JP2001208703A - X-ray inspection apparatus - Google Patents

X-ray inspection apparatus

Info

Publication number
JP2001208703A
JP2001208703A JP2000021650A JP2000021650A JP2001208703A JP 2001208703 A JP2001208703 A JP 2001208703A JP 2000021650 A JP2000021650 A JP 2000021650A JP 2000021650 A JP2000021650 A JP 2000021650A JP 2001208703 A JP2001208703 A JP 2001208703A
Authority
JP
Japan
Prior art keywords
image
adhesive
ray
inspected
threshold value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000021650A
Other languages
Japanese (ja)
Inventor
Tomohito Yamaguchi
朋仁 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000021650A priority Critical patent/JP2001208703A/en
Publication of JP2001208703A publication Critical patent/JP2001208703A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To solve such a problem that the binarized image of the adhesion state of an adhesive can not be accurately obtained according to circumstances by the effect of the copper pattern of a printed circuit board or the like in the case where an original image is binarized when the adhesion state of the adhesive state of an object to be inspected is inspected by an X-ray transmission image. SOLUTION: The length and breadth dimension, the number of rows and lines and the diameter of the adhesion state of the adhesive of the object to be inspected are set on the basis of an X-ray original image and, on the basis of these set values, a square mask frame is formed on the X-ray original image displayed on the screen of a computer. The mask frame is arranged at a proper position so that it is received in the adhesion part of the X-ray original image.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリント基板実装
電子部品の検査においてX線非破壊検査において用いら
れるX線検査装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an X-ray inspection apparatus used for X-ray nondestructive inspection in inspection of electronic components mounted on a printed circuit board.

【0002】[0002]

【従来の技術】従来、プリント基板上の被検査対象物の
接着状態をX線透過画像により検査する際に、原画像を
2値化する場合、画像全体にあるひとつの任意の階調値
(しきい値)を境として、白色部と黒色部に振り分ける
2値化方法により、検査のための2値化画像を得てい
た。
2. Description of the Related Art Conventionally, when an original image is binarized when an adhesion state of an object to be inspected on a printed circuit board is inspected by using an X-ray transmission image, one arbitrary gradation value (the entire image) is used. The threshold value is used as a boundary, and a binarized image for inspection is obtained by a binarizing method in which the image is divided into a white portion and a black portion.

【0003】[0003]

【発明が解決しようとする課題】上記従来の画像の2値
化方法においては、X線により被検査対象物の接着剤の
接着状態を撮像した画像を正しく2値化することが出来
ない場合があった。
In the above-mentioned conventional image binarization method, there is a case where an image obtained by capturing an adhesion state of an adhesive on an object to be inspected by X-rays cannot be correctly binarized. there were.

【0004】図6はX線検査装置における被検査対象物
の接着剤の接着状態のX線原画像である。図9はその原
画像にあるひとつの任意のしきい値を境として、黒色部
と白色部に振り分けた2値化処理を施した2値化画像で
ある。図9のように画像の左下部においては、接着剤の
背景の濃淡が影響し、接着剤の接着状態が良好な2値化
画像として得られていないことが分かる。すなわち、プ
リント基板の銅のパターン等が影響し、被検査対象物の
背景の画像の濃淡が均一ではない場合があり、ひとつの
任意のしきい値を画像全体に適用し、画像を白色部と黒
色部に振り分ける2値化方法では検査に適した接着剤の
接着状態の2値化画像を得ることが出来なかったのであ
る。
FIG. 6 is an X-ray original image of the bonding state of the adhesive on the inspection object in the X-ray inspection apparatus. FIG. 9 is a binarized image that has been subjected to binarization processing in which the image is divided into a black portion and a white portion with one arbitrary threshold value in the original image as a boundary. As shown in FIG. 9, in the lower left portion of the image, it can be seen that the density of the background of the adhesive influences and the adhesive state of the adhesive is not obtained as a good binary image. In other words, the pattern of the copper on the printed circuit board affects the image density of the background image of the object to be inspected may not be uniform.One arbitrary threshold value is applied to the entire image, and the image is defined as a white portion. With the binarization method of distributing to the black portion, it was not possible to obtain a binarized image of the adhesive state suitable for the inspection.

