JP2001237355A - Heat transmitting method, heat sink and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin light heat sink whose constitution is simple. SOLUTION: In a heat sink 20, ceramic fine grains are laminated on one face of a metallic sheet 22 and a heat receiving/radiating layer 26 is formed. An adhesive layer 28 is formed on the other face.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a heat transfer method, a heat sink, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In electronic devices such as computers,
High-density mounting of components has been progressing to meet the demand for miniaturization and high performance, and this has increased the heat generation density. If proper thermal measures are not taken, circuit problems such as noise and timing will occur. appear.

For this reason, conventionally, a heat sink is mounted on a single electronic component or a printed wiring board on which the electronic component is mounted.

This heat sink is usually made of an aluminum plate integrally formed with a large number of radiating fins, and dissipates heat into the air by natural or forced air cooling.

[0005] In addition, there is a heat sink structure in which a large number of fins are provided outside a cylinder head and a cylinder block of an air-cooled engine.

Further, in a portion of the air conditioner, refrigerator, radiator or the like that requires heat radiation, a large number of heat radiation fins are provided outside a pipe through which a heat medium flows to dissipate heat to the atmosphere.

[0007]

In any of the above-described heat sink structures or heat dissipation structures, a large number of metal fins must be provided, which increases the manufacturing cost, weight and volume. There is a problem that brings.

Further, in an air conditioner or the like, there is a problem that dust easily adheres to many fine metal fins, which deteriorates a heat exchange function.

Further, in the heat sink to be mounted on the electronic component or the printed wiring board or the like, it is required to provide a very small and large number of fins, and the limit has already been reached due to the manufacturing cost.

The present invention has been made in view of the above-mentioned conventional problems, and provides a heat transfer method, a heat sink, and a method of manufacturing the heat sink using a low-cost, simple structure, light-weight and small-volume heat-dissipating member. The purpose is to do.

[0011]

The invention of a heat transfer method is characterized in that heat is radiated from a heat source to a heat-receiving fluid in contact with the heat-receiving / radiating layer via a heat-receiving / radiating layer formed by laminating ceramic fine particles. The above object is achieved by a heat transfer method.

Another aspect of the heat transfer method is characterized in that heat is transferred from a heat source to a metal layer on which the heat receiving and radiating layer is laminated and radiated through a heat receiving and radiating layer formed by laminating fine particles of ceramics. The above object is achieved by a heat transfer method.

[0013] Yet another invention of a method of transferring heat comprises the steps of:
Through the heat source side heat radiation layer formed by laminating ceramic fine particles, heat is transferred to the metal layer on which the heat source side heat radiation layer is laminated,
Furthermore, via a heat-receiving-side heat-receiving / radiating layer formed by laminating ceramic fine particles on the opposite side of the heat-source-side heat-receiving / radiating layer of the metal layer,
The above object is attained by a heat transfer method characterized by radiating heat to a heat receiving fluid in contact with the heat receiving / radiating layer.

In the above heat transfer method, the thickness of the heat receiving / radiating layer may be increased as the temperature of the heat source side portion in contact with the heat receiving / radiating layer becomes higher.

In the heat transfer method, the thickness of the heat receiving and radiating layer may be set to 2.0 mm or more when the temperature of the heat source side contacting the heat receiving and radiating layer is 80 to 100 ° C.
2.5 mm or more at 125 ° C., 3.0 mm or more at 125 to 150 ° C., 3.5 mm at 150 to 170 ° C.
As described above, the temperature may be 6.5 mm or more at 170 to 200 ° C.

In the heat transfer method, the ceramic fine particles may have a spherical shape.

Further, in the heat transfer method, the diameter of the ceramic fine particles may be 50 to 400 μm.

Further, in the heat transfer method, the ceramics may have a hollow shape.

The present invention according to the heat sink achieves the above object by providing a heat sink, wherein a heat receiving / radiating layer formed by laminating ceramic fine particles is provided on one surface of a thin plate made of a thermal conductor. Is what you do.

In the heat sink, a second heat radiation layer formed by laminating fine particles of ceramics may be provided on the other surface of the thin plate.

Further, in the heat sink, an adhesive layer may be provided on the other surface of the thin plate.

Further, in the heat sink, the one surface of the thin plate may have an uneven surface, and the heat receiving / radiating layer may be laminated on the uneven surface.

Further, in the heat sink, the thin plate of the good heat conductor may be made of one of a metal and a resin.

Further, another object of the heat sink is to achieve the above object by a heat sink characterized in that a heat receiving / radiating layer formed by laminating fine particles of ceramics is provided on one surface of an adhesive layer. Is what you do.

