JP2001203061A - Heating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heating device that can improve the efficiency of the heating unit and heat the object more uniformly. SOLUTION: A radiation plate 21a is disposed opposite to the surface mount board 13. A sheath heater which heats the radiation plate 21a is disposed inside a radiation plate 21a. A plurality of projecting units 23a are disposed on the radiation plate 21a on the surface opposite to the surface 14 of the board carrying conveyor 12. Air holes 24a through which the supplied air is heated and supplied toward the surface of the surface mount board 13 are provided at the radiation plate 21a and the projecting unit 23a. The air holes 24a penetrate the radiation plate 21a and the projecting unit 23a. The surface of the surface mount board 13 is heated by conduction heat of the air heated in the air hole 24a by the heating of the sheath heater 22. The surface of the surface mount board 13 is also heated by the radiation heat of the far-infrared rays generated from the radiation plate 21a and all the surface of the projecting units 23a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a heating device having a heat sink.

[0002]

2. Description of the Related Art Conventionally, as a heating device having a heat radiating plate, for example, a configuration shown in FIG. 4 is known.

A heating apparatus 1 shown in FIG.
And a plurality of heating elements 4 arranged side by side along the transfer path 3. A surrounding gas is supplied between the heating elements 4 on the side of the heating elements 4 facing the object to be heated 2. An air supply unit (not shown) for supplying the gas heated by the heating element 4 to the object to be heated 2 is provided.

The blowing means supplies the gas heated by the heating elements 4 to the object 2 to be transported on the transport path 3, and conducts the heat generated by the heating elements 4. The object to be heated 2 is heated by radiant heat of far infrared rays as heat rays.

[0005]

However, in the heating device 1 shown in FIG. 4, the gas heated by each heating element 4 is supplied to the object 2 by the blowing means, so that the object 2 is heated. Since heating is performed, the gas heated by each heating element 4 escapes to the outside, and it is not easy to efficiently supply the gas heated by each heating element 4 to the object 2 to be heated. It is not easy to improve the heating efficiency.

Further, since the heating efficiency differs between the position near each heating element 4 and between the heating elements 4, the heating efficiency differs depending on the location. For this reason, there is a problem that a temperature difference of the object to be heated 2 occurs in each place, and it is not easy to uniformly heat the object to be heated 2.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heating device that improves the heating efficiency of a heating element and heats an object to be heated more uniformly.

[0008]

According to a first aspect of the present invention, there is provided a heating apparatus, comprising: a radiator plate disposed to face an object to be heated; a heating element for heating the radiator plate; A protruding body protruding from a surface facing the object, and a ventilation hole provided to penetrate the heat sink and the protruding body, for heating supplied gas and supplying the gas to the object to be heated. Is what it is.

In this configuration, the gas supplied to the vent is heated in the vent. Here, the ventilation hole penetrates the radiator plate and the protrusion protruding from the surface of the radiator plate facing the object to be heated. Therefore, the gas supplied into the ventilation hole is heated in the projecting body after being heated in the radiator plate. Further, since the projecting body is provided on the heat sink, the surface area of the heat sink increases. For this reason, since the heat rays generated by the heat generated by the heating element are generated from the surfaces of the heat radiating plate and the protruding body, the radiant heat from the more heat rays heats the object to be heated. As a result, the conductive heat generated by the gas supplied to the ventilation holes and the heat rays generated from the surfaces of the heat radiating plate and the protruding body heat the object to be heated. The heating efficiency by the body is improved.

According to a second aspect of the present invention, in the heating apparatus according to the first aspect, the object to be heated is transported along a transport path, and the radiator plate is disposed along the transport path. .

In this configuration, the heat radiating plate is provided along the transport path for transporting the object to be radiated, so that the object to be transported along the transport path has a surface facing the object to be heated in the heat radiating plate. Heated throughout. Therefore, the heat radiating plate more efficiently heats the object to be heated and more uniformly heats the object to be heated.

According to a third aspect of the present invention, in the heating apparatus according to the first or second aspect, the heating element is disposed in a heat sink.

In this configuration, since the heating element is disposed in the heat sink, heat generated by the heating element is directly conducted to the heat sink and the protrusion. For this reason, since the heating element heats the radiator plate and the protruding body with higher thermal efficiency, the heating efficiency by the heating element is further improved.

