JP2001237528A - Component mounting board, method of manufacturing component mounting board and mounting method of chip component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting board wherein alignment of a peripheral edge of an aperture part of a metal mask and a peripheral edge of a land is unnecessary and a solder metal film can be formed easily, a mounting method of a chip component, and a manufacturing method of the component mounting board. SOLUTION: Lands 2, 4 are formed in a mounting surface of a board 1. The respective solder metal films (9, 11, 13, 15, 17, 19) have plane areas smaller than the plane area of the land 2 and are formed on a surface of the land 2 at specified intervals. The respective solder metal films (21, 23, 25, 27, 29, 31) have plane areas smaller than the surface area of the land 4 and are formed on a surface of the land 4 at specified intervals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a component mounting board, a method of manufacturing a component mounting board, and a method of mounting a chip component.

[0002]

2. Description of the Related Art When an electronic component, particularly a chip-shaped electronic component, is soldered to a component mounting board, conventionally, as disclosed in Japanese Patent Application Laid-Open No. H11-121915, for example, , A land) is coated with a solder paste. And
The components are placed on the solder paste formed on the component mounting board, and then passed through a reflow furnace to perform soldering.

Meanwhile, in order to cope with high-density mounting of various electronic devices, mounted components have been miniaturized, and the pitch between components has been narrowed. Under such conditions, when components are soldered to a component mounting board by a conventional soldering method, various problems that have not conventionally been required to be considered arise. One of them is that the solder paste protrudes from the land.

[0004] The solder paste is applied by means such as a screen printing method using a metal mask. However, with the miniaturization of the mounted components, the lands and the component mounting boards have also been miniaturized, and it has become difficult to align the lands with the metal mask. For this reason,
On one side of the land, the solder paste is not applied, and the solder paste may protrude from the periphery of the other side of the land. Such a solder paste protrusion phenomenon causes a poor connection between the mounted component and the land due to a shortage of the solder paste on one side of the land, and a circuit between the adjacent land on the other side of the land. This causes a short circuit phenomenon.

[0005] Another problem is the bleeding of the solder metal component. Before passing through the reflow oven, the solder paste is not solidified. Therefore, the solder paste may seep out of the land due to the mounting pressure of the chip component. When such a solder paste seepage phenomenon occurs, a short circuit occurs between the terminal electrodes of adjacent components at a reduced arrangement interval or between lands on the component mounting board due to a solder metal component in the seepaged solder paste. As a result, a failure due to a short circuit occurs. This means the limit of narrowing the pitch between mounted components. In fact, in the conventional method using a solder paste, the space between mounted components is 2
00 μm was the limit.

In order to avoid the bleeding-out phenomenon of the solder metal component, it is only necessary to control the area where the solder paste is applied to the land, that is, the opening area of the metal mask. However, if the area of application of the solder paste to the land is too limited, poor conduction between the mounted component and the land will occur due to insufficient solder paste. In the present circumstances,
In order to determine the optimal opening area of the metal mask, there is no other way but to repeat trial and error for each land, and it is troublesome.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide a component mounting board, a chip component mounting method and a component mounting board manufacturing method capable of avoiding the bleeding of the solder metal component and thus reducing the interval between the mounting components. To provide.

Another object of the present invention is to provide a component mounting board and a chip component which can easily form a solder metal film without having to align the periphery of the opening of the metal mask with the periphery of the land. And a method for manufacturing a component mounting board.

[0009]

In order to solve the above-mentioned problems, the present invention discloses a component mounting board, a method of manufacturing the component mounting board, and a method of mounting a chip component.

[0010] A component mounting board according to the present invention has at least one land and a plurality of solder metal films. At least one land is formed in the plane of the substrate.
Each of the solder metal films has a plane area smaller than the plane area of the land, and on the surface of the land,
They are formed spaced apart from each other.