In the heat sink, a part of the fine particles of the ceramics in the heat receiving / radiating layer may be disposed so as to bite into the pressure-sensitive adhesive layer.

Further, in the heat sink, a part of the fine particles of the ceramics penetrating the pressure-sensitive adhesive layer may be arranged so as to be exposed on the other surface of the pressure-sensitive adhesive layer.

In the heat sink, the heat-receiving / radiating layer is formed by laminating and solidifying fine particles of ceramics in advance, and the pressure-sensitive adhesive layer has a fine spherical shape similar to that constituting the heat-receiving / radiating layer. It may be a gel in which the ceramics is dissolved in a solvent.

In the heat sink, the surface of the heat radiation layer may be either a flat surface or an uneven surface.

Further, in the heat sink, the thickness of the heat receiving / radiating layer may be made larger as the temperature of the heat source side portion in contact with the heat receiving / radiating layer becomes higher.

In the heat sink, the thickness of the heat receiving and radiating layer may be set to 2.0 mm or more when the temperature of the heat source side contacting the heat receiving and radiating layer is 80 to 100 ° C.
2.5mm or more, 125-150 ° C at 0-125 ° C
3.0 mm or more at 150 ° C. and 3.5 at 150 to 170 ° C.
mm or more and 6.5 mm or more at 170 to 200 ° C.

In the heat sink, the ceramic fine particles may have a spherical shape.

In the heat sink, the diameter of the ceramic fine particles may be 50 to 400 μm.

Further, in the heat sink, the ceramics may have a hollow shape.

Further, in the heat sink, the heat-receiving / radiating layer includes a reinforcing frame surrounding at least an outer periphery of a side surface of the heat-receiving / radiating layer in a state where most of both surfaces are released, and the heat-receiving / radiating layer is provided inside the reinforcing frame. The fine particles of the ceramics may be filled.

In still another invention of a heat sink, the above object is achieved by a heat sink characterized in that a pipe for circulating a heat medium is molded by a heat receiving / radiating layer formed by laminating ceramic fine particles. Is what you do.

In the heat sink, the pipe may have at least one substantially U-shaped curved portion molded by the heat receiving / radiating layer.

Further, in the heat sink, the heat-receiving / radiating layer has a concave portion for receiving the pipe, and is formed by laminating and solidifying ceramic fine particles in advance. And a filling portion hardened between the pipes.

Further, in the heat sink, the filling portion may be a gel-like material obtained by dissolving the same ceramic fine particles as in the heat-receiving / radiating layer in a solvent between the plate-like portion and the pipe. May be cured.

The present invention according to a method for manufacturing a heat sink,
After the fine particles of the ceramics liquefied by the solvent are adhered to one surface of the heat transfer layer in a layered manner by one of recoating and molding, the solvent is diffused, dried and solidified to be received. The object is achieved by a heat sink manufacturing method characterized by forming a heat radiation layer.

In the method for manufacturing a heat sink, a reinforcement frame surrounding at least the outer periphery of the side surface of the heat-receiving and radiating layer is arranged in contact with one surface of the heat-transfer layer in a state where most of both surfaces are released. Then, the ceramic frame may be filled in the reinforcing frame to form the heat receiving / radiating layer.

Further, in the method for manufacturing a heat sink, an adhesive layer may be laminated on the other surface of the heat transfer layer in advance or after forming the heat receiving / radiating layer.

In the method for manufacturing a heat sink, the heat transfer layer may be made of one of a metal thin plate and a heat conductive resin sheet.

In the method for manufacturing a heat sink, the heat transfer layer may be an adhesive layer, and the heat radiation layer may be formed on the adhesive layer.

Further, another invention of a method for manufacturing a heat sink is to form fine particles of a ceramic in a liquid state by a solvent into a plate shape by any of recoating and molding, and then disperse the solvent. The above object is achieved by a method for manufacturing a heat sink, which comprises drying and solidifying to form a heat-receiving / receiving layer, and laminating an adhesive layer on one surface of the heat-receiving / receiving layer.

Further, in the method for manufacturing a heat sink, the pressure-sensitive adhesive layer may be a gel-like substance in which fine particles of the same ceramic as those constituting the heat-receiving / radiating layer are dissolved in a solvent.

Further, in the heat sink manufacturing method, the thickness of the heat receiving / radiating layer may be increased as the temperature of the heat source side portion in contact with the heat receiving / radiating layer becomes higher.

