JPH10292118A - Resin composition for sealing electronic parts and sealed electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject resin composition having excellent moisture- resistant reliability and moldability, by making the resin composition include a polyphenylene sulfide(PPS), an inorganic ion exchange material, a surface- coated red phosphorus or silicon powder and a specified inorganic filler. SOLUTION: The objective composition is produced including (A) 100 pts.wt. of PPS containing the recurring unit of the formula as the main constituent unit and preferably having a melting point of >=260 deg.C and a melt viscosity of 50-500 poise, (B) 0.5-5 pts.wt. of an inorganic ion exchange material preferably expressed by the formula Sba Bib Oc (OH)d (NO3 )e .nH2 O ((a) and (b) are each 1-2; (c) is 1-7; (d) is 0.2-3; (e) is 0.05-3; (n) is 0-2), (C) 0.1-10 pts.wt. of surface-coated red phosphorus and/or silicon powder and (D) 20-500 pts.wt. of an inorganic filler at a volume fraction of >=75% in a molded article produced by the compression molding of the inorganic filler under a pressure to keep the original average particle diameter of the inorganic filler even after the compression molding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to electronic components such as LSIs, ICs, hybrid ICs, transistors, diodes, capacitors, thyristors, coils, transformers, connectors, sensors, crystal oscillators, power switches, etc., and hybrid components thereof. The present invention relates to an electronic component encapsulating resin composition used for encapsulation, and an electronic component encapsulating these electronic components using the electronic component encapsulating resin composition.

[0002]

2. Description of the Related Art Conventionally, thermosetting resins such as epoxy resins have been used for encapsulating electronic components. However, thermosetting resins take a long time to cure, so that molding cycles are long and productivity is poor. It has been pointed out that sprues and runners generated during molding cannot be regenerated, and the efficiency of material utilization is low.

On the other hand, in order to solve these disadvantages of the thermosetting resin, a thermoplastic resin composition such as polyphenylene sulfide (hereinafter abbreviated as PPS) or liquid crystal polymer (hereinafter abbreviated as LCP) is sealed with an electronic component. Can be used as a resin composition for use in Japanese Patent Publication No. 7-98901 and Japanese Patent Application Laid-Open No. 7-33.
No. 1036, Japanese Patent Application Laid-Open No. 62-150752, and the like.

However, since the LCP resin composition has a high melt viscosity at the time of molding, a wire such as a gold wire for bonding is caused to flow by the flow of the resin, thereby causing a sweep or deformation of the wire, or a wire breakage. In addition, there is a problem that molding defects are likely to occur, and the adhesion of electronic components to lead frames and elements is poor. In addition, since the molecular structure is polyester, it is used for reliability acceleration tests such as PCT (pressure cooker test). Then, there is a problem that the molecules are hydrolyzed, and the moisture resistance reliability is greatly reduced.

[0005] Also, sealed electronic components sealed with a PPS resin composition have insufficient moisture resistance reliability.
Since the S resin composition system contains a large amount of ionic impurities (such as Cl and Na), it has been difficult to increase the moisture resistance reliability of the sealed electronic component. On the other hand, the present inventors have disclosed in
In JP-A-2-36461, a resin composition with less ionic impurities is provided by blending an inorganic ion exchanger with PPS. However, although the encapsulated electronic component sealed with this resin composition can obtain a practical level of humidity resistance reliability in the PCT of the accelerated reliability test, a THB (Tempera) that performs the test by applying a bias voltage is used.
In a reliability accelerated test such as T. Humidity Bias, it was difficult to obtain high humidity resistance reliability.

[0006]

As described above, the use of a thermoplastic resin as a resin composition for encapsulating electronic components has many problems to be solved, and at present it has not been put to practical use yet. . The present invention has been made in view of the above points, and has as its object to provide a resin composition for sealing electronic components of a thermoplastic resin having excellent moisture resistance reliability and moldability, and a sealed electronic component. It is.

[0007]

The resin composition for encapsulating an electronic component according to the present invention comprises polyphenylene sulfide of 100%.
Weight, 0.5 to 5 parts by weight of inorganic ion exchanger, 0.1 to 10 parts by weight of at least one of red phosphorus and silicon powder coated on the surface, average particle size of inorganic filler before compression molding is compressed It is characterized by comprising 20 to 500 parts by weight of an inorganic filler having a volume fraction of 75% or more in a molded body obtained by compression-molding the inorganic filler at a pressure maintained after molding. It is assumed that.