In the method of mounting a chip component according to the present invention, the chip component is soldered on the component mounting substrate using the above-described component mounting substrate according to the present invention. In soldering, a flux is applied on the lands and the solder metal film provided on the component mounting board, the terminal electrodes of the chip components are positioned on the flux, and the solder is passed through a reflow furnace or the like.

Here, in the component mounting board according to the present invention, since the solder metal film is used, the chip component is mounted on the solid solder metal film. Therefore, before passing through the reflow furnace, the solder metal film
Even if it receives the mounting pressure of the chip component, it does not seep out of the land. Accordingly, between the terminal electrodes of adjacent components or between lands on the component mounting board or the like at the narrowed arrangement interval is not short-circuited by the exuded solder metal component, and a failure due to a circuit short-circuit is generated. Absent. Flux is applied between the solder metal film and the chip component, but the oozing of the flux does not cause a short circuit. For this reason, according to the component mounting board according to the present invention, the interval between mounted components can be reduced as compared with the related art.

The component mounting board according to the present invention has a plurality of solder metal films. Each of the solder metal films has a plane area smaller than that of the land, and is formed on the surface of the land with an interval therebetween. According to this, since an appropriate number of solder metal films may be arranged at appropriate positions on the land, there is no need to align the periphery of the opening of the metal mask with the periphery of the land. For this reason, a solder metal film can be easily formed.

Moreover, according to such a solder metal film, it is sufficient to dispose the solder metal film according to the shape of the land, so that it is possible to easily cope with a change in the shape of the land. For example, the solder metal film is “0603 land”, “1005 land”.
In the case of a rectangular land such as a "land", it may be arranged in a matrix of a plurality of rows and a plurality of columns, and in the case of a lead frame land, it may be arranged in a row or a column.

[0015] The method of manufacturing a component mounting board according to the present invention comprises:
It includes the following steps.

First, in at least one substrate surface,
A land is formed, and a protective film is formed on the substrate surface to fill a space generated around the land.

Next, a resist film is formed on the surface of the protective film so as to surround the land. Next, a solder metal film is formed on the land surrounded by the resist film.

Next, the surface of the solder metal film is flattened. After that, the resist film is removed from above the protective film.

In the above steps, the step of forming a resist film on the surface of the protective film so as to surround the land can be performed by a step of forming the resist film by a printing method or by a photolithography step.

When a photolithography process is adopted, a resist is applied to the surface of the land and the protective film, the resist is exposed and developed, and the resist existing on the land is removed.

[0021]

FIG. 1 is a partial cross-sectional view of a component mounting board according to the present invention, FIG. 2 is an enlarged partial cross-sectional view taken along line 2-2 of FIG. 1, and FIG. FIG. 3 is an enlarged partial sectional view taken along line 3-3 of FIG. Component mounting board 1 shown
Are two lands 2, 4 and a solder metal film (9, 11,
13, 15, 17, 19), (21, 23, 25, 2)
7, 29, 31).

The lands 2 and 4 are on one surface of the substrate 1 (mounting surface).
Is formed within. The illustrated lands 2 and 4 are two, but the number is arbitrary. The number may be only one or two or more. In the illustrated embodiment, the land 2 is composed of the Cu foil 5, the Ni film 33 and the Au film 3.
5 are sequentially laminated, and the land 4 has C
It has a laminated film structure in which the u foil 7, the Ni film 37 and the Au film 39 are sequentially laminated. In addition, a different metal film or a laminated film structure may be adopted.

Each of the solder metal films (9 to 19)
The land area is smaller than the land area of land 2, and land 2
Are formed at an interval from each other.
Each of the solder metal films (21 to 31) has a plane area smaller than the plane area of the land 4, and is formed on the surface of the land 4 with an interval therebetween.

Each of the illustrated solder metal films (9 to 19) is arranged on the land 2 in three rows and two columns, and each of the solder metal films (21 to 31) is disposed on the land 4 in three rows. Although arranged in two rows, the number and arrangement are arbitrary. However, the mounted components and substrate 1
And other conditions must be satisfied such that a sufficient bonding strength is ensured between the components and the mounting component and the substrate 1 and no conduction failure and short circuit do not occur.