In the method for manufacturing a heat sink, the thickness of the heat radiating layer may be set to 2.0 mm or more when the temperature of the heat source side contacting the heat radiating layer is 80 to 100 ° C., and 100 to 125 mm. 2.5 mm or more at 125 ° C, 125 to
3.0 mm or more at 150 ° C., 3.5 mm or more at 150 to 170 ° C., 6.5 mm at 170 to 200 ° C.
The above may be adopted.

In the method for manufacturing a heat sink, the ceramic fine particles may have a spherical shape.

Further, in the method for manufacturing a heat sink, the diameter of the fine particles of the ceramics may be 50 to 400 μm.
It may be.

Further, in the method for manufacturing a heat sink, the ceramics may have a hollow shape.

[0051]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a sectional view showing a heat radiating structure for implementing the heat transfer method according to the present invention.

In this heat transfer method, as shown in FIG. 1, a heat receiving and radiating layer 14 made of ceramic in the form of microspheres is laminated on the outside of a metal layer 12 constituting a part of the heat source Is radiated from the heat receiving / radiating layer 14 through the metal layer 12 to a heat receiving fluid, for example, air, water, or the like.

Here, the diameter of the sphere in the micro sphere-shaped ceramics constituting the heat receiving / radiating layer 14 is 50 to 400.
μm. Further, the thickness of the heat-receiving / radiating layer 14 is, for example, such that the fine-particle ceramic is made of a ceramic cover (trademark) manufactured by Thelma Coat Co., Ltd.
In the case of using a μm type one, it is as shown in Table 1 below.

[0055]

[Table 1]

That is, the heat receiving / radiating layer 14 is made thicker as the temperature of the heat source 10 becomes higher.

When the heat-receiving / radiating layer 14 is formed thinner than the thickness shown in Table 1, the heat-insulating effect is generated, and the heat of the heat source 10 cannot be dissipated.

The heat source 10 includes an electronic component, a printed wiring board on which the electronic component is mounted, or a space in which the electronic component is mounted, a heat radiation side portion of a heat exchanger, a condenser in a refrigerating apparatus, a radiator of an engine, and an air conditioner. A heat dissipating part in a conditioner;

As described above, the ceramic fine particles are made of a ceramic cover (trademark) manufactured by Thelma Court.
The components are latex resin, residual monomer, silicate, perlite, zinc oxide, emulsion resin as a solid component, ethylene glycol, water, ammonia, a surfactant as a solvent, US Federal Procurement Supplies Certified: GSA # 8030-01-387-1
No. 027, a heat-insulating paint with a government-approved number.

According to the experiment of the first example of the embodiment, when the heat receiving and radiating layer 14 is formed in a thickness corresponding to the heat source temperature of 130 ° C. to 175 ° C., the temperature of the surface of the metal layer 12 is The temperature was lower in the range of 16 to 28 ° C. than in the case where the layer 14 was not provided.

The surface temperature of the heat radiation layer 14 was, of course, slightly lower than the temperature of the heat source 10.

On the other hand, the thickness of the heat receiving / radiating layer is shown in Table 1 above.
When the thickness is smaller than the minimum thickness of each temperature zone, for example, by about 0.2 to 1.5 mm, the original heat insulating effect can be obtained. Therefore, the temperature of the heat source 10 is 150 ° C.
Even to the extent possible, it was possible to make contact with the heat receiving and radiating layer 14 with bare hands.

The exact reason why the heat radiation effect is obtained when the thickness of the heat radiation layer 14 is a certain value or more is unknown, but can be guessed as follows.

Usually, when heat is dissipated from a solid to a gas, for example, air, heat is transferred from a heat source to a solid, for example, a metal, and the heat is directly conducted in the metal layer, and reaches the surface of the metal layer. Heat a thin layer of air that comes into contact at the surface.

As a result, convection occurs in the air. If this convection is to be promoted, the fan must impinge the air stream against the surface of the metal layer to quickly remove the heated air.

Although radiant heat is also generated from the metal surface, the radiant heat travels straight through the air without heating the air.
Heat is transferred only after reaching the target object such as a solid.

The heating of air on the surface of the metal layer is considered to be direct conduction from metal to air.

In general, in direct conduction, heat rays (infrared rays) from a heat source excite outer electrons of metal crystal particles, thereby generating infrared rays of the same wavelength and further exciting outer electrons of adjacent metal particles. It is done in the process.

It is considered that the reason why direct conduction from the surface of the metal layer to the air layer is not efficiently performed is that the size of metal crystal particles and the size of air particles of the metal layer are significantly different.

Therefore, it can be inferred from the above experimental results that the fine spherical ceramic particles constituting the heat receiving / radiating layer 14 are close to the size of the air particles, so that the heat receiving / radiating heat is as in a metal. It is considered that the air is efficiently heated by direct conduction from the layer 14.