According to a second aspect of the present invention, the polyphenylene sulfide is a polymer having the following repeating unit as a main structural unit:

[0009]

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The melting point is 260 ° C. or higher, and the melt viscosity is 50 to 5
00 poise (temperature 300 ° C, shear rate 1000 (1 /
(Measured in seconds). According to a third aspect of the present invention, the inorganic ion exchanger is Sb _a Bi _b O _c (OH) _d (NO ₃ ) _e · nH ₂ O (where a and b are 1-2 and c is 1-7, respectively). , D is 0.2 to 3, e is 0.05 to 3, and n is 0 to 2).

The invention according to claim 4 is characterized in that red phosphorus is surface-coated with a phenol resin and aluminum hydroxide. The invention of claim 5 is
Red phosphorus is characterized in that its surface is coated with a styrene resin and aluminum hydroxide. The invention according to claim 6 is characterized in that red phosphorus is surface-coated with TiO ₂ .

According to a seventh aspect of the present invention, the silicon powder has a maximum particle size of 200 μm or less. The invention of claim 8 is characterized in that the silicon powder contains a glycidyl group. The invention according to claim 9 is characterized in that the silicon powder has a methacryl group.

[0013] The invention according to claim 10 is characterized in that the inorganic filler is amorphous silica. The invention according to claim 11 is characterized in that the inorganic filler contains crystalline silica in a volume fraction of 40 to 90% in the inorganic filler. According to a twelfth aspect of the present invention, the inorganic filler has a volume fraction of 30 to 1 in the inorganic filler.
It is characterized by containing spherical alumina in the range of 00%.

The invention of claim 13 is characterized in that the inorganic filler is synthetic silica. further,
A sealed electronic component according to the present invention is characterized by being sealed with the above-described resin composition for electronic component sealing.

[0015]

Embodiments of the present invention will be described below. The polyphenylene sulfide (PPS) used in the present invention is a polymer composed of p-phenylene sulfide as a main repeating unit shown in the above “Chemical Formula 2”, and has a melting point of 260 ° C. or more and a melt viscosity of 50 to 50.
0 poise (temperature 300 ° C, shear rate 1000 (1 / sec))
Is preferred. PP with a melting point of less than 260 ° C
S is not preferred because it has a small molecular weight and weakens the mechanical strength of the sealing resin. Although the upper limit of the melting point of PPS is not particularly limited, about 290 ° C. is a practical upper limit. Also PP
If the melt viscosity of S is less than 50 poise, the molecular weight of PPS is small, and the mechanical strength of the sealing resin is undesirably reduced. Conversely, if the melt viscosity of PPS exceeds 500 poise, molding fluidity deteriorates, and the wire may be swept or broken during molding, which is not preferable.

As long as the PPS used in the present invention contains 70% by weight or more, preferably 90% by weight or more of the repeating unit of p-phenylene sulfide, it may be used in combination with other structural units. Good. Such other structural units include m-phenylene sulfide. The PPS used in the present invention is CPS contained in the PPS.
It is not necessary to reduce the amount of ionic impurities such as 1 and Na in advance, but it is preferable to use one having an electric conductivity of 50 μS / cm or less when PPS is extracted with pure water.

In the present invention, examples of the inorganic ion exchanger include zeolite, hydrotalcite, titania, and the like.
Although those represented by the following general formula can be used, it is particularly preferable to use those represented by the following general formula. Sb _a Bi _b O _c (OH) _d (NO ₃ ) _e · nH ₂ O (where a and b in the general formula are 1-2 and c is 1 to 2, respectively)
7, d is 0.2-3, e is 0.05-3, and n is 0-2) By blending this inorganic ion exchanger with PPS, ionic impurities contained in PPS, PCT It is capable of adsorbing and capturing ions hydrolyzed during the treatment, preventing a reduction in the moisture resistance reliability of the sealing resin, and suppressing corrosion of the aluminum wiring of the sealing electronic component. The compounding amount of the inorganic ion exchanger is preferably in the range of 0.5 to 5 parts by weight based on 100 parts by weight of PPS. If the amount of the inorganic ion exchanger is less than 0.5 part by weight, the effect of adsorbing and trapping ions cannot be sufficiently obtained.
Conversely, if the amount of the inorganic ion exchanger exceeds 5 parts by weight, THB or USPCBT (U.
nsaturated Pressure Cooke
In an accelerated test for moisture resistance reliability such as (R Bias Test), the inorganic ion exchanger may be ionized, which may rather cause extreme deterioration in humidity resistance reliability.

