JP2001257222A - Semiconductor mounting device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem in which it is hard to handle a semiconductor chip of small thickness, so that a non-contact recognition device in which the above semiconductor chip is built is low in capability for assembling mass- production, and the cost of a security management for prevention of the forgery of the non-contact recognition device is high. SOLUTION: A film 15 is expanded to be enlarged in area so as to enhance a semiconductor chip array in space between semiconductor chips 2 before the semiconductor chips 2 are transferred onto the tape 3 from the film 15, by which the semiconductor chips 2 are directly transferred and mounted on the tape 3 without using a suction nozzle 91. Furthermore, a random number holder 8 which holds uncreatable random numbers is provided inside a non- contact recognition device 6, and the numbers are registered on a data base 32 just before the non-contact recognition device 6 is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package manufacturing technique for accommodating a semiconductor chip such as an IC card, and more particularly to an efficient method for manufacturing a non-contact recognition device using a semiconductor chip.

[0002]

2. Description of the Related Art FIGS. 17 to 19 show a conventional example of a method for manufacturing an IC card. FIG. 17 is a cross-sectional view showing a step of sucking the semiconductor chip 2 from the pellet case 92 by the suction nozzle 91. FIG. 18 is a cross-sectional view of a process showing that the semiconductor chip that has been adsorbed is moved onto the film substrate 93 to which the adhesive material 92 has adhered and is pressed and mounted. FIG. 19 is a cross-sectional view of a step of covering the cover sheet 94 with the roller 95.

A method of mounting a semiconductor chip on a substrate is described in Japanese Patent Application Laid-Open No. 8-316194 (hereinafter referred to as a reference). In this example, the semiconductor chips attached to the film are individually pressed as needed against the substrate and simultaneously heated to mount the semiconductor chip on the substrate.

[0004]

In recent years, a thin semiconductor package has been required as a form. This is because the thinness of the semiconductor package makes it easy to handle and carry it, for example, it can be attached to an arbitrary place, so that its use is greatly expanded. A telephone card with a built-in IC for a public telephone is an example of such a thin semiconductor package. In a telephone card with a built-in IC, the thickness of the semiconductor chip is about 50 μm, and the thickness of the telephone card is about 0.45 mm. As the use of thin semiconductor packages expands in the future, semiconductor chips and semiconductor packages that are thinner than the current situation will be required, and the thickness of the semiconductor chips at that time is expected to be around 10 μm or less. Further, in order to meet the demand for further cost reduction, the vertical and horizontal dimensions of the semiconductor chip are also reduced, and one side is expected to be about 0.3 mm or less. However, thin and small semiconductor chips are very difficult to handle, such as handling, in a semiconductor package manufacturing process, and it is difficult to realize a mounting process using a conventional suction nozzle. For example, a tilt occurs when the semiconductor chip is suctioned by the suction nozzle, and the semiconductor chip may be damaged during mounting. Even if mounting can be realized by improving the mounting process using a suction nozzle, high-speed mounting operation is difficult. Further, even in the manufacturing method disclosed in the cited example that does not use a suction nozzle, there is a problem that an adjacent semiconductor chip is easily damaged. For these reasons, with the current technology, the mass productivity of the thin semiconductor package is extremely low, and there is a problem that the product manufacturing cost is significantly increased as compared with the semiconductor package currently widely distributed.

[0005] Further, it is expected that applications for providing an authentication function to a semiconductor chip will increase. When a semiconductor chip having such an authentication function is to be attached to all kinds of commodities, security management of the semiconductor chip is performed by storing, stocking, and stocking a conventionally manufactured semiconductor package.
There is a problem in that the method of strictly managing the delivery increases costs. Insufficient management will not be able to respond to chip theft or counterfeiting, and will cause extremely large damages such as the loss of social credibility of the organization shipping and using the semiconductor chip with authentication function. Become.

[0006]

According to the present invention, the following means are provided to solve the above-mentioned problems.

In manufacturing a semiconductor package, the distance between the semiconductor chips is increased by stretching the film to which the semiconductor chip is attached in the plane direction, and the semiconductor package is manufactured in a state where the semiconductor chip is attached to the film. Thus, the step of mounting a semiconductor chip using a suction nozzle is not required, and more semiconductor chips can be mounted at the same time.

In addition, during the assembly of the semiconductor package, a random number holding unit for generating one-of-a-kind random number data which can be read out and cannot be reproduced is provided in the semiconductor package. By registering this random number data in the database as data for authenticating the semiconductor package,
Security management of semiconductor packages has been simplified.

Further, by assembling the semiconductor package and registering it in the main computer simultaneously with the start of use of the semiconductor package, security management in the semiconductor package manufacturing process is minimized.

[0010]

Embodiments of the present invention will be described below. Note that the same reference numerals in the drawings denote the same components, and thus overlapping description may be omitted.

FIG. 13 shows a non-contact recognition device 6. The non-contact recognition device 6 is a kind of semiconductor package,
The semiconductor chip 2 is mounted therein, and the semiconductor chip 2 is connected to an antenna 7 used for data communication with the outside. In addition, the non-contact recognition device 6
It has a random number holding unit 8 that generates a random number at the time of its manufacture and holds it. The random number holding unit 8 has pattern information such as the random arrangement of the fine particles 9 and their respective dimensions. This pattern information can be converted into numerical data and the like, and can be used as random numbers. Therefore, the data in the semiconductor chip 2 and the random number held by the random number holding unit 8 are recorded in the non-contact recognition device 6.
Since the random numbers held by the random number holding unit 8 are generated at random in the manufacturing process of the non-contact recognition device 6, the non-contact recognition device 6 that holds exactly the same random numbers is copied. It is impossible.

FIG. 14 shows an example of a method of recording random numbers in the random number holding unit 8 by dispersing the fine particles 9 in the random number holding unit 8 in the process of assembling the non-contact recognition device 6. The fine particles 9 stored in the fine particle storage tank 96 are mixed with the solvent tank 97 and sprayed from the nozzle 98 by the gas flow from the gas pipe 99. Except for the place where it is necessary to prevent the attachment of the fine particles 9 such as the semiconductor chip 2 on the non-contact recognition device 6, that is, other than the random number holding unit 8,
Covered by one. For this reason, the fine particles 9 are dispersed and attached to the random number holding unit 8. Since the solvent is volatilized, only the fine particles 9 remain in the random number holding unit 8.

FIG. 15 shows a non-contact recognition device 6 provided in a random number holding unit 8 in which another pattern information is recorded. As described above, since the fine particles 9 are randomly attached to the random number holding unit 8, the fine particles 9 cannot exist in exactly the same arrangement pattern. Therefore, this pattern information can be used as random number data. As the fine particles 9, glass beads having a diameter of 10 μm or less can be used. Since the non-contact recognition device 6 is finally laminated, the fine particles 9 are fixed similarly to the semiconductor chip 2. For this reason, since the pattern information of the fine particles 9 does not change with time, random number data is also held.
For example, even if a malicious third party attempts to duplicate the non-contact recognition device 6, it is practically impossible to arrange a large number of the fine particles 9 exactly the same as the real one. Further, even when the disassembly of the non-contact recognition device 6 is attempted, the fine particles 9 fall off or dislocate at the time of disassembly. It is impossible. By storing the data stored in the semiconductor chip 2 in the non-contact recognition device 6 and the above-described random number data in a database immediately before using the non-contact recognition device 6 in association with both, the non-contact recognition is performed. The authentication confirmation of the device 6 becomes more reliable. In addition to the method of generating random numbers using the fine particles 9 as described in the present embodiment, a method using ink bleeding, a method of spraying a foil, a method of transferring a fingerprint-like random number pattern, A method of utilizing a foreign substance trapped in the contact recognition device 6 may be considered.