When the heat-receiving / radiating layer 14 is thin, no heat-dissipating effect is observed, and conversely, the heat-insulating effect is observed. When the heat-receiving / radiating layer 14 is thin, it is possible to obtain a virtual particle diameter similar to air particles. It is considered that heat rays are reflected.

By the way, even with the same kind of metal material, it is known that the heat conductivity is improved when the size of crystal grains is made larger than usual by heat treatment, and conversely, the heat conductivity is reduced when the crystal grains are made smaller. Have been.

Next, a heat transfer method according to an example of a preferred embodiment in the case where the heat source is a fluid will be described with reference to FIG.

This heat transfer method is suitable when the heat source 10 is a gas such as heated air. A second heat radiation layer 16 having the same structure as the heat radiation layer 14 is provided inside the metal layer 12. ing.

The thickness of the heat radiation layer 16 is also set according to the temperature of the heat source 10 in the same manner as the thickness of the heat radiation layer 14 shown in Table 1.

In this way, the heat source 10 can be used to
As compared with the case where heat is directly transferred to the second heat transfer, the heat transfer is performed more quickly and efficiently.

If the rigidity of the heat-receiving / radiating layer 14 or the heat-receiving / radiating layer 14 and the heat-receiving / radiating layer 16 can be obtained without providing a metal layer, or if a large rigidity is not required, FIG. As in the third example of the embodiment shown, heat may be transferred from the heat source 10 to the outside only by the heat receiving / radiating layer 18.

This structure is used when the pressure difference between the heat source 10 side and the outside of the heat receiving / radiating layer 18 is small, and the liquid or the like does not wet the heat receiving / radiating layer 18 from the heat source 10 side.

The ceramic fine particles constituting the heat-receiving / radiating layer 14, the heat-receiving / radiating layer 16 or the heat-receiving / radiating layer 18 are made of ceramic cover (trademark) manufactured by Thelma Coat as described above.
Although it is referred to as a hollow sphere, the present invention is not limited to this, it may be a shape other than a sphere,
Further, it may be solid.

Next, a heat sink according to an embodiment of the present invention will be described.

FIG. 4 is an enlarged sectional view showing a heat sink 20 according to a first embodiment of the present invention. This heat sink 20 is made of a thin aluminum plate 2 which is a good heat conductor.
2 is an uneven surface 24, and the uneven surface 2
Heat receiving / radiating layer 26 formed by laminating ceramic fine particles on
And an adhesive layer 28 is provided on the other surface.

The fine particles of the ceramics forming the heat-receiving / radiating layer 26 have the same diameter and the same material as those of the heat-receiving / radiating layers 14, 16 and 18 shown in FIGS. .

The planar shape of the thin plate 22 is made to substantially match the shape of the mounting surface of the heat radiation side member 30 on which the heat sink 20 is mounted, and a release paper 32 is mounted on the surface of the adhesive layer 28. When attaching the heat sink 20 to the member 30, the release paper 32 is peeled off to expose the adhesive layer 28, and the adhesive layer 28 is pressed against the surface of the member 30.

Here, the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 28 usually has the same heat resistance and good heat conductivity as those used when attaching a heat sink to a CPU or a printed wiring board.

Usually, an aluminum heat sink is provided with a large number of radiating fins having a height of at least about 10 mm. That is, it is necessary to have a thickness of at least 10 mm as a heat dissipation layer and a thickness of at least about 3 mm as a substrate supporting the heat dissipation layer, and a total thickness of about 13 mm.

On the other hand, in the case of the heat sink 20 according to the first example of the above embodiment, for example, when it is used for a printed wiring board, the temperature of the heat generating portion of the printed wiring board is about 120 ° C. According to Table 1 described above, the thickness of the heat radiation layer 26 is 2.5 mm or more, and 3 mm is enough to allow for the thickness. Further, since the heat radiation layer 26 is flexible, the deformation amount is large. Otherwise, the thin plate 22 supporting the heat-receiving / radiating layer 26 does not break, and a thickness of 1 mm is sufficient.

Accordingly, the overall thickness of the heat sink 20 is about 4 mm, which is about 1/3 of the conventional thickness. In addition, the specific gravity of the ceramic fine particles constituting the heat-receiving / radiating layer 26 in the laminated state is about 0.56 in the case of the ceramic cover manufactured by Thelma Coat Co., Ltd., so that the weight is significantly reduced as compared with aluminum. Can also be achieved.

Regarding the most important heat radiation characteristics, the member 30
The heat radiation characteristics could be improved by about 20% as compared with the conventional aluminum heat sink having the best heat radiation characteristics, with the same area of the heat sink mounting surface on the side.

