JP2001273960A - Socket for semiconductor mounting and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for mounting a semiconductor that has a sufficient insulation resistance between electrodes and that has a less load when pressure- contacted. SOLUTION: In a socket for mounting the semiconductor comprising a framework for connection in a face-to-face position to a circuit board 110 mounted with a packaged semiconductor 100 and pressure-contacting type connectors to obtain an electric connection by compressing the package from an upper side, the pressure-contacting type connector 14 comprises an insulating elastomer 21 on a flat plate, metal wires 16 arranged on both sides of this elastomer and a plate 20 with holes in a position equivalent to an electrode of the semiconductor. The metal wires 16 are plurally arranged through the holes of the plate 20 and formed as an electrode part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor socket used for mounting a packaged semiconductor, mainly a semiconductor corresponding to an area array type package such as LGA and BGA on a substrate, and a method of manufacturing the same. It is.

[0002]

2. Description of the Related Art Conventionally, sockets for mounting such a semiconductor include a socket in which metal pins are arranged in a resin frame, a socket in which spring probes are arranged in resin, and a socket using an anisotropic conductive sheet. Have been used.

[0003]

In a socket in which metal pins are arranged and a socket in which spring probes are arranged,
Since the compression for electrically connecting the semiconductor is supported by the spring property of a metal, a spring spring or a curved spring pin is used, so the conduction path becomes longer and the electric capacity becomes larger. There is a problem that it is not possible to cope with the high speed. On the other hand, sockets using anisotropic conductive sheets are also used for this purpose, but metal wires that do not contribute to connection are buried between the electrodes because the metal wires are uniformly arranged in all areas. Therefore, there is a problem that the inter-electrode insulation resistance decreases and crosstalk occurs, and furthermore, there is a problem that a load at the time of press-fitting increases because many metal wires are compressed.

An object of the present invention is to provide a semiconductor mounting socket which ensures a sufficient inter-electrode insulation resistance, minimizes the occurrence of crosstalk, and requires a small load during pressure welding.

[0005]

To solve the above problems, the present invention employs the following means. According to a first aspect of the present invention, there is provided a semiconductor package comprising a frame for positioning a packaged semiconductor on a substrate on which the package is mounted, and a press-connecting connector for obtaining electrical connection by compressing the package from above. In the socket, the press-connecting type connector is constituted by an insulating elastomer on a flat plate, a metal wire disposed over the front and back surfaces of the elastomer, and a plate having a hole at a position corresponding to a semiconductor electrode; It is characterized in that a plurality of wires penetrate through the holes of the plate and are arranged as electrode portions.

[0006] In the first aspect of the present invention, the metal wire of the press-connecting connector is arranged in a thickness direction of the press-connecting connector.
It is preferable that the metal wires are arranged with a certain angle in a range of 45 ° to 90 °, and the length of the metal wire is in a range of 0.5 mm to 2 mm.

According to the first aspect of the present invention, the metal wire of the press-connecting connector is formed in a spiral shape, and the number of turns r is zero.
<R ≦ 1 is preferable.

According to the first aspect of the present invention, at least one of the front and back surfaces of the pressure contact type connector has only an electrode portion of 0.05 mm
It is preferable to protrude constantly within a range of 0.3 mm.

In the first aspect of the present invention, the plate preferably has a hole for controlling a relative position between a substrate on which the semiconductor is mounted and a frame of a semiconductor mounting socket.

In the first aspect of the present invention, it is preferable that at least one surface of the plate is covered with an insulating elastomer.

According to a second aspect of the present invention, there is provided a method of manufacturing a semiconductor mounting socket, comprising: forming a plurality of linear bodies in which a plurality of metal wires are embedded in an insulating elastomer; Forming a plate having holes at opposing positions, arranging a plurality of such plates in parallel, penetrating the linear body through all the holes for the electrode positions, and arranging these plates at predetermined intervals; A step of casting this into an elastomer casting mold to cast and cure the insulating elastomer member, and a step of taking out the cured product from the mold and cutting between the plates to form a press-fit connector. Laser engraving of the elastomer other than the electrode position with a laser to protrude the electrode part, and integration with the frame to connect this press-fit connector to the position opposite to the board on which the semiconductor is mounted It is characterized by comprising that the step.