Solder metal films (9-19), (21-3)
In 1), as shown in FIGS. 2 and 3, almost the entire surface is a flat surface substantially parallel to one surface (mounting surface) of the substrate 1.

The illustrated solder metal films (9-19),
(21 to 31) has a circular shape, but the shape is arbitrary. The shape may be an elliptical shape, or may be a square shape as described later.

The distance between the solder metal films (9 to 19) and the distance between the solder metal films (21 to 31) are different from those of the solder metal films (9 to 1) arranged on the lands 2 and 4.
9), the number of (21 to 31), and the relative relationship between the plane area of the lands 2, 4 and the plane area of the solder metal film. For example, when a rectangular “0603 land” having a size of 200 μm × 300 μm is used as a land and a circular solder metal film having a diameter of 100 μm is used, six solder metal films can be arranged on the surface of the land. The spacing between the solder metal films to be formed is substantially zero. At this time, the thickness of the solder metal film is desirably about 35 to 80 μm.

The illustrated component mounting board 1 further has a protective film 3. The protection film 3 is formed on the mounting surface of the substrate 1 and fills a space generated around the lands 2 and 4. The protective film 3 can be formed of a resist that is frequently used in this type of component mounting board.

<Method of Mounting Chip Components> FIG. 4 is a partial sectional view showing a soldering process of a chip component using the component mounting board according to the present invention, and FIG. 5 is a portion in a process after the process shown in FIG. FIG. 6 is a sectional view, and FIG.
FIG. 4 is a partial cross-sectional view along a line. The chip component 45 is shown in FIG.
3 is soldered on the component mounting board 1 shown in FIG. 4 to 6 show only one chip component 45, but the number is arbitrary. The chip components 45 are various electronic components.

In soldering the chip component 45, a flux 41 is applied onto the solder metal film (9 to 19) and the land 2 provided on the component mounting board 1 by printing or the like, and the solder metal film ( Flux 43 is applied on 21 to 31) and land 4.

Next, on the fluxes 41 and 43, FIG.
As shown in (2), the terminal electrodes 49 and 51 of the chip component 45 are positioned. Then, a reflow furnace or the like is passed in the state of FIG. Thus, an electronic component device as shown in FIGS.

Here, as shown in FIGS. 1 to 3, the component mounting board 1 has solder metal films (9 to 19), (21 to 21).
Since 31) is used, the chip component 45 is mounted on the solid solder metal films (9 to 19) and (21 to 31). Therefore, before passing through the reflow furnace (see FIG. 4), the solder metal films (9 to 19), (21 to
31) receives the mounting pressure of the chip component 45,
The solder metal component does not seep out of the lands 2 and 4. Accordingly, the land 2-2 between the terminal electrodes of the components adjacent to each other at the reduced arrangement interval or the land 2-
There is no short circuit between the four or the like due to the exuded solder metal component, and no failure occurs due to a short circuit. Fluxes 41 and 43 are applied between the solder metal films (9 to 19) and (21 to 31) and the chip component 4 (see FIG. 4), but seepage of the fluxes 41 and 43 causes a short circuit. Absent. For this reason, according to the component mounting board 1 according to the present invention, the interval between mounted components can be reduced as compared with the related art. Further, it is possible to contribute to the miniaturization of the chip component 45 and the reduction of the terminal electrode interval.

FIG. 7 shows the relationship between the distance (μm) between adjacent components and the short-circuit rate (%) of adjacent components when the chip component 45 is soldered to the component mounting board 1 shown in FIGS. It is. In the figure, a curve L11 shows the adjacent component short-circuit rate (%) according to the related art in which the chip component 45 is soldered using a solder paste. Curve L
Reference numeral 12 indicates the adjacent component short-circuit rate (%) when the chip component 45 is soldered using the component mounting board 1 according to the present invention. The distance between adjacent parts is 300 μm, 2
Four levels of 00 μm, 150 μm, and 100 μm were set.

As shown in the figure, in the conventional soldering method using a solder paste, the distance between adjacent components is 200 μm.
If it is smaller than 150 μm or 100 μm, a short circuit between adjacent components occurs. This means that in the conventional soldering method using a solder paste, the distance between adjacent components is 20
It means that it cannot be smaller than 0 μm.

On the other hand, the component mounting board 1 according to the present invention
When the chip component 45 is soldered using
As shown in FIG. 12, even if the interval between adjacent components is set to 150 μm or even to 100 μm, no short circuit occurs between adjacent components. This data shows that, according to the present invention, at least the distance between adjacent components can be reduced to 100 μm.

In the component mounting board 1 according to the present invention, each of the solder metal films (9 to 19) and (21 to 31) has a plane area smaller than that of the lands 2 and 4,
On the surfaces of the lands 2, 4, they are formed at an interval from each other (see FIGS. 1 to 3). According to this, since an appropriate number of solder metal films may be arranged at appropriate positions on the lands 2 and 4, the peripheral edge of the opening of the metal mask and the peripheral edge of the lands 2 and 4 are aligned. Therefore, the solder metal films (9 to 19) and (21 to 31) can be easily formed. Moreover, according to the solder metal films (9 to 19) and (21 to 31), the solder metal films (9 to 19) and (21 to
Since 1) may be arranged, it is possible to easily cope with a change in the shape of the land.

In the embodiment, the solder metal films (9 to 19),
In (21-31), the chip component 45 is soldered substantially parallel to the mounting surface of the substrate 1 because almost the entire surface is a flat surface substantially parallel to the mounting surface of the substrate 1. Is done.

Furthermore, in the component mounting substrate 1 according to the present invention, the protective film 3 is formed on the mounting surface of the substrate 1 and fills the space generated around the lands 2 and 4, so that peeling, oxidation and the like occur. The side surfaces of the lands 2 and 4 which are easy to cover can be covered and protected by the protective film 3.

As the fluxes 41 and 43, a general flux containing rosin as a main component can be used. Rosin contains carboxylic acids such as abietic acid and levovimaric acid.
The oxide film on the metal surface to be soldered is removed.

Various additives such as a solvent, a plasticizer or a thixotropic agent may be added for the purpose of improving printability and obtaining temporary fixing strength. For example, JP-A-11-1219
As disclosed in Japanese Patent Publication No. 15, a type of flux whose viscosity is adjusted by adding alcohol may be used.

As another flux, an RMA (halogen-free) flux specified in the mill standard can be used. In the case of this flux, a washing step of the flux or the like after the reflow is omitted.

Further, as another example of the fluxes 41 and 43, an adhesive flux containing an adhesive resin and a curing agent can be used. Since this adhesive flux contains an adhesive resin and a curing agent, after soldering, the adhesive resin can function as an adhesive for fixing the component mounting board and the component. For this reason, it is possible to prevent the components from peeling or falling off due to impact or thermal stress, and to improve the reliability of the solder joint. This point is significantly different from the conventional rosin flux having no bonding function after soldering.

Moreover, by using the adhesive flux, a sufficient fixing strength can be ensured even if the solder has no fillet portion. For this reason, it is not necessary to provide a region for generating a fillet portion in the lands 2 and 4 formed on the component mounting board 1, and it is possible to improve the mounting density.

In the adhesive flux, as the adhesive resin, a resin having a high adhesive strength can be selected from a large number of resin materials in accordance with the temperature, and can be used as the adhesive resin. Therefore, the chip component 45 is formed on the first surface of the component mounting board of the double-sided mounting type by using the adhesive flux.
After soldering, a normal eutectic solder is used on the second surface of the component mounting board 1 and even when the reflow furnace is passed,
The chip component 45 mounted on the face does not cause a problem such as shifting, Manhattan phenomenon (component standing phenomenon) or dropout. Of course, an adhesive flux can be used in both the first and second soldering processes.

The adhesive flux can be in a liquid, paste or sheet form. The liquid or paste-like flux can be formed in layers on the component mounting substrate 1 by various coating methods or dipping methods. The application method includes a printing method, a dispenser application method, a spray application method, a brush application, and the like. The sheet-like flux is
It can be attached to the component mounting board 1.

In the adhesive flux, a preferred adhesive resin is a thermosetting resin. Specific examples of the thermosetting resin include at least one selected from an epoxy resin, a phenol resin, a polyimide resin, a silicone resin, a modified resin, and an acrylic resin.
The types and amounts of the exemplified resin materials can be selected according to the bonding temperature range, the target film hardness, and the like.

The curing agent may be any as long as it cures the adhesive resin. Preferably, it contains a carboxylic acid. The curing agent containing a carboxylic acid has not only a hardening action on the thermosetting resin but also a flux action for removing an oxide film on the surface of the metal to be soldered.

The adhesive flux may contain a solvent, a plasticizer or a thixotropic agent. The solvent is added to adjust the curing temperature and the curing speed of the adhesive resin and to adjust the viscosity according to the application form. Plasticizers and thixotropic agents are also added to adjust the viscosity depending on the form of application. The amounts of the solvent, plasticizer, thixotropic agent and the like are selected according to the purpose of use.

The adhesive flux may be in the form of a microcapsule in which an adhesive resin, an organic acid, a carboxylic acid, a solvent or a curing agent for providing a reducing action is encapsulated.

<Another Embodiment of Component Mounting Board> FIGS.
FIG. 6 is a plan view showing another embodiment of the component mounting board according to the present invention. In the drawings, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals.

The feature of the embodiment shown in FIG. 8 is that the shape of the solder metal film (53, 55, 57, 59) is square (square), and the solder metal films 53 and 55 are formed on the surface of the land 2. The solder metal films 57 and 5 are arranged at intervals.
9 is arranged at an interval on the surface of the land 4.

In FIG. 8, the solder metal film (53-5)
9) has a size of about 100 μm × 100 μm and an interval between adjacent solder metal films is about 50 μm.

FIG. 9 shows a group of solder metal films 61 and 6 having a circular shape.
3 shows a state in which they are arranged on lands 2 and 4 over 5 rows and 3 columns, respectively. For example, 300 μm
The land “1005 land” of × 500 μm is land 2,
4 and a case of a circular solder metal film having a diameter of 100 μmΦ corresponds to this.

FIG. 10 shows a group of square solder metal films 65,
Reference numeral 67 denotes a state where they are arranged on the lands 2 and 4 over three rows and two columns.

Each of the embodiments shown in FIGS. 8 to 10 has substantially the same operation and effect as those of the component mounting board 1 shown in FIGS.

<Method of Manufacturing Component Mounting Board> FIGS. 11 and 2
6 shows a manufacturing process of the component mounting board 1 according to the present invention. Here, the land 2 and the solder metal film (9-1 to 1)
9), and only the laminated film of the lands 4 and the solder metal films (21 to 31) is omitted.

First, a land 2 is formed on the mounting surface of the substrate 1, and a protective film 3 is formed on the mounting surface of the substrate 1 so as to fill a space around the land 2. This process is
This is a process mainly including a photolithography step, which is already known as a land forming means, and will be described with reference to FIGS.

Referring to FIG. 11, on the mounting surface of the substrate 1,
A Cu foil 50 is formed. The substrate 1 having such a Cu foil 50 is well known as a copper foil-laminated substrate.

Next, as shown in FIG. 12, a resist film R1 is applied to the entire surface of the Cu foil 50. The resist film R1 can be formed by a means such as a curtain coating method or a spin coating method. Further, the resist film R1 can be used by selecting from various commercially available resist materials.

Next, as shown in FIG.
1. A photomask M1 having a predetermined mask pattern is set on 1 and exposed. Then, development is performed by a conventionally known means to form a specified resist mask R11 as shown in FIG. After this, Cu
The portion of the foil 50 that is not covered by the resist mask R11 is removed by a method such as chemical etching. Thereby, as shown in FIG. 15, a Cu foil 5 having a land pattern to be obtained is formed at a predetermined position.

Next, as shown in FIG. 16, a resist film R2 is applied to the entire surface of the substrate 1 including the Cu foil 5, and thereafter, as shown in FIG. 17, a photomask M2 is set on the resist film R2. And expose. The photomask M2 is positioned (in the case of a positive resist) so that the cut pattern is positioned on the Cu foil 5.

Thereafter, by developing, as shown in FIG. 18, the resist on the exposed Cu foil 5 is removed. Portions of the resist film R2 that are not exposed remain. Thereby, a structure in which the space generated around the Cu foil 5 is filled with the resist film R2 is obtained. Thereafter, as shown in FIG.
The film 33, the Au film 35, and the like are formed by means such as plating. As a result, a structure in which the space generated around the land 2 is filled with the protective film 3 formed of the resist film R2 is obtained.

In the method of manufacturing a component mounting board according to the present invention, the processes shown in FIGS.

This process includes a step of forming a resist film on the surface of the protective film 3 so as to surround the land 2.
This step can be performed by two different processes. One is a photolithography process and the other is a printing method. First, a case where a photolithography process is employed will be described.

In this case, as shown in FIG. 20, a photosensitive resist film R3 is applied to the surfaces of the lands 2 and the protective film 3. The resist film R3 may be negative or positive. The embodiment shows a case where a negative type ultraviolet curable resist is used. The resist film R3 is applied to a thickness of, for example, about 50 μm by applying a curtain coating method, a spin coating method, or the like.

Next, as shown in FIG.
3 and a photomask M3 was placed on it, and using an exposure machine,
The resist film R3 is exposed. Exposure is limited to exposure in the ultraviolet region. The photomask M3 has a circular pattern group such that a corresponding portion is not exposed in an area above the land 2.

Next, development is performed. As a result, as shown in FIG. 22, the resist film R3 is removed in a portion corresponding to the area above the land 2 that has not been exposed, and the land 2 appears. The exposed portions of the resist film R3 remain as resist films (R31 to R34).

Next, as shown in FIG. 23, solder metal films (9, 11, 13, 15, 17, 19) are formed on the lands 2 at the resist removal marks on the lands 2. The solder metal films (9 to 19) are formed so as to obtain a final thickness of about 35 to 60 μm. The solder metal films (9 to 19) can be formed by a solder leveler method. The solder metal films (9 to 19) are made of Sn, Cu,
It can be selected from Ag, Sb, Pb, Zn, In and Bi. To obtain a Pb-free solder paste, the solder powder is composed of a solder powder other than Pb.

Next, as shown in FIG. 24, the surface of the solder metal film (9 to 19) is
The resist film (R31 to R34) is flattened so as to be at substantially the same plane position as the surface. Thereby, as shown in FIG. 25, the surface of the solder metal film (9 to 19) is flattened so as to be at substantially the same plane position as the surface of the resist film (R31 to R34).

Thereafter, the resist films (R31 to R34) remaining on the protective film 3 are removed. Resist film (R3
In removing 1 to R34), for example, a 5% NaOH solution can be used, although it depends on the resist material.

As a result, as shown in FIG. 26, the component mounting board 1 according to the present invention is obtained. Solder metal film (9 ~
The film thickness of 19) is set to about 35 to 60 μm. In the case of the present invention, the thickness of the resist film (R) in the planarization process (FIGS. 24 and 25)
31 to R34). In addition, the surface of the solder metal film (9 to 19) has extremely high flatness (smoothness) and rises in a shape in which the periphery is almost vertical.