【0005】本発明は、プリント基板の銅のパターン等
の影響によらず、被検査対象物の接着剤の接着状態を撮
像したX線画像を正しく良好な2値化画像の得ることの
できる2値化処理を実現し、良否判定可能な2値化画像
を得る画像処理手段を提供することを目的としている。
According to the present invention, an X-ray image obtained by capturing an adhesion state of an adhesive on an object to be inspected can be accurately obtained as a good binary image irrespective of the influence of a copper pattern or the like on a printed circuit board. It is an object of the present invention to provide an image processing unit that realizes a binarization process and obtains a binarized image from which pass / fail can be determined.

【0006】[0006]

【課題を解決するための手段】本発明は、上記目的を達
成するために、被検査対象物の接着剤の個々の接着部を
マスキングするマスキング部と、その個々のマスク枠内
の構成画像に適した個々のしきい値を決定するしきい値
決定部及び、その個々のしきい値を用いてマスク枠内の
構成画像を2値化する2値化処理部で構成される。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a masking section for masking an individual bonding portion of an adhesive of an object to be inspected, and a configuration image in each mask frame. It is composed of a threshold value deciding unit for deciding suitable individual threshold values, and a binarization processing unit for binarizing a constituent image in the mask frame using the individual threshold values.

【0007】[0007]

【発明の実施の形態】上記構成により、被検査対象物の
接着剤の個々の接着部をマスキングしたマスク枠内の構
成画像に適した2値化のしきい値を決定することで、プ
リント基板の銅のパターン等による画像の背景の濃淡に
よらず、良好な2値化画像を得ることが出来るものであ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS With the above arrangement, a printed circuit board is determined by determining a binarization threshold suitable for a constituent image in a mask frame in which individual adhesive portions of an adhesive of an inspection object are masked. A good binarized image can be obtained regardless of the density of the background of the image due to the copper pattern or the like.

【0008】(実施の形態)図1がX線検査装置におけ
る全体処理を記したフローチャートである。図2が被検
査対象物の接着剤の接着部を囲うマスク枠を作成するマ
スキング部のフローチャートである。図3が個々のマス
ク枠内の構成画像に適した2値化のしきい値を決定する
演算部のフローチャートである。図4が前述のしきい値
演算部により得られたしきい値により2値化を行う2値
化処理のフローチャートである。図5がX線検査装置の
構成図である。図6がX線により透過された被検査対象
物の原画像である。図7が前述のマスキング部により作
成された原画像上に配置されたマスク枠である。図8が
前述の2値化処理により原画像を2値化した2値化画像
である。
(Embodiment) FIG. 1 is a flowchart showing the overall processing in an X-ray inspection apparatus. FIG. 2 is a flowchart of a masking unit that creates a mask frame surrounding the adhesive portion of the inspection object. FIG. 3 is a flowchart of a calculation unit that determines a binarization threshold suitable for a constituent image in each mask frame. FIG. 4 is a flowchart of a binarization process for performing binarization based on the threshold value obtained by the above-described threshold value calculation unit. FIG. 5 is a configuration diagram of the X-ray inspection apparatus. FIG. 6 is an original image of the inspection object transmitted by X-rays. FIG. 7 shows a mask frame arranged on the original image created by the masking unit described above. FIG. 8 shows a binarized image obtained by binarizing the original image by the above-described binarization processing.

【0009】以下、本発明の実施の形態を各図に基づい
て説明する。
An embodiment of the present invention will be described below with reference to the drawings.

