、25はこの電気回路基
板2を包含し支持しているフレームであり、前記表パネ
ル20aと裏パネル20bは接着剤26によってフレー
ム25に固定される。そして、前記表パネル20aと裏
パネル20bは締結用ビス30により結合され、ICカ
ードの剛性が向上する。また、前記表パネル20aと裏
パネル20bは凹部の平面部23aと凹部の平面部23
bが面で接触するよう結合され、表裏パネルがしっかり
と導電させられる。 (第2の実施例)次に本発明の第2の実施例を図4をも
とに説明する。第1の実施例と同じ構成のものは同一符
号を付与する。FIG. 3 shows the front panel 20a and the back panel 20.
FIG. 10 is a partial cross-sectional view of a fastening portion of an IC card assembled by using b, 10 is an IC card, 2 is an electric circuit board on which a semiconductor element 3 and the like are mounted, and 25 includes the electric circuit board 2. It is a supporting frame, and the front panel 20a and the back panel 20b are fixed to the frame 25 by an adhesive 26. Then, the front panel 20a and the back panel 20b are joined by the fastening screw 30 to improve the rigidity of the IC card. Further, the front panel 20a and the back panel 20b have a flat surface portion 23a of the concave portion and a flat surface portion 23 of the concave portion.
The b's are joined in face-to-face contact and the front and back panels are made to be conductive. (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals.
【0016】図4は前記表パネル20aと裏パネル20
bを用いて組み立てられたICカードの締結部の部分断
面図を示したもので、10はICカード、2は半導体素
子3等を搭載した電気回路基板、25はこの電気回路基
板2を包含し支持しているフレームであり、前記表パネ
ル20aと裏パネル20bは接着剤26によってフレー
ム25に固定される。また、前記表パネル20aと裏パ
ネル20bは電気回路基板2を介して締結用ビス30に
より結合される。前記表パネル20aと裏パネル20b
は、凹部の平面部23aと凹部の平面部23bがそれぞ
れ電気回路基板2に面で接触するよう結合され、電気回
路基板2のパネルとの当接面はスノーホールにより表裏
が導通状態になっており、その結果表裏パネルがしっか
りと導通させられる。この構成では、電気回路基板2と
表裏パネル20が結合されるのでICカードの機械的剛
性が向上する。 (第3の実施例)次に本発明の第3の実施例を図5をも
とに説明する。第1の実施例と同じ構成のものは同一符
号を付与する 図5は前記表パネル20aと裏パネル20bを用いて組
み立てたICカードの締結部の部分断面図を示したもの
で、10はICカード、2は半導体素子3等を搭載した
電気回路基板、25はこの電気回路基板2を包含し支持
しているフレームであり、前記表パネル20aと裏パネ
ル20bは接着剤26によってフレーム25に固定され
る。また、フレーム25には前記電気回路基板2に実装
された半導体素子3に干渉しない場所に補強用リブ27
がフレーム25と一体的に設けられている。第1及び第
2の実施例では締結部とリブ27の位置は干渉しない様
に設定されているが、本実施例では、リブ27の位置を
移動させ、前記表パネル20aと裏パネル20bは電気
回路基板2とリブ27を介して締結用ビス30により結
合される。通常フレーム25はプラスチック製であるた
め、リブ27には上面と下面の導通を図る金属製の舌片
28が設けられている。そして、前記表パネル20aと
裏パネル20bとの結合は、凹部の平面部23aとスノ
ーホールにより表裏が導通状態になった回路基板の当接
面、当接面と舌片28そして舌片28と凸部の平面部2
3bとがそれぞれ面で接触するよう結合され、その結果
表裏パネルがしっかりと導通させられる。この構成で
は、電気回路基板2とフレーム25と表裏パネル20
a、20bが結合されるのでICカードの機械的剛性が
さらに向上する。また、金属製の舌片28の一端は、回
路基板の当接面に電気的に接続されていれば良いのでこ
の構成に限定されることはない。 (第4の実施例)最近ICカードにおいても様々な展開
が図られ、図6に示すような従来のICカードに対して
長手方向に対して長くかつ厚み方向に関して一部分厚い
ICカードが提案されている。このICカードの用途と
しては、通信カードやカード型カメラ等があげられる。
このようなICカードも構成は上述のICカードと同じ
であるが、一部分厚くなっているために金属板では形成
できず別のカバー部材を設けている。本実施例ではこの
ような場合におけるカード剛性と静電気に対する耐力の
向上を実現する。FIG. 4 shows the front panel 20a and the back panel 20.