When the printing method is adopted, as shown in FIG. 19, a Ni film 33 and an Au film 35 are formed on the Cu foil 5, and a space generated around the land 2 on the mounting surface of the substrate 1. Is buried with a protective film 3 made of a resist film R2, the processes of FIGS. 20 and 21 are omitted, and in the process shown in FIG. 22, a resist film (R3
1 to R34) are formed by means such as screen printing using a metal mask. Resist film (R31-R3
As 4), a thermosetting, solvent stripping, or NaOH stripping resist may be used. In the example, the resist film R31 was screen-printed using a NaOH strippable resist.

Thereafter, the processes shown in FIGS. 23 to 26 are executed. In the process of FIG. 26, the resist films (R31 to R34) can be stripped using a solvent and a NaOH solution.

<Dimensional Limit of Solder Metal Film> Next, FIG.
The dimensional limit values of the circular solder metal film in the component mounting board 1 shown in Nos. 1 to 3 will be verified based on actually measured data. Table 1 shows the printability of the solder metal film, the properties after smoothing,
Also, the properties after the resist is stripped are shown. The diameter of the solder metal film is 50 μmΦ, 100 μmΦ, 15
Five levels of 0 μmφ, 200 μmφ, and 250 μmφ were set. The thickness of the solder metal film is 100 μm, 80
It was set to six levels of μm, 60 μm, 35 μm, 22 μm, and 8 μm. × means impossible to form, Δ means poor shape, ○ means slightly good shape, and ◎ means good shape.

As shown in Table 1, when the diameter of the solder metal film is 50 μmΦ, the thickness is desirably about 35 to 60 μm, and when the diameter is 100 μmΦ, the thickness is 35 μm.
It is understood that the thickness is preferably about 80 μm, and when the diameter is 150 μmΦ, the film thickness is preferably about 35 μm to 60 μm. Thus, the solder could be filled even in the metal mask having the hole diameter of 50 μmΦ. Solder formed on the resist after printing and reflow was seen, but could be removed in the resist stripping step.

When the diameter exceeds 200 μmΦ, 8 to 1
Even if the film thickness was adjusted between 00 μm, no effective solder metal film was obtained. If the diameter is 200 μmΦ or more, the molten solder spreads in the smoothing step, and uniform smoothing becomes difficult.

[0077]

As described above, according to the present invention, the following effects can be obtained. (A) bleeding of the solder metal component can be avoided, and
It is possible to provide a component mounting board, a method for mounting chip components, and a method for manufacturing a component mounting board, which can reduce the space between mounted components as compared with the related art. (B) There is no need to align the periphery of the opening of the metal mask with the periphery of the land, and the component mounting substrate, the mounting method of the chip component, and the manufacturing of the component mounting substrate can easily form the solder metal film. A method can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of a component mounting board according to the present invention.

FIG. 2 is an enlarged partial sectional view taken along line 2-2 of FIG.

FIG. 3 is an enlarged partial sectional view taken along line 3-3 in FIG. 1;

FIG. 4 is a partial sectional view showing a soldering process of a chip component using the component mounting board according to the present invention.

FIG. 5 is a partial cross-sectional view in a process after the process shown in FIG. 4;

FIG. 6 is a partial sectional view taken along line 6-6 in FIG. 5;

FIG. 7 is a view showing a relationship between a distance (μm) between adjacent components and a short-circuit ratio (%) of adjacent components when a chip component is soldered to the component mounting board according to the present invention.

FIG. 8 is a plan view showing another embodiment of the component mounting board according to the present invention.

FIG. 9 is a plan view showing still another embodiment of the component mounting board according to the present invention.

FIG. 10 is a plan view showing still another embodiment of the component mounting board according to the present invention.

FIG. 11 is a view showing one of the manufacturing processes of the component mounting board according to the present invention.

FIG. 12 illustrates a process after the process illustrated in FIG. 11;

FIG. 13 illustrates a process after the process illustrated in FIG. 12;

FIG. 14 illustrates a process after the process illustrated in FIG. 13;

FIG. 15 illustrates a process after the process illustrated in FIG. 14;

FIG. 16 illustrates a process after the process illustrated in FIG. 15;

FIG. 17 illustrates a process after the process illustrated in FIG. 16;

FIG. 18 illustrates a process after the process illustrated in FIG. 17;

FIG. 19 illustrates a process after the process illustrated in FIG. 18;

FIG. 20 illustrates a process after the process illustrated in FIG. 19;

FIG. 21 illustrates a process after the process illustrated in FIG. 20;

FIG. 22 illustrates a process after the process illustrated in FIG. 21.

FIG. 23 illustrates a process after the process illustrated in FIG. 22.

FIG. 24 illustrates a process after the process illustrated in FIG. 23.

FIG. 25 illustrates a process after the process illustrated in FIG. 24.

FIG. 26 illustrates a process after the process illustrated in FIG. 25.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting board 2, 4 Land 3 Protective film 9-31 Solder metal film 45 Chip component 41, 43 Flux

Claims (14)

[Claims] 1. A component mounting board including at least one land and a plurality of solder metal films, wherein the lands are formed in a substrate surface, and each of the solder metal films has a plane area. Is smaller than the plane area of the land, and on the surface of the land,
Component mounting boards formed at an interval from each other. 2. The component mounting board according to claim 1, wherein substantially the entire surface of the solder metal film has a flat surface substantially parallel to the substrate surface. 3. The component mounting board according to claim 1, wherein the shape of the solder metal film includes at least one selected from a circular shape, an elliptical shape, and a square shape. substrate. 4. The component mounting board according to claim 1, further comprising a protective film, wherein the protective film is formed on the substrate surface, and a space generated around the land. Is a component mounting board. 5. The component mounting board according to claim 1, wherein the solder metal film is formed of Sn, Cu, Ag, Sb, Pb,
A component mounting substrate including at least one selected from Zn, In, and Bi. 6. A method for manufacturing a component mounting board, comprising: forming a land in at least one board surface;
Forming a protective film on the substrate surface to fill a space generated around the land; forming a resist film on the surface of the protective film so as to surround the land; A method for manufacturing a component mounting board, comprising: forming a solder metal film thereon; planarizing a surface of the solder metal film; and removing the resist film from above the protective film. 7. The method according to claim 6, wherein the step of forming the resist film on the surface of the protective film so as to surround the land includes a coating method, a spin coating method, or a curtain coating method. A method for manufacturing a component mounting board, comprising the step of forming the resist film by any one of the above. 8. The method according to claim 6, wherein the step of forming the resist film on the surface of the protective film so as to surround the land comprises: forming a resist on the land and the protective film. A method for manufacturing a component mounting board, comprising a step of applying the resist on a surface, exposing and developing the resist, and partially removing the resist existing on the lands. 9. The method according to claim 6, wherein the solder metal film is formed of Sn, Cu, Ag, Sb, Pb,
A method of manufacturing a component mounting board including at least one selected from Zn, In, and Bi. 10. A method for mounting a chip component on a component mounting board, wherein the component mounting board is manufactured by the method according to claim 6, and the chip component is mounted on the component mounting board. And a method for mounting a chip component, comprising a step of soldering the chip component. 11. The method for mounting a chip component according to claim 10, wherein a step of forming an adhesive flux layer containing an adhesive resin and a curing agent before soldering the chip component. The mounting method of chip parts including. 12. The method for mounting a chip component according to claim 11, wherein the adhesive resin of the adhesive flux contains a thermosetting resin. 13. The mounting method of a chip component according to claim 12, wherein the thermosetting resin is an epoxy resin, a phenol resin,
A method of mounting a chip component including at least one selected from a polyimide resin, a silicon resin, a modified resin, and an acrylic resin. 14. The mounting method of a chip component according to claim 11, wherein the curing agent includes a carboxylic acid.