JP2001262229A - Method for producing wire for wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce wire for a wire saw retaining good wire curl tendency even after cutting. SOLUTION: In the method for producing wire for a wire saw used for the cutting and slicing of hard materials such as silicon and a solar battery through a wire drawing stage, after the wire drawing stage, heat treatment is performed in the range of 100 to 250 deg.C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wire for a wire saw used for cutting and slicing hard materials such as silicon and solar cells.

[0002]

2. Description of the Related Art In a wire saw, a wire row in which a wire is wound around a plurality of groove rollers at a predetermined pitch is run, and while a material to be cut (work) is pressed against the wire row, the wire row and the work are joined together. This is an apparatus that cuts a work into a large number of wafers by a grinding action of abrasive grains while pouring an abrasive liquid during the process.

Meanwhile, as a characteristic required for a wire used in such a wire saw, it is important that a wire habit such as a free coil diameter, twist, and undulation does not change in the cutting process. After the cutting, if the free coil diameter becomes smaller than the initial value or if the wire has a bad habit such as a minute wave (undulation), there arises a problem that the accuracy of the slice surface is significantly reduced.

[0004] Therefore, the present invention, even after cutting,
An object of the present invention is to provide a method of manufacturing a wire for a wire saw that maintains a good wire habit.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a method of manufacturing a wire for a wire saw used for cutting and slicing hard materials such as silicon and solar cells through a wire drawing process. The heat treatment is performed later.

[0006] Usually, when manufacturing a wire for a wire saw, the drawing process is the final process.

In the present invention, after the final drawing step, a further heat treatment is performed to suppress a reduction in wire habit after use without lowering the required tensile strength.

[0008] The temperature of the heat treatment which can maintain the wire habit of the used wire satisfactorily is from 100 ° C to 250 ° C, preferably from 150 ° C to 250 ° C.
In particular, at a temperature of 150 ° C. or more, the effect of favorably maintaining the wire habit is remarkable. At a temperature of 300 ° C. or higher, the required tensile strength cannot be maintained as a wire for a wire saw.

The heat treatment may be performed after the wire is wound on a reel and then wound on a reel, or after passing through a final die at the time of wire drawing, the wire is heated by a method such as energization. Then, it may be wound on a reel.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A silicon ingot is prepared by using a wire for a wire saw having a diameter of 0.16 mm produced by wire drawing and not subjected to a heat treatment, and a wire subjected to a heat treatment at a temperature of 100 ° C. to 300 ° C. Was cut, and the wire habit of the used wire was evaluated. Table 1 shows the presence or absence of heat treatment,
The wire habit and overall evaluation of the used wire are shown. However, the overall evaluation has sufficient strength as a wire saw wire,
A sample having a good wire habit after use was evaluated as ○.

[0011]

[Table 1]

As shown in Table 1, the sample A without heat treatment was used.
Wire has poor wire habit after use. On the other hand, the wires B to E obtained by subjecting the wire of the sample A to the heat treatment to 300
It has a free coil diameter of at least mm, has no undulation, and has a good wire habit. Further, the wire of F subjected to the heat treatment at a high temperature of 300 ° C. was reduced in the tensile strength required as a wire for a wire saw, and thus the overall evaluation was evaluated as x.
Further, as shown in Table 1, the heat treatment at 100 ° C. eliminates the undulation of the used wire, the free coil diameter is larger than that of the material A which has not been subjected to the heat treatment, and the wire habit is improved. This tendency becomes more remarkable with a heat treatment at 150 ° C. or higher. From the above, it was confirmed that the wire subjected to the heat treatment at a temperature of 100 to 250 ° C., preferably 150 to 250 ° C. after the drawing had a good wire habit after use.

[0013]

According to the present invention, it is possible to produce a good wire saw wire which has a good wire habit even after use, maintains a free coil diameter of 300 mm or more, and has no undulation.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Susumu Yamamoto 1-1-1 Kunyokita, Itami-shi F-term in Sumitomo Electric Industries, Ltd. Itami Works (reference) 3C058 AA05 DA03 4K042 AA13 BA14 DC02

Claims (2)

[Claims] 1. A method of manufacturing a wire for a wire saw used for cutting and slicing hard materials such as silicon and solar cells through a wire drawing process, wherein a heat treatment is performed after the wire drawing process. Of manufacturing a wire for a wire saw. 2. The method for producing a wire for a wire saw according to claim 1, wherein the heat treatment is performed at a temperature of 100 ° C. or more and 250 ° C. or less.