FIG. 3 is a partial cross-sectional view of a fastening portion of an IC card assembled by using b, where 10 is an IC card, 2 is an electric circuit board on which a semiconductor element 3 and the like are mounted, and 25 includes the electric circuit board 2. It is a supporting frame, and the front panel 20a and the back panel 20b are fixed to the frame 25 by an adhesive 26. Further, the front panel 20a and the back panel 20b are connected by the fastening screw 30 via the electric circuit board 2. The front panel 20a and the back panel 20b
Is coupled so that the flat surface portion 23a of the concave portion and the flat surface portion 23b of the concave portion are in surface contact with the electric circuit board 2, respectively, and the contact surface of the electric circuit board 2 with the panel becomes conductive due to snow holes. As a result, the front and back panels are firmly connected. With this configuration, the electric circuit board 2 and the front and back panels 20 are joined together, so that the mechanical rigidity of the IC card is improved. (Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. The same components as those in the first embodiment are designated by the same reference numerals. FIG. 5 is a partial sectional view of a fastening portion of an IC card assembled by using the front panel 20a and the back panel 20b. The card 2 is an electric circuit board on which the semiconductor element 3 and the like are mounted, and 25 is a frame that includes and supports the electric circuit board 2. The front panel 20a and the back panel 20b are fixed to the frame 25 by an adhesive 26. To be done. In addition, reinforcing ribs 27 are provided on the frame 25 at locations that do not interfere with the semiconductor element 3 mounted on the electric circuit board 2.
Are provided integrally with the frame 25. In the first and second embodiments, the positions of the fastening portion and the rib 27 are set so as not to interfere with each other, but in the present embodiment, the position of the rib 27 is moved so that the front panel 20a and the back panel 20b are electrically connected. The circuit board 2 and the ribs 27 are coupled by fastening screws 30. Since the frame 25 is usually made of plastic, the rib 27 is provided with a metal tongue piece 28 for conducting the upper surface and the lower surface. The front panel 20a and the back panel 20b are connected to each other by the contact surface, the contact surface, the tongue piece 28, and the tongue piece 28 of the circuit board whose front and back surfaces are electrically connected to each other by the flat surface portion 23a of the recess and the snowhole. Flat part 2 of the convex part
3b and 3b are respectively brought into contact with each other at their surfaces, so that the front and back panels are firmly brought into conduction. In this configuration, the electric circuit board 2, the frame 25, and the front and back panels 20 are
Since a and 20b are combined, the mechanical rigidity of the IC card is further improved. Further, one end of the metal tongue piece 28 is not limited to this structure as long as it is electrically connected to the contact surface of the circuit board. (Fourth Embodiment) Recently, various developments have been made in the IC card as well, and an IC card as shown in FIG. 6 is proposed which is longer in the longitudinal direction and partially thick in the thickness direction than the conventional IC card. There is. Applications of this IC card include communication cards and card type cameras.
Although such an IC card has the same structure as the above-mentioned IC card, it cannot be formed of a metal plate because it is partially thick, and another cover member is provided. In this embodiment, the card rigidity and the resistance to static electricity in such a case are improved.
【0017】次に本発明の第4の実施例を7図を用いて
説明する。Next, a fourth embodiment of the present invention will be described with reference to FIG.