FIG. 16 shows a recognition method using the non-contact recognition device 6. The non-contact recognition device 6 is attached to the object 100. The object 100 corresponds to anything that needs to be identified, such as securities, over-the-counter products, ID cards, and living things. The non-contact recognition device 6 transmits data stored therein in response to a transmission radio wave from the interrogator antenna 42 connected to the recognition controller 43, and the interrogator antenna 42 and the recognition controller 43 receive the data. Further, random number information unique to the non-contact recognition device 6 held in the random number holding unit 8 of the non-contact recognition device 6 by a sensor such as the image camera 41 is taken in, and converted into random number data by the recognition controller 43.
The recognition controller 43 compares the received data and the recognized random number with those registered in the database 32 via the network 31 to confirm the authenticity of the non-contact recognition device 6, and checks the data registered in the database 32. Receiving information on the object 100 corresponding to. The authentication data thus obtained is displayed or converted and used by a connection device (not shown). This allows
Inventory management, tracking of luggage, confirmation of authenticity, etc. of the object 100 to which the non-contact recognition device 6 is attached can be performed. In addition, the non-contact recognition device 6 can be attached to a living body, and in that case, tracking and identification of the living thing can be performed.

Hereinafter, a method of manufacturing the non-contact recognition device 6 will be described.

FIG. 1 shows a semiconductor wafer 1 on which a large number of semiconductor chips 6 built in a non-contact recognition device 6 are formed. The semiconductor wafer 1 has a thin film 11 on its surface.
Is pasted on. The film 11 is a metal frame 1
0. Each semiconductor chip 6 holds therein data necessary for the contactless recognition device 6 up to this point.

FIG. 2 shows a state in which the semiconductor wafer 1 shown in FIG. 1 is separated into two semiconductor chips. As a separation method, in addition to cutting with a rotating blade which is widely used at present, separation by a chemical etching technique may be performed. When chip separation by a chemical etching technique is adopted, the shape of the semiconductor chip 2 can be an arbitrary shape such as a hexagon or a circle instead of a square.

FIG. 3 shows a state in which the interval between a large number of semiconductor chips 2 attached to the film 11 is widened. FIG. 4 shows a cross section of a portion indicated by an arrow in FIG. In FIG. 4, a block 12 pushes up the surface of the film 11 on the side where the semiconductor chip 2 is not attached. Since the periphery of the film 11 is fixed to the metal frame 10, the film 11 is spread out,
A gap is formed between the semiconductor chips 2 attached to 1.

In this state, as shown in FIG. 5, the second film 15 and the second metal frame 14 holding the periphery thereof and the second film 15 pressed against one surface of the second film 15 are provided. The push-up block 13 is pressed against the semiconductor chip 2 in which the gap is formed, so that the second film 15 is formed.
Transfer to The transfer can be performed by making the adhesive force or the adhesive force between the semiconductor chip 2 and the second film 15 larger than the adhesive force or the adhesive force between the semiconductor chip 2 and the film 11. As a method for controlling the adhesive force, various conventionally known methods such as irradiation with ultraviolet rays and heating can be used.

FIG. 6 shows a state in which the semiconductor chip 2 is transferred to the second film 15 in this manner. FIG. 7 shows a state in which the distance between the semiconductor chips 2 is further increased in this state by the same method as that shown in FIG. Although not shown in FIG. 7, the second lifting block 13 exists on the side of the second film 15 on which the semiconductor chip 2 is not attached.
The second push-up block 13 is used for the second film 15.
, The interval between the semiconductor chips 2 is wider than the state shown in FIG. The second push-up block 13 is shown in FIG.

