JP2001219366A - Polishing supporting method and device and polishing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To support the polishing to stably flatten a work. SOLUTION: A polishing condition of the work 7 is input by an interactive method with an operator from an interactive interface 29, a polishing amount of the work 7 is calculated by a polishing amount calculating means 30 under the consideration of whether an arbitrary working point on the work 7 is within a polishing region or not on the basis of the input condition, a result of the judgment whether the shape of the work 7 achieves a predetermined shape specification value or not on the basis of the polishing amount, is informed by a shape specification value judging means 31, and the polishing condition of the work 7 is repeatedly input until the shape of the work 7 achieves the shape specification value.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing support method and apparatus for polishing a workpiece such as a ceramic component while rotating and pressing the workpiece against a lap plate.

[0002]

2. Description of the Related Art FIG. 6 is a structural view of a polishing apparatus, and FIG. 7 is a view of the polishing apparatus as viewed from above. The lap surface plate 2 is rotatably supported on the fixed member 1 via a shaft 3, and an induction motor 4 for rotating the lap surface plate 2 is provided. A belt 5 is provided between the rotation shaft of the induction motor 4 and the shaft 3 of the lap platen 2.
Is hung.

[0003] A work 7 such as a semiconductor wafer, which is held by a carrier 6, is placed on the lapping platen 2. A weight 8 is placed on a work 7 on the carrier 6, and the work 7 is pressed against the lap surface plate 2 by its own weight. Each roller 9 rotatably attached to the fixed member 1 is in contact with the outer peripheral surface of the carrier 6. The fixing member 1 is provided with a polishing liquid supply means 11 for supplying a polishing liquid 10 onto the lapping platen 2.

In such a device, the rotation of the induction motor 4 is transmitted through the belt 5 to the shaft 3 of the lap platen 2.
And the lap platen 2 rotates. At the same time, the work 7 rotates together with the carrier 6 while being pressed against the lapping plate 2 by the weight of the weight 8, and the polishing liquid supply means 11 supplies the polishing liquid 10 onto the lapping plate 2. Thereby, the work 7 is polished.

[0005]

Generally, in the above-mentioned polishing apparatus, the outer dimensions of the work 7 are often smaller than the outer dimensions of the lapping plate 2. For example, as semiconductor wafers become larger, FIG. As shown in the figure, the outer dimensions of the work 7 may be larger than the outer dimensions of the lapping platen 2. This is the case where the external dimensions of the work 7 itself are larger than the external dimensions of the lap surface plate 2 itself, or the case where a concave relief is formed at the center of the lap surface plate 2. FIG. 7 shows a case where a concave relief is formed at the center of the lap platen 2.

In such a case, the work 7 is placed on the lap plate 2
The work 7 and the lapping plate 2 are not rubbed in the protruding area, and the work 7 is not polished. The region not polished is referred to as a non-polished region B.

The amount of polishing of the work 7 by the polishing apparatus exemplified in the above-mentioned prior art depends on the number of rotations of the work 7, the number of rotations of the lapping plate 2, the processing pressure applied to the lapping plate 2 of the work 7, and the like. It is calculated by the proportional Preston's equation. This Preston's equation is a polishing amount that can be calculated when friction occurs between the work 7 and the surface of the lap surface plate 2 (this is a polishing area). This Preston's equation gives Δh = η · P · V · t for the polishing amount Δh under normal polishing conditions.
… (1) is known. Here, η is a proportional constant of polishing, P is a polishing pressure, V is a relative speed between the lapping plate 2 and the work 7, t
Is the polishing time.

However, in the non-polishing region B, since the polishing effect cannot be obtained in the first place, the polishing amount cannot be obtained by applying the Preston's formula. Therefore, when the outer dimensions of the work 7 are larger than the outer dimensions of the lapping platen 2,
A processing point where the polishing area A and the non-polishing area B alternately appear depending on the position of the work 7, and the Preston equation cannot be applied uniformly to the entire processing surface of the work 7. Moreover, the ratio between the polishing area A and the non-polishing area B depends not only on the area of the work 7 but also on the center of the lap platen 2 and the work 7.
Depends on the distance to the center. This makes it difficult to determine the amount of polishing and often relies on the experience of the operator.