The thin plate 22 may have a slightly reduced heat radiation characteristic, but may have a flat shape without the uneven surface 24. Further, the material is not limited to metal, and a resin sheet having a high heat conductivity is used. Or a film.

Next, a heat sink 40 according to a second embodiment of the present invention shown in FIG. 5 will be described.

The heat sink 40 is obtained by directly forming the heat-receiving / radiating layer 26 on the adhesive layer 28 by omitting the thin metal plate 22 in the heat sink 20 shown in FIG.

In this heat sink 40, the thin plate 22 is omitted as compared with the heat sink 20, so that heat transfer from the heat radiation side member 30 to the heat radiation layer 26 via the adhesive layer 28 can be carried out quickly. As a result, the heat radiation characteristics can be further improved.

Here, the heat sink 41 shown in FIG.
When a part of the ceramic fine particles 42 constituting the heat-receiving / radiating layer 26 is made to bite into the pressure-sensitive adhesive layer 28 and is exposed on the opposite surface, heat from the member 30 is directly transmitted to the pressure-sensitive adhesive Since the heat is transmitted to the heat receiving / radiating layer 26 without passing through the layer 28, the heat radiation characteristics can be further improved.

In any case, the pressure-sensitive adhesive layer 28 is covered with a release paper 32, and is peeled off when it is attached to the member 30.

Next, a heat sink 50 according to a third embodiment of the present invention shown in FIG. 7 will be described.

In the heat sink 50, a second heat radiation layer 52 having the same structure as the heat radiation layer 26 on the opposite side is also provided on the heat source 10 side of the thin metal plate 22 similar to the heat sink 20 shown in FIG. It is provided.

In the case of this heat sink 50, the second
Is attached so that the heat receiving / radiating layer 52 is directly exposed to the heat source 10 side.

In this way, the heat from the heat source is quickly transmitted to the second heat receiving and radiating layer 52, and is efficiently radiated to the outside from the heat receiving and radiating layer 26 via the thin plate 22.

Here, the thickness of the second heat radiation layer 52 is preferably equal to or slightly greater than that of the outer heat radiation layer 26. This is because it is normal for the temperature to gradually decrease from the heat source toward the second heat-receiving / radiating layer 52, the thin plate 22, and the heat-receiving / radiating layer 26.

Next, a heat sink 60 according to a fourth embodiment of the present invention shown in FIG. 8 will be described.

The heat sink 60 is composed of only the heat receiving and radiating layer 62, and one surface of the heat receiving and radiating layer 62 is exposed to the heat source 10 and heat is radiated from the other surface. In addition, when the both surfaces of the heat receiving / radiating layer 62 are formed as the uneven surface 63, the heat radiation characteristics are improved, but both surfaces or one surface may be flat.

This heat sink 60 is used when the pressure difference between the heat source 10 side and the outside is small and large rigidity is not required. In addition, the heat source 10 side is used for drying air or the like.
This is used when the heat receiving / radiating layer 62 is not wetted or eroded.

Next, a heat sink 70 according to a fifth embodiment of the present invention shown in FIG. 9 will be described.

The heat sink 70 is obtained by molding a pipe 72 for circulating a heat medium with a heat receiving / radiating layer 74 similar to the above.

In the case of a radiator tube (pipe) of a refrigerator, for example, the pipe 72 is configured to be curved in a substantially U-shape a plurality of times, and the heat-receiving / radiating layer 74 includes the curved portion 73 of the pipe 72. Molded.

In this way, the pipe 72
Are integrally fixed without providing complicated heat radiation fins or the like, and in a state where rigidity is given by the heat radiation layer 74.

In this case, as shown in FIG. 10, the heat receiving and radiating layer 74 is divided into a plate-like portion 74A having a concave portion 76 for receiving the pipe 72, and a plate-like portion 74A.
And a filling section 74B descending between the pipe 72.

This is for shortening the time required for molding the pipe 72 with the fine particles of ceramics. The plate-like portion 74A made of the fine particles of ceramics in which the concave portion 76 in which the pipe 72 is fitted is formed in advance. The pipe 72 is supported by being fitted into the concave portion 76, and a liquid filler material serving as an adhesive is injected into the concave portion 76 and solidified to form the filler 74B. Good.

At this time, as the material of the filling portion 74B, a gel-like material in which fine particles of ceramics, which is the same material as that forming the plate-like portion 74A, is dissolved by a solvent, is used.
This may be filled in the gap between the plate-shaped portion 7A and the pipe 72 and solidified to form the filled portion 74B.

