JP2001244104A - Resistive element and resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistive element which controls shift of trimming laser beams at high precision the use of a normal trimmer, and can confirm the results of trimming which has actually been conducted. SOLUTION: An alignment mark 13 as a positional reference for trimming is provided in a resistive body 11, having a resistive pattern which can be trimmed, and an alignment mark 14 serving both as a laser passing confirming mark which does not affect the electrical characteristics is provided in a margin near parts 12a, 12b which can trim the resistive pattern, respectively. Thus, the position of the trimming is controlled accurately, and the results of the trimming which has actually been conducted are confirmed by a trace of laser beams of the alignment mark 14 serving both as a laser passing confirming mark.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor and a resistor having an alignment mark for trimming a film resistor.

[0002]

2. Description of the Related Art Conventionally, a resistor using a thin film resistor, such as a chip resistor, has a large number of chip regions provided on the surface of a substrate made of ceramics or the like, and each chip region is made of nickel chrome (NiCr) or the like. A thin film resistor pattern is formed and trimmed with a laser so that the resistance value of each thin film resistor pattern is matched with a target resistance value.

[0003] As shown in FIG. 4, a resistor 4 using about 10000 thin-film resistors on a wafer 41 made of, for example, alumina having a diameter of 4 to 6 inches.
Form 2 Then, alignment marks 44 and 45 having a size of 1 mm square, for example, are formed at a predetermined distance d from a resistor group 43 which is an aggregate of the resistors 42.

The alignment marks 44 and 45 are recognized by a recognition camera of a laser trimming device, and the resistor group 43 is set using the alignment marks 44 and 45 as position references.
The resistance pattern of each resistor 42 is trimmed to obtain a desired resistance value.

FIG. 5 shows an example of a resistance pattern of the resistor 42. In the example of FIG. 5, the resistance pattern is a thin line 4 in the horizontal direction.
2a and the vertical thin line 42b are combined in a lattice shape. Then, in order to adjust the resistance value between both electrodes (not shown), the resistance value is trimmed by a suitable amount while measuring the resistance value in the vertical direction at a predetermined position, and then trimmed in the horizontal direction to accurately obtain the desired resistance value. The purpose is to obtain a resistor 42 having a matched resistance value.

The alignment marks 44 and 45 in such trimming can be formed with high positional accuracy with the resistor group 43 or the individual resistor 42, but have a fixed area (for example, the above-mentioned 1 mm square size). It is difficult to recognize the center positions of the alignment marks 44 and 45 having the error, and it is difficult to control the movement of the trimming laser light within an error of several nanometers. It was very difficult with a normal trimmer having only a table as a means of moving laser light.

In the case where the individual resistors 42 are trimmed by an appropriate amount in the vertical direction at a predetermined position as shown in FIG. 5, an example shown in FIG. Is a correct stop position, but even if a laser beam is run on the wafer 41 formed of alumina or the like, the alumina is white and cannot be visually recognized, and no trace of the laser beam remains. It is not possible to confirm whether the trimming has been performed up to the middle.

Further, when an overrun for trimming a part of a thin line which should not be trimmed as indicated by a dot B in FIG. 5 is not so much affected as a measured resistance value, it is overlooked in the trimming operation. The thin line portion, which is partially trimmed during use of the resistor, is liable to break the pattern due to heat generation during use, and the reliability cannot be compensated. It is also very difficult to confirm such a trimming overrun.

[0009]

As described above, in the conventional resistor using a thin film resistor, it is difficult to control the movement of the trimming laser beam with high precision, and it is difficult to perform the trimming actually performed. The result could not be confirmed.

Therefore, the present invention uses a recognition device using a CCD camera and an ordinary trimmer that uses an XY mirror or an XY table attached to a galvanometer as a means for moving the laser light, and controls the movement of the trimming laser light with high precision. It is an object of the present invention to provide a resistor and a resistor that can be performed and a result of trimming actually performed can be confirmed.