In this state, the mounting block 16 and the tape 3 are lowered onto the semiconductor chip 2 as shown in FIGS. FIG. 9 is a cross-sectional view at a location indicated by an arrow in FIG. The mounting block 16 is a tape 3
Is pressed against the semiconductor chip 2 so that the semiconductor chip 2
Is transferred onto the tape 3. The transfer can be performed by making the adhesive force or the adhesive force between the semiconductor chip 2 and the tape 3 larger than the adhesive force or the adhesive force between the semiconductor chip 2 and the second film 15. In a single transfer operation, a plurality of semiconductor chips 2 can be transferred onto the tape 3 simultaneously, instead of one by one. Semiconductor chip 2 transferred at once
Is determined by the size of the mounting block 16 and the like. After transferring the semiconductor chip 2 to the tape 3, the mounting block 16 is raised, and the tape 3 is fed in its length direction. The semiconductor chip 4 transferred to the tape is
By this operation, it comes off the mounting block 16 and is sent to the next step.

The semiconductor chip 4 thus transferred onto the tape 3 is laminated with a second tape 5 as shown in FIG. A commercially available laminating apparatus can be used for lamination. The upper roller 18 and the lower roller 19 cover the semiconductor chip 4 transferred to the tape with the second tape 5 under a pressure environment lower than the atmospheric pressure. After that, heating is performed. By lamination,
The non-contact recognition device 6 is formed continuously.

FIG. 11 shows the tape 3 indicated by A in FIG.
The state of is shown. As described above, the antenna 7 and the random number holding unit 8 shown in FIG. 13 that the non-contact recognition device 6 uses for communication with the outside are formed on the tape 3 before lamination. Note that the antenna 7 may be formed in advance on the semiconductor chip 2 by a semiconductor process in order to reduce the number of steps for connecting the antenna 7 and the semiconductor chip 2.

As described above, according to the present invention, the non-contact recognition device 6 is assembled without using the suction nozzle 91. Therefore, damage to the semiconductor chip 2 can be prevented. Moreover, since a plurality of semiconductor chips 2 are simultaneously mounted on the tape 3 as a substrate, mass productivity is excellent.

Non-contact recognition device 6 formed continuously
FIG. 1 shows a method of attaching to an object 100 to be recognized.
It is shown in FIG. Non-contact recognition device 6 formed continuously
Are stored in the reel 21 and are fed out one by one. The non-contact recognition device 6 is cut into individual pieces by the cutter 23, the adhesive 24 is dropped by the dispenser 24, and the non-contact recognition device 6 is attached to the object 100 by the rotating operation of the attaching machine 22. Before the non-contact recognition device 6 is attached, a non-defective product is determined by communication with the inspection antenna 28, and a defective product is not attached to the object 100 but is collected by a collection mechanism (not shown). At the same time as the attachment of the non-contact recognition device 6, based on the command of the registration controller 26,
The non-contact recognition device 6 by the random number registration image camera 25
The random number information of the random number holding unit 8 is read, and data registered in the semiconductor chip 2 in the non-contact recognition device 6 is read by the data registration antenna 27. These pieces of information are combined and registered in the database 32 via the network 31. As described above, since the data and the random number information registered in the semiconductor chip 2 are registered in the database 3 only after being attached to the object 100, the non-contact recognition device 6 is attached to the object 100 before being attached to the object 100. Is low in value, so storage costs can be reduced. In addition, since it has unique random number data, damage due to forgery can be prevented.

[0026]

According to the present invention, the following effects can be obtained. That is, since semiconductor chips can be mounted without using a suction nozzle, and a large number of thin semiconductor chips can be easily mounted at the same time, mass productivity of thin semiconductor packages such as non-contact authentication devices is significantly improved.

The semiconductor package according to the present invention comprises:
It holds unreproducible random number information, and this random number information is registered in the database together with the information recorded on the semiconductor chip at the start of use of the semiconductor package, which reduces the cost of forgery and storage. Can be minimized.

[Brief description of the drawings]

FIG. 1 is a view showing a state in which a semiconductor wafer of the present invention is fixed to a film and a metal frame.

FIG. 2 is a diagram showing a state where a semiconductor wafer of the present invention is separated into semiconductor chips.

