JP2001247767A5 - - Google Patents
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- JP2001247767A5 JP2001247767A5 JP2000061418A JP2000061418A JP2001247767A5 JP 2001247767 A5 JP2001247767 A5 JP 2001247767A5 JP 2000061418 A JP2000061418 A JP 2000061418A JP 2000061418 A JP2000061418 A JP 2000061418A JP 2001247767 A5 JP2001247767 A5 JP 2001247767A5
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- alumina
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- particle diameter
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【請求項１】 （ａ）ポリフェニレンスルフィド樹脂１０〜８０重量％、（ｂ）平均粒子径が５μｍ未満で、かつα結晶粒子径が５μｍ未満であるαアルミナ２０〜７０重量％、および（ｃ）α結晶粒子径が１０〜５０μｍであるαアルミナ２０〜５０重量％を含有することを特徴とする樹脂組成物。 1. A (a) polyphenylene sulfide resin 10 to 80 wt%, (b) an average particle size of less than 5 [mu] m, and alpha crystal grain size of less than 5 [mu] m alpha alumina 20-70% by weight, and (c) A resin composition comprising 20 to 50 % by weight of α alumina having an α crystal particle diameter of 10 to 50 μm.
すなわち、本発明の樹脂組成物は、（ａ）ＰＰＳ樹脂１０〜８０重量％、（ｂ）平均粒子径が５μｍ未満で、かつα結晶粒子径が５μｍ未満であるαアルミナ２０〜７０重量％、および（ｃ）α結晶粒子径が１０〜５０μｍであるαアルミナ２０〜５０重量％を含有することを特徴とする。 That is, the resin composition of the present invention comprises: (a) 10 to 80% by weight of a PPS resin; (b) 20 to 70 % by weight of α-alumina having an average particle diameter of less than 5 μm and an α crystal particle diameter of less than 5 μm; And (c) 20 to 50% by weight of α alumina having an α crystal particle diameter of 10 to 50 μm.
また。αアルミナ（ｂ）の配合比は２０〜７０重量％である。αアルミナ（ｂ）の配合量が上記の範囲を下回ると、熱伝導性が低くなり、上記の範囲を上回ると、流動性が不足して成形が困難になる傾向となる。 Also. The mixing ratio of α-alumina (b) is 20 to 70% by weight. If the amount of α-alumina (b) is below the above range, the thermal conductivity will be low, and if it exceeds the above range, the fluidity will be insufficient and molding tends to be difficult.
本発明で用いられるαアルミナ（ｃ）のα結晶粒子径は１０〜５０μｍである。α結晶粒子径が上記の範囲より小さくなると、得られる樹脂組成物の熱伝導性の向上効果が低い傾向となる。 The α-crystal particle diameter of α-alumina (c) used in the present invention is 10 to 50 μm. If the α crystal particle diameter is smaller than the above range, the effect of improving the thermal conductivity of the obtained resin composition tends to be low.
また、αアルミナ（ｃ）の配合比は２０〜５０重量％である。αアルミナ（ｃ）の配合量が上記の範囲を下回ると、熱伝導性が低くなり、上記の範囲を上回ると、流動性が不足する傾向となる。 The mixing ratio of α-alumina (c) is 20 to 50% by weight. When the amount of α-alumina (c) is below the above range, the thermal conductivity is low, and when it exceeds the above range, the fluidity tends to be insufficient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000061418A JP5207261B2 (en) | 2000-03-07 | 2000-03-07 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000061418A JP5207261B2 (en) | 2000-03-07 | 2000-03-07 | Resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001247767A JP2001247767A (en) | 2001-09-11 |
| JP2001247767A5 true JP2001247767A5 (en) | 2007-04-19 |
| JP5207261B2 JP5207261B2 (en) | 2013-06-12 |
Family
ID=18581559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000061418A Expired - Fee Related JP5207261B2 (en) | 2000-03-07 | 2000-03-07 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5207261B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5177089B2 (en) * | 2008-07-30 | 2013-04-03 | 東レ株式会社 | Polyarylene sulfide resin composition, polyarylene sulfide resin composition tablet and molded product obtained therefrom |
| JP5655547B2 (en) * | 2010-12-21 | 2015-01-21 | 東ソー株式会社 | Polyarylene sulfide resin composition and sealing member for secondary battery sealing plate comprising the same |
| CN105658715B (en) | 2013-10-24 | 2017-11-28 | Dic株式会社 | Resin combination, heat sink material and radiating component |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6424859A (en) * | 1987-07-21 | 1989-01-26 | Showa Denko Kk | Highly heat-conductive rubber/plastic composition |
| JP2932567B2 (en) * | 1990-02-13 | 1999-08-09 | 東レ株式会社 | Blow blow molding |
| JP2704732B2 (en) * | 1988-08-01 | 1998-01-26 | 東レ・ダウコーニング・シリコーン株式会社 | Curable liquid organopolysiloxane composition |
| JPH06279676A (en) * | 1993-11-01 | 1994-10-04 | Toray Ind Inc | Polyphenylene sulfide resin composition |
| JP3652460B2 (en) * | 1996-12-02 | 2005-05-25 | 株式会社メイト | Resin composition |
| JPH10292118A (en) * | 1997-02-19 | 1998-11-04 | Matsushita Electric Works Ltd | Resin composition for sealing electronic parts and sealed electronic part |
| JPH10293940A (en) * | 1997-04-18 | 1998-11-04 | Kureha Chem Ind Co Ltd | Optical pickup device holding vessel |
| JPH11189719A (en) * | 1997-10-24 | 1999-07-13 | Matsushita Electric Works Ltd | Resin composition for sealing electronic part, its production and sealed electronic part using the composition |
-
2000
- 2000-03-07 JP JP2000061418A patent/JP5207261B2/en not_active Expired - Fee Related
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