When the flatness of the work 7 is improved,
Since the surface of the work 7 becomes smooth, the substantial contact area between the work 7 and the lapping plate 2 increases, and the polishing resistance increases accordingly. The larger the size of the work 7 is, the larger the contact area with the lapping platen 2 becomes, so that the tendency becomes remarkable. As a result, the load torque to the motor derived from the polishing resistance becomes excessive, and the carrier 6 holding the work 7 is forcibly driven to rotate, or the allowable torque of the rotational drive of the lap surface plate 2 is exceeded, so that the emergency stop is performed. It may be. In order to avoid this, an operator is present at the polishing process and supplies a polishing liquid as needed so as to reduce the polishing resistance before the emergency stop.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a polishing support method and apparatus for supporting polishing for performing stable flattening of a workpiece.

More specifically, the present invention provides a polishing support method and apparatus for optimizing a processing pressure and stably flattening a work without an emergency stop caused by excessive polishing resistance. With the goal.

[0012]

According to the first aspect of the present invention, when a workpiece is polished while being pressed against a rotating lap plate while rotating the workpiece, a polishing liquid is supplied thereto. In the polishing support method, a step of inputting a condition for polishing the work, and whether an arbitrary processing point on the work is in a polishing area or outside the polishing area based on the condition input in this step. Calculating the amount of distribution of the amount of polishing of the work in consideration of the distinction between; and reporting the determination result of whether or not the shape of the work reaches a predetermined shape specification value based on the amount of polishing. And a condition for polishing the work until the shape of the work reaches the shape specification value is repeatedly input again.

According to a second aspect of the present invention, in the polishing support method according to the first aspect, at least the number of rotations of the work, the number of rotations of the lap plate, and the lap plate are set as conditions for polishing the work. The distance from the center of the workpiece to the center of the work, and the processing pressure between the lap surface plate and the work are input.

According to a third aspect of the present invention, in the polishing support method according to the first aspect, polishing is performed from a measured shape of the work before processing, and a distribution of a polishing amount of the work after the polishing is determined. A step of obtaining a deviation from the shape specification value, a step of obtaining a standard deviation from the deviation, and reporting a comparison result between the standard deviation and a target standard deviation.

The present invention according to claim 4 provides claim 1,
A polishing method for polishing a work under processing conditions obtained by the polishing support method according to 2 or 3.

According to a fifth aspect of the present invention, there is provided a polishing support apparatus for a polishing apparatus which presses a rotating lap plate while rotating the workpiece and supplies a polishing liquid thereto to polish the workpiece. An interface for inputting conditions for polishing the work, and considering whether a given processing point on the work is within or outside the polishing area based on the conditions input at this interface. Polishing amount calculating means for calculating the polishing amount of the work, and determining whether or not the shape of the work has reached a predetermined shape specification value based on the polishing amount calculated by the polishing amount calculating means. This is a polishing support device including a shape specification value determination unit that reports a result.

According to a sixth aspect of the present invention, in the polishing support apparatus according to the fifth aspect, at least the number of rotations of the work, the number of rotations of the lap plate, and the center of the lap plate are provided from the interface. The distance to the center of the work and the processing pressure between the lap plate and the work are input.

According to a seventh aspect of the present invention, in the polishing support apparatus according to the fifth aspect, the polishing amount calculating means includes: a rotation number of the work, an outer diameter of the work, a rotation number of the lap platen, The outer diameter of the lap plate, the processing pressure between the lap plate and the work, and the distance from the center of the lap plate to the center of the work are input, and a preset polishing amount calculation formula is obtained. And has a function of calculating the polishing amount for the entire surface of the work by using it.

According to an eighth aspect of the present invention, in the polishing support apparatus according to the fifth aspect, the shape specification value determining means performs a grinding process from a shape measured value of the workpiece before machining, and performs a grinding process after the grinding process. One having a function of obtaining a deviation between the distribution of the polishing amount of the workpiece and the shape specification value, and a function of obtaining a standard deviation from the deviation and reporting a comparison result between the standard deviation and a target standard deviation. It is.

According to a ninth aspect of the present invention, in the polishing support apparatus according to the fifth aspect, the shape specification value determining means determines whether the workpiece has a shape specification value when the workpiece shape measurement value reaches the shape specification value. The one having a function of calculating a rotation speed, a rotation speed of the lap surface plate, a processing pressure between the lap surface plate and the work, and a distance from a center of the lap surface plate to a center of the work as optimum condition values. It is.