In the invention described in claim 2, the step of forming the plate includes a step of forming a position control hole for controlling a relative position between the substrate on which the semiconductor is mounted and the frame of the semiconductor mounting socket. Is preferred.

[0013]

According to the first aspect of the invention, since the position of the metal wire provided in the insulating elastomer is restricted by the plate and is only the position corresponding to the semiconductor electrode, a sufficient insulation resistance can be obtained. In addition, crosstalk can be suppressed to a minimum, and the load at the time of pressing can be reduced because the metal wire is compressed. Further, if the metal wire is inclined, the spring property is improved, and the contact with the semiconductor contact and the substrate contact can be maintained with a small pressing force. When the metal wire is formed into a spiral shape, the spring property is further improved, and the contact with the semiconductor contact and the substrate contact can be maintained with a small pressing force. If at least one of the front and back surfaces of the press-connecting connector is formed such that only the electrode portion protrudes constantly, the pressing force can be further reduced. When the plate is provided with a hole for controlling the relative position of the semiconductor mounting socket relative to the frame, when the frame is mounted on the substrate, the electrode portions of the semiconductor coincide with the electrodes of the substrate. If the elastomer is arranged only on one side of the plate, the pressing force can be reduced. According to the second aspect of the present invention, the semiconductor mounting socket according to the first aspect can be manufactured.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a state in which a semiconductor package 100 is mounted on a mounting substrate 110 using a semiconductor mounting socket 10 according to a first embodiment of the present invention, and FIG. 2 is an exploded side view. The semiconductor mounting socket 10 is composed of a frame 12 for positioning the packaged semiconductor on a mounting substrate 110 and a press-connecting connector 14 for obtaining electrical connection by compressing the package 100 from above. Have been. In addition,
Reference numeral 120 in the figure is a heat sink. FIG. 3 is a longitudinal sectional view showing a state where the semiconductor package 100 is mounted on a mounting substrate 110 using the semiconductor mounting socket 10;
FIG. 4 is an enlarged view of a portion A of the round frame in FIG.

Next, a method of manufacturing the semiconductor mounting socket 10 will be described. First, a method of manufacturing the press contact type connector 14 of the semiconductor mounting socket 10 will be described with reference to FIGS. Reference numeral 13 in FIG. 6 is a punching blade. As shown in FIG. 5 (a), two metal wires 16 are sandwiched between three uncured silicone rubber sheets 15 in a state of being arranged in parallel, and press-cured. Next, the completed sheet 17 containing a metal wire is cut by a cutter 18 as shown in FIG. 3B to form a linear body 19 as shown in FIG. The linear body 19 includes four metal wires 16 inside. The metal wire 16 is a metal wire of various shapes such as circular, elliptical, and square in cross section.
Copper, tungsten, iron, nickel, gold, silver, or alloys thereof can be used. Plating various metals such as nickel, Au, Pd, and Pt on the surface thereof is optional.

On the other hand, as shown in FIG. 5D, a hole 20a is provided at a position opposite to the electrode position of the semiconductor package.
Further, a plate 20 having a position control hole 20b for controlling a relative position with respect to the frame 12 is manufactured. The plate 20 is made of a metal such as stainless steel, copper, or 42 alloy, or a resin such as polyester, ABS, or LCP, and has a thickness in a range of 0.05 mm to 0.5 mm to stably perform compression during connection. Can be done.

Next, as shown in FIG. 5E, a plurality of the plates 20 are arranged in parallel, and the linear members 19 are inserted into the respective holes 20a. This state is as shown in FIG. Subsequently, as shown in (g), the plate 20 is tilted in a range of 45 ° to 90 ° with respect to the horizontal plane, and inserted into the casting mold to form the insulating elastomer 21.
To perform a thermosetting treatment. The completed cube is sliced one by one between the plates 20 using a wire saw 22 as shown in FIG. As the insulating elastomer 21 to be used, silicone rubber, butyl rubber, nitrile rubber, acrylic rubber, fluorine rubber, or the like can be selected, but silicone rubber having stable rubber properties over a wide temperature range and relatively inexpensive silicone rubber is desirable. .

