JP2001253465A - Seal material for packaging - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a seal material for packaging which prevents gas generated from packaging materials themselves or gas generated when welding the material from remaining within a packaging bag. SOLUTION: The seal material for packaging is used to seal an opening 1a of a packaging bag 10, and the seal material is composed of a mixture of welding resins 3 and gas adsorptive materials 4, and the seal material further has a continuous porous structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing material for packaging used for sealing a packaging bag such as a resin film or a metal foil.
More specifically, the present invention relates to a sealing material for a packaging bag for packaging a clean product such as a semiconductor wafer or a chemical filter.

[0002]

2. Description of the Related Art In the manufacture of semiconductors, the presence of gaseous contaminants such as ammonia in the atmosphere causes pattern defects and dielectric breakdown on wafers. For this reason, semiconductor production is performed in a clean room.

As a simple packaging method for shipping or transferring a semiconductor wafer manufactured in a clean room as described above, a method of putting a semiconductor wafer in a resin film bag and sealing the opening by heat sealing is known. Has been adopted. However, when the resin film is heat-sealed in this manner, a small amount of contaminant gas is generated from the resin film and may remain in the bag. The residual gas may cause contamination of the semiconductor wafer stored in the bag and deteriorate the quality.

[0004] In order to avoid the influence of the contaminant gas generated from the resin film itself constituting the bag, there is a method in which the opening of the bag of the resin film is simply bent and sealed with an adhesive tape. However, since this method was a passive measure, it was not always possible to completely prevent contamination.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a heat-sealing seal without leaving a gas generated from the packaging material itself or a gas generated during the heat fusion in the packaging bag. The object of the present invention is to provide a sealing material for packaging which makes possible.

[0006]

According to the present invention, there is provided a packaging sealing material for sealing an opening of a packaging bag by heat sealing, wherein the sealing material is formed by heat sealing. It comprises a mixture of an adhesive resin and a gas-adsorbing substance, and has a continuous porous structure.

As described above, since the sealing material is made of a mixture of a heat-fusible resin and a gas-adsorbing substance and has a continuous porous structure, when this sealing material is heat-sealed together with the opening of the packaging bag, the packaging is A small amount of gas generated from the material itself or a small amount of gas generated during heat fusion is adsorbed by the gas-adsorbing substance through the continuous porous structure, and thus can be prevented from remaining in the packaging bag.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a packaging material such as a resin film or a metal foil is used as a means for packaging a clean product. Hereinafter, a case where a resin film is used will be described.

[0009] The resin film bag used for packaging is not particularly limited as long as it is made of a heat-fusible resin. For example, resins such as polyethylene, polypropylene, nylon, polyester and polyvinyl chloride are used. Can be mentioned.

The sealing material for packaging of the present invention is characterized in that it is formed of a mixture of a heat-fusible resin and a gas-adsorbing substance and is formed so as to have a continuous porous structure.
With such a continuous porous structure, when heat-sealing the opening of the resin film bag, a small amount of contaminant gas generated from the resin film can be smoothly guided to the gas-adsorbing substance and adsorbed. Can be.

In order to obtain such a continuous porous structure, a mixture of the heat-fusible resin and the gas-adsorbing substance is formed by molding the heat-fusible resin into a fibrous form and the gas-adsorptive substance by a powder form. Preferably, there is. That is, the heat-fusible resin has a long-fiber or short-fiber shape and becomes a randomly entangled non-woven fabric or paper-like structure. The non-woven fabric or paper-like structure is used as a carrier to disperse and hold a powdery gas-adsorbing substance. Are preferred.

The type of the heat-fusible resin is not particularly limited as long as it has heat-fusibility, but preferably the same type as the resin used for the resin film bag. For example, polyethylene, polypropylene, nylon, polyester, polyvinyl chloride, etc. exemplified for the resin film bag. Particularly, a copolymer containing these resins as a main component is preferable. Since the copolymer has a lower melting point than the homopolymer, the copolymer can be thermally deformed so as not to leave a gap after the heat fusion, and can exhibit good sealing properties.

As the gas adsorbing substance, a carbonaceous adsorbent,
Inorganic adsorbents, ion-exchange adsorbents and the like can be mentioned. These gas adsorbing substances can be used alone or in combination of two or more.

As the carbonaceous adsorbent, activated carbon having a powdery, granular or spherical shape can be used.
As the inorganic adsorbent, zeolite, activated clay, activated alumina, silica gel and the like can be used. As the ion-exchange adsorbent, for example, a cation-exchange adsorbent in which a sulfonic acid group is introduced into polystyrene and an anion-exchange adsorbent in which a trimethylammonium group is introduced into polystyrene can be used. Further, a phosphoric acid, citric acid, a drug such as potassium carbonate is added to the above adsorbent,
It is also possible to control the adsorption characteristics.

In the above description, a case where a resin film is used as a packaging material has been described. However, various additives such as a plasticizer are often contained in a resin film.
These additives can be a source of pollutant gases. However, when a metal foil is used as a packaging material, the generation of contaminant gas is small, so that it can be said that the material is more preferable. Preferred examples of the metal material include aluminum, stainless steel, and copper.

The use of these metal foils as a packaging material and the packaging sealing material of the present invention not only reduces the generation of polluting gas from the packaging material itself, but also suppresses the generation of polluting gas during heat fusion. In addition, the amount of contaminated gas in the bag can be reduced. However, when metal foil is used, the strength of the heat-sealed part is likely to be lower than when a resin film is used. It is recommended that no load is applied.

Further, as the packaging material, the above-mentioned resin film and metal foil may be laminated, and a packaging material having both the gas barrier performance of the metal foil and the breaking strength of the resin film may be used. As a method of lamination, both can be bonded together, or a metal can be deposited or plated on a resin film.

The form of lamination is to reduce the generation of polluting gas in the packaging bag, for example, when the inside (the side where the clean product is stored) is made of metal foil and the outside (the side that is exposed to outside air) is made of a resin film. Can be. Further, since the resin film functions as a protective material for the metal foil, it is possible to prevent the bag from being damaged due to impact or the like. Of course, the lamination may be a resin film on the inside and a metal foil on the outside. The structure is not limited to two layers, and a three-layer structure including a metal foil, a resin film, and a metal foil in this order from the inside, or a four-layer structure may be formed by further laminating a resin film layer on the outside. These lamination forms may be appropriately determined according to the desired strength and cost.

Hereinafter, description will be made with reference to the embodiment shown in the drawings.

FIG. 1 illustrates a resin film bag whose opening is heat-sealed by the sealing material of the present invention.

The bag body 1 of the resin film bag 10 is formed so as to have an opening 1a at the top from the resin film. The bag body 1 accommodates, for example, a semiconductor wafer A, and the sealing material 2 of the present invention is inserted into the opening 1a so as to cover the entire width, and is heated from both outer resin films to be heat-sealed. Sealed.

The seal member 2 has a structure as shown in FIG. 2 before heat sealing. That is, a large number of fibrous heat-fusible resins 3 are entangled with each other to form a nonwoven fabric having a continuous porous structure, and a large number of powdery gas-adsorbing substances 4 are randomly dispersed in the continuous porous structure. It is carried on.

Therefore, if the resin film of the bag body 1 is inserted into the inside of the opening 1a of the bag body 1 as shown in FIG. The gas easily penetrates into the continuous porous structure of the sealing material 2 and is adsorbed by coming into contact with the gas-adsorbing substance 4 that is dispersed a large number of times during the passage. Therefore, contaminant gas generated from the resin film hardly remains in the resin film bag 10. Further, the fibrous heat-fusible resin 3 is finally thermally deformed into a film shape by the above-mentioned heating, so that the opening 1a can be almost completely heat-sealed.

In the above embodiment, the resin film bag 1
Although a semiconductor wafer is exemplified as a clean product packaged in a package 0, the present invention is not limited to this, and an object affected by a small amount of gas generated when a resin film is thermally fused. Anything may be used. For example,
In addition to semiconductor products, parts of liquid crystal products, chemical filters and the like can be mentioned.

[0025]

As described above, according to the sealing material for packaging of the present invention, the sealing material is made of a mixture of a heat-fusible resin and a gas-adsorbing substance and has a continuous porous structure. When heat sealing is performed together with the bag opening, a small amount of gas generated from the packaging material itself or a small amount of gas generated during heat sealing is adsorbed by the gas-adsorbing substance through the continuous porous structure. Can be prevented from remaining inside.

[Brief description of the drawings]

FIG. 1 illustrates a resin film bag heat-sealed with a sealing material for packaging according to the present invention, wherein (A) is a front view and (B) is a cross-sectional view along XX in (A).

FIG. 2 is a perspective view of a packaging sealing material according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bag main body 1a Opening 2 Sealing material 3 (fibrous) heat-fusible resin 4 (powder) gas-adsorbing substance 10 resin film bag

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 3E064 AA01 BA26 BA30 BA36 BA38 BA54 BC18 BC20 EA18 EA30 FA01 GA02 HN05 3E067 AA11 AB41 AB47 AC01 BA12A BA18A BB14A BB15A BB16A BC03A CA24 EA06 FA01 FC01 BA01 AD03 BA03 BA15 BA35 BB01 CA31 DA08 3E094 AA12 BA13 CA01 DA08 HA08

Claims (7)

[Claims] 1. A packaging sealing material for sealing an opening of a packaging bag by heat sealing, wherein the sealing material comprises a mixture of a heat-fusible resin and a gas-adsorbing substance, and has a continuous porous structure. A packaging sealing material having a structure. 2. The packaging sealing material according to claim 1, wherein the heat-fusible resin is in a fibrous form, and the gas-adsorbing substance is in a powder form. 3. The packaging sealing material according to claim 1, wherein the gas-adsorbing substance is at least one selected from the group consisting of a carbonaceous adsorbent, an inorganic adsorbent, and an ion-exchange adsorbent. 4. The packaging sealing material according to claim 1, wherein said packaging bag is made of a resin film and / or metal foil. 5. A clean product is stored in the packaging bag, and after the sealing material according to claim 1 is interposed in the opening thereof, the sealing material and the packaging bag are heated. A method for manufacturing a clean product package in which an opening is sealed by fusing. 6. The method according to claim 5, wherein the clean product is a chemical filter. 7. A clean product package produced by the method according to claim 5.