The present invention according to claim 10 provides the present invention according to claim 5.
The polishing support apparatus according to the above, further comprising a work rotation number control means for controlling a rotation number of the lap platen based on the optimum condition obtained by the shape specification value judgment means.

The present invention according to claim 11 provides claim 5
The polishing support apparatus according to the above, further comprising a processing pressure control unit that controls a processing pressure between the lap surface plate and the work based on the optimum condition obtained by the shape specification value determination unit.

The present invention according to claim 12 provides claim 5.
The polishing support apparatus according to the above, further comprising a work positioning control means for controlling a distance from a center of the lap surface plate to a center of the work based on the optimum condition obtained by the shape specification value determining means. .

The present invention according to claim 13 provides the present invention according to claim 5
The polishing support apparatus according to any one of the preceding claims, further comprising: a torque detection unit that detects a load torque of a motor that rotates the workpiece; and a polishing liquid supply that controls a supply amount of the polishing liquid based on the load torque measured by the torque detection unit. Control means.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram of a polishing apparatus. A lap surface plate 21 is connected to the rotation axis of the lap surface plate rotation means 20 composed of a motor or the like. The lap surface plate 21 has a concave relief 22 at the center thereof.

The work 7 held by the holder 23 is placed on the lap surface plate 21. Holder 23
The work 7 is rotated while holding the work 7 by the holder rotation motor 24. Each roller 25 rotatably contacts the outer peripheral surface of the holder 23. These rollers 25 are rotatably supported by a roller arm 26, and support the holder 23 so as to rotate in a horizontal plane.

A polishing liquid supply means 27 is provided above the lap surface plate 21. This polishing liquid supply means 27
Is for supplying a processing liquid onto the lap surface plate 21.

The optimum value calculation processing section 28 discriminates whether an arbitrary processing point Q on the work 7 is in the polishing area A or the non-polishing area B as shown in FIG. It has a function of calculating the polishing amount of the work 7 in consideration of B and calculating the optimum conditions for polishing the work 7 based on the polishing amount.

The calculation of the optimum polishing conditions will be described. The polishing amount Δh under normal polishing conditions is generally represented by the above Preston equation. It has already been explained that this formula is applied when the lap surface plate 21 and the work 7 rub against each other. As shown in FIG. 2, when the size of the work 7 is larger than the lap surface plate 21 or when the concave relief 22 is formed at the center of the lap surface plate 21, an arbitrary processing point Q of the work 7 is The polishing area A and the non-polishing area B are alternately repeated with the rotation of the work 7. The ratio between the polishing area A and the non-polishing area B is determined by the lapping plate 2
Distance Dw from the center Ot of 1 to the center Ow of the work 7
t, the distance varies depending on the distance Rw from the center Ow of the workpiece 7 to an arbitrary processing point Q. Therefore, the polishing amount Δh at an arbitrary processing point Q is applied only when the polishing point exists in the polishing area A, and the polishing amount Δh = 0 when it exists in the non-polishing area.

The speed at an arbitrary processing point Q is a relative speed between the rotation speed of the lap platen 21 and the rotation speed of the work 7, and the processing pressure is the sum of the pressure due to the work load and the additional pressure.

By calculating the polishing amount Δh at an arbitrary processing point Q on the work 7 and obtaining the polishing amount for the entire surface of the work 7 as described above, it is possible to estimate the shape after polishing (processing simulation).

A processing simulation is performed based on the shape of the workpiece 7 having a low flatness before polishing, and the number of rotations of the lap plate 21, the number of rotations of the work 7, and the lap plate 21 are adjusted so as to obtain the required flatness. Each optimum condition value of the processing pressure between the workpiece 7 and the distance Dwt from the center Ot of the lap surface plate 21 to the center Ow of the workpiece 7 is calculated.

However, the optimum value calculation processing unit 28
Specifically, at least before the execution of the processing simulation, at least the rotation speed of the work 7, the rotation speed of the lap surface plate 21, and the distance D from the center Ot of the lap surface plate 21 to the center Ow of the work 7.
wt, the processing pressure between the lapping plate 21 and the work 7 is input in an interactive manner with the operator, and the work 7 before processing is input.
Is polished from the measured value of the shape, a deviation between the shape of the workpiece 7 after the polishing and a predetermined shape specification value is obtained, and a standard deviation (variation) is obtained from the deviation. The rotation speed of the work 7 and the lap surface 21 are again compared so that the standard deviation becomes smaller than the target standard deviation.
From the center Ot of the lap plate 21 to the work 7
Has a function of repeating the simulation by inputting the distance Dwt to the center Ow of the work and the processing pressure between the lap surface plate 21 and the work 7 in the form of dialogue with the operator. The interactive interface 29, the polishing amount calculating means 30
And each function of the shape specification value determining means 31.