Subsequently, FIG. 6 sliced in FIG.
As shown in (a), a punching blade 13 is applied to the one shown in (a) to scrape off the insulating elastomer 21 at the portion in contact with the bottom surface of the frame body 12 to prepare a shape (c). further,
As shown in (d), the front and back surfaces of the insulating elastomer 21 (only the front surface treatment is shown in the figure) except for the portion of the linear body 19 using a laser are slightly (0.05 mm to 0.3 m).
m) is cut off to complete the press-connecting connector 14. The length of the metal wire is in the range of 0.5 mm to 2 mm.

Next, the frame 12 for positioning the semiconductor package 100 on the mounting substrate 110 will be described. As shown in FIGS. 1 and 2, the frame 12 is formed in a quadrangular cylindrical shape, and has a positioning protrusion 12 on the bottom surface.
a is provided, and the semiconductor package 10 is fitted into a hole provided at a predetermined position of the mounting board 110.
0 can be positioned on the mounting board 110. Further, by fitting the projection 12a into the position control hole 20b of the plate 20, the semiconductor package 100, the press-connecting connector 14, and the mounting board 110 can be positioned. The material of the frame 12 is an epoxy resin, an acrylic resin, a polyether resin, a polyphenylene sulfide resin, a polyether sulfone resin, a polyetherimide resin, or the like, and it is optional to reinforce these resins with glass fibers or the like. It is said. Cutting, injection molding or the like is used for molding the frame.

In this embodiment, as described above, since the position of the metal wire provided in the insulating elastomer is regulated by the plate, only the position corresponding to the electrode of the semiconductor is obtained. Insulation resistance is obtained,
Crosstalk is suppressed to a minimum, and the load at the time of pressing can be reduced because the metal wire is compressed.

Next, a second embodiment of the semiconductor mounting socket according to the present invention will be described. However, frame 1
2 is the same as that of the first embodiment and is omitted, and the same or corresponding parts as those of the first embodiment are denoted by the same reference numerals and description thereof is omitted. Hereinafter, the same applies to the following embodiments. The press-fit type connector 24 of the semiconductor mounting socket according to the second embodiment is shown in FIG.
It is configured as shown in (a) to (d). In addition,
(A) is a plan view, (b) is a cross-sectional view taken along line bb of (a), (c) is an enlarged view of a C section of (a), and (d) is an enlarged view of a d section of (b). It is.

The press contact type connector 24 used in the second embodiment differs from the first embodiment in the structure of the linear body. The linear body 29 is made of cylindrical silicone rubber, and a plurality of (eight in the figure) metal wires 26 disposed inside have a circular cross section, and are spirally formed over the front and back of the linear body 29. The number of turns r is in the range of 0 <r ≦ 1. The radius of the spiral is close to the radius of the linear body 29.

According to this configuration, the spring property is further improved, and the contact with the semiconductor contact and the substrate contact can be maintained with a small pressing force.

Next, a third embodiment of the semiconductor mounting socket according to the present invention will be described. Press-fit connector 34 of semiconductor mounting socket according to a third embodiment.
Is configured as shown in FIGS. 8A to 8F.
(A) is a plan view, (b) is a cross-sectional view taken along line bb of (a), (c) is an enlarged view of a portion C of (a), and (d) is dd of (a). FIG. 7E is an enlarged view of a portion E in FIG. 7B, and FIG. 7F is an enlarged view of an F portion in FIG.

The first embodiment differs from the first embodiment in that the press-contact type connector 34 used in the third embodiment is different from the first embodiment in the structure of the linear body. The linear body 39 is a quadrangular prism-shaped silicone rubber, and the cross section of the metal wire 36 disposed inside is also quadrangular, and six wires are disposed. (E), (f)
As is clear from FIG.
It is a point that has been cut. In this figure, the illustration of the plate 20 is omitted.