[0011]

According to a first aspect of the present invention, a resistor is formed on a substrate and includes a trimmable resistor pattern and an alignment mark serving as a position reference for trimming the resistor pattern. And

The resistor according to claim 2 is formed on a substrate,
It has a trimmable resistor pattern, an alignment mark serving as a position reference for trimming the resistor pattern, and an alignment mark serving also as a laser passage confirmation mark in a margin near a trimmable portion of the resistor pattern. .

According to a third aspect of the present invention, there is provided the resistor according to the second aspect, wherein the resistor pattern has at least a lattice pattern, and an alignment mark serving also as a laser passage confirmation mark is provided in a margin of the lattice pattern. It is characterized by having been done.

According to a fourth aspect of the present invention, there is provided the resistor according to any one of the first to third aspects, wherein the alignment mark serving as a position reference is provided at a dicer margin removed after the trimming of the resistor pattern is completed. I do.

According to a fifth aspect of the present invention, in the resistor of the second aspect, the alignment mark serving as a position reference and the alignment mark serving also as a laser passage confirmation mark are formed of the same material as the resistance pattern. It is characterized by.

The resistor according to claim 6 is formed on a substrate,
It is characterized by having a trimmed or trimmable resistance pattern and an alignment mark which is arranged in a margin near the trimmed portion or the trimmable portion of the resistance pattern and also serves as a confirmation mark for confirming laser passage.

As described above, the alignment mark serving as a position reference for trimming is provided on each of the resistors having the resistor pattern capable of being trimmed, so that the CCD can be used.
XY attached to a camera recognition device and galvanometer
Using a normal trimmer that uses a mirror or an XY table as a means for moving the laser light, the movement of the laser light for trimming can be controlled with high precision, and the trimming can be accurately performed.

In addition, by providing an alignment mark serving as a laser passage confirmation mark having no influence on electrical characteristics, in addition to an alignment mark serving as a position reference, a margin near a trimmable portion of the resistor pattern is provided. Since the position of the trimming can be controlled while checking the alignment mark also serving as the laser passage confirmation mark, the trimming can be performed accurately. Then, the result of the actually performed trimming can be confirmed by the trace of the laser light of the alignment mark also serving as the laser passage confirmation mark.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing the configuration of a resistor pattern and the like of a resistor 11 according to a first basic embodiment of the present invention. As in the conventional example, a large number (about 10000) of the resistors 11 are formed on a wafer having a diameter of 4 to 6 inches made of, for example, alumina using a thin film resistor.

As shown in FIG. 1, the resistance pattern of the resistor 11 is formed of a material that can be trimmed by a laser beam, and a horizontal thin line 12a and a vertical thin line 12b are combined in a grid pattern. Constitute the resistance between the electrodes provided in the first and second electrodes. Each of the resistors 11 is provided with an alignment mark 13 serving as a position reference for trimming a resistor pattern.
Is usually the laser light oscillation point.

An alignment mark 14 also serving as a laser passage confirmation mark is provided in a grid-like blank formed by the horizontal thin lines 12a and the vertical thin lines 12b.

The alignment mark 13 serving as a position reference and the alignment mark 14 also serving as a laser passage confirmation mark are formed of a material that keeps a trace of the laser beam when irradiated. Specifically, the alignment marks 13 and 14 are formed of the same material as the material of the resistance pattern.

In the lattice-shaped resistance pattern of the resistor 11, the change in the resistance value per cut of the horizontal thin line 12a is large, and the change in the resistance value per cut of the vertical thin line 12b is small. Therefore, trimming is performed as follows in order to adjust the resistance value between both electrodes.

First, a specific resistor 11 to be trimmed out of a number of resistors is determined, and an alignment mark 13 serving as a position reference of the resistor 11 is recognized by a recognition camera of a laser trimming device. In the example of FIG. 1, the laser beam is oscillated to obtain a target resistance value.
Trim 2a. Then, when the resistance value reaches a predetermined value, the direction is changed and trimming is performed rightward, and the thin line 12b in the vertical direction is sequentially trimmed. When the target resistance value is reached, the trimming is completed.

In this case, in the vertical trimming, the trimming is performed in the order of the horizontal thin line 12a, the laser passing confirmation mark / alignment mark 14, the horizontal thin line 12a, the laser passing confirmation mark / alignment mark 14. However, when the horizontal thin line 12a to be the last of the vertical trimming is trimmed, the laser pass confirmation mark / alignment mark 14 located next to the thin line 12a is recognized, and trimming is performed halfway.

Thereafter, the direction is changed and the trimming is performed in the horizontal direction. After confirming from the measured value that the resistance value has reached the target value, the trimming of the vertical thin line 12b is finally performed. The laser pass confirmation mark / alignment mark 14 to be recognized is recognized, trimming is performed halfway, and the process is completed.

Here, the dimensions of the lattice formed by the horizontal thin lines 12a and the vertical thin lines 12b, and the dimensions of the laser passage confirmation mark and alignment mark 14 formed in this lattice, that is, in the vicinity margin, are as follows: It is regulated by the width dimension of the laser beam used for trimming.

If the inner dimension of the grating is not larger than the width of the laser beam, accurate trimming cannot be performed. In order to confirm that the laser beam has passed the center position, the laser passage confirmation mark and alignment mark 14 must be used. The width is preferably larger than the width of the laser light. For example, if the laser width is 10 μm, the relationship is defined as follows: for example, the inner dimension of the grating 15 μm> the width of the alignment mark 14 ≧ the width of the laser light 10 μm. Can be In any case, the dimensions are determined so that the grating can be trimmed at a predetermined position with a laser beam having a predetermined width, and the movement locus of the laser beam can be grasped.

As described above, by providing the alignment mark 13 as a position reference for trimming on each of the resistors 11 having the resistor pattern which can be trimmed, the recognition device using the CCD camera and the XY mirror or XY table attached to the galvanometer can be used. The movement of the trimming laser light can be controlled with high precision using a normal trimmer that uses the laser beam as a moving means of the laser light, and the trimming can be accurately performed.

The trimming portion 1 of the resistance pattern is provided together with the alignment mark 13 serving as a position reference.
By providing an alignment mark 14 which also serves as a laser passage confirmation mark having no influence on electrical characteristics in the margin near 2a and 12b with the same material as the resistance pattern, the trimming position is controlled while the trimming position is confirmed during the trimming. Therefore, trimming can be performed accurately.

Then, the result of the actually performed trimming can be confirmed by the trace of the laser beam of the alignment mark 14 also serving as the laser passage confirmation mark, and as shown in FIG. It can be confirmed that trimming has been correctly completed at the center position of the alignment mark 14 also serving as a confirmation mark.

In the case where there is no trace of the laser beam on the alignment mark 14 also serving as the laser passage confirmation mark, or in the case where there is any trace on the whole, the center position of the alignment mark 14 also serving as the laser passage confirmation mark is correctly determined. It can be confirmed that the trimming has not been completed. In this case, the operator or the like confirms the amount of deviation from the desired state, then adjusts the laser trimming device again, and performs the next trimming operation.

FIG. 2 is a diagram showing an overall configuration including a resistance pattern of a resistor 21 according to a second embodiment of the present invention. This resistor 21 is also similar to the prior art,
For example, a large number (about 10000) is formed on a wafer having a diameter of 4 to 6 inches made of alumina using a thin film resistor.

The resistance pattern of the resistor 21 is
The planar portion 27-1 under the left electrode, the first zigzag circuit portion L2, the second zigzag circuit portion L3, the lattice circuit portion L1, the third zigzag circuit portion L4, and the right under the electrode It is formed from a plane portion 27-2. The electrodes 28-1 and 28-2 and the bumps 29-1 to 29-4 are formed on the portions 27-1 and 27-2 below the electrodes, and are used as chip-shaped components.

As in the first embodiment, the resistor 21 is provided with an alignment mark 23 serving as a position reference for trimming the resistor pattern. An alignment mark 24 also serving as a laser passage confirmation mark is provided in a grid-like blank portion formed by the thin line 22b.

The zigzag circuit portions L2, L3, and L4 are provided so as to short-circuit the zigzag portions L2-1, L3-1, and L4-1, respectively, and are opened by trimming. And the short-circuit opening adjustment parts L2-2, L3-2, and L4-2.

The alignment mark 23 serving as a position reference and the alignment mark 24 also serving as a laser passage confirmation mark are the same as those in the embodiment of FIG.

The zigzag circuit sections L2 and L2 are connected to each other so that the resistor 21 can be adjusted to an arbitrary resistance value as a whole.
3 and L4, the step of adjusting the resistance value is determined differently for each of the vertical and horizontal directions of the lattice circuit portion L1.

For example, in the zigzag circuit portion L4, the change in resistance value per disconnection of the short-circuit / opening adjustment portion L4-2 is 20.
%, The zigzag circuit portion L3 is a short-circuit opening adjustment portion L3-2.
And the zigzag circuit portion L2 has a resistance value change of 15%, and the zigzag circuit portion L2 has a resistance value change of 10% per cut of the short-circuit opening adjustment portion L2-2.
Indicates that the resistance value per cut of the horizontal thin line 22a is 0.
The resistance value adjustment step is determined differently, for example, 5%, and the resistance value change per one cut of the vertical thin line 22b is 0.2%.

Instead of oscillating and trimming from the position of the alignment mark 23 serving as a position reference, the fine lines 22a, 22a at specific positions of the lattice circuit portion L1 are not trimmed.
By trimming b, the resistance value can be more finely adjusted.

In the embodiment shown in FIG. 2, three examples of trimming are shown. First, the lattice circuit part L1
As shown by the trimming trajectory T1, a predetermined number of horizontal thin lines 22a and a laser passing confirmation mark / alignment mark 24 are trimmed in the vertical direction with the alignment mark 23 serving as a position reference as an oscillation point, Then, a predetermined number of vertical thin lines 22b, laser passing confirmation marks and alignment marks 24 are trimmed,
Next, in the vertical direction, the laser pass confirmation mark / alignment mark 24 and the horizontal thin line 22a are trimmed by a predetermined number and returned to another alignment mark 23.
Character-shaped trimming is performed. In this trimming,
Starting from the lattice mark circuit portion L1 at the alignment mark 23 serving as an oscillation point, the lattice circuit is trimmed, and trimming to other alignment marks 23 can be performed accurately. In addition, the confirmation of the trimming can be recognized as the laser passage confirmation mark / alignment mark 24 and the locus of the laser beam in the resistance pattern.

Next, in the same manner, in the lattice circuit portion L1,
As shown by the trimming trajectory T2, the laser beam is moved by a predetermined amount without oscillating the laser beam with the alignment mark 23 serving as a position reference as a base point, and the laser oscillation is started when the predetermined laser passage confirmation mark and alignment mark 24 are recognized. To start. And, in the vertical direction, the horizontal thin line 2
2a, Laser passing confirmation mark and alignment mark 2
4 is trimmed by a predetermined number, and stops at the center of the final laser passage confirmation mark / alignment mark 24.
I-shaped trimming is performed as a whole. In this trimming, the lattice circuit portion L1 is started from the alignment mark 23 serving as a position reference, and the laser beam is oscillated from the middle of the lattice circuit portion. You can start cutting from the middle of the grid. Therefore,
The resistance value can be freely adjusted with high accuracy.

Next, in the zigzag circuit portion L3, as shown by the trimming locus T3, the short-circuit opening adjustment portion L3
The resistance value is adjusted by trimming -2. With the alignment mark 23 serving as a position reference as an oscillation point, the thin line of the short-circuit / opening adjustment portion L3-2 and the laser passage confirmation mark / alignment mark 24 are sequentially trimmed in the horizontal direction to reach another alignment mark 23. The resistance value of the zigzag circuit portion L3 is adjusted by trimming the short-circuit opening adjustment portion L3-2. Of course, it is also possible to trim not a part of the short-circuit opening adjustment part L3-2 but only a part thereof. Also, adjust the trimming,
The confirmation can be performed in the same manner as in the embodiment of FIG. Trimming can be performed in the other zigzag circuit portions L2 and L4 in the same manner.

FIG. 3 is a diagram showing an overall configuration including a resistance pattern of a resistor 31 according to a third embodiment of the present invention. This resistor 31 is also similar to the prior art,
For example, a large number (about 10000) is formed on a wafer having a diameter of 4 to 6 inches made of alumina using a thin film resistor.

The resistance pattern of the resistor 31 is
It is formed of a flat portion 37-1 under the left electrode, a first zigzag circuit portion L2, a lattice circuit portion L1, a second zigzag circuit portion L3, and a flat portion 37-2 under the right electrode. I have. Electrodes 38-1, 38-2 and the like are formed in portions 37-1, 37-2 below the electrodes, and are used as chip-shaped components.

As in the first embodiment, the resistor 31 is provided with an alignment mark 33 serving as a position reference for trimming the resistor pattern. An alignment mark 34 also serving as a laser passage confirmation mark is provided in a grid-like blank portion formed by the thin line 32b.

Further, the zigzag circuit portions L2 and L3
Are each provided with a zigzag-shaped portion and a short-circuit opening adjustment portion provided to short-circuit each zigzag-shaped portion and opened by trimming.

Also in this resistor 31, each zigzag circuit portion L is adjusted so that it can be adjusted to an arbitrary resistance value as a whole.
2 and L3, the step of adjusting the resistance value is determined differently for each of the vertical and horizontal directions of the lattice circuit portion L1.

The zigzag circuit portion L2 has a short-circuit and open adjustment portion only on the upper side, and the zigzag circuit portion L3 has a short-circuit and open adjustment portion on both the upper and lower sides. With this configuration, for example, the zigzag circuit portion L2 has a resistance change of 20% per disconnection of the short-circuit and open adjustment portion, and the zigzag circuit portion L3 has a resistance change of 10% per disconnection of the short-circuit and open adjustment portion. %, And the lattice circuit portion L1
Indicates that the resistance value per cut of the horizontal thin wire 32a is 1
%, And the resistance value adjustment step is determined differently, for example, the change in the resistance value per cut of the vertical thin line 32b is 0.2%.

Also, instead of oscillating and trimming from the position of the alignment mark 33 serving as a position reference, the horizontal thin line 32 at a specific position of the lattice circuit portion L1 is used.
By trimming a, the resistance value can be further finely adjusted such that the resistance value per one cut of the horizontal thin line 32a is 0.01%.

The material and dimensions of the alignment mark 33 serving as the position reference and the alignment mark 34 also serving as the laser passage confirmation mark are the same as those in the embodiment shown in FIGS. However, in this embodiment,
The alignment mark 33 serving as a position reference is provided for the dicer. In FIG. 3, the dicer cost is an outer portion shown by vertical and horizontal broken lines in the figure.

In the third embodiment shown in FIG. 3, the method of trimming is the same as that shown in the first embodiment shown in FIG. 1 and the second embodiment shown in FIG. Can be done. However, the description is omitted for simplicity.

In the third embodiment, the dicer margin is cut off after the trimming of the resistor 31 is completed. At this time, the alignment mark 33 serving as a position reference provided in the dicer margin is necessarily cut at the same time. Will be done.

However, at the time when the dicer margin is cut off, the adjustment of the resistance value as the resistor, that is, the trimming work has been completed, so that there is no problem even if there is no alignment mark 33 serving as a position reference.

Rather, by removing unnecessary portions as a completed resistor, the chip size of the resistor can be reduced. For example, the chip size of the resistor in the third embodiment is 0.6 mm × 0. It can be as small as 3 mm.

In each of the embodiments of the present invention described above, each resistor which has been adjusted to a predetermined resistance value by trimming the resistor pattern is cut and separated for each resistor to form a chip resistor. .

Therefore, the resistor of the present invention is formed on a substrate, and the resistor pattern has a trimmed portion and a trimmable but not trimmed portion. It has an alignment mark that is arranged in a margin near a portion or a portion that can be trimmed but is not trimmed and also serves as a confirmation mark that can confirm laser passage.

The alignment mark, which also serves as a confirmation mark for confirming the passage of the laser through the resistor, is formed of the same material as that of the resistor pattern, but is electrically insulated from the resistor pattern, and has a characteristic as a resistor. It does not make any particular contribution, but it does not cause any inconvenience. The presence of the alignment mark, which also serves as a confirmation mark for confirming the passage of the laser, has a characteristic as a resistor.

[0060]

According to the present invention, by providing an alignment mark serving as a position reference for trimming on a resistor having a resistor pattern that can be trimmed,
Recognition device by D camera and X attached to galvanometer
Using a normal trimmer using a Y mirror or an XY table as a means for moving the laser light, the movement of the laser light for trimming can be controlled with high precision, and the trimming can be accurately performed.

In addition to the alignment mark serving as a position reference, an alignment mark serving as a laser passage confirmation mark having no influence on electrical characteristics is provided in a margin near a trimmable portion of the resistance pattern, so that a margin near the resistance pattern can be reduced. Since the position of the trimming can be controlled while checking the alignment mark also serving as the laser passage confirmation mark, the trimming can be performed accurately. Then, the result of the actually performed trimming can be confirmed by the trace of the laser light of the alignment mark also serving as the laser passage confirmation mark.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a resistor according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a resistor according to a second embodiment of the present invention.

FIG. 3 is a diagram showing a configuration of a resistor according to a third embodiment of the present invention.

FIG. 4 is a diagram showing an overall configuration of a related art.

FIG. 5 is a diagram showing a configuration of a conventional resistor.

[Explanation of symbols]

11, 21 and 31 Resistors 12a, 22a and 32a Thin horizontal lines 12b, 22b and 32b of grid circuit portion Thin vertical lines 13 and 23 of grid circuit portion Alignment marks 14 to serve as position references 14, 24 and 34 Laser Alignment mark that also serves as a passage confirmation mark

Claims (6)

[Claims] 1. A resistor comprising a resistor pattern formed on a substrate and capable of being trimmed, and an alignment mark serving as a position reference for trimming the resistor pattern. 2. A resistance pattern formed on a substrate and capable of being trimmed, an alignment mark serving as a position reference for trimming the resistance pattern, and a laser passage confirmation mark in a margin near a trimmable portion of the resistance pattern. A resistor having an alignment mark also serving as a resistor. 3. The resistor according to claim 2, wherein the resistor pattern has at least a lattice pattern, and an alignment mark serving also as a laser passage confirmation mark is provided in a margin of the lattice pattern. And the resistor. 4. The resistor according to claim 1, wherein said alignment mark serving as a position reference is provided at a dicer margin to be removed after trimming of said resistor pattern. 5. The resistor according to claim 2, wherein the alignment mark serving as a position reference and the alignment mark serving also as a laser passage confirmation mark are formed of the same material as the resistor pattern. . 6. A resistor pattern formed on a substrate and trimmed or capable of being trimmed, and a confirmation mark arranged in a margin near the trimmed portion or the trimmable portion of the resistor pattern and capable of confirming laser passage. A resistor having an alignment mark that also serves as a resistor.