The interactive interface 29 includes an outer diameter of the work 7, the number of rotations of the work 7, an inner diameter of the lap plate 21, an outer diameter of the lap plate 21, and a lap plate according to a dialog with the operator. It has a function of inputting the number of rotations of 21, the working pressure between the lap surface plate 21 and the work 7, and the wear constant (η).

The polishing amount calculating means 30 determines whether an arbitrary processing point Q on the workpiece 7 is in the polishing area A or the non-polishing area B, and discriminates the polishing area A and the non-polishing area B from each other. The number of rotations of the work 7, the outer diameter of the work 7, the number of rotations of the lap plate 21, the outer diameter of the lap plate 21, the lap Distance Dwt from center Ot of surface plate 21 to center Ow of work 7, lap surface plate 2
Using the processing pressure between the work 1 and the work 7, the Preston equation is calculated to calculate the amount of polishing on the entire surface of the work 7.

As shown in FIG. 3, the shape specification value judging means 31 takes in the shape measurement value M (i) of the work 7 before processing through the interactive interface 29, and
The polishing process is performed from (i), and the deviation ε (i) between the shape of the workpiece 7 after the polishing process based on the polishing amount calculated by the polishing amount calculating means 30 and a predetermined shape specification value T (i). ). The shape measurement value M (i) is
It corresponds to the distance (processing point radius) Rw (i) from the center Ow of the work 7 to an arbitrary processing point Q. This deviation ε (i) is
Assuming that the polishing amount for each processing point radius Rw (i) is ΣΔh _ij , it is calculated as follows: ε (i) = ｛M (i) −ΣΔh _ij ｝ −T (i) (2)

Next, the shape specification value determining section 31, the deviation ε determined: (i) from the standard deviation Esuipushiron (i), it compares the standard deviation S _T to the standard deviation Esuipushiron (i) the target as a result, so standard deviation Sε (i) is smaller than the standard deviation S _T of the _{target, S T> Sε (i)} ... (3) again, the workpiece 7 through the interactive interface 29
, The number of rotations of the lap surface plate 21, the distance D from the center Ot of the lap surface plate 21 to the center Ow of the work 7
wt, and a function of changing the processing pressure between the lap surface plate 21 and the work 7 and re-entering the same through dialogue with the operator to repeat the simulation.

Next, the shape specification value judging means 31 calculates the rotational speed of the workpiece 7, the rotational speed of the lap surface plate 21, and the center Ot of the lap surface plate 21 at which the above equation (3) is finally achieved. It has a function of calculating a distance Dwt to the center Ow of the work 7 and a processing pressure between the lap surface plate 21 and the work 7.

The polishing liquid supply control means 32 of the optimum value calculation processing section 28 takes in the load torque of the motor detected by the torque detection means 37 described later, and instructs the supply amount of the polishing liquid based on the load torque. It has a function of giving a value to the polishing liquid supply control unit 36.

[0041] Further, the optimum value calculation processing unit 28, when the standard deviation Sε (i) is smaller than the standard deviation S _T of the target, the command value in accordance with the optimum conditions for polishing a workpiece 7 at this time , The workpiece rotation speed control unit 33, the processing pressure control unit 34,
It has a function of giving to the work positioning control unit 35 and the polishing liquid supply control unit 36 and taking in the load torque of the holder rotation motor 24 measured by the torque detection unit 37.

The work rotation speed control unit 33 has a function of receiving a command value from the optimum value calculation processing unit 28 and drivingly controlling the holder rotation motor 24 at a rotation speed according to the command value. .

The processing pressure control unit 34 is provided with the optimum value calculation processing unit 2
8 and receives the processing pressure according to this command value.
The holder 23 holding the work 7 itself is placed on the lapping platen 2
It has a function to drive and control the processing pressure means 38 pressing against the first.