According to this configuration, as compared with the first embodiment, since the insulating elastomer 21 is cut off on only one side, the working time can be reduced.

Next, a fourth embodiment of the semiconductor mounting socket according to the present invention will be described. Press-fit connector 44 of semiconductor mounting socket according to a fourth embodiment.
Are configured as shown in FIGS. 9A to 9F.
(A) is a plan view, (b) is a cross-sectional view taken along line bb of (a), (c) is an enlarged view of a portion C of (a), and (d) is dd of (a). FIG. 7E is an enlarged view of a portion E in FIG. 7B, and FIG. 7F is an enlarged view of an F portion in FIG.

The point that the press-contact type connector 44 used in the fourth embodiment differs from that of the first embodiment lies in the structure of the linear body. The linear body 49 is the same in that it is a quadrangular prism-shaped silicone rubber, but the metal wire 4 disposed inside is linear.
6 is a combination of thin metal foils so that the cross section has a lattice shape. Further, as is clear from (e) and (f), the insulating elastomer 21 is shaved only on the back surface. In this figure, the illustration of the plate 20 is omitted.

Next, a fifth embodiment of the semiconductor mounting socket according to the present invention will be described. Press-fit connector 54 of semiconductor mounting socket according to a fifth embodiment.
Are configured as shown in FIGS. 10 (a) to 10 (e). (A) is a plan view, (b) is a cross-sectional view taken along line bb of (a), (c) is an enlarged view of a portion C of (a), (d)
3A is a sectional view taken along line dd in FIG. 3A, and FIG.
It is an enlarged view of a part.

A different point of the press contact type connector 54 used in the fifth embodiment from the first embodiment lies in the structure of the linear body. The linear body 59 is the same in that it is a quadrangular prism-shaped silicone rubber, but differs in that the six metal wires 56 arranged inside are arranged in a state in which a thin metal foil is twisted. . In this figure, the illustration of the plate 20 is omitted.

[0031]

[Example] Press-molded connector molding 100 parts by weight of silicone rubber KE-951U vulcanized C
-8A, 2 parts by weight, silane coupling material KBM-40
3 and 2 parts by weight (all are product names of Shin-Etsu Chemical Co., Ltd.) are kneaded to prepare a silicone material.

An unvulcanized silicone sheet having a width of 200 mm and a thickness of 0.2 mm is prepared from the prepared silicone material using a calender roll. Two gold-plated ribbons (metal wires) each having a width of 0.1 mm and a thickness of 0.05 mm are arranged on the silicone sheet at an interval of 0.2 mm.
A further two are arranged at an interval of 0 mm. The silicone sheet was cut, and two sheets with ribbons arranged and one sheet without ribbons were produced. Three sheets were overlapped so that the ribbon position was not shifted, and a mold with a clearance of 0.55 mm was inserted. Heat and pressure cure at a temperature of 150 ° C. for 5 minutes. This molded product is cut to a width of 0.5 mm so that the ribbon is located at the center, and further cut to a length of 50 mm, thereby producing four string-shaped press-connecting connector members having a cross section of 0.5 mm in length and 50 mm. did. Repeat this,
A total of 64 press contact type connector members (linear bodies) were produced.

Separately, SUS3 having a thickness of 0.1 mm
04 plate is etched at a position corresponding to the outer diameter of 30 mm square electrode part with 0.6 mm square and 1 mm pitch by etching.
Four electrode alignment holes, holes for fitting with the frame,
Furthermore, 40 alignment plates (plates) with screw holes
Were produced. Forty alignment plates are overlaid,
The string-shaped press-contact type connector member was inserted into all the electrode portions, and the alignment interval was adjusted while sandwiching a spacer so that the alignment plate interval became 1 mm. Further, the alignment plate was tilted at 32 ° and inserted into the casting mold.