In this case, since the filling portion 74B made of the same material as the plate-shaped portion 74A exists between the pipe 72 and the plate-shaped portion 74A, the heat radiation characteristics do not deteriorate.

In each of the embodiments shown in FIGS. 4 to 10, the heat-receiving / radiating layer constituting the heat sink is composed of only ceramic fine particles, but the present invention is not limited to this. For example, in a state where most of both surfaces are released, as in a heat radiation layer 78 illustrated in FIG.
A reinforcing frame 78B surrounding the outer periphery of the side surface of the fine particle layer 78A may be provided, and the reinforcing frame 78B may be filled with the ceramic fine particles to form the heat receiving / radiating layer 78.

In this way, the heat receiving and radiating layer is less likely to be damaged by an external impact or the like.

Next, a method for manufacturing each of the above-mentioned heat-receiving / radiating layers or heat sinks will be described.

In the case of the heat sink 20 shown in FIG. 4, the fine particles of the ceramic liquefied by a solvent are applied to the thin plate 22 in a layered manner by coating or molding, and then the solvent is diffused to dry and solidify. Thus, the heat radiation layer 26 is formed. Next, the pressure-sensitive adhesive layer 28, one side of which is covered with a release paper 32, is bonded to the thin plate 22 on the side opposite to the heat receiving / radiating layer 26, thereby completing the heat sink 20. It should be noted that the heat radiation layer 2
Before the 6 is solidified, the uneven surface 24 may be formed by, for example, a pressing die.

In the case of the heat sink 40 shown in FIG.
Fine particles of the ceramics constituting the heat-receiving / radiating layer 26 are laminated and solidified on the adhesive layer 28 on the release paper 32 in the same manner as described above.

In the case of the heat sink 41 shown in FIG. 6, the fine particles 42 of the ceramics are pushed in so strongly that a part thereof penetrates the adhesive layer 28 and projects to the release paper 32 side. Further, an integral heat-receiving / radiating layer 26 is formed thereon by coating or molding with ceramic fine particles.

In the case of the heat sink 50 shown in FIG. 7, the thin plate 22 is previously provided with the heat radiation layer 26 or the second heat radiation layer 5.
2 is formed, and the remaining heat-receiving / radiating layer is formed on the opposite side.

The heating-side member 30 is a plate-like member.
If the ceramic fine particles can be laminated on the inside, the second heat receiving / radiating layer 52 is laminated on the inside of the member 30 in advance.

In the case of the heat sinks 20 and 40 shown in FIGS. 4 and 5, the fine particles of ceramics are laminated and solidified in advance to form the heat receiving and radiating layer 62, and after the solidification, the adhesive layer 28 is formed on one surface. Alternatively, the same fine particles of ceramics as those constituting the heat-receiving / radiating layer 62 may be applied to the heat-receiving / radiating layer 62 or the member 30 as a gel in which the fine particles are dissolved in a solvent.

Further, for example, in a state where the gel-like fine particles are applied to the solidified heat-receiving / radiating layer 62, the outer surface of the gel-like material is covered with, for example, a release paper 32 to prevent the diffusion of the solvent. For example, just before mounting, the release paper 32 is peeled off to expose the gel-like body, and the gel-like body is pressed against the member 30 so that the heat sinks 20 and 40 are attached to the member 30.
Can be attached and formed.

When the heat sink 70 is formed on the pipe 72 for circulating the heat medium as shown in FIG. 9, a mold (not shown) is provided so as to include the pipe 72 therein.
Here, fine particles of ceramics dissolved in a solvent are injected and solidified.

When molding using a mold is impossible, or when it is desired to construct a heat sink in a short time,
As shown in FIG. 10, the concave portion 7 for receiving the pipe 72 is provided.
6 is molded in advance with ceramic fine particles, this is fitted into a pipe 72, and the gap between the pipe 72 and the plate-shaped portion 74A is filled with ceramic fine particles dissolved in a solvent. The heat sink 70 is solidified to form a filling portion 74B, and the heat sink 70 is integrally attached to the pipe 72.

[0123]

Since the present invention is constructed as described above, it has an excellent effect that it is possible to efficiently perform heat transfer with a simple structure, light weight, small volume and a heat sink. Have.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a heat transfer method according to the present invention.

FIG. 2 is a sectional view showing the second example.

FIG. 3 is a sectional view showing the third example.

FIG. 4 shows a first embodiment of the heat sink according to the present invention.
Sectional view showing an example

FIG. 5 is a sectional view showing a heat sink according to a second example of the embodiment.

FIG. 6 is a sectional view showing a modification of the second example of the embodiment.