FIG. 3 is a diagram showing a state in which the interval between the semiconductor chips of the present invention is widened.

FIG. 4 is a cross-sectional view taken along a dashed double-dotted line in FIG.

FIG. 5 is a view showing a state in which the semiconductor chip of the present invention is transferred to a second film.

FIG. 6 is a view showing a state in which the semiconductor chip of the present invention has been transferred to a second film.

FIG. 7 is a diagram in which the interval between the semiconductor chips of the present invention is increased.

FIG. 8 is a diagram showing a state in which the semiconductor chip of the present invention is transferred onto a tape.

FIG. 9 is a cross-sectional view of the present invention taken along a two-dot broken line in FIG.

FIG. 10 is a view showing a state where the semiconductor chip of the present invention is laminated.

FIG. 11 is a diagram showing a state in which the semiconductor chip of the present invention has been transferred onto a tape.

FIG. 12 is a diagram showing a method of attaching a non-contact recognition device of the present invention and registering authentication information in a database.

FIG. 13 is a diagram showing a structure of a non-contact recognition device of the present invention.

FIG. 14 is a diagram illustrating a method of forming a random number holding unit according to the present invention.

FIG. 15 is a diagram showing a non-contact recognition device holding different random numbers according to the present invention.

FIG. 16 is a diagram showing an authentication method using the non-contact recognition device of the present invention.

FIG. 17 is a diagram showing a semiconductor chip suction step in a conventional IC card manufacturing method.

FIG. 18 is a view showing a semiconductor chip mounting step in a conventional IC card manufacturing method.

FIG. 19 is a view showing a semiconductor chip cover step in a conventional IC card manufacturing method.

[Explanation of symbols]

1. Semiconductor wafer, 2. Semiconductor chip, 3. Tape,
4 semiconductor chip transferred to tape, 5 second tape, 6 non-contact recognition device, 7 antenna, 8 random number holding unit, 9 fine particles, 10 metal frame, 11 film
12 ... push-up block, 13 ... second push-up block, 14 ... second metal frame, 15 ... second film, 16
... Mounting block, 18 ... Top roller, 19 ... Bottom roller, 2
DESCRIPTION OF SYMBOLS 1 ... Reel, 22 ... Pasting machine, 23 ... Cutter, 24 ... Dispenser, 25 ... Random number registration image camera, 26 ... Registration controller, 27 ... Data registration antenna, 28 ... Inspection antenna, 31 ... Network, 32 ... Database, 41
... image camera, 42 ... interrogator antenna, 43 ... recognition controller, 91 ... suction nozzle, 92 ... pellet case,
93: film base material, 94: cover sheet, 95: roller, 96: particle storage tank, 97: solvent tank, 98
... Nozzle, 99 ... Gas piping, 100 ... Object, 101 ... Mask

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G06K 19/10 G06K 19/00 R 19/07 H H01L 21/301 H01L 21/78 PF term (Reference) 2C005 MA02 MA19 NA08 RA22 RA24 5B035 AA13 BA03 BB03 BB09 CA01 CA23 5B058 CA15 KA32 KA33 5F047 FA90

Claims (5)

[Claims] 1. A semiconductor mounting device comprising a random number holding section for holding random number data. 2. A semiconductor mounting apparatus wherein a combination of unique random number data held in a random number holding unit and authentication data held by a built-in semiconductor chip is registered in a database. 3. A semiconductor mounting apparatus, wherein registration of one-of-a-kind random number data and authentication data in a database is performed almost simultaneously with attachment to an object requiring authentication. 4. A method of manufacturing a semiconductor mounting device, comprising a step of applying a tension to a film to which a semiconductor chip is attached to increase a distance between adjacent semiconductor chips. 5. A process for transferring a semiconductor chip from a film to which a semiconductor chip is attached to a second film and applying a tension to the second film until the interval between the semiconductor chips becomes a desired interval. 5. The method according to claim 4, wherein the method is repeated.