JP2001264741A - Method for manufacturing liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the thermosetting time in forming a plurality of thin film patterns containing a photosensitive resin on a substrate in the manufacturing process of a liquid crystal display device. SOLUTION: The method for manufacturing the liquid crystal display device is provided with a step to form a first thin film pattern containing the photosensitive resin on one out of a pair of substrates 6, 13, a step to imperfectly thermoset the first thin film pattern, a step to form a second thin film pattern containing the photosensitive resin on the surface of the one substrate on which the imperfectly thermoset first thin film is formed and a step to perfectly thermoset both the imperfectly thermoset first thin film pattern and the second thin film pattern simultaneously. The method is characterized by constructing one out of a color filter layer 9 and a peripheral light shielding layer with the perfectly thermoset first thin film pattern and by constructing at least the other out of the color filter layer 9 and the peripheral light shielding slayer or a spacer 12 with the perfectly thermoset second thin film pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a liquid crystal display, and more particularly, to a liquid crystal display having a color filter layer and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, in the field of information equipment centering on computers and the field of video equipment centering on televisions, etc., the development of small and lightweight liquid crystal display devices capable of high-definition display has been actively pursued. ing.

At present, most of the liquid crystal display devices generally used have a structure in which a liquid crystal layer is sandwiched between a pair of glass substrates having electrodes on respective opposite surfaces. For example, in an active matrix type liquid crystal display device capable of color display, usually, as one of those glass substrates, a thin film transistor having amorphous silicon or polysilicon as a semiconductor layer on one main surface, a pixel electrode connected to the thin film transistor, and a scanning electrode. An array substrate on which lines and signal lines are formed is used. As the other of the glass substrates, a counter substrate in which a color filter layer in which three primary color layers are juxtaposed on one main surface and a counter electrode are sequentially formed Is used.

Meanwhile, recently, in addition to the liquid crystal display device having the above-described structure, a liquid crystal display device in which a spacer or a peripheral light-shielding layer is formed on an array substrate and a color filter layer is provided between the glass substrate and the pixel electrode. The device is receiving attention. When such a structure is employed, there is an advantage that the demand for the bonding accuracy of the substrates can be reduced and the aperture ratio can be improved.

However, since the color filter layer, the spacer, the peripheral light-shielding layer, and the like are all formed by using a photosensitive resin, it takes a long time for each of the heat curing. Therefore, when all of them are formed on the array substrate, there is a problem that the production capacity is reduced.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and a plurality of thin film patterns containing a photosensitive resin are formed on one substrate in a manufacturing process of a liquid crystal display device. In doing so, the object is to reduce the time required for thermosetting them.

Another object of the present invention is to provide a method of manufacturing a liquid crystal display device capable of manufacturing a liquid crystal display device capable of reducing the demand for the accuracy of bonding substrates and improving the aperture ratio with a high production capacity. The purpose is to:

[0008]

In order to solve the above-mentioned problems, the present invention comprises a pair of substrates arranged to face each other, and a color filter layer provided on one of the opposing surfaces of the pair of substrates. A spacer disposed between the pair of substrates to maintain a constant distance between the pair of substrates, a peripheral light-shielding layer provided at a peripheral portion between the pair of substrates, and a liquid crystal layer sandwiched between the pair of substrates A method of manufacturing a liquid crystal display device, comprising: a first substrate containing a photosensitive resin in one of the pair of substrates.
Forming the first thin film pattern, incompletely thermosetting the first thin film pattern, and forming a photosensitive resin on the surface of the one substrate on which the incompletely thermoset first thin film is formed. Forming a second thin film pattern containing: and a step of simultaneously and completely thermosetting both the incompletely thermoset first thin film pattern and the second thin film pattern, The fully thermoset first
One of the color filter layer and the peripheral light-shielding layer is constituted by the thin film pattern of at least the other of the color filter layer and the peripheral light-shielding layer or the spacer is constituted by the completely thermally cured second thin film pattern. Provided is a method for manufacturing a liquid crystal display device characterized by comprising.