According to a fourth aspect of the present invention, there is provided a heating device according to any one of the first to third aspects, further comprising a blowing means for supplying the gas heated by the heating element to the object to be heated through the ventilation hole. Is what it is.

In this configuration, the blowing means supplies gas to the vent, so that the gas heated in the vent is supplied to the object to be heated. Therefore, the blowing means reliably supplies the gas to the ventilation holes sequentially, so that the supply amount of the heated gas supplied to the object to be heated is increased and stabilized. Therefore, the object to be heated is more efficiently and uniformly heated, so that the heating efficiency of the heating element is further improved.

According to a fifth aspect of the present invention, in the heating device according to any one of the first to fourth aspects, the protrusion has a fin portion projecting from a tip of the protrusion.

In this configuration, since the fin portion is protruded from the tip of the projection, the surface area of the projection increases. For this reason, since the heat rays generated by the heat generated by the heating element are also generated from the surface of the fin portion, the object to be heated is heated by the radiant heat generated by more heat rays. Therefore, the heating efficiency by the heating element is further improved, and the object to be heated is more efficiently and uniformly heated.

According to a sixth aspect of the present invention, in the heating apparatus according to any one of the first to fifth aspects, the protrusion is formed integrally with the heat sink.

In this configuration, since the protruding body is formed integrally with the heat radiating plate, the heat conductivity of the heating element for heating the heat radiating plate is lower than that in the case where the protruding body is formed separately from the heat radiating plate. As a result, the heating efficiency of the heating element is further improved.

According to a seventh aspect of the present invention, in the heating device according to any one of the first to fifth aspects, the projecting body is formed separately from the heat radiating plate.

In this configuration, since the projecting body is formed separately from the heat sink, the ventilation hole of the projecting body is connected to the vent hole of the existing heat sink, and this projecting body is connected to the existing heat sink. If attached, the heating efficiency of the heating element that heats the existing radiator plate is improved.

The heating device according to an eighth aspect of the present invention is the heating device according to the seventh aspect, further comprising a plurality of protrusions, and the plurality of protrusions are attached to a surface of the heat sink facing the object to be heated. Each of the ridge blocks protrudes.

In this configuration, a plurality of projections are provided on the ridge block attached to the surface of the radiator plate facing the object to be heated, so that a plurality of ventilation holes are formed in the radiator plate. However, the projections are attached to each of the plurality of ventilation holes simply by connecting the ventilation holes of the projections to the ventilation holes of each of the heat radiation plates and attaching the ridge block. Installation work becomes easy.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a first embodiment of the heating device of the present invention will be described below with reference to FIG.

In FIG. 1, reference numeral 11a denotes a heating device. The heating device 11a is provided on a surface of a surface-mounted substrate 13 as an object to be heated which is conveyed by a substrate conveyance conveyor 12 as a substantially horizontally arranged conveyance path. This is an air reflow device of a hot air circulation system that heats and reflows a solder paste of an electrode part such as each electronic element (not shown) mounted while being mounted on the surface mounting board 13.

The heating device 11a includes a heat radiating plate 21a which is formed in a substantially flat shape from a material such as a metal having excellent thermal conductivity and is disposed substantially horizontally. This heat sink 2
1a is a surface treatment, that is, for example, a stainless steel plate coated with ceramics for generating far infrared rays as heat rays, and is a transfer surface 14 of the board transfer conveyor 12 of the surface mount board 13.
It is arranged along.

Further, a sheath heater 22 as a heating element is appropriately bent substantially horizontally, that is, embedded in the heat radiation plate 21a in a state of being arranged substantially horizontally. The sheath heater 22 is disposed inside the heat radiating plate 21a so as to meander at substantially constant intervals over substantially the entire area of the heat radiating plate 21a. In addition, the sheath heater 22 is
The heat generated by itself heats the entire radiator plate 21a.

Then, the surface mount substrate 1 on the heat sink 21a
On the lower surface of the heat radiating plate 21a, which faces the surface 3, a plurality of elongated cross-sectional rectangular projections 23a projecting toward the transport surface 14 of the substrate transport conveyor 12 that transports the surface-mounted substrate 13, that is, projecting downward. Are juxtaposed. Each of these protrusions 23a
It protrudes from the radiator plate between the sheathed heaters 22 and is formed integrally with the radiator plate 21a. In addition, each of these protrusions 2
3a is formed between the sheath heaters 22 alternately with the sheath heaters 22 provided inside the heat sink 21a. further,
Each of these protrusions 23a is provided on the surface mounting board of the heat sink 21a.
13 are formed at positions equidistantly separated on the surface facing 13. In addition, each of these protrusions 23a is
Heat is generated by the sheath heater 22 disposed therein and is heated via the heat radiating plate 21a.

Further, the heat radiating plate 21a is formed with a plurality of ventilation holes 24a penetrating the heat radiating plate 21a from above to below. Each of the ventilation holes 24a passes through a substantially central portion of each of the protrusions 23a from above the heat radiating plate 21a, and penetrates to the tip of each of the protrusions. In addition, each of these ventilation holes 24
a is a gas as an inert gas such as nitrogen located above the heat sink 21a is supplied to each ventilation hole 24a,
The gas is heated by the heat generated by the sheath heater 22 disposed in the heat radiating plate 21a, and the heated gas is blown downward to the lower side of the heat radiating plate 21a, and the gas is transferred to the substrate transport conveyor.
It is supplied to the surface mount substrate 13 on the substrate 12.

On the upper side of the radiator plate 21a, which is opposite to the transfer surface 14 of the substrate transfer conveyor 12, there is provided a blower for supplying gas to each of the ventilation holes 24a passing through the radiator plate 21a and the protruding body 23a. 31 are arranged. This blowing means
The 31 includes a fan 32 and a drive unit 33 such as an electric motor. The rotation of the fan 32 by the drive unit 33 blows gas downward. Further, the blowing means 31 includes a heat sink 21a.
And through each ventilation hole 24a of each protrusion 23a,
The gas heated in 24a is supplied to the surface mount substrate 13 on the substrate transport conveyor 12.

Next, the operation of the first embodiment will be described.

First, the surface mount substrate 13 is transported below the heat sink 21a by the substrate transport conveyor 12. At this time, the driving unit 33
The fan 32 is rotated by the drive of the heat sink 21a.
Is supplied into each ventilation hole 24a.

At this time, the sheath heater 22 in the heat sink 21a
The heat radiation plate 21a and each protruding body 23a are heated by the heat generated by the heat generation. Therefore, the gas supplied into each of the ventilation holes 24a is heated by the heat radiating plate 21a and each of the protrusions 23a when passing through each of the ventilation holes 24a.

Next, the gas heated in each ventilation hole 24a is supplied from the tip of the protruding body 23a to below the heat radiating plate 21a. Then, the surface of the surface mount substrate 13 transported by the substrate transport conveyor 12 below the heat radiating plate 21a is heated by the heat of conduction by the heated gas.

Further, the heat generated by the sheath heater 22 in the heat radiating plate 21a generates far-infrared rays as heat rays from the entire surface of the heat radiating plate 21a and each of the protrusions 23a. For this reason, since the far infrared rays irradiate the surface of the surface mounting substrate 13, the radiant heat due to the far infrared rays heats the surface of the surface mounting substrate 13.

As a result, the conductive paste of the heated gas and the radiant heat of the far-infrared ray reflow the solder paste of the electrode parts such as the electronic elements mounted on the surface of the surface mounting substrate 13. .

Thereafter, the gas supplied to the surface of the surface mount substrate 13 circulates through the heating device 11a, and is circulated again by the air blowing means 31.
The fan 32 sucks.

The reflowed surface mount board 13 is
Again, the substrate is transferred to the transfer end by the substrate transfer conveyor 12.

As described above, according to the first embodiment, since the radiator plate 21a and the respective projecting members 23a are heated by the sheath heater 22, the air is supplied into the respective ventilation holes 24a by the blowing means 31. The heated gas is heated when passing through each of the ventilation holes 24a, and then supplied toward the transport surface 14 from the tips of the respective projections 23a. Thus, the heat of conduction by the heated gas heats the surface of the surface mount substrate 13 transported by the substrate transport conveyor 12.

For this reason, since a plurality of projections 23a are formed on the heat radiating plate 21a, and the ventilation holes 24a pass through each of the heat radiating plates 21a and the projections 23a, the gas supplied into the ventilation holes 24a is: After being heated in the radiator plate 21a, it is heated in the protruding body 23a. Therefore, the heating efficiency of the sheath heater 22 when heating the surface of the surface mount substrate 13 can be improved, and the gas for heating the surface of the surface mount substrate 13 can be efficiently heated.

Further, since the far-infrared rays are generated from the entire surface of the heat radiating plate 21a and each of the protrusions 23a due to the heat generated by the sheath heater 22, the surface area of the heat radiating plate 21a is increased by forming the protrusion 23a on the heat radiating plate 21a. I do. Therefore, the amount of far-infrared rays generated by the heat generated by the sheath heater 22 can be increased. The radiant heat generated by far infrared rays is
Since the surface of the substrate 13 is heated, the heating efficiency of the sheathed heater 22 when heating the surface of the surface mount substrate 13 can be further improved.

As a result, the surface of the surface mount substrate 13 transported by the substrate transport conveyor 12 can be heated more uniformly than when the projecting body 23a is not formed on the heat sink 21a. It is possible to more accurately reflow the solder paste of the electrode portion such as each electronic element mounted on the surface.

Further, since the projecting body 23a is formed on the radiator plate 21a, the heating efficiency of the sheath heater 22 is improved, so that the solder paste of the electrode parts such as the electronic elements mounted on the surface of the surface mounting substrate 13 is formed. The amount of power required when reflowing is reduced. For this reason, the manufacturing cost when manufacturing the surface mount substrate 13 can be reduced.

Since the heat radiating plate 21a is provided along the transfer surface 14 of the substrate transfer conveyor 12, the heat radiating plate 21a
The surface of the surface mount substrate 13 transported by the substrate transport conveyor 12 can be heated over the entire surface facing the transport surface 14 in FIG. For this reason, the heat sink 21 with respect to the surface of the surface mount substrate 13
The heating efficiency of the sheath heater 22 can be improved because the heating efficiency of the sheath heater 22 is improved by the heating efficiency a and the protruding body 23a. Furthermore, since the heat radiating plate 21a is arranged along the transfer surface 14 of the board transfer conveyor 12, that is, along the surface of the surface mounting substrate 13, the heat radiating plate 21a and each protrusion 23a heat the surface of the surface mounting substrate 13 more uniformly. it can.

The sheath heater 22 is provided inside the heat sink 21a.
Is disposed, the heat generated by the sheath heater 22 is directly conducted to the heat radiating plate 21a.
Conducts heat to Therefore, the sheath heater 22 can more efficiently heat the radiator plate 21a and each protruding body 23a.
The heating efficiency of 22 can be improved.

Further, by providing the blowing means 31 for supplying gas to each ventilation hole 24a, the blowing means 31 reliably supplies gas to each ventilation hole 24a sequentially. For this reason, the supply amount of the gas for heating the surface of the surface mounting substrate 13 by the conduction heat can be increased and the gas supply can be stabilized. Therefore, since the surface of the surface mounting substrate 13 can be more efficiently and uniformly heated, the heating efficiency of the sheath heater 22 with respect to the surface of the surface mounting substrate 13 can be improved.

Further, since each projecting body 23a is formed integrally with the heat radiating plate 21a, compared with the case where each projecting body 23a is formed separately from the heat radiating plate 21a, the heat radiating plate 21a heated by the sheath heater 22 is provided. Improves the thermal conductivity when heating each protrusion 23a, so that the sheath heater 2 for each protrusion 23a
2 can improve the heating efficiency. Therefore, the surface mount substrate 1
The surface of 3 can be heated more efficiently.

Each projecting member is located at a position equally spaced on the surface of the radiator plate 21a facing the transfer surface 14.
Because of the formation of the protrusions 23a, the heat of conduction by the heated gas supplied from the tips of the protrusions 23a heats the surface of the surface mounting substrate 13 substantially uniformly. Therefore, the surface of the surface mount substrate 13 can be more uniformly heated.

In the first embodiment, the fan
The configuration in which the air blowing means 31 having the drive unit 32 and the driving unit 33 is disposed above the heat radiating plate 21a has been described. However, the present invention is not limited to such a configuration. Any configuration may be used as long as it can be supplied into the pores 24a and the surface of the surface mounting substrate 13 located below the heat sink 21a can be heated by the heat conducted by the gas.

Next, the configuration of the second embodiment of the present invention will be described with reference to FIG.

The heating device 11b shown in FIG. 2 is basically the same as the heating device 11a shown in FIG. 1, except that each projection 23b is formed separately from the heat radiating plate 21b.

Mounting holes having internal threads threaded on the inner periphery are formed on the sides of the heat radiation plate ventilation holes 41 penetrating through the heat radiation plate 21b, facing the conveying surface 14, ie, on both sides of the lower opening. 42b are respectively formed.

Further, a plurality of elongated rectangular projections 23b are provided in parallel at each of equally spaced positions on the side of the radiator plate 21b facing the transfer surface 14 of the substrate transfer conveyor 12. Each of the protrusions 23b is formed with a protrusion ventilation hole 43b that penetrates from above to below. Here, air holes 24b for supplying gas to the surface of the surface mount substrate 13
Has a heat sink ventilation hole 41 and a protruding body ventilation hole 43b.

Further, at the base end of each projection 23b, that is, at the outer edge of the opening on the side connected to the heat sink 21b, these projections 2
A pair of mounting pieces 44 projecting along the longitudinal direction toward the width direction in 3b are formed. Each of the mounting pieces 44 is formed with an insertion hole 46b having a diameter dimension through which the tip of the bolt 45 passes.

An elongated rectangular flat plate protruding along the longitudinal direction in one width direction of each of the protrusions 23b, that is, in the same direction, is provided at the tip of each of the protrusions 23b, that is, at the outer edge of the opening located on the lower side. Each of the fin portions 51 is formed. The fin portions 51 are formed substantially flush with each other and substantially parallel to the transfer surface 14 of the substrate transfer conveyor 12. In addition, each of these fin portions 51
Is generated by the heat generated by the sheath heater 22 in the heat sink 21b because the surface area of the protrusion 23b is increased by attaching the protrusion 23b to the heat sink 21b as compared with the protrusion 23a having no fin portion 51. Increases the amount of far infrared rays generated.

Each of the protrusions 23b is connected to each of the protrusions 2b.
3b With the tips of the bolts 45 inserted through the respective insertion holes 46b, the tips of the bolts 45 are tightened into the mounting holes 42b of the heat sink 21b, so that the heat sink ventilation holes 41 and the respective projecting body ventilation holes
43b and is attached to the heat sink 21b.

Next, the operation of the second embodiment will be described.

The operation of the heating device 11b shown in FIG. 2 is basically the same as that of the heating device 11a shown in FIG.

As described above, in the above-described second embodiment, the conduction heat of the gas that has passed through the inside of each vent hole 24b and is heated by the far-infrared ray generated from the surface of the heat radiating plate 21b and each of the protrusions 23b. The surface of the surface mount substrate 13 is heated by the radiant heat of the heating device 11a, so that the same effect as the heating device 11a shown in FIG. 1 can be obtained.

The surface area of each projection 23b is increased by projecting the fin portion 51 at the tip of each projection 23b.
Therefore, far-infrared rays generated by heat generation of the sheath heater 22 are also generated from the surface of the fin portion 51. Therefore, more far-infrared rays are generated, and the surface of the surface-mounted board 13 is heated by radiant heat generated by the far-infrared rays.
The surface of 13 can be heated more efficiently.

Further, since the entire fin portion 51 is formed substantially flush with and opposed to the transfer surface 14 of the substrate transfer conveyor 12, far infrared rays generated from the surface of each fin portion 51 are transmitted to the transfer surface 14. The substrate transfer conveyor 12
Thus, the surface of the surface mounted substrate 13 transported can be heated more uniformly.

The fins 51 of each projection 23b are formed in the same direction, so that the surface of the surface mounting substrate 13 transported by the substrate transport conveyor 12 under these projections 23b is removed. More uniform heating.

Further, since the heat radiating plate 21b and each of the protrusions 23b are formed separately, even if the existing heat radiating plate 21b is used,
A mounting hole 42b is formed in the heat radiating plate 21b, and the heat radiating plate ventilation hole 41 of the heat radiating plate 21b and the projecting body ventilation hole 43b of the projecting body 23b are communicated with each other. Since the projecting body 23b can be attached to the plate 21b,
The heating efficiency of the sheath heater 22 for heating the existing heat radiating plate 21b can be improved.

In the second embodiment, the configuration in which the fin portions 51 are formed on the respective protruding members 23b in the same direction has been described. However, the present invention is not limited to such a configuration.

Next, the configuration of the third embodiment of the present invention will be described with reference to FIG.

The heating device 11c shown in FIG. 3 is basically the same as the heating device 11b shown in FIG.
In this example, a ridge block 61 having a projection 3c is attached to a heat sink 21c.

A plurality of protrusions 23c are provided on a surface of the heat dissipation plate 21c facing the transfer surface 14 of the substrate transfer conveyor 12.
Is attached. This ridge block 61 is formed separately from the heat sink 21c,
The transfer surface 14 of the board transfer conveyor 12 on the heat sink 21c
And a block main body 62 formed in a substantially rectangular flat plate shape having substantially the same shape as the surface opposed thereto. In addition, a plurality of protrusions 23c are protruded from one plane of the block body 62.

Further, the block body 62 and the projecting body 23c
Each of the projections 23c has a projection ventilation hole 43c penetrating from the center of each projection 23c to the block body 62. Each of the protruding body ventilation holes 43c is formed at a position communicating with the radiating plate ventilation hole 41 of the radiating plate 21c in a state where the block body 62 is attached to the radiating plate 21c.

An insertion hole 46 having a diameter dimension into which the tip of the bolt 45 is inserted is located at a position near each corner of the surface of the block main body 62 facing the transfer surface 14 of the substrate transfer conveyor 12.
An opening c is formed. Here, at a position near each corner of the surface of the heat sink 21c facing the transfer surface 14 of the substrate transfer conveyor 12, a female screw is formed on the inner periphery and a mounting hole 42c into which a bolt 45 can be screwed is formed. ing.

The block main body 62 is inserted into the respective insertion holes 46c of the block main body 62 with the respective insertion holes 46c of the block main body 62 communicating with the respective mounting holes 42c of the heat sink 21c. After that, the mounting holes of each heat sink 21c
It is screwed to 42c and attached to the heat sink 21c.

Next, the operation of the third embodiment will be described.

The heating device 11c shown in FIG. 3 is basically the same as the operation of the heating device 11b shown in FIG.

As described above, in the third embodiment, by attaching the ridge block 61 to the radiator plate 21c, the gas is heated in the protrusion ventilation hole 43c of the ridge block 61, and the radiator plate is formed. Since the surface area of 21c is increased and the amount of generation of infrared rays is increased, the same effect as the heating device 11b shown in FIG. 2 can be obtained.

Further, in a state where the radiator plate ventilation holes 41 on the surface of the radiator plate 21c facing the transfer surface 14 of the substrate transfer conveyor 12 and the protrusion ventilation holes 43c of the ridge block 61 respectively communicate with each other, Just by attaching the ridge block 61 in which the 23c is unitized to the radiator plate 21c, even if a plurality of radiator plate vents 41 are formed in the radiator plate 21c, the ridge block 61 projects into each radiator plate vent 41 respectively. Since the body 23c can be attached, the work of attaching each projecting body 23c to the heat sink 21c can be facilitated.

In each of the above embodiments, each air hole 24
a, 24b, 24c, heat conduction by gas passing through
The surface of the surface mounting substrate 13 is heated by radiant heat generated by far infrared rays generated from the surfaces of 1a, 21b, 21c and each of the protrusions 23a, 23b, 23c. Although the air reflow device for reflowing the solder paste of the part has been described, the present invention is not limited to such a configuration. For example, the heating devices 11a, 11b, 11
c can also be applied as a pre-heater of a jet type soldering apparatus.

[0076]

According to the heating device of the first aspect, the gas supplied to the vent hole is heated in the vent hole of the heat radiating plate and then in the vent hole of the projecting body. Heat rays generated by the heat are generated from the surfaces of the radiator plate and the protruding body, and the object to be heated is heated by more radiant heat by far-infrared rays. Since the object to be heated can be more efficiently and uniformly heated by the radiant heat generated by the heat rays generated from the surface of the body, the heating efficiency of the heating element can be improved.

According to the heating device of the second aspect, in addition to the effect of the heating device of the first aspect, the radiating plate is disposed along the transport path, so that the surface of the radiating plate facing the object to be heated. Since the object to be heated is heated in the entire region, the radiator plate can more efficiently heat the object to be heated and more uniformly heat the object to be heated.

According to the heating device of the third aspect, in addition to the effect of the heating device of the first or second aspect, the heat generated by the heat generating member is disposed in the heat radiating plate, so that the heat generated by the heat generating member is reduced by the heat radiating plate and the protrusion. Since heat is directly conducted to the body, the heat radiating plate and the protruding body can be more efficiently heated by the heating element, so that the heating efficiency of the heating element can be further improved.

According to the heating device of the fourth aspect, in addition to the effect of the heating device of any one of the first to third aspects, when the blowing means supplies gas to the ventilation hole, the gas is heated in the ventilation hole. Since the gas is supplied to the object to be heated, the blowing means surely supplies the gas to the ventilation holes sequentially, so that the supply amount of the heated gas supplied to the object to be heated can be increased and stabilized. Can be more efficiently and uniformly heated, and the heating efficiency of the heating element can be further improved.

According to the heating device of the fifth aspect, in addition to the effects of the heating device of any one of the first to fourth aspects, when a fin portion is protruded at the tip of the protruding body, a heat ray due to heat generation of the heating element is generated. Since the heat is generated from the surface of the fin portion, the object to be heated is heated by radiant heat from more heat rays, so that the heating efficiency of the heating element can be further improved and the object to be heated can be more efficiently and uniformly heated.

According to the heating device of the sixth aspect, in addition to the effect of the heating device of any one of the first to fifth aspects, when the projection is formed integrally with the heat sink, the projection is separate from the heat sink. Since the heat conductivity to the protruding body when the heat radiating plate is heated is improved as compared with the case where the heat radiating plate is formed, the heating efficiency by the heat generating body can be further improved.

According to the heating device according to the seventh aspect, in addition to the effects of the heating device according to any one of the first to fifth aspects, when the protrusion is formed separately from the heat sink, the ventilation holes of the existing heat sink are provided. By connecting the ventilation holes of the protruding body to the protruding body, the protruding body can be attached to the existing heat radiating plate, so that the heating efficiency of the heating element for heating the existing heat radiating plate can be improved.

According to the heating device of the eighth aspect, in addition to the effect of the heating device of the seventh aspect, in addition to the effects of the heating device of the seventh aspect, a plurality of protruding members are protruded from the ridge block attached to the surface of the radiator plate facing the object to be heated. Therefore, even when a plurality of ventilation holes are formed in the heat radiating plate, if the ridge block is attached by connecting the ventilation holes of the protrusions to the respective ventilation holes of the heat radiating plate, a plurality of ventilation holes can be formed at once. Since the protrusion can be attached to the heat sink, the work of attaching the protrusion to the heat sink can be facilitated.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a part of a first embodiment of a heating device of the present invention.

FIG. 2 is a sectional view showing a part of a second embodiment of the present invention.

FIG. 3 is a sectional view showing a part of a third embodiment of the present invention.

FIG. 4 is an explanatory view showing a conventional heating device.

[Explanation of symbols]

 11a, 11b, 11c Heating device 12 Substrate transport conveyor as transport path 13 Surface mount substrates 21a, 21b, 21c as objects to be heated Radiator plate 22 Seed heaters 23a, 23b, 23c as heating elements Projections 24a, 24b, 24c Ventilation hole 31 Ventilation means 51 Fin part 61 Ridge block

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Fumihiro Yamashita 591-11 Kamihirose, Oaza, Sayama City, Saitama Prefecture Inside the Tamura FA System Co., Ltd. F-term in FA system (reference) 3K058 AA86 BA19 CE12 CE16 GA06

Claims (8)

[Claims] A heat radiating plate disposed to face the object to be heated; a heating element for heating the heat radiating plate; and a projecting member protruding from a surface of the heat radiating plate facing the object to be heated. And a ventilation hole provided through the heat radiating plate and the protruding body to heat the supplied gas and supply the gas to the object to be heated. 2. The heating apparatus according to claim 1, wherein the object to be heated is transported along a transport path, and wherein the radiator plate is disposed along the transport path. 3. The heating device according to claim 1, wherein the heating element is disposed in a heat sink. 4. The heating device according to claim 1, further comprising a blower for supplying a gas heated by the heating element through the ventilation hole to the object to be heated. 5. The heating device according to claim 1, wherein the protrusion has a fin portion protruding from a tip of the protrusion. 6. The heating device according to claim 1, wherein the protrusion is formed integrally with the heat sink. 7. The heating device according to claim 1, wherein the protruding body is formed separately from the heat radiating plate. 8. A plurality of protruding bodies, each of which is protruded from a ridge block attached to a surface of the radiator plate facing the object to be heated. 7. The heating device according to 7.