Here, PPS originally has a very good flame retardancy, so that it is not necessary to add a flame retardant. However, the present invention relates to a surface treatment known as a flame retardant in combination with an inorganic ion exchanger. By blending the coated red phosphorus and / or silicon powder, even in accelerated tests for moisture resistance reliability such as THB or USPCBT, which require a bias voltage, the moisture resistance reliability is deteriorated, and the aluminum wiring of sealed electronic components is deteriorated. This is an effect which can be prevented from being caused by corrosion, and an effect which cannot be predicted conventionally can be obtained. It is considered that the reason for this effect is that red phosphorus or silicon powder coated on the surface suppresses ionization of the inorganic ion exchanger.

The amount of the red phosphorus and / or silicone powder coated on the surface is preferably 0.1 to 10 parts by weight based on 100 parts by weight of PPS. If the compounding amount is less than 0.1 part by weight, the effect of suppressing ionization becomes insufficient, and if the compounding amount exceeds 10 parts by weight, the melt viscosity of the resin composition increases, and the wire sweeps or breaks. Molding defects such as are likely to occur.

Here, the surface-coated red phosphorus includes polyolefin, polyester, polyamide, polycarbonate, polysulfone, polyethersulfone, polyphenylene ether, polyether ether ketone,
Polyacetal, polyetherimide, polyimide, polystyrene, syndiotactic polystyrene, ABS
A resin, a synthetic resin such as polytetrafluoroethylene, an epoxy resin, a phenol resin, a silicone resin, and a urethane resin is coated on the surface of red phosphorus as a first layer, and further, aluminum hydroxide is coated thereon as a second layer. Or a two-layer coating, or silicon dioxide (Si
O _2), it can be used such as those formed by coating an inorganic material such as titanium dioxide (TiO _2). Among them, red phosphorus whose first layer is coated with phenol resin, whose second layer is coated with aluminum hydroxide, red phosphorus whose first layer is coated with polystyrene and whose second layer is coated with aluminum hydroxide, TiO ₂ are preferable. Is red phosphorus surface-coated with. In the case of red phosphorus coated on the surface with a phenol resin and aluminum hydroxide, phenol resin / aluminum hydroxide = 1/9 to 9
It is preferable to form the surface coating in a weight ratio in the range of / 1, and in the case of red phosphorus surface-coated with polystyrene and aluminum hydroxide, polystyrene / aluminum hydroxide = 1
It is preferred to form the surface coating with a weight ratio in the range of / 9 to 9/1. The average particle diameter of the surface-coated red phosphorus is preferably 0.5 to 50 μm, and the maximum particle diameter is 1 μm.
It is preferably 50 μm or less. If the average particle diameter is less than 0.5 μm, it is difficult to coat red phosphorus on the surface (especially, two layers), and if the average particle diameter exceeds 50 μm, the dispersibility in the resin composition decreases. . The maximum particle size is 150μ
If it exceeds m, there is a problem in the filling property of the sealing resin.

As the silicone powder, there can be used a polysiloxane powder obtained by three-dimensionally cross-linking the compound represented by the formula (3) as a repeating unit.

[0022]

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Among them, preferred are ordinary silicone powders in which R ₁ and R ₂ are alkyl groups such as methyl groups.
_A glycidyl group-containing silicone powder wherein at least one of ₁ and R ₂ is a glycidyl group (the other is an alkyl group);
A methacryl group-containing silicone powder in which at least one of R ₁ and R ₂ is a methacryl group (the other is an alkyl group). It is desirable that the silicone powder has a maximum particle size of 200 μm or less. Silicone powders having a particle size of more than 200 μm have poor dispersibility, reduce the chance of contact with an inorganic ion exchanger, and have an insufficient effect of suppressing ionization of the inorganic ion exchanger.