【0018】図7はカード型カメラの図6におけるVI
I−VII断面図を示したもので、図6、図7におい
て、40はカード型カメラ、2は半導体素子3等を搭載
した電気回路基板、50aは表パネルで耳部51aを有
し、50bは裏パネルで締結部材41の頭部が外部に出
っ張らない深さになっている凹部51bを有す。42は
前記電気回路基板上に配置されたCCDを含む撮像ブロ
ック、45はこの電気回路基板2を包含し支持している
フレームであり、前記表パネル50aと裏パネル50b
は接着剤46によってフレーム45に固定される。ま
た、前記撮像ブロック42の光束を制限しない大きさの
開口47も備えている。43は前記撮像ブロック42を
覆い、前記フレームに固定されると共に、前記締結用ビ
スのねじ部がねじ込まれる雌ねじ部44が設けられたカ
バーである。また、前記表パネル50aと裏パネル50
bは締結用ビス41によりカバー43に対して結合され
る。前記表パネル50aと裏パネル50bとの結合は、
平面部を有す耳部51aと凹部51bの平面部52bが
面で接触するよう結合され、表裏パネルがしっかりと導
通させられる。FIG. 7 shows a VI of the card type camera in FIG.
6 and 7 are cross-sectional views taken along the line I-VII. In FIG. 6 and FIG. 7, 40 is a card type camera, 2 is an electric circuit board on which the semiconductor element 3 and the like are mounted, 50a is a front panel and has ears 51a, and 50b. Has a recess 51b on the back panel which has a depth such that the head of the fastening member 41 does not project outside. 42 is an image pickup block including a CCD arranged on the electric circuit board, and 45 is a frame including and supporting the electric circuit board 2, the front panel 50a and the back panel 50b.
Is fixed to the frame 45 with an adhesive 46. Further, an opening 47 having a size that does not limit the luminous flux of the image pickup block 42 is also provided. Reference numeral 43 is a cover that covers the imaging block 42, is fixed to the frame, and is provided with a female screw portion 44 into which the screw portion of the fastening screw is screwed. In addition, the front panel 50a and the back panel 50
b is joined to the cover 43 by fastening screws 41. The connection between the front panel 50a and the back panel 50b is
The ear portion 51a having a flat surface portion and the flat surface portion 52b of the concave portion 51b are joined so as to come into surface contact with each other, so that the front and back panels are firmly conducted.
【0019】また、本実施例では表裏のパネルのみを締
結用ビスで締結するとして説明したが、上述の第2、第
3の実施例の様な構成にしてもカードの剛性の向上とい
う効果を生じさせることができる。Further, in the present embodiment, it has been described that only the front and back panels are fastened with the fastening screws, but the effect of improving the rigidity of the card can be obtained even with the constructions of the above-mentioned second and third embodiments. Can be generated.
【0020】[0020]
【発明の効果】以上説明したように、本発明の請求項1
の発明によれば、半導体素子等を登載した電気回路基板
と、前記電気回路基板を囲む様に配置され、前記電気回
路基板に実装された半導体素子に干渉しない位置に設け
られたリブを有するフレームと、前記フレームに固定さ
れ前記電気回路を両面より覆う金属製の表及び裏パネル
と、前記パネルを互いに結合させる結合部材とを有する
ICカードにおいて、前記結合部材は、少なくとも表パ
ネル、裏パネルを機械的に結合させたので、ICカード
の剛性を向上させることができる。As described above, according to the first aspect of the present invention.
According to the invention, a frame having an electric circuit board on which a semiconductor element and the like are mounted, and a rib arranged so as to surround the electric circuit board and provided at a position not interfering with the semiconductor element mounted on the electric circuit board. And an IC card having a metal front and back panel fixed to the frame and covering the electric circuit from both sides, and a coupling member for coupling the panels to each other, the coupling member includes at least a front panel and a back panel. Since they are mechanically coupled, the rigidity of the IC card can be improved.
【0021】また、請求項2の発明によれば、半導体素
子等を登載した電気回路基板と、前記電気回路基板を囲
む様に配置され、前記電気回路基板に実装された半導体
素子に干渉しない位置に設けられたリブを有するフレー
ムと、前記フレームに固定され前記電気回路を両面より
覆う金属製の表及び裏パネルと、前記パネルとは別に前
記回路基板の少なくとも片面を覆うカバー部材と、前記
パネルを前記カバー部材に結合させる結合部材を有する
ICカードにおいて、前記結合部材は、前記カバーに対
して、少なくとも表パネル、裏パネルを機械的に結合さ
せたので、ICカードの剛性を向上させることができ
る。According to the second aspect of the invention, an electric circuit board on which a semiconductor element or the like is mounted, and a position which is arranged so as to surround the electric circuit board and does not interfere with the semiconductor element mounted on the electric circuit board. A frame having ribs provided on the front and rear panels, a metal front and back panel fixed to the frame and covering the electric circuit from both sides, a cover member that covers at least one side of the circuit board separately from the panel, and the panel In the IC card having a connecting member for connecting the cover member to the cover member, since at least the front panel and the back panel are mechanically connected to the cover, the connecting member can improve the rigidity of the IC card. it can.
【0022】また、請求項3の発明によれば、請求項1
及び請求項2の発明において、結合させる部材を介して
表パネルと裏パネルとの導通を図るので、静電気に対す
る耐力が向上する。According to the invention of claim 3, claim 1
Further, in the invention of claim 2, since the front panel and the back panel are electrically connected to each other through the members to be coupled, the resistance to static electricity is improved.
【0023】さらに、請求項4の発明によれば、請求項
3の発明において、結合させる部材を面接触させること
により表パネルと裏のパネルとの導通を図るので、静電
気に対する耐力が向上する。Further, according to the invention of claim 4, in the invention of claim 3, since the front panel and the back panel are electrically connected by bringing the members to be joined into surface contact with each other, the resistance to static electricity is improved.
【図1】本発明の第1の実施例によるICカードの主要
構成を示す斜視図である。FIG. 1 is a perspective view showing a main configuration of an IC card according to a first embodiment of the present invention.
【図2】本発明の第1の実施例によるICカードの主要
構成を示す分解斜視図である。FIG. 2 is an exploded perspective view showing the main configuration of the IC card according to the first embodiment of the present invention.
【図3】本発明の第1の実施例によるICカードの主要
構成を示す部分断面図である。FIG. 3 is a partial cross-sectional view showing the main structure of the IC card according to the first embodiment of the present invention.
【図4】本発明の第2の実施例によるICカードの部分
断面図である。FIG. 4 is a partial sectional view of an IC card according to a second embodiment of the present invention.
【図5】本発明の第3の実施例によるICカードの部分
断面図である。FIG. 5 is a partial sectional view of an IC card according to a third embodiment of the present invention.
【図6】本発明の第4の実施例によるICカードの斜視
図である。FIG. 6 is a perspective view of an IC card according to a fourth embodiment of the present invention.
【図7】図6のVII−VII断面図である。7 is a sectional view taken along line VII-VII in FIG.
【図8】従来のICカードを示す斜視図である。FIG. 8 is a perspective view showing a conventional IC card.
【図9】図8のIX−IX断面図である。9 is a sectional view taken along line IX-IX in FIG.
10,40 ICカード 2 電気回路基板 3 半導体素子 20a,20b,50a,50b パネル 25,45 フレーム 26 接着剤 27 リブ 42 撮像ブロック 43 カバー 10, 40 IC card 2 Electric circuit board 3 Semiconductor element 20a, 20b, 50a, 50b Panel 25, 45 Frame 26 Adhesive 27 Rib 42 Imaging block 43 Cover
Claims (4)
気回路基板と、前記電気回路基板を囲む様に配置され、
前記電気回路基板に実装された半導体素子に干渉しない
位置に設けられたリブを有するフレームと、前記フレー
ムに固定され前記電気回路を両面より覆う金属製の表及
び裏パネルと、前記パネルを互いに結合させる結合部材
とを有するICカードにおいて、 前記結合部材は、少なくとも表パネル、裏パネルとを結
合させることを特徴とするICカード。1. An electric circuit board on which electronic components such as semiconductor elements are mounted, and the electric circuit board is arranged so as to surround the electric circuit board.
A frame having ribs provided at positions not interfering with semiconductor elements mounted on the electric circuit board, metal front and back panels fixed to the frame and covering the electric circuit from both sides, and the panels are coupled to each other. An IC card having a coupling member for allowing the coupling member to couple at least a front panel and a back panel.
気回路基板と、前記電気回路基板を囲む様に配置され、
前記電気回路基板に実装された半導体素子に干渉しない
位置に設けられたリブを有するフレームと、前記フレー
ムに固定され前記電気回路を両面より覆う金属製の表及
び裏パネルと、前記パネルとは別に前記回路基板の少な
くとも片面を覆うカバー部材と、前記パネルを前記カバ
ー部材に結合させる結合部材とを有するICカードにお
いて、 前記結合部材は、前記カバーに対して、少なくとも表パ
ネル、裏パネルを結合させることを特徴とするICカー
ド。2. An electric circuit board on which electronic parts such as semiconductor elements are mounted, and the electric circuit board is arranged so as to surround the electric circuit board.
A frame having ribs provided at positions not interfering with semiconductor elements mounted on the electric circuit board, front and back panels made of metal fixed to the frame and covering the electric circuit from both sides, and the panel separately. In an IC card having a cover member that covers at least one surface of the circuit board and a coupling member that couples the panel to the cover member, the coupling member couples at least a front panel and a back panel to the cover. An IC card characterized by
いて、 前記結合部材は、結合させる部材を介して表裏のパネル
を電気的に導通させたことを特徴とするICカード。3. The IC card according to claim 1, wherein the coupling member electrically connects the front and back panels via the coupling member.
より表裏のパネルを電気的に導通させたことを特徴とす
るICカード。4. The IC card according to claim 3, wherein the coupling member electrically connects the front and back panels by bringing the coupling members into surface contact with each other.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7284424A JPH0999679A (en) | 1995-10-06 | 1995-10-06 | Ic card |
US08/690,793 US5991468A (en) | 1995-08-03 | 1996-08-01 | Card-type image sensor |
EP96112544A EP0757479A3 (en) | 1995-08-03 | 1996-08-02 | Image sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7284424A JPH0999679A (en) | 1995-10-06 | 1995-10-06 | Ic card |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0999679A true JPH0999679A (en) | 1997-04-15 |
Family
ID=17678381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7284424A Withdrawn JPH0999679A (en) | 1995-08-03 | 1995-10-06 | Ic card |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0999679A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004221440A (en) * | 2003-01-17 | 2004-08-05 | Sanyo Electric Co Ltd | Radio communications card |
US7765687B2 (en) * | 2005-08-11 | 2010-08-03 | Synqor, Inc. | Method for mechanical packaging of electronics |
JP2015026043A (en) * | 2013-06-20 | 2015-02-05 | ブラザー工業株式会社 | Image forming apparatus |
JP2015026044A (en) * | 2013-06-20 | 2015-02-05 | ブラザー工業株式会社 | Image forming apparatus |
JP2015121677A (en) * | 2013-12-24 | 2015-07-02 | ブラザー工業株式会社 | Image forming apparatus |
-
1995
- 1995-10-06 JP JP7284424A patent/JPH0999679A/en not_active Withdrawn
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004221440A (en) * | 2003-01-17 | 2004-08-05 | Sanyo Electric Co Ltd | Radio communications card |
US7765687B2 (en) * | 2005-08-11 | 2010-08-03 | Synqor, Inc. | Method for mechanical packaging of electronics |
US8644027B2 (en) | 2005-08-11 | 2014-02-04 | Synqor, Inc. | Method for mechanical packaging of electronics |
JP2015026043A (en) * | 2013-06-20 | 2015-02-05 | ブラザー工業株式会社 | Image forming apparatus |
JP2015026044A (en) * | 2013-06-20 | 2015-02-05 | ブラザー工業株式会社 | Image forming apparatus |
JP2015121677A (en) * | 2013-12-24 | 2015-07-02 | ブラザー工業株式会社 | Image forming apparatus |
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