【0010】図5のように、パーソナルコンピュータ6
から検査ソフトウェアを起動後、検査装置内のプリント
基板2をティーチング操作によりX線撮像位置に被検査
対象物3を移動する。X線照射指示により、X線発生部
1からX線を照射すると、センサ5により映像信号とし
てパーソナルコンピュータ6のA/Dボード7に取り込
まれる。A/Dボード7でデジタル信号に変換された
後、それを12ビットの画像情報として取り込み、記憶
装置8に保管する。記憶された画像が表示装置9に表示
される。図6が表示装置上に表示されたX線原画像を表
す図である。
[0010] As shown in FIG.
After starting the inspection software, the inspection target 3 is moved to the X-ray imaging position by the teaching operation of the printed circuit board 2 in the inspection apparatus. When an X-ray is emitted from the X-ray generation unit 1 in accordance with the X-ray irradiation instruction, the X-ray is captured by the sensor 5 as an image signal into the A / D board 7 of the personal computer 6. After being converted into a digital signal by the A / D board 7, it is captured as 12-bit image information and stored in the storage device 8. The stored image is displayed on the display device 9. FIG. 6 is a diagram illustrating an X-ray original image displayed on the display device.

【0011】次に図1のマスキング部の詳細を図2のフ
ローチャートに基づいて説明する。表示装置上のX線原
画像に基づき、被検査対象物の接着剤の接着部が均等に
収まると予想される四角のマスク枠の縦横サイズを入力
する。次に、マスク枠の列行数及び、接着部の直径を設
定する。よって個々の接着剤の画像は略等面積に設定す
ることができる。前記入力値は被検査対象物の設計値に
より入力してもよい。次にマスク枠作成指示により、前
記入力済みのマスク枠縦横サイズ、列行数に基づき、表
示装置上のX線原画像上にマスク枠が表示される。次に
マスク枠移動指示によりマスク枠を個々の接着剤の接着
部に個々のマスク枠が均等の収まるように移動する。個
々の接着剤の接着部がマスク枠内に均等に収まらない場
合、設定済みのマスク枠縦横サイズ及び、列行数を再度
設定し、調整を行う。図7に示す格子状の目がX線原画
像上に配置された接着剤の接着部を収めたマスク枠であ
る。
Next, the details of the masking section of FIG. 1 will be described with reference to the flowchart of FIG. Based on the X-ray original image on the display device, the user inputs the vertical and horizontal sizes of a rectangular mask frame that is expected to uniformly fit the adhesive of the inspection object. Next, the number of rows and columns of the mask frame and the diameter of the bonding portion are set. Therefore, the images of the individual adhesives can be set to have substantially the same area. The input value may be input based on a design value of the inspection object. Next, in response to a mask frame creation instruction, a mask frame is displayed on the original X-ray image on the display device based on the input mask frame length and width and the number of rows and columns. Next, the mask frame is moved in accordance with the mask frame moving instruction so that the individual mask frames are evenly fitted in the bonding portions of the individual adhesives. If the bonding portions of the individual adhesives do not fit evenly within the mask frame, the set mask frame length and width and the number of rows and columns are set again and adjusted. The grid-like eyes shown in FIG. 7 are the mask frames containing the adhesive portions of the adhesive arranged on the original X-ray image.