Liquid silicone rubber KE-1800A B
The material is mixed with 10 parts by weight of color BK, poured into a casting mold and left for 3 hours to perform a demolding treatment, and then a curing treatment is performed on a hot plate set at 120 ° C. for 2 hours. The cured product was taken out of the mold and sliced between the alignment plates using a wire saw to produce a sheet. This socket was manufactured by engraving about 0.3 mm of silicone rubber between the electrodes with a YAG laser so that only the electrode portions protruded.

When the compression characteristics and the connection resistance of the socket manufactured by the above method were measured using a measurement substrate,
The load for compressing and shifting by 0.3 mm was found to be a sufficiently low load of 19 N for 64 connections and 0.3 N per connection. The connection resistance at this time is 0.0
15 Ω, and it was confirmed that the connection resistance was sufficiently low. In addition, the connection reliability was confirmed by performing a temperature cycle of 0-100 ° C (1 cycle / hour), a vibration test, a shock test, etc., and it was confirmed that sufficient reliability was secured in each evaluation. Completed the socket.

[0036]

As described above, according to the present invention,
Since the position of the metal wire provided in the insulating elastomer is restricted by the plate and is only the position corresponding to the semiconductor electrode, a sufficient inter-electrode insulation resistance is obtained, and crosstalk is suppressed to a minimum. Further, since the metal wire is compressed, the load at the time of pressing can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a semiconductor mounting example using a semiconductor mounting socket according to a first embodiment of the present invention;

FIG. 2 is an exploded side view of the mounting example shown in FIG.

FIG. 3 is a vertical sectional view of a mounted state.

FIG. 4 is an enlarged view of a portion A in FIG. 3;

FIG. 5 is a diagram showing a manufacturing process of the semiconductor mounting socket.

FIG. 6 is a view showing a continuation of the step shown in FIG. 5;

FIG. 7 is a view showing a press-contact type connector used for a semiconductor mounting socket according to a second embodiment of the present invention.

FIG. 8 is a diagram showing a press-contact type connector used for a semiconductor mounting socket according to a third embodiment of the present invention.

FIG. 9 is a view showing a press-contact type connector used for a semiconductor mounting socket according to a fourth embodiment of the present invention.

FIG. 10 is a view showing a press-fit type connector used for a semiconductor mounting socket according to a fifth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Socket for semiconductor mounting 12 Frame 12a Positioning protrusion 13 Extraction blade 14, 24, 34, 44, 54 Press-fit type connector 15 Uncured silicon rubber 16, 26, 36, 46, 56 Metal rod 17 Sheet 18 Cutter 19, 29, 39, 49, 59 Linear body 20 Plate 20a Hole 20b Position control hole 21 Insulating elastomer 22 Wire saw 100 Semiconductor package 110 Mounting board 120 Heat sink

Claims (2)

[Claims] 1. A semiconductor package comprising a frame for connecting a packaged semiconductor at a position opposed to a substrate on which the package is mounted, and a press-fit type connector for obtaining electrical connection by compressing the package from above. In the socket, the press-connecting connector is constituted by an insulating elastomer on a flat plate, a metal wire arranged over the front and back surfaces of the elastomer, and a plate having a hole at a position corresponding to a semiconductor electrode; A semiconductor mounting socket, wherein a plurality of wires are arranged through the holes of the plate to form an electrode portion. 2. A step of forming a plurality of linear bodies in which a plurality of metal wires are embedded in an insulating elastomer, and a step of forming a plate having holes at positions corresponding to electrode positions of a semiconductor. Arranging a plurality of such plates in parallel, penetrating the linear body through all the holes for the electrode positions, arranging these plates at predetermined intervals, and inserting the plates into an elastomer casting mold to insulate them; A step of casting and curing the elastomer member, a step of taking out the cured product from the mold and cutting between the plates to form a press-connecting connector, and a position of the press-connecting connector facing the substrate on which the semiconductor is mounted. A semiconductor mounting socket, comprising: a step of integrating the frame with a frame body for connection to the electrode; and a step of laser engraving an elastomer other than the electrode position to project the electrode portion. Construction method.