JP2001221827A - Aging determining apparatus for semiconductor socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an IC socket aging determining apparatus for semiconductor inspecting instruments which enables early discovery of the aging of an IC socket by a method, without means which disturb semiconductor inspection. SOLUTION: A camera 51 is provided to take an image of a contact part 11 of an IC socket 1 and a personal computer 52 to process the image of the contact part 11 of the IC socket 1 as image picked up by the camera 51 through adjustment the focus of the camera 51. Thus, aging of the contact 11 is determined through an image processing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor socket deterioration judging device, and more particularly to a semiconductor socket deterioration judging device used for a semiconductor inspection device.

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for judging deterioration of a semiconductor socket (hereinafter referred to as "IC socket") used in a semiconductor inspection (measurement) process. FIG. 1 shows an example of using an IC socket. 2. Description of the Related Art In a semiconductor inspection (measurement) system, an IC socket is used for connecting an IC to an inspection (measurement) device for inspecting electrical characteristics of the IC. Normally, an IC socket is fixed to an inspection (measurement) device, and contacts with the ICs are repeated in order to inspect the electrical characteristics of a plurality of ICs. Then, as the IC socket is repeatedly contacted with the IC, the contact portion is worn out, leading to a deteriorated state.

In such a semiconductor inspection (measurement), conventionally,
A method of quantitatively determining the deterioration state of the IC socket is not used, and a method of replacing the IC socket when a certain number of IC inspections have been completed has been used. However, in this method, there is a problem that the IC measurement may be continued in an unstable state when the life of the IC socket approaches a certain number of times at which the deterioration occurs. In addition, there is also a problem that a contact failure often occurs near a certain number of lifespans, so that an inspection product cannot be measured normally, and a non-defective product is classified and determined as defective.

[0004]

As described above, the conventional semiconductor inspection (measurement) apparatus does not particularly include a device for judging the deterioration of the IC socket. A method of replacing the IC socket at an appropriate time has been adopted. Therefore, there is a problem that the measurement of the IC is performed in an unstable connection state, and there is a possibility that a non-defective IC is determined to be defective.
The present invention solves this problem and makes it possible to detect the deterioration state of an IC socket at an early stage with a relatively simple method and without hindering semiconductor inspection. The task is to realize the device.

[0005]

In order to achieve the above object, the present invention is applied to a semiconductor inspection apparatus for measuring an electrical characteristic of a semiconductor device to be inspected, and the semiconductor device to be inspected is mounted on the semiconductor device. In an IC socket deterioration judging device for judging deterioration of an IC socket realizing an electrical connection with a semiconductor inspection device, an image pickup means for picking up an image of a contact portion of the IC socket, and an image pickup focus of the image pickup means are adjusted. The image processing apparatus further includes: a focus adjusting unit; and an image processing unit configured to process an image of the contact portion of the IC socket captured by the imaging unit. This allows
The contact part of the IC socket is determined by the image,
The deterioration of the IC socket can be determined relatively early and relatively easily.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an IC socket deterioration judging device according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows the configuration of an IC inspection apparatus using the IC socket deterioration determination apparatus of the present invention. The IC socket deterioration determination device of the present invention determines the deterioration state of the contact portion 11 of the IC socket 1 that connects the inspection (measurement) device 2 and the IC 3 as shown in FIG.
In the case of G, the measurement is automatically suspended temporarily.

In the embodiment of the present invention, the contact portion 1
As a method for determining the deterioration state of No. 1 by image processing, FIG.
Camera 51, personal computer 52, display 53
An image processing system 5 having the following configuration is used. As shown in FIG. 3, the camera 51 is located at a position where it does not hinder measurement during IC measurement. When the inspection (measurement) device 2 measures a predetermined number of ICs 3, deterioration of the contact portion 11 of the IC socket 1 is determined. Contact part 1 to determine
1 is a movable type that moves to the upper side.

The personal computer 52 is installed outside the inspection (measurement) device 2 and is connected to the camera 51 via an image signal transmission cable 54. The image signal is processed. The personal computer 52 is also connected to the measurement system of the inspection (measurement) device 2. If the determination result of the deterioration state of the contact portion 11 is NG, the inspection (measurement) device 2 is connected.
Is temporarily stopped, and the display 53 indicates that the socket needs to be replaced. Display 5
3 is installed near the personal computer 52, taken from the camera 51, and processed by the personal computer 52.
1, a determination result of the deterioration state of the contact portion 11, a message indicating that socket replacement is necessary, and the like.

To capture an image of the contact section 11,
First, the camera 51 is connected to the contact portion 11 of the IC socket 1.
The camera 51 is focused on the surface of the contact portion 11 as shown in FIG. At this time,
The processing is performed on the personal computer 52 side so that only the image of the focused portion of the camera 51 is captured.

Next, in the first embodiment of the present invention, the focal length of the camera 51 is changed as shown in FIG. 5, and at this time, the image of the focused portion of the camera 51 is captured. Hereinafter, in the same manner, the operation of capturing an image while changing the focal length is performed a plurality of times, and a three-dimensional image of the contact portion 11 is created by superimposing the images as shown in FIG. Thereby, the state of deterioration of the contact portion 11 can be confirmed. As a criterion for judging the deterioration state of the contact portion 11, a condition in which the electrical characteristics of the IC 3 cannot be measured stably, for example, a condition where the gold plating on the surface of the contact portion 11 has been peeled off and the base has been exposed is determined. Used as Therefore, when capturing an image, the resolution of the focal length of the camera 51 must be finer than the thickness of the gold plating on the surface of the contact portion.
Must be automatically adjusted by the personal computer 52 and recognized. In addition, the in-focus range (the depth of focus in the depth direction) is also required to be equal to or less than the resolution of the focal length.

The images captured at each focal length as shown in FIG. 6 are programmed so as to be processed as three-dimensional images by the personal computer 52. In FIG. 6, what is indicated by a broken line is the contour of the contact section 11, and a three-dimensional image of the contact section 11 is created by superimposing images captured at each focal length inside this contour. In addition, for example, the display color of the image is blue on the surface of the contact portion 11,
By changing the image at the next focal length from green to red after the base, it is possible to determine the current state of deterioration of the contact portion 11. If the image is solid blue, it indicates that the contact portion 11 has not deteriorated, and the determination is OK. If the image contains a color other than blue except for red, the contact portion 11
Indicates that the level is slightly degraded, but temporarily indicates that the level can be measured stably, and the determination is OK. on the other hand,
If there are many red parts in the image, it means that the base is exposed, so the determination is NG.

This series of determination operations is automatically performed by the program of the personal computer 52. If the determination is NG, the measurement system is temporarily stopped, and a message indicating that the socket needs to be replaced is displayed on the display 53. If the determination is OK, the camera 51 is moved to a position that does not hinder the IC measurement, and the IC measurement is restarted.

In the above example, the case where the deterioration state of the contact portion 11 is determined based on the difference in the focal length has been described. However, the determination of the IC socket deterioration by the image processing of the present invention is limited to the above example. Not something. 7 and 8
Next, second and third embodiments of the present invention will be described. The detailed description of the same parts as those in the first embodiment is omitted. In the second embodiment shown in FIG. 7, the deterioration state of the contact portion 11 is determined based on the difference in luminance. That is, if the personal computer 52 is programmed in advance so that the determination becomes NG when the contact portion 11 has a portion having a certain brightness or more, the deterioration state of the contact portion 11 can be determined based on the brightness. . In the third embodiment shown in FIG. 8, the deterioration state of the contact portion 11 is determined based on a difference in color. If a certain color portion is found in the contact portion 11, the determination is NG. If the personal computer is programmed in advance so as to be as follows, the state of deterioration of the contact portion can be determined by its color.

According to the present invention, the deterioration state of the contact portion 11 is determined by image processing. Stable measurement of the semiconductor inspection device can be secured. 2. Eliminates the classification and sorting of non-defective products due to defective contacts. 3. The deterioration state of the contact portion of the IC socket and its transition can be easily grasped. This has the effect. In addition, by performing determination in image processing, There is also an effect that not only the deterioration state of the contact portion but also the contact position can be confirmed at the same time.

[0015]

As described above, the first aspect of the present invention is:
IC socket deterioration that is used in a semiconductor inspection device that measures the electrical characteristics of a semiconductor device to be inspected and that determines the deterioration of an IC socket that mounts the semiconductor device to be inspected and realizes electrical connection with the semiconductor inspection device. In the determination device,
An image pickup means for picking up an image of the contact portion of the IC socket, a focus adjusting means for adjusting the image pickup focus of the image pickup means, and an image processing means for processing the image of the contact portion of the IC socket picked up by the image pickup means. It is characterized by.
As a result, the deterioration state of the contact portion can be determined by image processing, the deterioration state of the contact portion can be determined by a non-contact method that does not hinder semiconductor inspection, and the contact position can be confirmed at the same time. Can be.

According to a second aspect of the present invention, the image processing means detects the change in the depth of focus at the time of imaging the contact portion of the IC socket.
The deterioration of the socket is determined. This makes it possible to relatively easily determine the wear state of the contact portion three-dimensionally and accurately determine the deterioration of the contact portion.

The invention according to claim 3 is characterized in that the image processing means determines the deterioration of the IC socket from a change in the brightness of the contact portion of the IC socket. This makes it possible to relatively easily determine the wear state of the contact portion and accurately determine the deterioration of the contact portion.

The invention according to claim 4 is characterized in that the image processing means judges the deterioration of the IC socket from a change in the color of the contact portion of the IC socket. This makes it possible to relatively easily determine the wear state of the contact portion and accurately determine the deterioration of the contact portion.

According to a fifth aspect of the present invention, the I
An image display means for displaying an image of the contact portion of the C socket is provided. Thereby, the wear state and the deterioration state of the contact portion can be reproduced on the image, and the user can easily determine.

The invention according to claim 6 is characterized in that the imaging means is retracted to a predetermined position when measuring the characteristics of the semiconductor device to be inspected. Thus, the deterioration state of the contact portion can be easily determined by a method that does not hinder the semiconductor inspection.

The invention according to claim 7 is characterized in that when the image processing means judges the deterioration of the IC socket, the inspection of the semiconductor device performed by the semiconductor inspection device is stopped. As a result, stable measurement can be performed by the semiconductor inspection device, and defective classification and selection due to contact failure can be prevented.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of use of an IC socket in a semiconductor inspection process.

FIG. 2 is a configuration diagram of an image processing system according to an embodiment of the present invention.

FIG. 3 is a layout diagram of the image processing system of FIG. 2 for semiconductor inspection.

FIG. 4 is an explanatory diagram showing a state of image capture by the image processing system according to the embodiment of the present invention;

FIG. 5 is an explanatory diagram showing a state of image capture by the image processing system according to the embodiment of the present invention;

FIG. 6 is a diagram showing a composite stereoscopic display image of an image captured at each focal length.

FIG. 7 is a diagram showing a display image in the case of determination based on luminance according to another embodiment of the present invention.

FIG. 8 is a diagram showing a display image in the case of determination based on color according to still another embodiment of the present invention.

[Explanation of symbols]

1. IC socket, 2. Inspection (measurement) device, 3. IC,
11 contact section, 5 image processing system, 51 camera, 52 personal computer, 53 display, 54 image signal transmission cable.

Claims (7)

[Claims] 1. A semiconductor socket which is used in a semiconductor inspection device for measuring an electrical characteristic of a semiconductor device to be inspected and which is mounted on the semiconductor device to be inspected to realize an electrical connection with the semiconductor inspection device. In a semiconductor socket deterioration determination device that determines deterioration, an imaging unit that captures an image of a contact portion of the semiconductor socket, a focus adjustment unit that adjusts an imaging focus of the imaging unit, and a semiconductor socket that is captured by the imaging unit. An image processing means for processing an image of a contact portion. 2. The apparatus according to claim 1, wherein said image processing means determines the deterioration of the semiconductor socket from a change in the depth of focus at the time of imaging the contact portion of the semiconductor socket. 3. The apparatus according to claim 1, wherein the image processing means determines the deterioration of the semiconductor socket from a change in luminance of a contact portion of the semiconductor socket. 4. The apparatus according to claim 1, wherein said image processing means determines the deterioration of said semiconductor socket from a change in color of a contact portion of said semiconductor socket. 5. The semiconductor socket deterioration judging device according to claim 1, further comprising image display means for displaying an image of the contact portion of the semiconductor socket picked up by the image pickup means. 6. The semiconductor socket deterioration judging device according to claim 1, wherein said image pickup means retreats to a predetermined position when measuring characteristics of said semiconductor device to be inspected. 7. The semiconductor socket deterioration judging device according to claim 1, wherein when the image processing means judges the deterioration of the semiconductor socket, the semiconductor inspection device stops the inspection of the semiconductor device. .