JP2001210960A - Producing method for electronic circuit block - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a producing method for electronic circuit block, with which inexpensive production is enabled by molding a resin only at a desired spot on a substrate. SOLUTION: A substrate 4 is located, while packaging an electronic component 3 inside a metal die 2 having a space 1 for resin injection. Next, a resin 5 is injected into the space 1 for resin injection and after the resin 5 is solidified or cured, an electronic circuit block A molding and forming the resin 5 on the substrate 4 is taken out of the metal die 2. By injecting and molding the resin 5 in the space 1 for resin injection, the resin 5 can be molded only at a spot requiring insulation or moisture proofing on the substrate 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing an electronic circuit block by molding a resin on a substrate on which electronic components are mounted.

[0002]

2. Description of the Related Art A substrate 4 formed of a printed wiring board or the like.
When the electronic component 3 is mounted on the surface of the substrate 4, the portion where the electronic component 3 is mounted on the substrate 4 may be sealed with a resin 5 for use as an electronic circuit block A for insulation and moisture prevention. Is being done. In sealing the portion of the substrate 4 where the electronic component 3 is mounted with the resin 5, conventionally, the resin 5 is formed on a part of the substrate 4 as shown in FIG.

That is, the resin 5 is poured into the resin receiving container 16 from the opening on the upper surface while the resin receiving container 16 is used and a part of the substrate 4 is inserted into the resin receiving container 16.
The resin 5 is injected so that the liquid level of the resin 5 comes to a position for sealing the electronic component 3 mounted on the substrate 4. At this time, of the electronic components 3 mounted on the substrate 4, only the portion on which the high-voltage electronic component 3 a is mounted is located below the liquid level of the resin 5, and the low-voltage electronic component 3 b is located above the liquid level of the resin 5. It is like that. After the resin 5 is solidified or hardened in this state, the resin 5 is removed from the resin receiving container 16 to form the resin 5 at a location where the high-voltage electronic component 3a is mounted on the substrate 4, and the resin 5 is used to form the electronic component. An electronic circuit block sealing 3a can be obtained.

[0004]

In manufacturing an electronic circuit block by molding the resin 5 on the substrate 4 by the method shown in FIG. 10, the resin 5 is poured into a resin receiving container 16 and injected. Therefore, the boundary between the portion where the resin 5 is formed on the substrate 4 and the portion where the resin 5 is not formed is formed by the liquid level of the resin 5 in the resin receiving container 16. However, since the liquid surface of the resin 5 can be held only as a horizontal surface, a boundary between a portion where the resin 5 is formed on the substrate 4 and a portion where the resin 5 is not formed is formed as one flat surface.
Therefore, there is a case where the resin 5 must be molded to a portion where the substrate 4 is not necessary, and the unnecessary portion must be removed later by cutting the resin 5 or the like. In this case, the number of steps increases and the material loss increases. However, there is a problem that the manufacturing cost increases.

The present invention has been made in view of the above points, and provides a method of manufacturing an electronic circuit block which can be formed at a necessary portion of a substrate and can be manufactured at low cost. The purpose is to do so.

[0006]

According to a first aspect of the present invention, there is provided a method of manufacturing an electronic circuit block, comprising: mounting a substrate on which an electronic component is mounted in a mold having a resin injection space;
Next, the resin 5 is injected into the resin injection space 1, and after the resin 5 is solidified or cured, the electronic circuit block A formed by molding the resin 5 on the substrate 4 is taken out of the mold 2. Things.

According to a second aspect of the present invention, in the first aspect, the substrate 4 is arranged in the mold 2 such that the mounting position of the electronic component 3 is located in the space 1 for resin injection. Things.

According to a third aspect of the present invention, in the first aspect, the substrate 4 is arranged in the mold 2 such that only the mounting location of the high-voltage electronic component 3a is located in the resin injection space 1. It is assumed that.