The above-mentioned red phosphorus-based surface-coated silicone powder and silicone powder may be used alone or in combination. Further, the inorganic filler used in the present invention may be used under the pressure at which the average particle diameter of the inorganic filler before compression molding is maintained after compression molding as disclosed in JP-A-5-170967. It is preferable that the inorganic filler has a volume fraction of 75% or more (this volume fraction is expressed as φm) in a compact obtained by compression-molding the material.

The volume fraction φm will be described in detail. The true specific gravity of each of the n inorganic fillers (n is an integer of 1 or more) used as the inorganic filler is represented by d _i , and the respective inorganic fillers are represented by: the mixing weight w _i (d _i, the i in w _i 1
, The specific gravity of the entire inorganic filler is a value calculated by the following equation (A). The true specific gravity is the original specific gravity of the material of the inorganic filler that does not include voids in the particles of the inorganic filler.

[0026]

(Equation 1)

The volume fraction φm (%) of the inorganic filler in the compact obtained by compression-molding the inorganic filler is obtained by compressing the weight of the inorganic filler to W (g). Assuming that the volume of the formed body is V (cc), it is calculated by the following equation (B). φm = 100 (W / d) / V (B) And the volume of the inorganic filler of the molded article molded under the maximum pressure at which the average particle diameter of the inorganic filler before compression molding is maintained after compression molding The fraction φm is a value smaller than the volume fraction φm of the inorganic filler of the molded product when molded at the above-mentioned maximum pressure.

By using an inorganic filler having a particle diameter such that the volume fraction φm is 75% or more, it is possible to obtain a sealing resin composition having low fluidity even when the content of the inorganic filler is increased. Can be done. Therefore, the volume fraction φm is 7
When an inorganic filler having a particle size of less than 5% is blended, the melt viscosity of the sealing resin composition increases, unfilling or voids are generated, and the wire may be swept or broken during molding. As a result, the moldability is greatly reduced.
The upper limit of the volume fraction φm is not particularly set, but is practically 9
0% is the upper limit.

The inorganic filler having a volume fraction φm of 75% or more can be blended in the range of 20 to 500 parts by weight based on 100 parts by weight of PPS. The inorganic filler is blended for the purpose of lowering the linear expansion coefficient of the sealing resin cured body to reduce the stress to heat and preventing cracks and the like from occurring in the sealing electronic component. If the compounding amount is less than 20 parts by weight, low stress property due to the decrease of the linear expansion coefficient cannot be expected, and if the compounding amount of the inorganic filler exceeds 500 parts by weight, the fluidity during molding becomes poor. ,
It cannot be put to practical use.

As the inorganic filler, amorphous silica,
Crystalline silica, silica such as synthetic silica, alumina, glass, milled fiber glass, titanium oxide, calcium carbonate, clay, talc, kaolin, silicon nitride, aluminum nitride, etc. can be used, but amorphous is particularly preferable. Silica such as silica, crystalline silica, synthetic silica, and spherical alumina.

It is preferable to use crystalline silica or spherical alumina as an inorganic filler in the sealing resin composition for high heat conduction. However, in consideration of moldability, in the case of crystalline silica, it is preferable that the inorganic filler contains crystalline silica in a volume fraction of 40 to 90%. In the case of spherical alumina, the inorganic filler has a volume fraction of 30 to 100.
It is preferable to include spherical alumina in the range of%. These volume fractions of crystalline silica and spherical alumina are numerical values in terms of true specific gravity. If the volume fraction of crystalline silica is less than 40% or the volume fraction of spherical alumina is less than 30%, it becomes difficult to obtain a desired thermal conductivity, and the volume fraction of crystalline silica exceeds 90%. In such a case, the fluidity at the time of molding is deteriorated, and wire sweep and disconnection are likely to occur.

On the other hand, it is preferable to use synthetic silica as an inorganic filler in the sealing resin composition for memory. Silica is usually produced by crushing naturally occurring silica, but such natural silica contains uranium and thorium as impurities, so it is used for sealing memory elements and the like that are adversely affected by α-rays. Is inappropriate. On the other hand, synthetic silica is industrially synthesized using silicon chloride, water glass, alkoxysilane, or the like as a raw material, and can minimize impurities. Therefore, the use of synthetic silica is useful for preventing soft errors in semiconductor devices.