The work positioning control section 35 receives the command value from the optimum value calculation processing section 28, and the distance from the center of the lap surface plate 21 to the center of the work 7 becomes the position of the work 7 according to the command value. Thus, the function of driving and controlling the work positioning means 39 is provided. The work positioning means 39 moves the position of the work 7 on the lapping plate 21 by moving the roller arm 26.

The polishing liquid supply control section 36 has a function of receiving a command value from the optimum value calculation processing section 28 and supplying a polishing liquid amount according to the command value from the polishing liquid supply means 27.

Next, the operation of the device configured as described above will be described.

The work 7 is held on the holder 23 and placed on the lap surface plate 21. Each roller 25 is rotatably contacted with the outer peripheral surface of the holder 23 and rotates while holding the work 7 by the holder rotating motor 24. At this time, the control is performed as follows.

The polishing amount calculation means 3 of the optimum value calculation processing section 28
0 discriminates whether an arbitrary processing point Q on the work 7 is in the polishing area A or the non-polishing area B as shown in FIG. Is calculated.

Here, the calculation of the polishing amount of the work 7 will be described with reference to the flowchart for calculating the optimum polishing conditions shown in FIG.

First, by the interactive operation of the operator on the interactive sineface 29, the interactive sineface 29 is turned on in step # 1, the outer diameter of the work 7, the number of revolutions of the work 7, the inner diameter of the lap plate 21. The dimensions, the outer diameter of the lap surface plate 21, the number of rotations of the lap surface plate 21, the processing pressure between the lap surface plate 21 and the work 7, and the wear constant (η) are input and set.

Next, the polishing amount calculating means 30 determines in step #
In step 2, i = 0 and j = 0 are set as initial values.
Here, these initial values i = 0 and j = 0 represent the initial position of an arbitrary machining point Q, and change as i = 0 to n and j = 0 to m, and work at i = n and j = m. 7 represents the end.

Next, the polishing amount calculating means 30 executes step #
In 3, the distance (processing point radius) Rw (i) from the center Ow of the workpiece 7 to an arbitrary processing point Q is determined. This processing point radius) Rw (i) is determined by calculating Rw (i) = ΔRw · i (i = 0 to n) (4).

Next, the polishing amount calculating means 30 executes step #
In 4, the processing point angle θw (j) is determined. The machining point angle θw (j) is determined by calculating θw (j) = Δθw · j (j = 0 to m) (5).

Next, the polishing amount calculating means 30 determines in step #
In 5, the intersection of the outer diameter of the lapping plate 21 and the outer diameter of the work 7 and the intersection of the inner diameter of the lapping plate 21 and the outer diameter of the work 7 are calculated.

Next, the polishing amount calculating means 30 determines in step #
6, the processing point radius Rw (i) and the processing point angle θw (j)
Based on the intersection between the outer diameter of the lapping plate 21 and the outer diameter of the work 7 and the intersection of the inner diameter of the lapping plate 21 and the outer diameter of the work 7, an arbitrary processing point Q It is determined whether any of the polishing areas B exists.

[0056] As a result of this determination, if there any machining point Q within the polishing region A, the polishing amount calculating unit 30 shifts from step # 7 to # 8, the relative velocity at any processing point Q V _{i j} Is calculated. This speed V _ij is determined by the lap plate 21
And the relative speed obtained from the rotation speed of the work 7.

Next, the polishing amount calculating means 30 executes step #
At 9, a processing pressure Pij at an arbitrary processing point Q is calculated. This processing pressure P _ij is the sum of the pressure due to the work load and the additional pressure.

Next, the polishing amount calculating means 30 executes step #
At 10, the polishing amount Δh _{ij at} an arbitrary processing point Q
Is calculated. The polishing amount Δh _ij is calculated by calculating Δhij = η · P _ij · V _ij (6).

Next, the polishing amount calculating means 30 executes step #
11, the total angle polishing amount ΣΔh _ijIs calculated.

Next, the polishing amount calculating means 30 executes step #
In step # 13, it is determined whether or not j = m. In step # 13, it is determined whether or not i = n.
If not, j = j + 1 is set in step # 14 and the process returns to step # 4. If i = n, i = i is set in step # 15.
Return to step # 3 as +1.

Next, the shape specification value determining means 31 determines whether or not the polishing amount of the work 7 has reached the shape specification value in the evaluation in step # 16.

As shown in FIG. 3, the shape specification value judging means 31 takes in the shape measurement value M (i) of the workpiece 7 before processing through the interactive interface 29, and performs polishing processing based on the shape measurement value M (i). And the polishing amount calculating means 30
7 after polishing based on the polishing amount calculated by
And the deviation ε (i) between the shape of
Is calculated by calculating the above equation (2).

In this case, the shape measurement value M (i) of the work 7 before machining is obtained by measuring the shape of the work 7 before machining using a length measuring machine or the like, and the measurement result is calculated in advance by an optimum value calculation processing unit. 2
Enter it in 8. The shape measurement value M (i) corresponds to a distance (processing point radius) Rw (i) from the center Ow of the workpiece 7 to an arbitrary processing point Q in the processing simulation.

Next, the shape specification value determining means 31 calculates the deviation ε
(i), the standard deviation Sε (i) is obtained, and the standard deviation Sε (i) is obtained.
(i) and comparing the standard deviation S _T a target. The result of this comparison is displayed on a display device or the like, and is notified to the operator.

[0065] The result of this comparison, if the standard deviation Sε (i) is greater than the standard deviation S _T of the target, such that the standard deviation Sε (i) is smaller than the standard deviation S _T of the target, again the operation of the operator Through the interactive interface 29, the rotation speed of the work 7, the rotation speed of the lap surface plate 21, the distance Dwt from the center Ot of the lap surface plate 21 to the center Ow of the work 7, the processing between the lap surface plate 21 and the work 7 The pressure is changed and re-entered.

As described above, the number of rotations of the work 7, the number of rotations of the lap surface plate 21, and the center Ot of the lap surface plate 21 are
The distance Dwt to the center Ow and the processing pressure between the lapping plate 21 and the work 7 are re-input, and the polishing amount calculating means 30 and the shape specification value determining means 31 again perform the above-described steps # 1 to # 1 of the processing simulation. # 17 is executed, the standard deviation Sε (i) and comparison with a standard deviation S _T of the target is displayed by the display device or the like, is reported to the operator.

[0067] Then, the standard deviation Sε (i) the result of comparison with a standard deviation S _T to a target, the standard deviation Sε (i) is smaller than the standard deviation S _T of the target shape specification value determining means Numeral 31 denotes the optimum condition values at this time, the number of rotations of the work 7, the number of rotations of the lap surface plate 21, and the center O of the lap surface plate 21.
The distance Dwt from t to the center Ow of the work 7 and the processing pressure between the lapping plate 21 and the work 7 are obtained.

The work rotation speed control unit 33 receives the command value of the rotation speed of the lap surface plate 21 calculated by the optimum value calculation processing unit 28, and drives the holder rotation motor 24 at the rotation speed according to the command value. Control.

The processing pressure control unit 34 is provided with the optimum value calculation processing unit 2
8 receives a command value of a processing pressure for pressing the work 7 against the lap surface plate 21, and the holder 23 holding the work 7 itself is placed on the lap surface plate 21 with a processing pressure according to the command value. The driving of the processing pressure means 38 pressed against the surface is controlled.

The work positioning control unit 35 calculates the center Ot of the lap surface plate 21 calculated by the optimum value calculation processing unit 28.
And a command value of the distance Dwt from the control unit to the center Ow of the work 7, and drive-controls the work positioning means 39 so that the position of the work 7 is in accordance with the command value.

The torque detecting means 37 measures the load torque of the motor 24 for rotating the holder and calculates the optimum value
Send to 8. The polishing liquid supply control means 32 of the optimum value calculation processing section 28 takes in the load torque of the holder rotating motor 24 and gives a command value of the supply amount of the polishing liquid to the polishing liquid supply control section 36 based on the load torque. . The polishing liquid supply control unit 36 receives a command value from the optimum value calculation processing unit 28, and adjusts the polishing liquid amount according to the command value to the polishing liquid supply unit 27.
Supply from

FIG. 5 shows the time change of the output torque of the holder rotating motor 24 when the work 7 is polished in accordance with the optimum condition value for obtaining the required flatness. In the initial stage of polishing, the flatness of the work 7 is low and the contact area between the lapping plate 21 and the processed surface of the work 7 is small, so that the polishing resistance is small. Thereby, the supply interval of the polishing liquid is long, and the supply amount of the polishing liquid is small. As the polishing progresses and the flatness of the work 7 improves, the contact area between the lapping plate 21 and the work 7 increases, and the polishing resistance also increases.

As the outer diameter of the work 7 increases, the output torque of the holder rotating motor 24 increases in a greater slope, and this output torque approaches the permissible torque of the rotational driving of the holder rotating motor 24.

In such a case, the optimum value calculation processing unit 28
Controls the polishing liquid supply means 32 for supplying the polishing liquid to reduce the polishing resistance by shortening the interval of the polishing liquid supply timing t or increasing the supply amount of the polishing liquid as shown in FIG. It is possible to prevent the drive torque of the holder rotating motor 24 from exceeding an allowable value. The polishing liquid has an effect of reducing the friction coefficient between the lap surface plate 21 and the work 7, and is effective in reducing the polishing resistance.

When it is desired to know the total polishing amount of the entire surface of the work 7, the polishing amount calculating means 30 calculates the total polishing amount ΣΣΔh _ij of the entire surface of the work 7 in step # 17 based on the total angle polishing amount ΣΔh _ij. It will be calculated.

As described above, in one embodiment,
The conditions for polishing the work 7 are interactively input with the operator from the interactive interface 29, and based on the input conditions, whether any processing point on the work 7 is within the polishing area or outside the polishing area. The polishing amount of the work 7 is calculated by the polishing amount calculating means 30 in consideration of the distinction between the two. The specification value judging means 31 informs the user that the conditions for polishing the work 7 are repeatedly input again until the shape of the work 7 reaches the shape specification value. There is no emergency stop caused by excessive polishing resistance, and polishing support for stably flattening the work 7 can be performed.

In this polishing support, the operator can work 7
For polishing the work 7 until the shape of the work 7 reaches the shape specification value, that is, the number of rotations of the work 7,
, The distance Dwt from the center Ot of the lap surface plate 21 to the center Ow of the work 7, and the processing pressure between the lap surface plate 21 and the work 7 may be repeatedly input. Work 7 can be polished to a desired degree of flatness, and labor for selecting conditions can be reduced.

The load torque of the holder rotating motor 24 is measured by the torque detecting means 33, and the supply amount of the polishing liquid is controlled based on the load torque. By optimizing the processing pressure, stable work flattening can be achieved without an emergency stop caused by excessive polishing resistance, and unmanned operation can be achieved by automatically supplying the polishing liquid.

The standard deviation Sε (i) is equal to the target standard deviation S
_When it becomes smaller than _T , the shape specification value determination means 31 determines the optimum condition values at this time, such as the number of rotations of the work 7, the number of rotations of the lap surface plate 21, from the center Ot of the lap surface plate 21 to the center Ow of the work 7. , The processing pressure between the lap surface plate 21 and the work 7 is determined, and the work rotation speed control unit 33,
Since the polishing is performed by issuing an instruction to the processing pressure control unit 34 and the work positioning control unit 35, the work 7 can be polished and can be stably flattened.

Further, for example, a semiconductor wafer having a large diameter can be polished as the work 7 with a relatively small polishing table, which can contribute to downsizing of the apparatus.

[0081]

As described above in detail, according to the present invention, it is possible to provide a polishing supporting method and apparatus for supporting polishing for performing stable flattening of a work.

Further, according to the present invention, it is possible to provide a polishing support method and apparatus for optimizing the processing pressure and stably flattening a work without an emergency stop caused by excessive polishing resistance.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing one embodiment of a polishing support device according to the present invention.

FIG. 2 is a view showing an operation of calculating an optimal polishing condition in one embodiment of the polishing support apparatus according to the present invention.

FIG. 3 is a schematic diagram for explaining the operation of shape specification value determination in one embodiment of the polishing support device according to the present invention.

FIG. 4 is a flowchart for calculating optimum polishing conditions in one embodiment of the polishing support apparatus according to the present invention.

FIG. 5 is a diagram showing a change over time of an output torque of a rotational drive of a holder for holding a workpiece when polishing is performed at an optimum condition value in one embodiment of the polishing apparatus according to the present invention.

FIG. 6 is a configuration diagram of a polishing apparatus.

FIG. 7 is a view of the device as viewed from above.

FIG. 8 is a diagram showing a polished area and a non-polished area when the external dimensions of the work are larger than the external dimensions of the lapping plate.

[Explanation of symbols]

 7: Work 20: Lapping plate rotating means 21: Lapping platen 22: Escape 23: Holder 24: Holder rotation motor 25: Roller 26: Roller arm 27: Polishing liquid supply means 28: Optimal value calculation processing unit 29: Dialogue Formula interface 30: Polishing amount calculating means 31: Shape specification value determining means 32: Polishing liquid supply control means 33: Work rotation number control section 34: Processing pressure control section 35: Work positioning control section 36: Polishing liquid supply control section 37: Torque detecting means 38: Processing pressure means 39: Work positioning means

Claims (13)

[Claims] 1. A polishing support method for pressing a work while rotating it against a rotating lap surface plate and supplying a polishing liquid to the work to polish the work. A step of inputting a condition, and a distribution of a polishing amount of the work in consideration of whether an arbitrary processing point on the work is within a polishing area or outside the polishing area based on the condition input in this step. And a step of notifying a determination result as to whether or not the shape of the work reaches a predetermined shape specification value based on the polishing amount, wherein the shape of the work is the shape specification value. A polishing support method, wherein conditions for polishing the workpiece are repeatedly input until the number of times reaches a predetermined value. 2. Conditions for polishing the work include at least the number of rotations of the work, the number of rotations of the lap plate, the distance from the center of the lap plate to the center of the work, the lap plate and the lap plate. The polishing support method according to claim 1, wherein a processing pressure between the workpiece and the workpiece is input. 3. A step of performing polishing from a measured value of the shape of the work before processing, and calculating a deviation between a distribution of a polishing amount of the work after the polishing and the specification value of the shape; 2. The polishing support method according to claim 1, further comprising: obtaining a deviation, and reporting a comparison result between the standard deviation and a target standard deviation. 4. A polishing method, characterized in that a workpiece is polished under processing conditions obtained by the polishing support method according to claim 1, 2 or 3. 5. A polishing support apparatus for a polishing apparatus which presses a work while rotating it against a rotating lap surface plate and supplies a polishing liquid to the work to polish the work. And an interface for inputting the conditions of the above, based on the conditions input in this interface, the polishing amount of the work is considered in consideration of whether an arbitrary processing point on the work is within the polishing area or outside the polishing area. Polishing amount calculating means to calculate, and a shape specification value for reporting a determination result as to whether or not the shape of the workpiece has reached a predetermined shape specification value based on the polishing amount calculated by the polishing amount calculating means. A polishing support apparatus, comprising: a determination unit. 6. From the interface, at least the number of rotations of the work, the number of rotations of the lap plate, the distance from the center of the lap plate to the center of the work, and the distance between the lap plate and the work. 6. The polishing support apparatus according to claim 5, wherein the processing pressure is input. 7. The polishing amount calculating means includes: a rotation speed of the work, an outer diameter of the work, a rotation speed of the lap plate, an outer diameter of the lap plate, and the lap plate and the work. A processing pressure between the center of the lap platen and the center of the work, and a function of calculating the polishing amount for the entire surface of the work using a preset polishing amount calculation formula. The polishing support device according to claim 5, wherein 8. The shape specification value determining means performs polishing from a shape measurement value of the work before processing, and obtains a deviation between a distribution of a polishing amount of the work after the polishing and the shape specification value. The polishing support apparatus according to claim 5, further comprising: a function; and a function of obtaining a standard deviation from the deviation, and reporting a comparison result between the standard deviation and a target standard deviation. 9. The shape specification value determining means, when the shape measurement value of the work reaches the shape specification value, the number of rotations of the work, the number of rotations of the lap platen, the lap platen, and The polishing support apparatus according to claim 5, further comprising a function of calculating a processing pressure between the work and a center of the lap plate from the center of the work as an optimum condition value. 10. The polishing apparatus according to claim 5, further comprising a workpiece rotation speed control unit that controls the rotation speed of the lap platen based on the optimum condition obtained by the shape specification value determination unit. Support equipment. 11. A processing pressure control means for controlling a processing pressure between the lap surface plate and the work on the basis of the optimum condition obtained by the shape specification value determining means. Item 6. A polishing support device according to Item 5. 12. A work positioning control means for controlling a distance from a center of the lap surface plate to a center of the work based on the optimum condition obtained by the shape specification value judgment means. The polishing support device according to claim 5. 13. A torque detecting means for detecting a load torque of a motor for rotating the work, and a polishing liquid supply controlling means for controlling a supply amount of the polishing liquid based on the load torque measured by the torque detecting means. The polishing support apparatus according to claim 5, comprising: