JP2001210983A - Thermal resistance controlling apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal resistance controlling apparatus wherein its thermal resistance can be made small and its radiating capability is excellent. SOLUTION: A thermal resistance controlling apparatus 1 is a box-type structure which has a heating element attaching portion 10, a heat sink attaching portion 20, a supporting structure 30a connected respectively with the attaching portions 10, 20 via heat insulators 31a, 31b, and a supporting structure 30b connected respectively with the attaching portions 10, 20 via heat insulators 31c, 31d. A radiating passage 6 is the one surrounded by fillers 7, 7a and opposite surface portions to each other 11, 21 which come into contact respectively with the attaching portion 10 and with the attaching portion 20. A controller 4 controls a driving portion 5. The driving portion 5 moves a shaft 42. The shaft 42 is connected with a good heat conductor 44 via a heat insulator 43. The good heat conductor 44 moves in the radiating passage 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal resistance control device, and more particularly to a thermal resistance control device for controlling thermal resistance by electrically changing the ratio of each material in a heat radiation path.

[0002]

2. Description of the Related Art In general, in electronic equipment and precision equipment (hereinafter simply referred to as equipment), a temperature range on a high temperature side and a low temperature side during operation and non-operation thereof are often defined. Particularly, in a device mounted on a spacecraft such as an artificial satellite, when the sunlight is incident on the outer surface of the spacecraft and when it is not incident, both the high-temperature side and the low-temperature side have severe thermal conditions. In recent years, with the diversification of missions and higher performance of computers, the amount of heat generated by devices has increased significantly. For such thermally severe equipment, equipment is usually mounted so that the thermal resistance in the heat radiation surface on the equipment side or the heat radiation path to the radiator mounting part on the satellite structure is as small as possible, and the temperature of the equipment is higher than the allowable temperature on the high temperature side. It is within the range. However, the amount of heat radiation increases greatly due to the satellite's orbit and the attitude change of the satellite accompanying the mission, the equipment becomes excessively cooled due to measures on the high temperature side, and the temperature of the equipment falls within the allowable temperature range on the low temperature side. In some cases, a heater is attached to make it fit. These are problems that occur because the heat resistance of the heat radiation path is constant. By controlling the thermal resistance of the heat dissipation path, it is possible to reduce the value of the thermal resistance at high temperatures to increase the heat radiation from the device, and to increase the value of the thermal resistance at low temperatures to reduce the heat radiation from the device. In addition to eliminating the need for a heater for the satellite, the power required for the satellite can be reduced.

As an example of such a thermal resistance control technique,
A "variable heat resistance device" described in Japanese Patent Application Laid-Open No. 05-251595 is known.

[0004] The variable thermal resistance device described in this publication is
A device that changes the thermal resistance electrically using the force generated by a piezoelectric element. A piezoelectric element is placed on the contact surface between two heat conductors in the heat dissipation path, and heat conduction is performed by applying a voltage to the piezoelectric element. Techniques are described that press the body and change the thermal resistance between these heat conductors.

[0005]

In the above-described conventional thermal resistance control device, the amount of heat generated from the piezoelectric element increases when heat is to be radiated, and further heat is generated to radiate the heat. In addition, in order to keep the thermal resistance value small, there is a disadvantage that the maximum voltage must be constantly applied to the piezoelectric element.

Further, the force generated by the piezoelectric element is not used as it is as the contact pressure, but is used to deform the heat conductor. In general, metals having good thermal conductivity include metals such as copper and aluminum, and in order to reduce their thermal resistance, the metal must be as thick as possible.
Large forces are required to deform such metals. In order to deform with a small force, it is necessary to provide a thin part, but in that part the thermal resistance increases,
Do not take advantage of the good thermal conductivity of metals. If a large amount of piezoelectric elements are used to generate more force, the amount of heat generated from the variable thermal resistance device increases accordingly. On the other hand, the heat conductivity of a substance that is easily deformed, such as a heat-dissipating sheet, has a performance that is several orders of magnitude worse than that of a metal, so that the thermal resistance cannot be reduced as a whole. Therefore, there is a drawback that the structure cannot cope with an increase in the heat radiation capability because it is difficult to reduce the thermal resistance.

An object of the present invention is to provide a thermal resistance control device which can reduce thermal resistance and has excellent heat dissipation capability.

[0008]

A thermal resistance control device according to the present invention is provided on a heat radiating path between a heating element and a heat radiating element. The heat resistance of the heat radiating path is controlled by changing the occupancy of the good heat conductor with respect to the heat radiating path.

[0009] A heating element mounting portion, a heat dissipating member mounting portion, a first support structure and a second supporting structure connected to these mounting portions via first, second heat insulating materials, and third and fourth heat insulating materials. A box-shaped structure comprising: a first filler filled on the first support structure side; and a second filler filled on the second support structure side. And a heat-radiating path surrounded by the first and second fillers, and a first facing portion in contact with the heating element mounting portion and a second facing portion in contact with the heat-radiating member mounting portion. A good heat conductor moving along the heat radiation path, a shaft connected to the good heat conductor via a fifth heat insulating material, a drive unit for moving the shaft, and a controller for controlling the drive unit. It is characterized by having.

When a command is issued from the controller to the drive section, the good heat conductor attached to the shaft via the fifth heat insulating material moves between the heat radiation paths. By changing the ratio of the good heat conductor to the heat dissipation path, the thermal resistance of the heat dissipation path is reduced by making the occupancy of the good heat conductor the largest with respect to the heat dissipation path. The heat resistance of the heat radiation path is increased by minimizing the occupancy of the good heat conductor.

[0011] First and second heat insulating layers are provided on the heat-generating body mounting portion other than the first and second facing portions with the heat-radiating path and on the contact surface between the heat-radiating body mounting portion and the first filler. Similarly, a third heat insulating layer and a fourth heat insulating layer are provided on the heat-generating body mounting portion other than the first and second facing portions with the heat-radiating path and on the contact surface between the heat-radiating body mounting portion and the second filler. It is characterized by having been provided.

The heat-generating body mounting portion and the heat-radiating body mounting portion are directly mounted by first and second support structures without interposing the first, second, third and fourth heat insulating materials. It is characterized by:

The first support structure is provided with a first compression / expansion mechanism using a spring, and the second support structure is provided with a second compression / expansion mechanism. These first and second compression / expansion mechanisms are provided. A gap between the heating element mounting portion and the good heat conductor and a gap between the heat radiating member mounting portion and the good heat conductor are reduced to generate a contact surface pressure.

[0014] The good heat conductor is a wedge-shaped good heat conductor, and the shape of the heating element mounting portion is made to match the shape of the wedge-shaped good heat conductor. .

[0015] The good heat conductor is a wedge-shaped good heat conductor, and the shape of the radiator mounting portion is also made to match the shape of the wedge-shaped good heat conductor. .

Further, the first and second fillers are removed,
It is characterized by thermal coupling by heat radiation in the gap between the heating element mounting portion and the good heat conductor and the gap between the heat radiating member mounting portion and the good heat conductor.

[0017]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a principle diagram of a thermal resistance control device according to the present invention.

Referring to FIG. 1, a thermal resistance control device 1 is mounted between a heat generator 2 and a heat radiator 3. The thermal resistance control device 1 electrically controls thermal resistance by using one or a plurality of materials for a heat radiation path and changing the ratio of each material in the heat radiation path.

FIG. 2 is a block diagram showing one embodiment of the thermal resistance control device of the present invention.

In this embodiment shown in FIG. 2, a heating element mounting portion 10, a heat radiating member mounting portion 20, these mounting portions and a heat insulating material 3 are provided.
A box-shaped structure including a supporting structure 30a and a supporting structure 30b connected via 1a, 31b and heat insulating materials 31c, 31d, and a filler 7 filled on the supporting structure 30a side; Filler 7a filled on the support structure 30b side, these fillers 7, 7a and the heating element mounting portion 1
0, the heat radiating path 6 surrounded by the facing part 21 that contacts the radiator mounting part 20, the good heat conductor 44 moving along the heat radiating path 6, and the good heat conductor 44.
A drive unit 5 for moving the shaft 42, and a controller 4 for controlling the drive unit 5. Note that the fillers 7 and 7a may be the same. That is, one region may be formed without any limitation.

The operation principle is as follows.
When a command is issued, the good heat conductor 44 attached to the shaft 42 via the heat insulating material 43 moves between the heat radiation paths 6.

Thus, the ratio of the good heat conductor 44 in the heat radiation path 6 can be changed. Heating element mounting part 1
Since the thermal resistance between the heat radiator mounting portion 20 and the heat radiator mounting portion 20 changes depending on the ratio of the good heat conductor 44 occupying the heat radiating path 6, the heat resistance between the heat radiating member mounting portion 10 and the heat radiator mounting portion 20 varies. The resistance can be controlled electrically.

That is, the thermal resistance control device 1 electrically controls the thermal resistance by changing the ratio of the good heat conductor 44 occupying the heat radiating path 6. The good heat conductor 44 is attached to the shaft 42 via a heat insulating material 43. It is desirable that the heat insulating material 43 has as small a thermal conductivity as possible. That is, when the thermal resistance is minimized in the thermal resistance control device 1, heat is prevented from flowing in from the outside via the shaft 42, and when the thermal resistance is evaluated, the flow of heat through the shaft 42 becomes a disturbance. It is to prevent. The position of the shaft 42 is controlled by the drive unit 5 according to a command from the controller 4. The good heat conductor 44 is disposed between the heating element mounting portion 10 and the heat radiating member mounting portion 20. Here, the heating element mounting portion 10 may be the heating element 2 itself shown in FIG. 1, and the radiator mounting portion 20 may be the radiator 3 itself.

The heating element mounting portion 10 and the heat radiating member mounting portion 20
The heat insulating materials 31a and 31b and the support structure 30a are attached via the heat insulating materials 31c and 31d and the support structure 30b. The portion through which the shaft 42 penetrates the support structure 30b is determined when the heating element mounting portion 10, the radiator mounting portion 20, the heat insulating materials 31c and 31d, and the filler 7a filled in the portion surrounded by the support structure 30b are present. In addition, a seal member 32 is attached so as to be able to seal so that heat does not flow out of the thermal resistance control device 1.

The thermal resistance control device 1 includes a heating element mounting portion 1.
0, radiator mounting portion 20, heat insulating materials 31a, 31b, 31
By adopting a box-shaped structure surrounded by c, 31d and the support structures 30a, 30b, the mechanical strength and rigidity as a device mounting surface are increased. The heating element mounting portion 10 is thick so as to reduce the thermal resistance of the heat radiation path 6 from the heating element mounting surface 12 to the facing portion 11 with the good heat conductor 44, but the supporting structures 30a, 30b The portion heading toward has a thin-walled shape to increase the thermal resistance. Similarly, the radiator mounting portion 20 is also thick so that the thermal resistance of the heat radiating path 6 from the facing portion 21 to the radiator mounting surface 22 to the radiator mounting surface 22 is reduced. The portion toward 30b has a thin shape so as to increase the thermal resistance.

Therefore, most of the heat of the heating element mounting portion 10 is transmitted to the heat radiating member mounting portion 20 through the good heat conductor 44. It is desirable that the gaps between the heating element mounting portion 10 and the good heat conductor 44 and between the heat dissipating member mounting portion 20 and the good heat conductor 44 be as small as possible within a range where the good heat conductor 44 does not hinder movement. This is to increase the heat radiation capability of the thermal resistance control device 1 as much as possible. Heating element mounting part 10,
Heat radiator mounting portion 20 and heat insulating materials 31a, 31b, 31
In portions surrounded by c and 31d and the support structures 30a and 30b, the thermal resistance of the gap between the heating element mounting portion 10 and the good heat conductor 44 and the gap between the heat radiating member mounting portion 20 and the good heat conductor 44 is reduced. As described above, the fillers 7, 7a are inserted. Examples of the fillers 7 and 7a include a gas, a liquid, and a gel-like substance, and a material having a high thermal conductivity and a small viscosity is preferable so that the good heat conductor 44 can be easily moved.

As described above, one thermal resistance control device 1
Although the case where one good heat conductor 44 is arranged has been described, the number of good heat conductors 44 is not limited. The dimensions of the thermal resistance control device 1 are not limited by the dimensions, and when the required amount of heat radiation is large, the heat radiation capability can be adjusted by increasing the size.

Although the shape of the good heat conductor 44 has been described as a rectangular parallelepiped, the shape of the good heat conductor 44 is not limited. Furthermore, although the description has been made assuming that the fillers 7 and 7a are present, the heating element mounting portion 10 and the good heat conductor 44, and the radiator mounting portion 20 and the good heat conductor 44 respectively when the fillers 7 and 7a are not provided. Is sufficiently small and thermal coupling by radiation can be expected, so there is no restriction due to the presence or absence of the fillers 7 and 7a.

FIG. 3 is a diagram for explaining the operation of the embodiment of FIG. 2 when the thermal resistance is small.

FIG. 4 is a diagram for explaining the operation of the embodiment shown in FIG. 2 when the thermal resistance is large.

In FIGS. 3 and 4, components corresponding to those shown in FIG. 2 are denoted by the same reference numerals or symbols, and description thereof will be omitted.

Referring to FIG. 3, the operation in the case where the thermal resistance of the thermal resistance control device 1 is reduced will be described. Of these, the occupation ratio of the good heat conductor 44 is set to be the largest. At this time, the shaft 4
2, the heat resistance of the heat radiation path 6 is the smallest.

Next, with reference to FIG. 4, the operation when the thermal resistance of the thermal resistance control device 1 is increased will be described. 6 so that the occupation ratio of the good heat conductor 44 is minimized. At this time, the heat resistance of the heat radiation path 6 is the largest among all the positions of the shaft 42.

FIG. 5 is a block diagram showing a second embodiment of the thermal resistance control device according to the present invention.

In FIG. 5, components corresponding to those shown in FIG. 2 are denoted by the same reference numerals or symbols, and description thereof will be omitted.

Referring to FIG. 5, a heat insulating layer is provided on the contact surface between the heat generator mounting portion 10 and the filler 7 and the contact surface between the heat radiator mounting portion 20 and the filler 7 other than the facing portions 11 and 21 with the heat radiation path 6. 8a and 8b are likewise the facing portion 1 with the heat radiation path 6.
Heat insulating layers 8c and 8d are provided on the contact surface between the heating element mounting portion 10 and the filler 7a other than the contact members 1 and 21 and the contact surface between the heat radiating member mounting portion 20 and the filler 7a, respectively. Filler 7, 7a
When heat is present, heat flows in and out of the heat-generating member mounting portion 10 and the heat-radiating member mounting portion 20 from other than the heat radiation path 6 via the fillers 7 and 7a. Decrease. Therefore, by providing the heat insulating layers 8a to 8d, the upper limit of the thermal resistance of the thermal resistance control device 1 can be increased.

FIG. 6 is a block diagram showing a third embodiment of the thermal resistance control device of the present invention.

In FIG. 6, components corresponding to those shown in FIG. 2 are denoted by the same reference numerals or symbols, and description thereof will be omitted.

Referring to FIG. 6, the heat-generating body mounting portion 10 and the heat-radiating body mounting portion 20 are directly connected to the support structure 30 without any heat insulating material.
a, 30b. Insulation material 31a
Through the support structures 30a, 3d.
The inflow and outflow of heat from Ob can be positively utilized. Although the upper limit value of the thermal resistance of the thermal resistance control device 1 is reduced, the lower limit value can be further reduced, so that it is possible to cope with a large heating device. Further, it is conceivable to use a metal such as copper or aluminum as the support structures 30a and 30b, and the strength and rigidity of the thermal resistance control device 1 can be further increased.

FIG. 7 is a block diagram showing a fourth embodiment of the thermal resistance control device according to the present invention.

In FIG. 7, components corresponding to those shown in FIG. 2 are denoted by the same reference numerals or symbols, and description thereof will be omitted.

Referring to FIG. 7, the support structure 30a is provided with a compression / deployment mechanism 9a using a spring or the like.
0b is provided with a compression / expansion mechanism 9b using a spring or the like. The compression mechanism of the compression / expansion mechanisms 9a and 9b includes a gap between the heating element mounting portion 10 and the good heat conductor 44 and a heat radiating member mounting portion 20.
The purpose of this is to reduce the gap between the heat conductor and the good heat conductor 44 to generate a contact surface pressure. In the example of FIG. 2, heat flows in and out of the heating element mounting portion 10 and the good heat conductor 44, and heat flows between the heat radiating member mounting portion 20 and the good heat conductor 44, respectively, through the fillers 7, 7a or radiation. , The heat generating element mounting portion 10 and the good heat conductor 44
In addition, the thermal resistance between the radiator mounting portion 20 and the good heat conductor 44 can be reduced. On the other hand, the expansion mechanisms of the compression / expansion mechanisms 9a and 9b are provided to facilitate movement of the good heat conductor 44 when changing the value of the thermal resistance of the thermal resistance controller 1. The compression / expansion mechanisms 9a and 9b normally operate on the compression side, so that power consumption can be prevented from occurring except when the value of the thermal resistance is changed.

FIG. 8 is a block diagram showing a fifth embodiment of the thermal resistance control device of the present invention.

In FIG. 8, components corresponding to those shown in FIG. 2 are denoted by the same reference numerals or symbols, and description thereof is omitted.

Referring to FIG. 8, the good heat conductor is a wedge-shaped good heat conductor 45, and the shape of the heating element mounting portion 10 side is made to match the shape of the wedge-shaped good heat conductor 45. Have been. In this case, the thermal resistance is controlled by changing the size of the wedge-shaped good heat conductor 45 between the heating element mounting portion 10 and the radiator mounting portion 20, instead of the ratio of the wedge-shaped good heat conductor 45. Things.

Although the shape of the heating element mounting portion 10 is matched to the shape of the wedge-shaped good heat conductor 45,
The same is true even if the shapes on the sides are matched.

[0048]

As described above, the thermal resistance control device of the present invention replaces the control of thermal resistance with the position control of a good heat conductor, thereby controlling the position of an external good heat conductor. This has the effect that the thermal resistance can be controlled.

Further, power for operating the driving device is required only when the resistance value of the thermal resistance is changed, and power consumption for maintaining the thermal resistance in any position state is not required. This has the effect of reducing the power used during operation.

[Brief description of the drawings]

FIG. 1 is a principle diagram of a thermal resistance control device of the present invention.

FIG. 2 is a block diagram showing one embodiment of the thermal resistance control device of the present invention.

FIG. 3 is a diagram illustrating an operation when the thermal resistance of the embodiment of FIG. 2 is small.

FIG. 4 is a diagram illustrating an operation of the embodiment of FIG. 2 when the thermal resistance is large.

FIG. 5 is a block diagram showing a second embodiment of the thermal resistance control device of the present invention.

FIG. 6 is a block diagram showing a third embodiment of the thermal resistance control device of the present invention.

FIG. 7 is a block diagram showing a fourth embodiment of the thermal resistance control device of the present invention.

FIG. 8 is a block diagram showing a fifth embodiment of the thermal resistance control device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermal resistance control apparatus 2 Heating element 3 Heat radiating element 4 Controller 5 Drive part 6 Heat radiating path 7, 7a Filler 8a, 8b, 8c, 8d Heat insulating layer 9a, 9b Compression / expansion mechanism 10 Heating element mounting part 11 Face part 12 Heating element Mounting surface 20 Heat radiator mounting portion 21 Facing portion 22 Heat radiator mounting surface 30a, 30b Support structure 31a, 31b, 31c, 31d Heat insulating material 32 Sealing material 42 Shaft 43 Heat insulating material 44 Good heat conductor 45 Wedge type good heat conductor

Claims (9)

[Claims] 1. A heat radiation path between a heating element and a heat radiator, wherein a position of a good heat conductor moving in the heat radiation path is electrically controlled from the outside to control the heat radiation of the good heat conductor. A thermal resistance control device, wherein the thermal resistance of the heat radiating path is controlled by changing the occupation ratio of the heat radiating path. 2. A heating element mounting portion, a heat radiating member mounting portion, a first support structure connected to these mounting portions via first, second heat insulating materials, and third and fourth heat insulating materials. A box-shaped structure provided with a second support structure, wherein a first filler filled on the first support structure side;
A second filler filled on the second support structure side;
A heat radiation path surrounded by the first facing portion in contact with the first and second fillers and the heating element mounting portion and the second facing portion in contact with the heat radiating member mounting portion; A good heat conductor that moves, a shaft connected to the good heat conductor via a fifth heat insulating material, a drive unit that moves the shaft, and a controller that controls the drive unit are provided. Thermal resistance control device. 3. When a command is issued from the controller to the drive unit, the good heat conductor attached to the shaft via the fifth heat insulating material moves between the heat radiation paths. The thermal resistance of the heat radiation path is reduced by changing the ratio of the good heat conductor to the heat radiation path so that the ratio of the good heat conductor to the heat radiation path is maximized. 4. The thermal resistance control device according to claim 3, wherein the thermal resistance of the heat radiation path is increased by minimizing the occupancy of the good heat conductor. 4. A first and a second heat insulating member on the heat-generating body mounting portion other than the first and second facing portions with the heat-radiating path and on a contact surface between the heat-radiating body mounting portion and the first filler. Similarly, third and fourth heat insulating layers are provided on the heating element mounting portion other than the first and second facing portions with the heat radiation path and on the contact surface between the heat radiating member mounting portion and the second filler. The thermal resistance control device according to claim 2 or 3, wherein a layer is provided. 5. The heating element mounting portion and the heat radiating member mounting portion are directly mounted by first and second support structures without interposing the first, second, third, and fourth heat insulating materials. The thermal resistance control device according to claim 2 or 3, wherein 6. The first support structure is provided with a first spring structure.
The second support structure is provided with a second compression / expansion mechanism, and the first and second compression / expansion mechanisms are provided with a gap between the heating element mounting portion and the good heat conductor. The thermal resistance control device according to claim 2 or 3, wherein a gap between the heat radiator mounting portion and the good heat conductor is reduced to generate a contact surface pressure. 7. The wedge-shaped good heat conductor, wherein the good heat conductor is a wedge-shaped good heat conductor, and the shape of the heating element mounting portion is made to match the shape of the wedge-shaped good heat conductor. The thermal resistance control device according to claim 2 or 3, wherein 8. The wedge-shaped good heat conductor, wherein the good heat conductor is a wedge-shaped good heat conductor, and the shape of the radiator mounting portion is also made to match the shape of the wedge-shaped good heat conductor. The thermal resistance control device according to claim 2 or 3, wherein 9. The heat resistance control device according to claim 2, wherein the first and second fillers are removed, and the heating element mounting portion, the good heat conductor, A thermal resistance control device comprising thermal coupling by heat radiation in a gap between the radiator mounting portion and the good heat conductor.