As described above, according to the present invention, a second thin film pattern is formed in a state where the first thin film pattern is incompletely thermoset, and thereafter, the first thin film pattern and the second thin film pattern are formed. Both are simultaneously and completely thermoset. That is, in the present invention, a part of the thermosetting of the first thin film pattern is substantially omitted by simultaneously performing the thermosetting of the second thin film pattern. Therefore, according to the present invention, the time required for thermosetting can be reduced.

In the present invention, incomplete thermal curing of the first thin film pattern may be performed to such an extent that sufficient resistance to a solvent or the like used for forming the second thin film pattern can be obtained. That is, the incomplete thermosetting of the first thin film pattern may be performed to such an extent that the amount of film reduction caused by forming the second thin film pattern is maintained at a sufficiently low level.

In the present invention, the thermosetting temperature of the second thin film is higher than the thermosetting temperature of the first thin film,
It is preferable that the heat setting time of the second thin film is longer than the heat setting time of the first thin film, or both are satisfied. In this case, when the second thin film is thermally cured, the first thin film can be surely thermally cured.

In the present invention, the color filter layer, the peripheral light-shielding layer, and the spacer may be formed on any of the pair of substrates. For example, when one substrate is an array substrate having a wiring such as a switching element or a scanning line and a signal line such as a thin film transistor, and the other substrate is a counter substrate having a common electrode, a color filter layer is formed on the array substrate. A peripheral light-shielding layer and a spacer may be formed, or they may be formed on a counter substrate. In the former case, in particular, it is effective to reduce the demand for the bonding accuracy of the substrates and to improve the aperture ratio.

When the color filter layer, the peripheral light-shielding layer, and the spacer are all formed on one substrate, the first thin-film pattern constitutes the peripheral light-shielding layer, and the second thin-film pattern constitutes the color filter layer or the spacer. can do. Further, the color filter layer can be constituted by the first thin film pattern, and the peripheral light-shielding layer or the spacer can be constituted by the second thin film pattern. Further, the color filter layer may be constituted by the first thin film pattern, and both the peripheral light-shielding layer and the spacer may be constituted by the second thin film pattern.
When both the peripheral light-shielding layer and the spacer are formed by the second thin film pattern as described above, the number of steps can be reduced.

In the present invention, the color filter layer, the peripheral light-shielding layer, and the spacer need not always be formed on the same substrate. Further, the spacer is preferably a columnar spacer formed on the substrate, but may be a granular spacer dispersed on the substrate.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail with reference to the drawings. In each of the drawings, the same components are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 1 is a sectional view schematically showing a liquid crystal display according to a first embodiment of the present invention. The liquid crystal display device 1 shown in FIG. 1 is a TN type liquid crystal display device capable of color display, and has a structure in which a liquid crystal layer 4 is sandwiched between an array substrate 2 and a counter substrate 3. Further, the liquid crystal display device 1 is sandwiched between a pair of polarizing plates 5, and a light source (not shown) is disposed on the back side thereof.

In the liquid crystal display device 1 shown in FIG. 1, the array substrate 2 has a transparent substrate 6 such as a glass substrate. On one main surface of the transparent substrate 6, a wiring 7 and a switching element 8 are formed, on which a color filter layer 9 and a peripheral light-shielding layer (not shown) are laminated.
A pixel electrode 10 is formed on the color filter layer 9, and an alignment film 11 and a columnar spacer 12 are formed thereon.

The wiring 7 is composed of scanning lines and signal lines arranged in a grid on one main surface of the transparent substrate 6. The switching element 8 is, for example, a thin film transistor (hereinafter, referred to as a TFT) using amorphous silicon or polysilicon as a semiconductor layer. The switching element 8 includes a wiring 7 such as a scanning line and a signal line and the pixel electrode 1.
0 so that the desired pixel electrode 10
It is possible to selectively apply a voltage to

The color filter layer 9 can be composed of, for example, a blue coloring layer, a green coloring layer, and a red coloring layer provided corresponding to the pixel electrode 10. These colored layers can be formed using a mixture containing a photosensitive resin and a coloring pigment or coloring dye corresponding to each color.