If necessary, the resin composition for sealing electronic parts of the present invention may contain another synthetic resin, an elastomer, an antioxidant, a crystal nucleating agent, a coupling agent, or the like, as long as the object of the present invention is not impaired. A release agent, a lubricant, a coloring agent and the like can be blended. As this synthetic resin, for example, polyolefin, polyester, polyamide, polycarbonate,
Polysulfone, polyethersulfone, polyphenylene ether, polyetheretherketone, polyacetal, polyetherimide, polyimide, polystyrene, syndiotactic polystyrene, ABS resin, polytetrafluoroethylene, epoxy resin, phenolic resin,
Silicone resins, urethane resins, etc., and elastomers include polyolefin rubbers, olefin copolymers, glycidyl group-containing olefin copolymers, and the like.

By blending the above-mentioned components, the resin composition for sealing electronic parts according to the present invention can be produced. A method of mixing with a mixer such as a Henschel mixer, or, if necessary, mixing and mixing a part of the necessary components in advance in a master batch, followed by melting and kneading with a kneading machine such as an extruder can be used.
Of course, it is not limited to these.

In sealing an electronic component using the electronic component sealing resin composition, the sealing method is not particularly limited. For example, an electronic element is fixed in a mold, Examples of the method include molding a resin composition for sealing electronic components by injection molding, transfer molding, or potting molding.

[0036]

Next, the present invention will be described specifically with reference to examples. After uniformly mixing each component of the composition shown in Tables 1 to 4 (the blending amount is part by weight) using a Henschel mixer, using a twin-screw kneading extruder having a screw diameter of 40 mm at a cylinder temperature of 300 ° C. The resin composition was extruded and pelletized to prepare the electronic component sealing resin compositions of Examples 1 to 12 and Comparative Examples 1 to 8.

In addition, resins A to D in Table 1, a coupling agent,
The following were used as inorganic ion exchangers AB and flame retardants AG. -Resin A: PPS resin (Kureha Chemical product number "W-203"
A ", melt viscosity 250 poise (300 ° C., shear rate 10
00 / sec)) ・ Resin B: PPS resin (Kuha Chemical Co., product number “W-21”)
4 ", melt viscosity 1800 poise (300 ° C., shear rate 1
Resin C: LCP (liquid crystal polymer) resin (Sumitomo Chemical Co., Ltd. product number "E7000P", melt viscosity 2000 poise (30
0 ° C., measured at a shear rate of 1000 / sec)) Resin D: SPS (Syndiotactic polystyrene)
Resin (Idemitsu Petrochemical Co., product number "S100", melt viscosity 8
20 poise (measured at a shear rate of 1000 / sec at 300 ° C.)) Coupling agent: epoxy silane coupling agent (product number “SH6040” manufactured by Toray Silicone Co., Ltd.) Inorganic ion exchanger A: Sb ₂ Bi _1.4 O _6.4 ( OH) _0.9 (NO ₃ ) _0.4
0.6H ₂ O. Inorganic ion exchanger B: Sb ₂ Bi _1.3 O _6.6 (OH) _0.8 (NO ₃ ) _0.06
0.6H ₂ O • Flame retardant A: Red phosphorus coated on the surface with phenol resin and aluminum hydroxide (Rinno Kagaku Sangyo Co., Ltd. product number “NOVA EXCEL 140”, weight ratio of phenol resin to aluminum hydroxide 3: 1, coating amount) 1% by weight of red phosphorus, average particle size 35
μ) Flame retardant B: Red phosphorus coated on the surface with polystyrene resin and aluminum hydroxide (Rinno Kagaku Sangyo Co., Ltd. product No. Excel, weight ratio of phenol resin to polystyrene resin 4: 1, coating amount 1 weight of red phosphorus %, Average particle size 30μ) Flame retardant C: Red phosphorus surface-coated with TiO ₂ (Nippon Synthetic Chemical Company product number “TP-10”, coating amount 2% by weight of red phosphorus, average particle size 40μ) ・ Flame retardant D: Silicone powder (Dow Corning Toray Silicone Co., Ltd., product number "DC4-7105") obtained by three-dimensionally cross-linking a compound represented by the chemical formula 3 in which R ₁ and R ₂ are each a methyl group as a repeating unit. Maximum particle size of 20
0 μm or less) Flame retardant E: maximum particle size is 1 mm
The above silicone powder (Dow Corning Toray Silicone Co., Ltd., product number “DC4-7105”) Flame retardant F: R ₁ and R _{2 in} the structural formula shown in Chemical Formula 3 are partially glycidyl groups and others are methyl groups. Glycidyl group-containing silicone powder obtained by three-dimensionally cross-linking an alkyl group having a maximum particle size of 200 μm or less by classifying Dow Corning Silicone Co., Ltd. product number “DC4-7051”. Flame retardant G: a methacrylic group-containing silicone powder obtained by three-dimensionally cross-linking, as a repeating unit, a part of R ₁ and R _{2 in} the structural formula shown in Chemical Formula 3, and the other part is an alkyl group such as a methyl group ( Classification of Toray Dow Corning Silicone product number “DC4-7081” to reduce the maximum particle size to 200 μm or less) In addition, inorganic fillers A to E are: It was prepared by mixing the filler F1~F10 of.・ F1: Spherical amorphous silica (Electrochemical Industry Co., Ltd. product number “F
B-74 ”) having an average particle size of 17 μm obtained by air classification.
Silica powder F2: spherical amorphous silica (Denka Chemical Co., product number "F
B-30 "), which is air-classified to obtain a silica powder having an average particle size of 4 µm. F3: spherical amorphous silica (Admatech product number" S
O-25R ”, average particle size 0.5 μm) F4: Silica powder with an average particle size of 18 μm obtained by air classification of crystalline silica powder (Tatsumori product number“ 3K ”) F5: Spherical alumina (Showa) Denko product number “AS-3
0 ") by air classification and an alumina powder having an average particle size of 23 µm. F6: spherical alumina (product number" AS-6 "manufactured by Showa Denko KK)
0 ”) by air classification and an alumina powder having an average particle diameter of 7 μm. • F7: spherical alumina (Admatech product number“ AO-
F8: Synthetic silica (Micron product number "SW-CO"
Y21 ”) is a synthetic silica powder having an average particle size of 23 μm obtained by air classification. • F9: Synthetic silica (Tokuyama product number“ SE-8 ”)
Of synthetic silica having an average particle size of 5 μm obtained by air classification of F10: Synthetic silica (Admatech product number “SO-
25H ", average particle size 0.5 μm) Inorganic filler A: F1 / F2 / F3 = 70/20/10
Amorphous silica mixed at a weight ratio of φm = 81% inorganic filler B: amorphous silica mixed at a weight ratio of F1 / F2 = 70/30, φm = 70% inorganic filler C: F3 Amorphous silica and crystalline silica mixed at a weight ratio of / F4 = 90/10, φm = 75% Inorganic filler D: F5 / F6 / F7 = 70/20/10
Alumina, φm = 84%, inorganic filler E: F8 / F9 / F10 = 70/20/1
Synthetic silica mixed at a weight ratio of 0, φm = 88% (The above volume fraction φm is determined by using an inorganic filler of 300 kg / c
The compression molding is performed at a pressure of m ² to produce a cylindrical molded body, and the volume V and the weight W of the molded body calculated from the diameter and the thickness of the molded body and the true specific gravity d of the inorganic filler are expressed by the formula (B) This is a calculated value. When the average particle size of the inorganic filler obtained by crushing the compact was measured, the average particle size was the same as the average particle size of the inorganic filler before molding. At a pressure of 300 kg / cm ² , the particles of the inorganic filler were measured. No destruction has occurred. Examples 1 to 12 and Comparative Example 1 prepared as described above
Using the pellets of the electronic component sealing resin compositions of Nos. 8 to 8, sealed electronic components for evaluation were produced. For the production of the encapsulated electronic component for evaluation, a semiconductor gate array element having a chip size of 3 mm square and having a glass-based protective film was mounted on a lead frame made of 42 alloy using silver paste, and then the semiconductor chip was molded for 16 DIP. This is performed by setting the mold in a mold and injection molding the electronic component sealing resin compositions of Examples 1 to 12 and Comparative Examples 1 to 8 under the conditions of a cylinder temperature of 300 ° C. and a mold temperature of 130 ° C. Was. (1) Formability The appearance state (filling property, void) and the disconnection state of the wire of the thus-prepared sealed electronic component for evaluation were confirmed by soft X-ray to evaluate the formability, and the molding failure (unfilled) , Voids and wire breaks) are shown in Tables 1 to 4 as “○” and those that did occur as “X”. (2) Moisture resistance reliability (PCT) The sealed electronic component for evaluation obtained by the same operation as above was
The treatment was performed for 1000 hours under the conditions of 1 ° C. and 100% RH. The operation of the gate array element was confirmed for the sample after the test, and the sample in which the operation failure occurred was determined to be defective. The obtained results are shown in Tables 1 to 4 as (number of defectives / number of tested samples). (3) Humidity Reliability (THB) The sealed electronic component for evaluation obtained by the same operation as above
A voltage of 30 V was applied under the condition of 85 ° C. and 85% RH.
A 0-hour continuous energization test was performed. The resistance value of the gate array element after the energization test was examined, and a sample whose resistance greatly changed from the initial value of the resistance before the test was regarded as defective. The obtained results are shown in Tables 1 to 4 as (number of defectives / number of tested samples).

[0038]

[Table 1]

[0039]

[Table 2]

[0040]

[Table 3]

[0041]

[Table 4]

In Comparative Example 5, wire cutting occurred in 15 of n = 50, in Comparative Example 7, wire cutting occurred in 40 of n = 50, and in Comparative Example 8, 35 of n = 50. Wire cutting occurs. As seen in Tables 1 to 4,
Each of the examples was extremely excellent in both moldability and moisture resistance reliability.

[0043]

As described above, according to the present invention, polyphenylene sulfide is used in an amount of 100 wt.
5 parts by weight, 0.1 to 10 parts by weight of at least one of surface-coated red phosphorus and silicon powder, inorganic filler at a pressure at which the average particle diameter of the inorganic filler before compression molding is maintained after compression molding. An inorganic filler having a volume fraction of 75% or more in a molded product obtained by compression molding of
Characterized in that the inorganic ion exchanger is combined with red phosphorus or silicon powder coated on the surface of the inorganic ion exchanger to suppress ionization of the inorganic ion exchanger. Thus, high humidity resistance reliability can be obtained even in a test in which a bias voltage is applied. Further, by using such an inorganic filler having a volume fraction of 75% or more, the melt viscosity of the resin composition for encapsulation molding can be reduced, and sweeping and disconnection of the wire during encapsulation molding can be prevented. It can improve moldability by preventing the formation.

A second aspect of the present invention is a polymer having, as a polyphenylene sulfide, a main structural unit represented by the following repeating unit:

[0045]

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The melting point is 260 ° C. or more, and the melt viscosity is 50 to 5
00 poise (temperature 300 ° C, shear rate 1000 (1 /
(Measured in seconds)), it is possible to obtain a sealing resin having excellent moldability and high mechanical strength. In the invention of claim 3, the inorganic ion exchanger may be Sb _a Bi _b O _c (OH) _d (NO ₃ ) _e · nH ₂ O (where a and b are 1-2 and c is 1-7, respectively). , D is from 0.2 to 3, e is from 0.05 to 3, and n is from 0 to 2), so that adsorption and capture of impurity ions of polyphenylene sulfide can be performed efficiently. Therefore, high moisture resistance reliability can be obtained.

According to the fourth aspect of the present invention, the red phosphorus whose surface is coated with a phenol resin and aluminum hydroxide is used, so that the effect of suppressing the ionization of the inorganic ion exchanger is enhanced. What you can get. Further, in the invention of claim 5, since a red phosphorus having a surface coated with a styrene resin and aluminum hydroxide is used, it is possible to obtain a high effect of suppressing ionization of the inorganic ion exchanger. You can do it.