【0012】次に図1のしきい値決定部の詳細を図3の
フローチャートに基づいて説明する。前述の作成された
個々のマスク枠内の画像を構成する画素の階調値(8ビ
ット、256階調)を階調値の最大値(255階調)か
ら最小値(0階調)へ順に変化させる。その変化時の階
調値kとマスク枠内の画像を構成する画素の階調値とを
比較し、画素の階調値が小さい場合を黒色部として黒色
部の個数nの足し込みを行う。マスク枠内の画像を構成
するすべての画素に対し、前記比較、足し込み処理を行
った後、前述の設定された接着部の直径により算出され
た面積を画素の個数sに変換し、その値と前記黒色部の
個数nとを比較し、足し込まれた黒色部の個数nがより
大きい場合、nをn’に記憶し、前記階調値との比較処
理を階調値kが0になるまで繰り返し行う。黒色部の個
数nが画素の個数s以下の場合、前記比較処理の繰り返
しを中断する。次に、画素の個数sと黒色部の個数nと
の差分の絶対値と、画素の個数sと前記記憶済みの黒色
部の個数n’の差分の絶対値の両者を比較し、画素の個
数sとより近い値を持つnまたはn’が算出された階調
値kまたは、k+1をマスク枠内のしきい値として記憶
する。この演算処理を個々のマスク枠すべてについて行
う。
Next, the details of the threshold value determining section of FIG. 1 will be described with reference to the flowchart of FIG. The gradation values (8 bits, 256 gradations) of the pixels constituting the image in each of the created mask frames are sequentially changed from the maximum gradation value (255 gradations) to the minimum value (0 gradations). Change. The gradation value k at the time of the change is compared with the gradation values of the pixels forming the image in the mask frame, and the number n of the black portions is added when the gradation value of the pixel is small. After performing the comparison and addition processing for all the pixels constituting the image in the mask frame, the area calculated by the set diameter of the bonding portion is converted into the number s of pixels, and the value is calculated. Is compared with the number n of the black portions. If the number n of the added black portions is larger, n is stored in n ′, and the comparison process with the gradation value is performed so that the gradation value k becomes 0. Repeat until it is. When the number n of black portions is equal to or less than the number s of pixels, the repetition of the comparison process is interrupted. Next, both the absolute value of the difference between the number s of pixels and the number n of black portions and the absolute value of the difference between the number s of pixels and the number n ′ of the stored black portions are compared, and the number of pixels The tone value k or k + 1 for which n or n ′ having a value closer to s is calculated is stored as a threshold value in the mask frame. This calculation process is performed for all the individual mask frames.

【0013】次に図1の2値化部の詳細を図4に基づき
説明する。前述のマスキング部により作成されたマスク
枠の個数回以下の処理を繰り返し行う。各マスク枠内の
構成画素の階調値と、前述のしきい値決定部により記録
された各マスク枠のしきい値とを比較し、そのしきい値
より大きい階調値の画素を白色部とし、そのしきい値以
下の階調値の画素を黒色部として画像処理を行う。この
比較処理をマスク枠内の画素すべてについて行う。図8
がX線原画像を2値化した画像である。
Next, the details of the binarizing section in FIG. 1 will be described with reference to FIG. The processing is repeated for the number of times equal to or less than the number of mask frames created by the masking unit. The gradation value of the constituent pixel in each mask frame is compared with the threshold value of each mask frame recorded by the above-described threshold value determination unit, and the pixel having a gradation value larger than the threshold value is compared with the white portion. Then, image processing is performed using pixels having a tone value equal to or less than the threshold value as a black portion. This comparison process is performed for all the pixels in the mask frame. FIG.
Is an image obtained by binarizing the original X-ray image.

【0014】このように実施の形態による2値化処理を
施せば、プリント基板の銅のパターン等による被検査対
象物の背景の画像の状態に影響されず、正しい2値化の
しきい値を算出でき、良好な2値化の画像を得ることが
出来る。
By performing the binarization processing according to the embodiment as described above, the correct binarization threshold value is not affected by the state of the background image of the inspection object due to the copper pattern or the like on the printed circuit board. It can be calculated and a good binarized image can be obtained.

【0015】[0015]

【発明の効果】以上の説明から明らかなように、本発明
によれば、プリント基板の銅パターン等に影響されず、
被検査対象物のそれぞれの接着剤の接着部に適切な2値
化のしきい値を算出でき、その2値化のしきい値をそれ
ぞれの接着剤の接着部の構成画素の階調値と比較し、黒
色部と白色部に振り分けることにより、良好な2値化画
像を得ることができ、また、良否判定精度の良いX線検
査装置を提供することができる。
As is clear from the above description, according to the present invention, the present invention is not affected by the copper pattern and the like of the printed circuit board.
An appropriate threshold value for binarization can be calculated for each adhesive bonding portion of the inspection object, and the binarization threshold value is calculated based on the gradation value of the constituent pixel of each adhesive bonding portion. By comparing and allocating to a black portion and a white portion, it is possible to obtain a good binary image and to provide an X-ray inspection apparatus with high accuracy of quality judgment.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態におけるX線検査装置の
全体処理フローチャート
FIG. 1 is an overall processing flowchart of an X-ray inspection apparatus according to an embodiment of the present invention.

【図2】本発明の一実施の形態におけるマスキング部の
フローチャート
FIG. 2 is a flowchart of a masking unit according to one embodiment of the present invention.

【図3】本発明の一実施の形態における2値化しきい値
決定部のフローチャート
FIG. 3 is a flowchart of a binarization threshold value determining unit according to the embodiment of the present invention;

【図4】本発明の一実施の形態における2値化部のフロ
ーチャート
FIG. 4 is a flowchart of a binarizing unit according to the embodiment of the present invention;

【図5】本発明の一実施の形態におけるX線検査装置の
構成図
FIG. 5 is a configuration diagram of an X-ray inspection apparatus according to an embodiment of the present invention.

【図6】プリント基板のX線原画像を表す図FIG. 6 is a diagram showing an original X-ray image of a printed circuit board;

【図7】本発明の一実施の形態におけるマスキング部に
より原画像上に作成されたマスク枠を表す図
FIG. 7 is a diagram illustrating a mask frame created on an original image by a masking unit according to an embodiment of the present invention.

【図8】本発明の一実施の形態におけるしきい値決定部
の2値化しきい値を用いて2値化部により画像処理を施
した、2値化画像を表す図
FIG. 8 is a diagram illustrating a binarized image that has been subjected to image processing by a binarization unit using a binarization threshold value of a threshold value determination unit according to an embodiment of the present invention.

【図9】従来のX線原画像全体を一定のしきい値を用い
て画像処理を施した、2値化画像を表す図
FIG. 9 is a diagram showing a binarized image obtained by performing image processing on a whole conventional X-ray original image using a fixed threshold value.

【符号の説明】[Explanation of symbols]

1 X線発生部 2 プリント基板 3 被検査対象物 4 接着剤 5 センサ 6 パーソナルコンピュータ 7 A/Dボード 8 記憶装置 9 表示装置 10 照射野 DESCRIPTION OF SYMBOLS 1 X-ray generation part 2 Printed circuit board 3 Inspection object 4 Adhesive 5 Sensor 6 Personal computer 7 A / D board 8 Storage device 9 Display device 10 Irradiation field

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 X線を照射するX線源と、被検査対象物
を透過したX線を検知するセンサと、前記被検査対象物
に塗布された複数の接着剤を個々の接着剤毎にマスキン
グするマスキング部を備えたX線検査装置。
An X-ray source for irradiating X-rays, a sensor for detecting X-rays transmitted through an object to be inspected, and a plurality of adhesives applied to the object to be inspected are separated for each individual adhesive. An X-ray inspection apparatus having a masking unit for masking.
【請求項2】 X線を照射するX線源と、被検査対象物
を透過したX線を検知するセンサと、前記接着剤を透過
したX線による画像の濃淡階調の閾値を決定する閾値設
定部とを有し、前記接着剤の画像毎に前記閾値を決定す
ることを特徴とするX線検査装置。
2. An X-ray source for irradiating X-rays, a sensor for detecting X-rays transmitted through an object to be inspected, and a threshold value for determining a threshold value of a gray scale of an image formed by the X-rays transmitted through the adhesive. An X-ray inspection apparatus, comprising: a setting unit, wherein the threshold value is determined for each image of the adhesive.
【請求項3】 X線を照射するX線源と、被検査対象物
を透過したX線を検知するセンサと、X線画像のうち前
記接着剤の部分の面積を予め決定する面積決定部と、前
記接着剤を透過したX線による画像の濃淡階調の閾値を
決定する閾値設定部とを有し、前記個々の接着剤の画像
が略等面積になるよう、前記閾値を決定することを特徴
とするX線検査装置。
3. An X-ray source for irradiating X-rays, a sensor for detecting X-rays transmitted through an object to be inspected, and an area determining unit for previously determining an area of the adhesive in an X-ray image. A threshold setting unit that determines a threshold value of a gray scale of an image formed by the X-rays transmitted through the adhesive, and determining the threshold so that the images of the individual adhesives have substantially the same area. Characteristic X-ray inspection equipment.
【請求項4】 X線を照射するX線源と、被検査対象物
を透過したX線を検知するセンサと、前記被検査対象物
に塗布された複数の接着剤の画像を個々の接着剤の画像
毎にマスキングするマスキング部と、前記接着剤を透過
したX線による画像の濃淡階調の閾値を決定する閾値設
定部とを有し、前記マスキング部によってマスキングさ
れた区分内毎に前記閾値を決定することを特徴とするX
線検査装置。
4. An X-ray source for irradiating X-rays, a sensor for detecting X-rays transmitted through an object to be inspected, and an image of a plurality of adhesives applied to the object to be inspected, A masking unit for masking each image, and a threshold setting unit for determining a threshold value of a gray scale of an image by X-rays transmitted through the adhesive, wherein the threshold value is set for each section masked by the masking unit. X characterized by determining
Line inspection equipment.
【請求項5】 X線を照射するX線源と、被検査対象物
を透過したX線を検知するセンサと、前記被検査対象物
に塗布された複数の接着剤の画像を個々の接着剤の画像
毎にマスキングするマスキング部と、X線画像のうち前
記接着剤の部分の面積を予め決定する面積決定部と、前
記接着剤を透過したX線による画像の濃淡階調の閾値を
決定する閾値設定部とを有し、前記個々の接着剤の画像
が略等面積になるよう、前記閾値を決定することを特徴
とするX線検査装置。
5. An X-ray source for irradiating X-rays, a sensor for detecting X-rays transmitted through an object to be inspected, and an image of a plurality of adhesives applied to the object to be inspected as individual adhesives. A masking section for masking each image, an area determining section for determining an area of the adhesive portion in the X-ray image in advance, and a threshold value of a gradation of an image by X-rays transmitted through the adhesive. An X-ray inspection apparatus, comprising: a threshold setting unit, wherein the threshold is determined so that the images of the individual adhesives have substantially the same area.
JP2000021650A 2000-01-31 2000-01-31 X-ray inspection apparatus Pending JP2001208703A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000021650A JP2001208703A (en) 2000-01-31 2000-01-31 X-ray inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000021650A JP2001208703A (en) 2000-01-31 2000-01-31 X-ray inspection apparatus

Publications (1)

Publication Number Publication Date
JP2001208703A true JP2001208703A (en) 2001-08-03

Family

ID=18548036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000021650A Pending JP2001208703A (en) 2000-01-31 2000-01-31 X-ray inspection apparatus

Country Status (1)

Country Link
JP (1) JP2001208703A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005003480A (en) * 2003-06-11 2005-01-06 Ishida Co Ltd X-ray examination apparatus
JP2007093343A (en) * 2005-09-28 2007-04-12 Shimadzu Corp X-ray inspection device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005003480A (en) * 2003-06-11 2005-01-06 Ishida Co Ltd X-ray examination apparatus
JP2007093343A (en) * 2005-09-28 2007-04-12 Shimadzu Corp X-ray inspection device
JP4742782B2 (en) * 2005-09-28 2011-08-10 株式会社島津製作所 X-ray inspection equipment

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