The pixel electrode 10 is made of a transparent conductive material such as ITO. The pixel electrode 10 can be formed by, for example, a sputtering method. The alignment film 11 can be formed by performing an alignment process such as a rubbing process on a thin film made of a transparent resin such as polyimide.

The columnar spacer 12 can be formed using a photosensitive resin. The columnar spacer 12 is preferably formed in a region that is not directly involved in display, such as a region between the pixel electrodes 10. The peripheral light-shielding layer is generally called a frame, and is formed on the peripheral portion of the surface of the transparent substrate 6 where the columnar spacers 12 are formed. The peripheral light-shielding layer can be formed, for example, by using a black pigment such as carbon fine particles or a mixture of a black dye and a photosensitive resin.

The counter substrate 3 has a structure in which a common electrode 14 and an alignment film 15 are sequentially formed on a transparent substrate 13 such as a glass substrate. These common electrode 14 and alignment film 15
Can be formed of the same material as the pixel electrode 10 and the alignment film 11 described above.

As described above, according to the present invention, a second thin film pattern is formed in a state where the first thin film pattern is incompletely thermoset, and thereafter, the first thin film pattern and the second thin film pattern are formed. By simultaneously and completely thermosetting both of the patterns, the time required for thermosetting can be reduced. In other words, in the present invention, after performing a part of the main firing of the first thin film pattern, the second thin film pattern is formed, and thereafter, the main firing of the second thin film pattern is performed to perform the first firing.
And by completely thermosetting the second pattern,
The firing time is shortened. Such a reduction in the firing time can be realized without substantially impairing the characteristics required for the first and second thin film patterns. This will be described with reference to FIG.

FIG. 2 is a graph showing the relationship between the heat curing time and the amount of film reduction. In the figure, the horizontal axis indicates the time of thermosetting of the first thin film pattern performed before forming the second thin film pattern, and the vertical axis indicates the film thickness of the first thin film pattern after forming the second thin film pattern. Is shown. The values on the vertical axis are shown as relative values when the thermosetting time t ₁ of the first thin film before forming the second thin film pattern is set to infinity, which is set to 100.

As shown in FIG. 2, when the thermosetting time t ₂ is short, the amount of film reduction is large, but the amount of film reduction decreases as the thermosetting time t ₂ increases. That is, when the thermosetting time t ₂ of the first thin film pattern is short, the thickness x of the first thin film pattern is reduced by the solvent used when forming the second thin film pattern, but the thermosetting time t ₂ Is made longer, the decrease in the film thickness x can be suppressed. Also, if the thermosetting time t ₂ is sufficiently long,
Variation of thickness x to thermal curing time t ₂ becomes almost zero. Therefore, if shortening the thermosetting time t _2, if the thickness x is maintained at a sufficient value, it is not damaging the characteristics required for the first thin film pattern most.

In order to realize the characteristics required for the first thin film pattern, it is usually sufficient if the film thickness x is 30% or more, more preferably 50% or more. Therefore, the thermosetting time t ₂ is preferably long enough to maintain at least such a film thickness x. The longer the heat curing time t ₂ , the more the amount of film reduction can be reduced, but on the other hand, the production capacity is reduced. Therefore, it is desirable to set the thermosetting time t _{2 so} that the film thickness x is 98% or less.

The heat curing of the second thin film is preferably performed at a higher temperature than that required for the heat curing of the first thin film. Further, the thermosetting treatment of the second thin film is performed in the first thin film.
It is preferable that the heat treatment is performed for a longer time than the time required for heat curing of the thin film. In particular, it is preferable to satisfy both of them. In this case, at the time of the heat curing treatment of the second thin film, the heat curing of the first thin film can be reliably performed, and sufficiently high reliability can be realized.

The principle described above can be applied in various forms to the manufacturing process of the liquid crystal display device 1 shown in FIG. For example, when the peripheral light-shielding layer is constituted by the first thin-film pattern and at least a part of the color filter layer 9 or the spacer 12 is constituted by the second thin-film pattern, the time required for thermosetting the peripheral light-shielding layer is reduced. Can be. Further, the color filter layer 9 is constituted by the first thin film pattern, and the peripheral light-shielding layer or the spacer 1 is constituted by the second thin film pattern.
In the case of the configuration 2, the time required for the thermosetting of the color filter layer 9 can be reduced. Further, when the color filter layer 9 is formed by the first thin film pattern and both the peripheral light-shielding layer and the spacer 12 are formed by the second thin film pattern, the time required for thermosetting the color filter layer 9 can be reduced. In addition to the above, the number of steps can be reduced.

The color filter layer 9 usually has a structure in which a plurality of colored layers having different absorption colors are juxtaposed. Therefore, when forming the color filter layer 9 with the first thin film pattern, a temporary firing is performed every time each colored layer is formed, and a part of the final firing is performed after forming all the colored layers.
Thereafter, when the peripheral light-shielding layer and / or the spacer 12 are fired, all the colored layers may be completely cured by heat. When the color filter layer 9 is constituted by the second thin film pattern, the peripheral light-shielding layer is incompletely thermoset, and the formation of each colored layer and the preliminary firing are repeated. Just do it.

In the above-described first embodiment, the color filter layer 9, the peripheral light-shielding layer, and the columnar spacers 12 are formed on the array substrate 2, but they are formed on the opposing substrate 3 as described below. Can be.

FIG. 3 is a sectional view schematically showing a liquid crystal display device 1 according to a second embodiment of the present invention. The liquid crystal display device 1 shown in FIG. 3 is similar to the liquid crystal display device 1 shown in FIG.
This is a TN type liquid crystal display device capable of color display, and has a structure in which a liquid crystal layer 4 is sandwiched between an array substrate 2 and a counter substrate 3. Further, the liquid crystal display device 1 is sandwiched between a pair of polarizing plates 5, and a light source (not shown) is disposed on the back side thereof.

In the liquid crystal display device 1 shown in FIG. 3, the array substrate 2 has a transparent substrate 6 such as a glass substrate. The wiring 7 and the switching element 8 are formed on one main surface of the transparent substrate 6, and the transparent insulating film 1 is formed thereon.
6 and a peripheral light shielding layer (not shown). The pixel electrode 10 is formed on the transparent insulating film 16, and the alignment film 11 is formed thereon.

In the liquid crystal display device 1 shown in FIG. 3, the counter substrate 3 has a transparent substrate 13 such as a glass substrate. On one main surface of the transparent substrate 13, a color filter layer and a common electrode 14 are sequentially formed, and a structure in which a spacer 12 and an alignment film 15 are formed thereon is provided.

That is, the liquid crystal display device 1 shown in FIG.
The color filter layer 9 and the columnar spacer 12 are
The liquid crystal display device 1 differs from the liquid crystal display device 1 shown in FIG. 1 in that a transparent insulating layer 16 made of a photosensitive resin is provided between the transparent substrate 6 of the array substrate and the pixel electrode 10.
Also in the liquid crystal display device 1 having such a structure, the firing time can be reduced by the same method as described in the first embodiment. In the liquid crystal display device 1 shown in FIG. 3, since the color filter layer 9 and the columnar spacer 12 are formed on the counter substrate 3, the array substrate 2 and the counter substrate 3 are different from the liquid crystal display device 1 shown in FIG. High accuracy is required by laminating.

[0035]

Embodiments of the present invention will be described below.

Example 1 The liquid crystal display device 1 shown in FIG. 1 was manufactured by the following method. First, a thin film of molybdenum having a thickness of about 0.3 μm was formed on one main surface of the glass substrate 6 by a sputtering method, and the thin film was patterned by photolithography to form a gate line. Next, an insulating film made of silicon dioxide having a thickness of 0.15 μm and used as a gate insulating film was formed on the surface of the glass substrate 6 where the gate lines were formed, and a semiconductor layer of the TFT was formed on the insulating film. Note that the gate insulating film can be formed using silicon nitride. Next, a signal line and a source electrode made of Al having a thickness of 0.3 μm were formed on the semiconductor layer. As described above, the wiring 7 and the TFT 8 were formed on the glass substrate 6.

Next, a UV-curable acrylic resin resist CR-2000 (manufactured by Fuji Hunt Electronics Technology Co., Ltd.) in which a red pigment is dispersed is applied to the entire surface of the glass substrate 6 on which the TFT 8 and the like are formed using a spinner or the like. did. A photomask was arranged above the coating film thus formed, and the coating film was irradiated with ultraviolet rays through this photomask so that the exposure amount became 200 mJ / cm ² . The photomask used here was irradiated with ultraviolet rays only on the portion where the red coloring layer was to be formed, and the outer periphery of the glass substrate 6 was shielded from light with a width of 10 μm, and the area corresponding to the contact hole was 20 μm. It is formed to be shielded from light at a size of × 20 μm. After completion of the exposure under the above conditions, the coating film was developed with a 1% KOH aqueous solution for 20 seconds, and further calcined at 100 ° C. for 5 minutes to form a red colored layer.

Next, a UV-curable acrylic resin resist CG-2000 (manufactured by Fuji Hunt Electronics Technology) in which a green pigment is dispersed and a UV-curable acrylic resin resist CB-20 in which a blue pigment is dispersed
00 (manufactured by Fuji Hunt Electronics Technology)
Was used to form a green colored layer and a blue colored layer sequentially in the same manner as described for the red colored layer. The color filter layer 10 was formed as described above. Thereafter, the main firing is usually performed at 200 ° C. for 60 minutes.
It was performed at 00 ° C. for 10 minutes. As described above, the RGB color filter layer 9 having the thickness of each colored layer of 1.5 μm was formed.

Next, the color filter layer 9 of the glass substrate 6
Is formed to a thickness of about 0.
A 1 μm ITO film was formed. The pixel electrode 10 was obtained by patterning this using a photolithography technique and an etching technique. Note that these pixel electrodes 1
0 was formed so as to be connected to the source electrode via the contact hole.

Thereafter, a black ultraviolet curable resin was applied to the entire surface of the glass substrate 6 on which the pixel electrodes 10 were formed, using a spinner. 90 ° C.
After drying for 10 minutes, a photomask was placed above the film, and the coating film was irradiated with ultraviolet rays through the photomask so that the exposure amount was 300 mJ / cm ² . The photomask used here is formed so that the area corresponding to the spacer 12 is exposed with a size of 7 μm × 7 μm and the outer peripheral portion of the display area is exposed with a width of 3 mm. . After completion of the exposure under the above-described conditions, the coating film was developed using an alkaline aqueous solution having a pH of 11.5 to form the spacer 12 and the peripheral light-shielding layer. Further, the spacer 12 and the peripheral light-shielding layer were completely cured by baking at 200 ° C. for 1 hour, and the RGB color filter layer 9 was completely cured by heat.

Next, the entire surface of the glass substrate 6 on which the spacers 12 and the like are formed is coated with an alignment film material, AL-1051.
(Manufactured by Nippon Synthetic Rubber Co., Ltd.) to form a thin film. Further, by subjecting this thin film to a rubbing treatment, an alignment film 1 is formed.
1 was obtained. As described above, the array substrate 2 was manufactured.

Next, an ITO film was formed as a common electrode 14 on one main surface of a separately prepared glass substrate 13 by using a sputtering method. Also on this common electrode 14,
The alignment film 15 was formed by the same method as described above.
As described above, the counter substrate 3 was manufactured.

Next, the array substrate 2 and the opposing substrate 3 are bonded using an adhesive XN-215 (manufactured by Mitsui Toatsu Chemicals, Inc.) made of an epoxy-based thermosetting resin so that the rubbing directions are orthogonal to each other. A cell was formed by bonding. In this cell, ZLI-4792 is used as a liquid crystal material.
(E. Merck) was injected by a usual method to form a liquid crystal layer 4. Further, the liquid crystal display device 1 was obtained by sealing the injection port with an ultraviolet curable resin. Thereafter, on both sides of the liquid crystal display device 1, LLC2-92 is used as a polarizing plate 5.
18S (manufactured by Sanritz) was attached to obtain a liquid crystal module.

In the manufacturing process according to the present embodiment, in addition to the shortening of the thermosetting time as compared with the conventional process, the spacer 12 and the peripheral light-shielding layer are simultaneously formed using the same material. As a result, the time required for manufacturing the liquid crystal display device 1 was significantly reduced. Also,
The display performance and reliability were compared between the module manufactured by the above-described method and the module manufactured by the conventional method.
It was confirmed that the module had the same display performance and reliability as the module manufactured by the conventional method.

Example 2 The liquid crystal display device 1 shown in FIG. 3 was manufactured by the following method. First, the wiring 7 and the TFT 8 were formed on one main surface of the glass substrate 6 by the same method as described in the first embodiment. Next, the glass substrate 6
The transparent insulating film 16 was formed on the surface on which the TFT 8 and the like were formed by a photolithography technique and an etching technique using an ultraviolet curable resin. After that, the pixel electrode 10 and the alignment film 11 were sequentially formed on the surface of the glass substrate 6 on which the transparent insulating film 16 was formed by the same method as described in the first embodiment. The array substrate 2 was manufactured as described above.

Next, a black ultraviolet curable resin was applied to the entire one main surface of the separately prepared glass substrate 13 using a spinner. The coating film thus formed is heated at 90 ° C. for 1 hour.
After drying for 0 minutes, a photomask was placed above the coating, and the coating film was irradiated with ultraviolet rays through the photomask so that the exposure amount was 300 mJ / cm ² . In addition,
The photomask used here was formed such that the outer peripheral portion of the display area was exposed with a width of 3 mm. After the exposure under the above-mentioned conditions, the coating film was developed using an alkaline aqueous solution having a pH of 11.5 to form a peripheral light-shielding layer. Thereafter, the main firing at 220 ° C. for 60 minutes was shortened to 200 ° C. for 10 minutes.

Next, on the surface on which the peripheral light-shielding layer of the glass substrate 13 is formed, film formation, patterning, and calcination are repeated in the same manner as described in Embodiment 1, so that a red colored layer and a green colored layer are formed. Was formed. Further, on the surface of the glass substrate 13 on which the red coloring layer and the green coloring layer are formed, an ultraviolet curable acrylic resin resist in which a blue pigment is dispersed is applied in the same manner as described in Example 1. To form a coating film, and this coating film was patterned. Then 2
By baking at 20 ° C. for 1 hour, each colored layer was completely thermoset to obtain the RGB color filter layer 9 and the peripheral light-shielding layer was completely thermoset.

Next, the common electrode 14 was formed on the surface of the glass substrate 13 on which the RGB color filter layer 9 and the like were formed by the same method as described in the first embodiment. Further, the columnar spacers 12 were formed on the common electrode 14 by using a photolithography technique and an etching technique using an ultraviolet curing resin. Thereafter, an alignment film 11 was formed on the entire surface of the glass substrate 13 on which the spacers 12 and the like were formed by the same method as described in Example 1. As described above, the counter substrate 3 was manufactured.

Using the array substrate 2 and the opposing substrate 3 thus manufactured, a liquid crystal display device 1 is manufactured in the same manner as described in Embodiment 1, and further using this liquid crystal display device 1 A liquid crystal module was obtained.

In the manufacturing process according to the present embodiment, the time required for manufacturing the liquid crystal display device 1 can be greatly reduced because the thermosetting time is shorter than that of the conventional process. Further, when the display performance and the reliability of the module manufactured by the above-described method and the module manufactured by the conventional method were compared, the module manufactured by the method according to the present embodiment was the module manufactured by the conventional method. It was confirmed that it had the same display performance and reliability as.

[0051]

As described above, according to the present invention, the first
A second thin film pattern is formed in a state where the thin film pattern of the above is incompletely thermoset, and thereafter both the first thin film pattern and the second thin film pattern are thermoset simultaneously and completely. That is, in the present invention, a part of the thermosetting of the first thin film pattern is substantially omitted by simultaneously performing the thermosetting of the second thin film pattern. therefore,
Sufficiently high production capacity even if all of the color filter layer, peripheral light-shielding layer, and spacer are formed on the array substrate for the purpose of reducing the requirement for substrate bonding accuracy and improving the aperture ratio Can be realized.

That is, according to the present invention, in forming a plurality of thin film patterns containing a photosensitive resin on a single substrate in a manufacturing process of a liquid crystal display device, it is possible to reduce the time required for thermosetting them. It becomes possible. Therefore, according to the present invention, there is provided a method of manufacturing a liquid crystal display device capable of manufacturing a liquid crystal display device capable of reducing the requirement for the bonding accuracy of the substrates and improving the aperture ratio with a high production capacity.

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a graph showing a relationship between a thermosetting time and a film reduction amount.

FIG. 3 is a sectional view schematically showing a liquid crystal display device according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device 2 ... Array substrate 3 ... Counter substrate 4 ... Liquid crystal layer 5 ... Polarizing plate 6, 13 ... Transparent substrate 7 ... Wiring 8 ... Switching element 9 ... Color filter layer 10 ... Pixel electrode 11, 15 ... Alignment film 12 ... spacer 14 ... common electrode 16 ... transparent resin layer

Continued on front page F term (reference) 2H089 LA01 LA09 LA12 NA01 QA12 QA16 RA05 TA01 TA04 TA09 TA12 2H090 JB02 KA05 LA01 LA02 LA04 LA15 2H091 FA02Y FA08X FA08Z FB03 FB04 GA01 GA06 GA08 GA13 HA07 LA12 LA16 LA30

Claims (8)

[Claims] A pair of substrates arranged opposite to each other, a color filter layer provided on one of the opposing surfaces of the pair of substrates, and a space between the pair of substrates arranged between the pair of substrates. A method for manufacturing a liquid crystal display device, comprising: a spacer that keeps constant; a peripheral light-shielding layer provided at a peripheral portion between the pair of substrates; and a liquid crystal layer sandwiched between the pair of substrates. Forming a first thin film pattern containing a photosensitive resin on one of the substrates; and incompletely thermosetting the first thin film pattern; and incompletely thermosetting the one substrate. Forming a second thin film pattern containing a photosensitive resin on the surface on which the first thin film has been formed; and forming both the incompletely thermally cured first thin film pattern and the second thin film pattern. Simultaneous and complete thermosetting process and Comprising one of the color filter layer and the peripheral light-shielding layer with the first thermosetting first thin film pattern, and at least the color filter with the completely thermosetting second thin film pattern. A method for manufacturing a liquid crystal display device, comprising forming the other of the layer and the peripheral light-shielding layer or the spacer. 2. The thermosetting temperature of the second thin film is equal to the first thermosetting temperature.
Higher than the thermosetting temperature of the thin film of
2. The method according to claim 1, wherein the thermosetting time of the thin film is longer than the thermosetting time of the first thin film. 3. The completely heat-cured first thin film constitutes the color filter layer, and wherein the completely thermosetting second thin film is formed.
3. The method according to claim 1, wherein the thin film forms at least one of the peripheral light-shielding layer and the spacer. 4. 4. The method according to claim 3, wherein the completely thinned second thin film constitutes both the peripheral light-shielding layer and the spacer. 5. The method according to claim 1, wherein the first thermally cured first thin film constitutes the peripheral light-shielding layer, and the completely thermally cured second thin film constitutes one of the color filter layer and the spacer. The method according to claim 1 or 2, wherein
3. The method for manufacturing a liquid crystal display device according to item 1. 6. One of the pair of substrates is an array substrate having a scanning line, a signal line, a switching element, and a pixel electrode on its opposing surface, and the other of the pair of substrates has a common electrode on its opposing surface. The method for manufacturing a liquid crystal display device according to any one of claims 1 to 5, wherein the counter substrate is provided. 7. The method according to claim 6, wherein the color filter layer, the peripheral light-shielding layer, and the spacer are formed on the array substrate. 8. The method according to claim 6, wherein the color filter layer, the peripheral light shielding layer, and the spacer are formed on the counter substrate.