According to a fourth aspect of the present invention, in the first to third aspects, the holding pin 6 is provided in the mold 2 so as to be movable in the axial direction thereof, and receives the injection pressure of the resin 5 at the tip end thereof. A pressure receiving surface 7 for retreating the substrate 6 is formed, and the tip of the holding pin 6 is brought into contact with the surface of the substrate 4 located in the space 1 for resin injection, thereby holding the substrate 4 in the space 1 for resin injection. When the resin 5 is injected into the space 1 and filled, the resin 5
Is applied to the pressure receiving surface 7 to retreat the holding pin 6.

A fifth aspect of the present invention is characterized in that, in the fourth aspect, the pressure receiving surface 7 of the holding pin 6 is formed as a tapered surface 7a.

According to a sixth aspect of the present invention, in the fourth aspect, the pressure receiving surface 7 of the holding pin 6 is formed as a round surface 7b.

According to a seventh aspect of the present invention, in the fourth to sixth aspects, when the mold 5 is opened and the electronic circuit block A is taken out of the mold 2 after the resin 5 has been solidified or cured, the resin injection space 1 is formed. In this case, the holding pin 6 which has been retracted is advanced by injecting the resin 5 into the electronic circuit block A, and the electronic circuit block A is protruded from the mold 2 by the advanced holding pin 6.

According to the invention of claim 8, the resin injection space 1 is injected into the resin injection space 1 from the resin injection port 8 provided in the mold 2 according to claims 1 to 7.
After the resin 5 is injected and filled, the resin injection port 8 is opened before the resin 5 is solidified or cured.

A ninth aspect of the present invention is characterized in that, in any of the first to eighth aspects, the injection of the resin 5 into the resin injection space 1 is performed while being controlled in a pulsed manner.

[0015] The invention of claim 10 is the invention of claims 1 to 9
Wherein an electrode 9 is provided on the mold 2 so as to face the space 1 for resin injection, and the resin 5 is injected into the space 1 for resin injection while measuring an electrical variable by the electrode 9. It is.

An eleventh aspect of the present invention is characterized in that a probe 10 is provided in a mold 2 and molding is performed while measuring characteristics of a predetermined circuit of a substrate 1 disposed in the mold 2 with the probe 10. It is assumed that.

[0017]

Embodiments of the present invention will be described below.

FIG. 1 shows an embodiment of the present invention. A mold 2 includes a pair of mold plates (upper mold and lower mold) 17 and 1.
The molding plates 19, 20 are provided with molding recesses 19, 20, respectively, and the mold plates 17, 18 are clamped to form the resin injection space 1 in the molding recesses 19, 20.
Is formed. One template 18 of mold 2
Is provided with a resin injection port 8, and the resin 5 is injected into the resin injection space 1 from the resin injection port 8.
In each of the mold plates 17 and 18 of the mold 2, accommodation recesses 21 and 22 are formed, respectively. By clamping the mold plates 17 and 18, the accommodation recesses 21 and 22 form a substrate accommodation space. 23 are formed.

On the other hand, the substrate 4 is formed of a printed wiring board or the like, has a circuit on the surface or an inner layer, and has the electronic components 3 mounted thereon. Here, the substrate 4 includes a high-voltage circuit section such as a power supply section and an output section, and a low-voltage circuit section. The high-voltage circuit section includes a high-voltage electronic component 3 a of the electronic components 3. The low voltage electronic component 3b among the electronic components 3 is mounted on the circuit portion.

In manufacturing the electronic circuit block A by molding and sealing the resin 5 at the place where the electronic component 3 of the substrate 4 is mounted, first, the mold 2 is opened and the mold plates 17 and 18 are opened. The substrate 4 is placed in between, and then the mold 2
The substrate 4 is set in the mold 2 by clamping the substrate 4 between the mold plates 17 and 18. At this time, the substrate 4 is arranged in the mold 2 such that the portion of the substrate 4 on which the electronic component 3 is mounted is located in the space 1 for resin injection. Here, in the embodiment of FIG. 1, among the electronic components 3, the substrate 4 on which the high-voltage electronic component 3a is mounted
Are located in the space 1 for resin injection, and the substrate 4 where the low-voltage electronic component 3b is mounted is located in the space 23 for accommodating the substrate. The resin injection space 1 is formed deeper than the height of the electronic component 3 protruding from the substrate 4, and the electronic component 3 is completely accommodated in the resin injection space 1.

After the substrate 4 is placed in the mold 2 as described above, the resin 5 is injected into the resin injection space 1 from the resin injection port 8 using an injection molding machine or the like. As the resin 5, a polyamide resin or the like can be used. Then, the resin 5 is injected and filled into the resin injection space 1, and the resin 5 is solidified or cured while maintaining the injection injection pressure. When the resin 5 is a thermoplastic resin, the mold 2 is cooled to solidify the resin 5, and when the resin 5 is a thermosetting resin, the mold 2 is cooled.
Is heated to cure the resin 5.

As described above, the resin 5 is injected and filled into the resin injection space 1 and solidified or hardened, so that the resin 5 is applied to the substrate 4 so as to cover the electronic components 3 arranged in the resin injection space 1. The substrate 4
Thus, an electronic circuit block A formed by molding the resin 5 can be obtained. The electronic circuit block A can be removed from the mold 2 by opening the mold 2 and separating the mold plates 17 and 18.

Here, in the embodiment shown in FIG.
Of the parts where the high-voltage electronic component 3a is mounted,
The low-voltage electronic component 3b is isolated in the substrate accommodating space 23 at the time of molding, and the resin 5 is not molded at the place where the low-voltage electronic component 3b is mounted. It is like that. The resin injection space 1 of the mold 2 is formed in a shape that covers only the high-pressure generating portion on which the high-voltage electronic component 3a is mounted, and is formed by the resin injection space 1 as shown in FIG. The resin 5 is formed on the substrate 4 in a shape covering only the high pressure generating portion,
The resin 5 is not molded in the low-pressure generating portion where the low-voltage electronic component 3b is mounted. By injecting and molding the resin 5 into the resin injection space 1 in this manner, the resin 5 can be molded on the substrate 4 only at necessary places. This eliminates the need to remove 5 by cutting or the like.

FIG. 3 shows another example of the embodiment of the present invention, in which a holding pin 6 is mounted in a mold 2 so as to be slidable in its axial direction. That is, the template 1
Each of the slide holes 7 and 18 is provided with a slide hole 25 that opens into the molding recesses 19 and 20, respectively. It protrudes into 1). A locking projection 26 projects from the rear end of the holding pin 6, and communicates with the opposite side of the molding recesses 19 and 20 of the slide hole 25 to a locking hole 27 provided in the mold 2. By locking the locking projection 26, the retaining pin 6 is prevented from coming off. A stopper plate 2 is provided on the back of each of the template plates 17 and 18.
8 is attached, and a spring 29 is provided between the locking projection 27 and the locking pin 26 to close the locking hole 27. Accordingly, the holding pin 6 is moved by the spring 29 into the molding recesses 19, 2.
The holding pins 6 provided on the template plates 17 and 18 are disposed with their tips facing each other. Other structures are formed in the same manner as in FIG.

The tip of the holding pin 6 is connected to a pressure receiving surface 7.
It is formed as FIG. 4 (a) shows an example of the pressure receiving surface 7, in which the tip of the holding pin 6 is formed in a truncated cone shape, and the pressure receiving surface 7 is formed as a tapered surface 7a inclined downward toward the rear. It is like that. FIG. 4B shows another example of the pressure receiving surface 7, in which the tip of the holding pin 6 is formed in a hemispherical shape, and the pressure receiving surface 7 is convexly curved rearward and is inclined downward. 7b.

Then, the mold 2 is opened, the substrate 4 is arranged between the mold plates 17 and 18, and the mold 2 is clamped to mold the mold plates 17 and 18.
When the substrate 4 is set in the mold 2 by sandwiching the substrate 4 therebetween, as shown in FIG. 3A, the tip of the holding pin 6 is placed on the surface of the substrate 4 located in the resin injection space 1. Are held in contact with each other by the biasing force of the spring 29, and the substrate 4 can be held between the holding pins 6 and held in the resin injection space 1. In this manner, the resin 5 is injected and injected into the resin injection space 1 from the resin injection port 8 while the substrate 4 is held in the resin injection space 1 by the holding pins 6. Resin 5 in resin injection space 1 without
Can be injected. When the resin injection space 1 is filled with the resin 5, the injection injection pressure P of the resin 5 acts on the pressure receiving surface 7 of the holding pin 6 as shown in FIG. Then, a force F in a direction to retract the holding pin 6 acts on the holding pin 6, and the holding pin 6
As shown in (b), the rearward locking projection 26 retreats against the force of the spring 29 until it comes into contact with the stopper plate 28. When the holding pins 6 are retracted in this way, the holding pins 6 are separated from the surface of the substrate 4, and the traces of the retraction of the holding pins 6 are filled with the resin 5, and the resin molded on the surface of the substrate 4 is formed. 5 has a hole at the holding pin 6
This prevents the substrate 4 from being exposed to the outside through this hole.

FIG. 5 shows another example of the embodiment in which the holding pin 6 is slidably mounted on the mold 2 so as to be slidable in the axial direction. The ejector plate 31 is provided behind the mold plate 17 of the mold 2. Is arranged. Ejector plate 3
Numeral 1 is moved and driven in a direction approaching and separating from the template 17, and is usually arranged at a position away from the template 17. Slide holes 25 and 32 are formed at positions opposing the template 17 and the ejector plate 31, and the holding pins 6 movably passed in the axial direction through the slide holes 25 and 32, and the leading ends thereof are formed into the molding recesses 19. It is projected inside. The locking projection 26 projecting from the rear end of the holding pin 6 communicates with the slide hole 32 on the side opposite to the template 17 and is locked by the locking hole 27 provided in the ejector plate 31. The holding pin 6 is prevented from coming off. A stopper plate 28 is mounted on the back surface of the ejector plate 31, and a stopper 29 is closed between the stopper plate 28 and a spring 29 is provided between the ejector plate 31 and the locking projection 26 of the holding pin 6. Accordingly, the holding pin 6 is urged by the spring 29 in a direction to protrude into the molding recess 19. Holding pin 6
A pressure receiving surface 7 similar to that shown in FIG.
Other configurations are the same as those in FIG.

In this case, molding can be performed in the same manner as in the case of FIG. That is, when the substrate 4 is set in the mold 2, as shown in FIG. 5A, the tip of the holding pin 6 is applied to the surface of the substrate 4 located in the resin injection space 1 by the urging force of the spring 29. In contact therewith, the substrate 4 can be held in the space 1 for resin injection. Next, when the resin 5 is injected and filled into the resin injection space 1 from the resin injection port 8, the injection injection pressure P of the resin 5 acts on the pressure receiving surface 7 of the holding pin 6 as shown in FIG. As shown in FIG. 5B, the force F in the direction of retracting the holding pin 6 acts, and the locking projection 26 at the rear end is
Retreat until it abuts.

After the resin 5 in the resin injection space 1 is solidified or hardened, the electronic circuit block A formed by molding the resin 5 on the substrate 4 is taken out of the mold 2 first. The mold is opened to separate the mold plates 17 and 18. At this time, the resin 5 of the electronic circuit block A is made to remain on the mold plate 17 at the side of the molding recess 19. Thereafter, when the ejector plate 31 is operated to move in the direction approaching the template 17, the holding pins 6 are moved as shown in FIG.
Is inserted deeply into the molding recess 19, and the molding recess 19
The resin 5 inside can be protruded by the holding pins 6, and the electronic circuit block A can be removed from the template 17. Thus, the electronic circuit block A can be taken out of the mold 2 by using the holding pins 6 as knockout pins.

FIG. 6 shows another example of the embodiment of the present invention, and the configuration of the mold 2 and the like is the same as in each of the above embodiments. In this embodiment, the resin injection space 1 is sealed by matching the resin injection port 8 of the mold 2 with the injection nozzle 34 of the injection molding machine.
After the resin 5 is injected and filled into the resin injection space 1 through the through hole, and after the resin 5 is filled into the resin injection space 1 as described above, before the resin 5 is solidified or cured, the injection nozzle 34 is connected to the resin injection port. 8. Then, when the injection nozzle 34 is detached and the resin injection port 8 is opened to open the resin injection space 1, the resin 5 in the molten state in the resin injection space 1 is pressed by the internal negative pressure into the resin injection port 8. Air is drawn in from the space 8, whereby a space 35 is formed in the resin 5. The volume of the resin 5 can be reduced, and the space is formed between the electronic components 3 mounted on the substrate 4. This space part 35 which becomes
Thus, the capacitance of the entire molding resin 5 can be reduced.

Here, the place where the electronic component 3 is mounted on the substrate 4 is arranged in the resin injection space 1, and the electronic component 3 is mounted when the resin 5 is injected and injected into the resin injection space 1. Since the void volume in the resin injection space 1 is different between the portion and the unmounted portion, if the resin 5 is injected into the resin injection space 1 at a high flow rate at a constant flow rate, the portion having a small void volume fills quickly. As a result, the space 1 for resin injection cannot be gradually and uniformly filled with the resin 5, and air is easily trapped.

In the present invention, in such a case, the flow rate of the resin 5 injected into the resin injection space 1 per hour (that is, the injection speed) is increased or decreased at predetermined time intervals, and as shown in FIG. Is performed while performing control to change to. When the injection of the resin 5 into the resin injection space 1 is changed in a pulsed manner, the resin injection space 1 is gradually and uniformly filled with the resin 5 so that the liquid level of the resin 5 rises uniformly. It can prevent air from being entrained.

FIG. 8 shows another example of the embodiment of the present invention, in which molding recesses 19 and 20 (that is, resin injection space 1) are formed on mold plates 17 and 18 of mold 2, respectively. And an electrode 9 is provided. Each of the electrodes 9 is electrically connected to a measuring instrument 37 such as a capacitance measuring instrument. Mold 2
An adjustment pin 38 is inserted into a slide hole 39 provided in the mold plate 17 so as to be able to advance and retreat in the axial direction, and the tip of the adjustment pin 38 projects into the resin injection space 1. Other configurations are substantially the same as those of the above embodiments.

In this apparatus, while injecting the resin 5 into the resin injection space 1, an electric variable such as the capacitance of the resin 5 in the resin injection space 1 which contacts the electrode 9 is measured by the measuring instrument 37. By adjusting the injection amount of the resin 5 into the resin injection space 1 so as to have a predetermined capacitance or the like, the electrical characteristics of the resin 5 molded on the substrate 4 can be adjusted to a predetermined value. Can be manufactured. Therefore, after molding the resin 5 on the substrate 4, man-hours such as cutting the resin 5 to adjust the electrical characteristics of the resin 5 to a predetermined value become unnecessary. At this time, by adjusting the amount of protrusion of resin 5 into resin injection space 1 by moving adjustment pin 38 forward and backward, the amount of resin 5 injected into resin injection space 1 is adjusted to adjust the capacitance. can do. Accordingly, by adjusting the injection amount of the resin 5 into the resin injection space 1 by moving the adjustment pin 38 forward and backward while measuring the capacitance with the measuring instrument 37 through the electrode 9 as described above, a predetermined amount is obtained. It is possible to adjust the injection filling amount of the resin 5 into the resin injection space 1 so that the capacitance becomes as described above. At this time, control may be performed such that the adjustment pin 38 is automatically moved forward and backward in accordance with an electric variable such as capacitance measured by the measuring instrument 37.

FIG. 9 shows another example of the embodiment of the present invention. In FIG.
Is provided. The probes 10 are arranged so that their tips protrude into the molding recesses 20 (that is, the resin injection space 1), and each probe 10 is electrically connected to an electric measuring instrument 37. Other configurations are substantially the same as those of the above embodiments.

In this example, the mold 2 is opened and the mold plate 1 is opened.
The substrate 4 is disposed between the mold plates 17 and 18 by clamping the mold 2 and placing the substrate 4 between the mold plates 17 and 18.
Is set in the mold 2, the tip of the probe 10 abuts on a circuit (not shown) formed on the surface of the substrate 4 in a portion located in the resin injection space 1, and the electrical characteristics of this circuit on the substrate 4 are changed. It can be measured by the electric measuring instrument 37. Then, while measuring the electrical characteristics of the circuit of the substrate 4, the resin 5 can be injected and filled into the resin injection space 1, solidified or cured, and further molded until it is released from the mold 2. Things. Therefore, it is not necessary to perform an inspection in a separate inspection step after the electronic circuit block A is manufactured, and the number of steps can be reduced.

[0037]

As described above, according to the method of manufacturing an electronic circuit block according to the first aspect of the present invention, a substrate on which electronic components are mounted is placed in a mold having a space for resin injection, and then the resin injection molding is performed. After injecting the resin into the space and the resin is solidified or cured,
Since the electronic circuit block formed by molding the resin on the board is taken out of the mold, the resin is injected into the space for resin injection and molded, so that it can be applied only to places where insulation, moisture proof, etc. are required. The resin can be molded, and there is no need to remove unnecessary portions of the resin by cutting or the like, so that the production can be performed at low cost.

According to a second aspect of the present invention, the substrate is arranged in the mold so that the mounting position of the electronic component is located in the resin injection space. The electronic component can be protected with resin.

According to the third aspect of the present invention, since the substrate is arranged in the mold so that only the mounting position of the high-voltage electronic component is located in the resin injection space, the high-voltage electronic component is mounted. The resin can be molded so as to cover the location, and the high-pressure generating portion can be protected by the resin.

According to a fourth aspect of the present invention, a holding pin is provided in a mold so as to be movable in the axial direction thereof, and a pressure-receiving surface is formed at a tip end of the holding pin for receiving the injection pressure of the resin to retreat the holding pin. The tip of the holding pin is brought into contact with the surface of the substrate located in the space for holding the substrate in the space for resin injection,
When the resin is injected into the space for resin injection and filled, the resin injection pressure is applied to the pressure receiving surface to retract the holding pins, so that the substrate is not displaced by the holding pins. It can be molded by injecting the resin into the resin injection space without causing any displacement on the substrate, and when the resin injection space is filled with the resin, the resin injection pressure Acts on the pressure receiving surface to retract the holding pin, and the trace of the retraction of the holding pin is filled with the resin, so that the substrate is not exposed to the outside.

According to the fifth aspect of the present invention, since the pressure receiving surface of the holding pin is formed as a tapered surface, it is possible to efficiently apply the resin injection pressure to the pressure receiving surface and generate a force for retracting the holding pin. The holding pin can be reliably retracted during molding.

According to the sixth aspect of the present invention, since the pressure receiving surface of the holding pin is formed as a rounded surface, the resin injection pressure can efficiently act on the pressure receiving surface to generate a force for retracting the holding pin. The holding pin can be reliably retracted.

According to a seventh aspect of the present invention, when the resin is solidified or hardened, the mold is opened and the electronic circuit block is taken out of the mold. The electronic circuit block is pushed out of the mold with the advanced holding pins, so the holding pins that hold the substrate in the space for resin injection are used as knockout pins, and the molded electronic circuit block is used. The mold can be released from the mold, and there is no need to separately provide a knockout pin, and the structure of the mold can be simplified.

According to the present invention, when the resin is injected from the resin injection port provided in the mold into the resin injection space, the resin is injected and filled into the resin injection space and before the resin is solidified or cured. Since the resin injection port is opened, when the resin injection space is opened after the resin is injected and filled, air from the resin injection port is applied to the molten resin in the resin injection space by the internal negative pressure. As a result, the space can be formed in the resin, and the electric variable such as the capacitance of the resin can be reduced.

According to the ninth aspect of the present invention, the resin injection into the resin injection space is performed while being controlled in a pulsed manner. Therefore, when the resin injection is changed in a pulsed manner, the liquid level of the resin becomes uniform. Thus, the space for resin injection can be gradually and uniformly filled with the resin so that the air can be prevented from being entrained.

According to a tenth aspect of the present invention, an electrode is provided on a mold facing the resin injection space, and the resin is injected into the resin injection space while measuring an electric variable by the electrode. Therefore, the amount of resin injected into the resin injection space can be adjusted according to the electrical variable, and an electronic circuit block in which the electrical characteristics of the resin molded on the substrate are set to a predetermined value can be manufactured. Things.

According to the eleventh aspect of the present invention, a probe is provided in a mold, and molding is performed while measuring characteristics of a predetermined circuit of a substrate disposed in the mold with the probe. The circuit can be inspected, and it is not necessary to perform the inspection in a separate inspection step.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an embodiment of the present invention.

FIG. 2 is a perspective view of a circuit block according to the embodiment.

3A and 3B show another example of the embodiment of the present invention, wherein FIG. 3A is a cross-sectional view and FIG. 3B is a partial cross-sectional view.

FIGS. 4A and 4B show a holding pin in the embodiment, and FIGS. 4A and 4B are partially enlarged front views.

FIG. 5 shows another example of the embodiment of the present invention, and (a) to (c) are partial cross-sectional views.

FIG. 6 is a sectional view showing another example of the embodiment of the present invention.

FIG. 7 is a diagram illustrating pulsed resin injection according to another example of the embodiment of the present invention.

FIG. 8 is a cross-sectional view showing another example of the embodiment of the present invention.

FIG. 9 is a sectional view showing another example of the embodiment of the present invention.

FIG. 10 is a sectional view showing a conventional example.

[Explanation of symbols]

 Reference Signs List 1 space for resin injection 2 mold 3 electronic component 3a high-voltage electronic component 4 substrate 5 resin 6 holding pin 7 pressure receiving surface 7a tapered surface 7b radius surface 8 resin injection port 9 electrode 10 probe

Claims (11)

[Claims] 1. A substrate on which electronic components are mounted is placed in a mold having a space for resin injection, and then the resin is injected into the space for resin injection. After the resin is solidified or cured, the resin is molded on the substrate. A method for manufacturing an electronic circuit block, comprising taking out the formed electronic circuit block from a mold. 2. The method for manufacturing an electronic circuit block according to claim 1, wherein the substrate is arranged in the mold so that the mounting position of the electronic component is located in the space for resin injection. 3. The method of manufacturing an electronic circuit block according to claim 1, wherein the substrate is arranged in the mold such that only the mounting portion of the high-voltage electronic component is located in the resin injection space. 4. A holding pin is provided in a mold so as to be movable in an axial direction thereof, and a pressure receiving surface for retreating the holding pin by receiving a resin injection pressure is formed at a tip end thereof, and is located in a resin injection space. The tip of the holding pin is brought into contact with the surface of the substrate to hold the substrate in the resin injection space, and when the resin is injected and filled in the resin injection space, the resin injection pressure is applied to the pressure receiving surface. 4. The method of manufacturing an electronic circuit block according to claim 1, wherein the holding pins are retracted. 5. The method according to claim 4, wherein the pressure receiving surface of the holding pin is formed as a tapered surface. 6. The method according to claim 4, wherein the pressure receiving surface of the holding pin is formed as a round surface. 7. When the mold is opened and the electronic circuit block is taken out of the mold after the resin is solidified or hardened, the holding pin, which has been retracted by injecting the resin into the resin injection space, is moved forward and moved forward. The method for manufacturing an electronic circuit block according to claim 4, wherein the electronic circuit block is protruded from the mold by the holding pin. 8. Injecting a resin into a resin injection space from a resin injection port provided in a mold, after filling the resin injection space with the resin, and before solidifying or hardening the resin, the resin injection port is closed. The method for manufacturing an electronic circuit block according to claim 1, wherein the electronic circuit block is opened. 9. The method for manufacturing an electronic circuit block according to claim 1, wherein the injection of the resin into the resin injection space is performed while controlling it in a pulsed manner. 10. An electrode is provided on a mold facing the resin injection space, and the resin is injected into the resin injection space while measuring an electrical variable by the electrode. 10. The method for manufacturing an electronic circuit block according to any one of items 9 to 9. 11. A mold is provided with a probe, and molding is performed while measuring characteristics of a predetermined circuit of a substrate disposed in the mold with the probe.
The method for manufacturing an electronic circuit block according to any one of the above.