FIG. 7 is a sectional view showing a third example of the embodiment.

FIG. 8 is a sectional view showing a heat sink according to a fourth example of the embodiment.

FIG. 9 is a perspective view showing a heat sink according to a fifth example of the embodiment.

FIG. 10 is an exemplary sectional view showing a modification of the heat sink according to the fifth embodiment of the present invention;

FIG. 11 is a cross-sectional view showing a modification of the heat receiving / radiating layer in the heat sink.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Heat source 12 ... Metal layer 14, 16, 18, 26, 62, 74, 78 ... Heat-dissipating / receiving layer 20, 40, 41, 50, 60, 70 ... Heat sink 22 ... Thin plate 24 ... Uneven surface 28 ... Adhesive layer DESCRIPTION OF SYMBOLS 30 ... Member 32 ... Release paper 42 ... Fine particles 52 ... Second heat radiation layer 72 ... Pipe 73 ... Curved portion 74A ... Plate portion 74B ... Filling portion 76 ... Concave portion 78B ... Reinforcement frame

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[Procedure amendment]

[Submission date] February 28, 2000 (200.2.2
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FIG. 11

Claims (40)

[Claims] 1. A heat transfer method comprising: radiating heat from a heat source to a heat-receiving fluid in contact with a heat-receiving / radiating layer through a heat-receiving / radiating layer formed by laminating fine particles of ceramics. 2. A heat transfer method, wherein heat is transferred from a heat source to a metal layer on which the heat receiving and radiating layer is laminated by radiating heat through a heat receiving and radiating layer formed by laminating ceramic fine particles. 3. Heat is transferred from a heat source to a metal layer on which the heat-source-side heat-receiving / radiating layer is laminated via a heat-source-side heat-receiving / radiating layer formed by laminating ceramic fine particles. A heat transfer method characterized in that heat is radiated to a heat receiving fluid in contact with the heat receiving / radiating layer via a heat receiving / radiating layer formed by laminating ceramic fine particles on the opposite side of the heat receiving / radiating layer. 4. The heat transfer method according to claim 1, wherein the thickness of the heat receiving / radiating layer is increased as the temperature of the heat source side contacting the heat receiving / radiating layer is higher. 5. The apparatus according to claim 4, wherein the thickness of said heat receiving and radiating layer is set to 8
2.0 mm or more at 0 to 100 ° C, 100 to 125 ° C
2.5 mm or more at the time of 3.0 and 3.0 at 125 to 150 ° C.
mm or more, 3.5 mm or more at 150 to 170 ° C, 1
A heat transfer method characterized in that the temperature is 6.5 mm or more at 70 to 200 ° C. 6. The heat transfer method according to claim 1, wherein the fine particles of the ceramics are in the form of microspheres. 7. A heat transfer method according to claim 1, wherein said fine particles have a diameter of 50 to 400 μm. 8. The heat transfer method according to claim 1, wherein the fine particles of the ceramics have a hollow shape. 9. A heat sink characterized in that a heat-receiving / radiating layer formed by laminating ceramic fine particles is provided on one surface of a thin plate made of a good heat conductor. 10. A heat sink according to claim 9, wherein a second heat receiving / radiating layer formed by laminating fine particles of ceramics is provided on the other surface of said thin plate. 11. A heat sink according to claim 9, wherein an adhesive layer is provided on the other surface of said thin plate. 12. The method according to claim 9, wherein
A heat sink, wherein the one surface of the thin plate has an uneven surface, and the heat receiving / radiating layer is laminated on the uneven surface. 13. The method according to claim 9, wherein
A heat sink, wherein the thin plate of the thermal conductor is made of one of a metal and a resin. 14. A heat sink, wherein a heat-receiving / radiating layer formed by laminating ceramic fine particles is provided on one surface of an adhesive layer. 15. The heat sink according to claim 14, wherein a part of the fine particles of the ceramics in the heat-receiving / radiating layer is disposed so as to bite into the pressure-sensitive adhesive layer. 16. The heat sink according to claim 15, wherein a part of the fine particles of the ceramics penetrating into the pressure-sensitive adhesive layer is disposed so as to be exposed on the other surface of the pressure-sensitive adhesive layer. . 17. The heat radiation layer according to claim 14, wherein:
A heat sink, wherein ceramic fine particles are preliminarily laminated and solidified, and the pressure-sensitive adhesive layer is a gel-like body in which the same ceramic fine particles as those constituting the heat receiving / radiating layer are dissolved in a solvent. . 18. A heat sink characterized in that a pipe for circulating a heat medium is molded by a heat-receiving / radiating layer formed by laminating ceramic fine particles. 19. A heat sink according to claim 18, wherein said pipe has at least one substantially U-shaped curved portion which is molded by said heat receiving / radiating layer. 20. The plate-like portion according to claim 18, wherein said heat-receiving / radiating layer has a shape having a concave portion for receiving said pipe, and is formed by laminating and solidifying ceramic fine particles in advance. And a filling portion hardened between the pipe and the pipe. 21. A method according to claim 20, wherein said filling portion comprises a gel-like material obtained by dissolving the same fine particles of ceramics as in said heat-receiving / radiating layer in a solvent between said plate-like portion and said pipe. A heat sink characterized by being cured. 22. The method according to claim 9, wherein
A heat sink, wherein the surface of the heat receiving / radiating layer is either a flat surface or an uneven surface. 23. The method according to claim 9, wherein
A heat sink, wherein the thickness of the heat receiving and radiating layer is increased as the temperature of the heat source side portion in contact with the heat radiating layer becomes higher. 24. The method according to claim 23, wherein the thickness of the heat radiation layer is determined by the temperature of the heat source side portion with which the heat radiation layer contacts.
2.0 mm or more at 80 to 100 ° C, 100 to 125
2.5 mm or more at 125 ° C, and
0 mm or more, 3.5 mm or more at 150 to 170 ° C.
A heat sink characterized by being 6.5 mm or more at 170 to 200 ° C. 25. The method according to claim 9, wherein
A heat sink, wherein the ceramic fine particles have a spherical shape. 26. The method according to claim 9, wherein
A heat sink, wherein the fine particles have a diameter of 50 to 400 μm. 27. The method according to claim 9, wherein
The ceramics is hollow;
Tosink. 28. The method according to claim 9, wherein
The heat-receiving / radiating layer includes a reinforcing frame surrounding at least an outer periphery of a side surface of the heat-receiving / radiating layer in a state where most of both surfaces are released,
A heat sink, wherein the reinforcing frame is filled with the ceramic fine particles. 29. A method in which fine particles of a ceramic liquefied by a solvent are adhered to one surface of a heat transfer layer in a layered manner by one of recoating and molding, and then the solvent is diverged. A method for manufacturing a heat sink, comprising drying and solidifying to form a heat-receiving / receiving layer. 30. The heat transfer layer according to claim 29, wherein a reinforcement frame surrounding at least the outer periphery of the side surface of the heat-receiving / radiating layer heat layer is arranged in contact with one surface of the heat transfer layer in a state where most of both surfaces are released. Forming a heat sink layer by filling the reinforcing frame with the ceramic fine particles. 31. The method for manufacturing a heat sink according to claim 29, wherein an adhesive layer is laminated on the other surface of the heat transfer layer in advance or after forming the heat receiving / receiving layer. . 32. A method for manufacturing a heat sink according to claim 29, wherein said heat transfer layer comprises one of a thin metal plate and a heat conductive resin sheet. 33. The method for manufacturing a heat sink according to claim 29, wherein the heat transfer layer is an adhesive layer, and the heat receiving / radiating layer is formed on the adhesive layer. 34. Fine particles of ceramics liquefied by a solvent are formed into a plate by any of recoating and molding, and then the solvent is diverged and dried and solidified to form a heat-receiving / radiating layer. A method for manufacturing a heat sink, comprising laminating an adhesive layer on one surface of a heat receiving / radiating layer. 35. The pressure-sensitive adhesive layer according to any one of claims 29 to 34, wherein the pressure-sensitive adhesive layer is a gel-like body obtained by dissolving the same ceramic fine particles as in the heat-receiving / radiating layer in a solvent. Heat sink manufacturing method. 36. The heat radiation layer according to claim 29, wherein the thickness of the heat radiation layer is increased as the temperature of the heat source side portion in contact with the heat radiation layer increases. Manufacturing method of heat sink. 37. The method according to claim 36, wherein the thickness of the heat radiation layer is set to 80 ° C.
2.0 mm or more at 100 to 125 ° C, 2.5 mm or more at 100 to 125 ° C, 3.0 m at 125 to 150 ° C
m or more, 3.5 mm or more at 17 to 150 ° C., 17
A method for producing a heat sink, wherein the thickness is 6.5 mm or more at 0 to 200 ° C. 38. The method for manufacturing a heat sink according to claim 29, wherein the fine particles of the ceramics have a spherical shape. 39. The method for manufacturing a heat sink according to claim 29, wherein the diameter of the fine particles is 50 to 400 μm. 40. The method for manufacturing a heat sink according to claim 29, wherein said ceramics has a hollow shape.