Further, according to the invention of claim 6, as red phosphorus, T
Since the one coated with iO ₂ is used, the effect of suppressing the ionization of the inorganic ion exchanger can be enhanced. Claim 7
Has a maximum particle size of 200 as a silicon powder.
Since the particles having a particle diameter of not more than μm are used, the effect of suppressing the ionization of the inorganic ion exchanger by increasing the mixing and dispersibility of the silicon powder can be obtained.

In the invention of claim 8, since a silicon powder containing a glycidyl group is used as the silicon powder, it is possible to obtain a high effect of suppressing ionization of the inorganic ion exchanger. According to the ninth aspect of the present invention, since the silicon powder having a methacryl group is used, the effect of suppressing the ionization of the inorganic ion exchanger can be enhanced.

According to the tenth aspect of the present invention, since amorphous silica is used as the inorganic filler, the linear expansion coefficient of the sealing resin cured body due to the blending of the inorganic filler is reduced to reduce the heat stress. It is possible to obtain a high effect. The invention according to claim 11 uses an inorganic filler containing crystalline silica in a volume fraction of 40 to 90% in the inorganic filler, so that the sealing resin obtained by blending the inorganic filler is used. The effect of reducing the thermal stress by reducing the coefficient of linear expansion of the cured product can be enhanced.

According to a twelfth aspect of the present invention, the inorganic filler contains spherical alumina in the range of 30 to 100% by volume in the inorganic filler. The effect of reducing the stress against heat by reducing the linear expansion coefficient of the cured sealing resin can be enhanced. According to the invention of claim 13, since synthetic silica is used as the inorganic filler, soft errors in the semiconductor element can be prevented by the synthetic silica capable of minimizing impurities.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 23/31

Claims (14)

[Claims] 1. 100 parts by weight of polyphenylene sulfide, 0.5 to 5 parts by weight of an inorganic ion exchanger, 0.1 to 10 parts by weight of at least one of red phosphorus and silicon powder coated on the surface, before compression molding At a pressure at which the average particle diameter of the inorganic filler is maintained even after the compression molding, the inorganic filler having a volume fraction of 75% or more of the inorganic filler in the molded product obtained by compression-molding the inorganic filler is from 20 to 500. What is claimed is: 1. A resin composition for sealing electronic parts, characterized by being blended in parts by weight. 2. Polyphenylene sulfide is a polymer having a repeating unit shown below as a main structural unit. Melting point is at least 260 ° C and melt viscosity is 50-500 poise (measured at a temperature of 300 ° C and a shear rate of 1000 (1 / sec))
The resin composition for sealing electronic parts according to claim 1, wherein: Wherein the inorganic ion _{exchangers, Sb a Bi b O c (} OH) d (NO 3) e · nH 2 O ( where, a, b respectively 1 to 2, c is 1 to 7, d is 3. The method according to claim 1, wherein 0.2 to 3, e is 0.05 to 3, and n is 0 to 2).
4. The resin composition for sealing electronic components according to item 1. 4. The resin composition for sealing electronic parts according to claim 1, wherein the surface of the red phosphorus is coated with a phenol resin and aluminum hydroxide. 5. The resin composition according to claim 1, wherein the surface of the red phosphorus is coated with a styrene resin and aluminum hydroxide. 6. The resin composition for sealing electronic parts according to claim 1, wherein the surface of the red phosphorus is coated with TiO ₂ . 7. Silicon powder has a maximum particle size of 200 μm.
The resin composition for sealing electronic parts according to any one of claims 1 to 6, wherein m is equal to or less than m. 8. The resin composition according to claim 1, wherein the silicon powder contains a glycidyl group. 9. The resin composition for sealing electronic components according to claim 1, wherein the silicon powder contains a methacryl group. 10. The resin composition for sealing electronic parts according to claim 1, wherein the inorganic filler is amorphous silica. 11. The electronic component sealing according to claim 1, wherein the inorganic filler contains crystalline silica in a volume fraction of 40 to 90% in the inorganic filler. A resin composition for stopping. 12. The electronic component sealing according to claim 1, wherein the inorganic filler contains spherical alumina in a volume fraction of 30 to 100% in the inorganic filler. A resin composition for stopping. 13. The resin composition for sealing electronic parts according to claim 1, wherein the inorganic filler is synthetic silica. 14. A sealed electronic component, which is sealed with the electronic component sealing resin composition according to claim 1. Description: