JP2001198784A - Method of grinding and polishing optical element - Google Patents

Method of grinding and polishing optical element

Info

Publication number
JP2001198784A
JP2001198784A JP2000008475A JP2000008475A JP2001198784A JP 2001198784 A JP2001198784 A JP 2001198784A JP 2000008475 A JP2000008475 A JP 2000008475A JP 2000008475 A JP2000008475 A JP 2000008475A JP 2001198784 A JP2001198784 A JP 2001198784A
Authority
JP
Japan
Prior art keywords
processing
optical element
polishing
fixed abrasive
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000008475A
Other languages
Japanese (ja)
Inventor
Tsukasa Nagayasu
司 永安
Atsushi Tomita
淳資 冨田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2000008475A priority Critical patent/JP2001198784A/en
Publication of JP2001198784A publication Critical patent/JP2001198784A/en
Pending legal-status Critical Current

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  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an optical element machining method capable of preventing the sludge of material for optical elements and abrasion grains from sticking onto the machined surface of the optical elements in grinding and polishing systems without a suction mechanism for sucking optical elements such as lenses or the like. SOLUTION: In grinding and polishing a lens 4, an optical element, by making the lens 4 abut on a fixed abrasive grain tool 1 to rotate the fixed abrasive grain tool 1 and pressing the lens 4 against the fixed abrasive grain tool 1 at a specified pressure, the machining heat generated between the lens 4 and the fixed abrasive grain tool 1 is reduced by changing machining conditions such as machining pressure and revolution in at least two stages, that is, machining the lens 4 at a lower machining pressure or at a lower revolution and further weakening the close adhesion strength between them. This can prevent the sludge of lens material and resin and the grain of the fixed abrasive grain tool from sticking onto the machine surface of the lens, improving the optical performance of the lens.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、固定砥粒工具を用
いたレンズ等の光学素子の研削・研磨加工方法に関し、
特に、レンズ等の光学素子の研削・研磨等の加工終了後
に、光学素子の被加工面に光学素子材料の主成分のスラ
ッジや固定砥粒工具の樹脂、砥粒等のスラッジが付着な
いしは固着することを防止することができる光学素子の
研削・研磨等の加工方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for grinding and polishing optical elements such as lenses using a fixed abrasive tool.
In particular, after processing such as grinding and polishing of an optical element such as a lens, sludge of a main component of the optical element material, resin of a fixed abrasive tool, and sludge such as abrasive grains adhere or adhere to the surface to be processed of the optical element. The present invention relates to a processing method, such as grinding and polishing of an optical element, which can prevent the occurrence of such a phenomenon.

【0002】[0002]

【従来の技術】従来、レンズ等の光学素子の研削・研磨
等の加工において、加工工具として、酸化セリウム等の
砥粒を樹脂系のボンドに混ぜ撹拌後に固めて加工面を光
学素子の形状に対応させて作製した固定砥粒工具が用い
られる場合がある。この種の固定砥粒工具は、通常一般
に使用される研磨パッドであるポリウレタンシートと比
較すると、ポーラス(気泡)含有率が数%であり非常に
緻密な組成となっており、そのために、所定の加工圧と
所定の回転数で加工した場合、固定砥粒工具の加工面と
光学素子の被加工面間の密着度が非常に高く、そして、
高速回転により光学素子の被加工面には相当の加工熱が
発生する。このような状態で研削・研磨等の加工がなさ
れたレンズ等の光学素子の被加工面には、レンズ材料の
スラッジや固定砥粒工具の砥粒等のスラッジが付着ない
しは固着し、光学素子の光学性能を低下させるという不
都合が生じることが知られている。
2. Description of the Related Art Conventionally, in processing such as grinding and polishing of an optical element such as a lens, abrasive grains such as cerium oxide are mixed with a resin-based bond as a processing tool, and then solidified after stirring to form a processed surface into the shape of the optical element. In some cases, a fixed abrasive tool prepared in correspondence with the tool is used. This type of fixed abrasive tool has a porous (bubble) content of several percent and a very dense composition as compared with a polyurethane sheet, which is a polishing pad generally used, and therefore has a predetermined density. When processing at a processing pressure and a predetermined number of rotations, the degree of adhesion between the processing surface of the fixed abrasive tool and the processing surface of the optical element is extremely high, and
Due to the high speed rotation, considerable processing heat is generated on the processing surface of the optical element. The sludge of the lens material or the sludge of the fixed abrasive tool adheres or adheres to the surface to be processed of the optical element such as the lens which has been subjected to processing such as grinding and polishing in such a state. It is known that inconvenience of deteriorating optical performance occurs.

【0003】このような固定砥粒工具を用いた光学素子
の研削・研磨等の加工において、光学素子の被加工面に
上記のような付着物が付着しないようにし、良好な光学
性能を得ることができる光学素子の研削・研磨等の加工
方法としては、特開平6−63856号公報に記載され
ているような加工方法が提案されている。
In processing such as grinding and polishing of an optical element using such a fixed abrasive tool, it is necessary to prevent the above-mentioned deposits from adhering to the surface to be processed of the optical element and obtain good optical performance. As a processing method such as grinding and polishing of an optical element that can be performed, a processing method described in JP-A-6-63856 has been proposed.

【0004】前記公報に記載された加工方法は、光学素
子を保持する保持部の回転ホルダーに光学素子を吸着保
持して加工工具から離脱させるための真空吸着機構を設
け、光学素子の加工時には、光学素子を回転ホルダーに
吸着することなく、光学素子を固定砥粒で作製した加工
工具に当接させ、加工工具の回転と上軸揺動により通常
の加工を行ない、所定の加工時間経過後であって加工工
具の回転中に、真空吸着機構を作動させて、回転ホルダ
ーに光学素子を吸着させ、光学素子の被加工面を回転し
ている加工工具から離脱させるようにし、固定砥粒で作
製した加工工具の回転中にレンズ等の光学素子を加工工
具から離脱させることで、光学素子の被加工面に、砥粒
等が埋没することがなく、さらに砥粒等が付着すること
もなく、光学性能の良好な光学素子が得られるとしてい
る。
In the working method described in the above publication, a vacuum suction mechanism for sucking and holding an optical element on a rotating holder of a holding portion for holding the optical element and detaching the optical element from a processing tool is provided. Without adsorbing the optical element to the rotating holder, the optical element is brought into contact with a processing tool made of fixed abrasive, and normal processing is performed by rotating the processing tool and swinging the upper shaft, and after a predetermined processing time has elapsed During the rotation of the processing tool, the vacuum suction mechanism is activated, the optical element is suctioned to the rotating holder, the processing surface of the optical element is separated from the rotating processing tool, and it is made with fixed abrasive. By removing the optical element such as a lens from the processing tool during the rotation of the processing tool, the processing surface of the optical element does not bury the abrasive grains and the like, and further, the abrasive grains and the like do not adhere. Optical performance It has a good optical element is obtained.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、前記公
報に記載された光学素子の研削・研磨等の加工方法で
は、固定砥粒工具の回転中に光学素子の被加工面を加工
工具から離脱させるために、光学素子を吸着保持するた
めの真空吸着機構を必要とするものであり、このような
真空吸着機構を有しない一般的な研削・研磨等の加工装
置では、固定砥粒工具の回転中に固定砥粒工具と光学素
子とを離脱させることは非常に難しく、前述した従来の
加工方法では、使用する加工装置および加工方式の選定
上、汎用性に欠けることが問題であった。
However, in the processing method such as grinding and polishing of an optical element described in the above-mentioned publication, the work surface of the optical element is separated from the processing tool during rotation of the fixed abrasive tool. In addition, a vacuum suction mechanism for holding the optical element by suction is required, and a general grinding / polishing processing apparatus that does not have such a vacuum suction mechanism is used during the rotation of the fixed abrasive tool. It is very difficult to separate the fixed abrasive tool from the optical element, and the conventional processing method described above has a problem that it lacks versatility in selecting a processing apparatus and a processing method to be used.

【0006】そこで、本発明は、上記の従来技術の有す
る未解決の課題に鑑みてなされたものであって、レンズ
等の光学素子を吸着する吸着機構を有しない研削・研磨
等の加工方式においても、光学素子の被加工面に光学素
子材料のスラッジや砥粒等のスラッジの付着ないしは固
着の発生を防止することができる光学素子の研削・研磨
加工方法を提供することを目的とするものである。
The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and is directed to a processing method such as grinding and polishing which does not have a suction mechanism for sucking an optical element such as a lens. Also, an object of the present invention is to provide a method of grinding and polishing an optical element that can prevent the generation or adhesion of sludge such as sludge or abrasive grains of an optical element material on a surface to be processed of an optical element. is there.

【0007】[0007]

【課題を解決するための手段】本発明者らは、光学素子
を吸着するための吸着機構を有しない研削・研磨等の加
工方式において、固定砥粒工具を用いてレンズ等の光学
素子を研削・研磨加工する際に、加工終了後に光学素子
材料や砥粒等のスラッジが光学素子の被加工面に付着な
いしは固着することを防止すべく鋭意検討したところ、
レンズ等の光学素子の被加工面に付着ないしは固着する
付着物は、固定砥粒工具による研削・研磨等の加工に際
して、固定砥粒工具と光学素子の被加工面間の密着度が
非常に高く、そして、固定砥粒工具の高速回転により光
学素子の被加工面には相当の加工熱が発生することによ
り、固定砥粒工具の加工面と光学素子の被加工面間に加
工進行の過程で残留した光学素子材料のスラッジや固定
砥粒工具の樹脂や砥粒等のスラッジが、固定砥粒工具の
停止と同時にあるいはその瞬時に被加工面に焼き付き現
象状に付着ないしは固着することを見出し、さらに、こ
れらの付着物を分析したところ、レンズ等の光学素子材
料の主成分が大半であり、これらの付着物は洗浄機等で
の洗浄では除去できないが、かみそりで抉ると除去する
ことができ、かつ除去後の被加工面には汚れやしみ等が
残らないことから、前記の焼き付き現象は軽度のもので
あると判断でき、これらのことから、加工時の固定砥粒
工具と被加工面の加工熱や密着度の低減を図ることで、
前記の焼き付け現象による光学素子材料等のスラッジの
付着ないし固着を防止することができることを見出し、
本発明を完成するに至ったものである。
Means for Solving the Problems The present inventors grind an optical element such as a lens using a fixed abrasive tool in a processing method such as grinding and polishing that does not have a suction mechanism for sucking an optical element. -When polishing, after extensive processing, to study whether to prevent sludge such as optical element material or abrasive grains from adhering or sticking to the surface to be processed of the optical element,
Deposits that adhere to or adhere to the processing surface of optical elements such as lenses have extremely high adhesion between the fixed abrasive tool and the processing surface of the optical element during processing such as grinding and polishing with a fixed abrasive tool. And, due to the high speed rotation of the fixed abrasive tool, considerable processing heat is generated on the processing surface of the optical element, so that the processing progresses between the processing surface of the fixed abrasive tool and the processing surface of the optical element. The sludge of the remaining optical element material and the resin and the abrasive of the fixed abrasive tool are found to adhere or stick to the surface to be machined at the same time or at the instant when the fixed abrasive tool is stopped, Furthermore, when these deposits were analyzed, the main components of the optical element materials such as lenses were mostly contained, and these deposits could not be removed by washing with a washing machine or the like, but could be removed by digging with a razor. ,And Since there is no dirt or stain left on the work surface after leaving, it is possible to judge that the seizure phenomenon is mild, and from these facts, it is possible to process the fixed abrasive tool and the work surface during processing. By reducing heat and adhesion,
It has been found that adhesion or sticking of sludge such as an optical element material due to the burning phenomenon can be prevented,
The present invention has been completed.

【0008】すなわち、本発明の光学素子の研削・研磨
加工方法は、光学素子の被加工面を固定砥粒工具に当接
させて、固定砥粒工具を回転させるとともに光学素子を
所定の加工圧で押し付けて光学素子を研削・研磨加工す
る光学素子の研削・研磨加工方法において、光学素子の
加工条件を少なくとも二段階に変更するようにし、加工
終了前の一定時間を、光学素子の被加工面と固定砥粒工
具との間に発生する加工熱や密着度を低減するような加
工条件に変更して加工することを特徴とする。
That is, in the method of grinding and polishing an optical element according to the present invention, the surface to be processed of the optical element is brought into contact with a fixed abrasive tool, the fixed abrasive tool is rotated, and the optical element is pressed at a predetermined processing pressure. In the grinding / polishing method for an optical element, in which the optical element is ground and polished by pressing the optical element, the processing conditions of the optical element are changed in at least two stages, and a certain time before the completion of the processing, the processing surface of the optical element It is characterized in that processing is performed by changing to processing conditions that reduce the processing heat and the degree of adhesion generated between the tool and the fixed abrasive tool.

【0009】また、本発明の光学素子の研削・研磨加工
方法は、光学素子の被加工面を固定砥粒工具に当接させ
て、固定砥粒工具を回転させるとともに光学素子を所定
の加工圧で押し付けて光学素子を研削・研磨加工する光
学素子の研削・研磨加工方法において、前記加工圧を少
なくとも二段階に変更して加圧するようにし、加工終了
前の一定時間を低加工圧で加工することを特徴とする。
In the method of grinding and polishing an optical element according to the present invention, the surface to be processed of the optical element is brought into contact with a fixed abrasive tool, the fixed abrasive tool is rotated, and the optical element is pressed at a predetermined working pressure. In the grinding / polishing method of an optical element, in which the optical element is ground and polished by pressing, the processing pressure is changed to at least two stages so that the pressure is increased, and the processing is performed at a low processing pressure for a certain time before the completion of the processing. It is characterized by the following.

【0010】本発明の光学素子の研削・研磨加工方法に
おいては、加工終了前の一定時間にかける低加工圧を、
加工装置の上軸構成部の自重ないしは自重以下に設定す
ることが好ましい。
In the method for grinding and polishing an optical element according to the present invention, a low processing pressure applied for a certain period of time before the completion of the processing is used.
It is preferable to set the weight of the upper shaft component of the processing apparatus to be equal to or less than its own weight.

【0011】さらに、本発明の光学素子の研削・研磨加
工方法は、光学素子の被加工面を固定砥粒工具に当接さ
せて、固定砥粒工具を回転させるとともに光学素子を所
定の加工圧で押し付けて光学素子を研削・研磨加工する
光学素子の研削・研磨加工方法において、前記固定砥粒
工具を回転させる回転数を少なくとも二段階に変更して
回転させるようにし、加工終了前の一定時間を低速の回
転数で加工することを特徴とする。
Further, in the method of grinding and polishing an optical element according to the present invention, the surface to be processed of the optical element is brought into contact with a fixed abrasive tool, the fixed abrasive tool is rotated, and the optical element is pressed at a predetermined processing pressure. In the grinding / polishing method of an optical element for grinding / polishing an optical element by pressing in such a manner that the number of rotations for rotating the fixed abrasive tool is changed in at least two stages and rotated, and a fixed time before the end of the processing. Is processed at a low rotation speed.

【0012】さらに、本発明の光学素子の研削・研磨加
工方法は、光学素子の被加工面を固定砥粒工具に当接さ
せて、固定砥粒工具を回転させるとともに光学素子を所
定の加工圧で押し付けて光学素子を研削・研磨加工する
光学素子の研削・研磨加工方法において、低温度に管理
された水あるいは低濃度の研磨液を光学素子と固定砥粒
工具の間に供給して、光学素子を研削・研磨加工するこ
とを特徴とし、前記水あるいは低濃度の研磨液の温度は
10℃以下に設定され管理されていることが好ましい。
Further, in the method of grinding and polishing an optical element according to the present invention, the surface to be processed of the optical element is brought into contact with a fixed abrasive tool, the fixed abrasive tool is rotated, and the optical element is pressed at a predetermined processing pressure. In the grinding / polishing method of an optical element in which the optical element is ground and polished by pressing with water, water or a low-concentration polishing liquid controlled at a low temperature is supplied between the optical element and a fixed abrasive tool, and the The element is ground and polished, and the temperature of the water or the low-concentration polishing liquid is preferably set and controlled at 10 ° C. or less.

【0013】[0013]

【作用】本発明の光学素子の研削・研磨加工方法によれ
ば、固定砥粒で作製した工具を使用したレンズ等の光学
素子の研削・研磨等の加工において、加工終了前の一定
時間に、加工圧を低圧化するまたは固定砥粒工具の回転
数を低速化するなど加工条件を変更することによって、
あるいは、水または低濃度の研磨液の液温を低温化する
ことによって、固定砥粒工具と光学素子との間で発生す
る加工熱を軽減でき、また、両者間の密着度を弱くする
ことができ、これにより、光学素子の被加工面に光学素
子材料のスラッジ、固定砥粒工具の樹脂や砥粒等のスラ
ッジが付着ないしは固着することを防止することがで
き、レンズ等の光学素子の研削・研磨加工において所定
精度の光学素子を確実に効率よく作製することができ
る。
According to the grinding / polishing method for an optical element of the present invention, in the processing such as grinding / polishing of an optical element such as a lens using a tool made of fixed abrasive grains, a predetermined time before the completion of the processing is obtained. By changing the processing conditions such as lowering the processing pressure or lowering the rotation speed of the fixed abrasive tool,
Alternatively, by lowering the temperature of water or a low-concentration polishing solution, the processing heat generated between the fixed abrasive tool and the optical element can be reduced, and the adhesion between the two can be reduced. This can prevent the sludge of the optical element material and the sludge of the resin and abrasive grains of the fixed abrasive tool from adhering or sticking to the surface to be processed of the optical element, and the grinding of the optical element such as a lens. In the polishing process, an optical element having a predetermined accuracy can be reliably and efficiently manufactured.

【0014】[0014]

【発明の実施の形態】本発明の実施の形態を図面に基づ
いて説明する。
Embodiments of the present invention will be described with reference to the drawings.

【0015】(第1の実施例)図1は、本発明の光学素
子の研削・研磨等の加工方法を実施するための加工装置
の概略構成図である。
(First Embodiment) FIG. 1 is a schematic configuration diagram of a processing apparatus for performing a processing method such as grinding and polishing of an optical element of the present invention.

【0016】図1において、1は固定砥粒で作製した研
削・研磨用の固定砥粒工具であり、具体的には、酸化セ
リウム等の砥粒を樹脂系のボンドに混ぜ撹拌後に固め加
工面をレンズ等の光学素子の形状に対応させて作製した
固定砥粒工具である。この固定砥粒工具1は、加工装置
の工具軸2に取り付けられ、主軸回転モーター3により
回転駆動され、通常は約2000rpmの速度で回転す
る。4は光学素子であるレンズであり、レンズ4を保持
するレンズホルダー5は、カンザシアーム7に保持され
るカンザシ6の先端突起部にセットされ、レンズ4を固
定砥粒工具1の加工面に当接させる。カンザシアーム7
は、不図示のモーターで駆動される分度器や偏心カム
(不図示)により揺動軸8を介して揺動して、レンズ4
を固定砥粒工具1上で円弧状に揺動させる。また、カン
ザシアーム7は、カンザシアーム7に取り付けられたエ
アーシリンダー9の作動により紙面上下方向に移動し、
カンザシ6を介してレンズ4を紙面上下方向に押圧ある
いは引圧(加工装置の上軸構成部の自重軽減用)駆動す
る。
In FIG. 1, reference numeral 1 denotes a fixed abrasive tool for grinding and polishing made with fixed abrasive grains. Specifically, abrasive grains such as cerium oxide are mixed with a resin-based bond, and after agitation, a solidified surface is formed. Is a fixed abrasive tool produced in accordance with the shape of an optical element such as a lens. The fixed abrasive tool 1 is attached to a tool shaft 2 of a processing apparatus, is rotationally driven by a spindle rotating motor 3, and normally rotates at a speed of about 2000 rpm. Reference numeral 4 denotes a lens which is an optical element. A lens holder 5 for holding the lens 4 is set on a tip end of a kansetsu 6 held by a kansashi arm 7 so that the lens 4 contacts the processing surface of the fixed abrasive tool 1. Contact Kansashi Arm 7
The lens 4 is swung by a protractor or an eccentric cam (not shown) driven by a motor (not shown) via a swing shaft 8.
Is swung in an arc shape on the fixed abrasive tool 1. In addition, the kansashi arm 7 moves in the vertical direction on the paper by the operation of the air cylinder 9 attached to the kansashi arm 7,
The lens 4 is pressed or pulled (in order to reduce the weight of the upper shaft component of the processing apparatus) in the vertical direction on the paper via the screw 6.

【0017】制御手段(コントローラ)10は、加工装
置の各種のモーターや加工圧を制御するものであり、本
実施例においては、レンズ4を研削・研磨する加工時間
の経過に応じて、加工圧を少なくとも二段階に変更する
ことができるように構成されており、エアーシリンダー
9に接続される電磁弁(不図示)を切り換えることによ
り、エアーシリンダー9の作動を制御する。すなわち、
制御手段10は、レンズの研削・研磨加工を、固定砥粒
工具の曲率半径精度の維持と加工時間の短縮を両立させ
ることができるような高加工圧での一次加工と、加工時
の密着度および加工熱を低減することができる低加工圧
での二次加工に分割して行なうことができるように制御
し、一次加工用としてのレギュレータとタイマー(不図
示)および二次加工用としてのレギュレータとタイマー
(不図示)を備えており、エアーシリンダー9に接続す
る電磁弁を適宜切り換えることができるように構成され
ている。
The control means (controller) 10 controls various motors and processing pressure of the processing apparatus. In the present embodiment, the processing pressure is controlled in accordance with the elapse of the processing time for grinding and polishing the lens 4. Is controlled in at least two stages, and the operation of the air cylinder 9 is controlled by switching a solenoid valve (not shown) connected to the air cylinder 9. That is,
The control means 10 performs the primary processing at a high processing pressure so that the maintenance of the radius of curvature of the fixed abrasive tool and the reduction of the processing time can be achieved at the same time, and the degree of adhesion during the processing. A regulator and timer (not shown) for primary processing and a regulator for secondary processing that are controlled so that they can be divided into secondary processing at a low processing pressure that can reduce processing heat And a timer (not shown), so that the electromagnetic valve connected to the air cylinder 9 can be appropriately switched.

【0018】制御手段10における一次加工用のレギュ
レータとタイマーは通常の高加工圧での研削・研磨加工
を行なうためのものであり、一次加工用のレギュレータ
により、加工圧を高加工圧に設定し、一次加工用のタイ
マーにより、高加工圧設定により所定のレンズの除去量
が得られる加工時間を設定する。そして、制御装置10
の二次加工用のレギュレータにより、加工圧を低加工圧
(例えば、加工装置の上軸構成部の自重による圧力ある
いはその自重以下の圧力)に設定し、加工熱の軽減に必
要な加工時間を二次加工用のタイマーで設定する。
The regulator and timer for the primary processing in the control means 10 are for performing grinding / polishing at a normal high processing pressure, and the processing pressure is set to a high processing pressure by the regulator for the primary processing. The timer for the primary processing sets the processing time during which a predetermined lens removal amount can be obtained by setting the high processing pressure. And the control device 10
The processing pressure is set to a low processing pressure (for example, the pressure due to the weight of the upper shaft component of the processing apparatus or a pressure less than the weight) by the secondary processing regulator, thereby reducing the processing time required to reduce the processing heat. Set with the secondary processing timer.

【0019】以上のように構成される加工装置におい
て、固定砥粒工具1を用いてレンズ4を加工する際に、
レンズ4を保持するレンズホルダー5をカンザシ6にセ
ットするとともにレンズ4を固定砥粒工具1の加工面に
当接させ、エアーシリンダー9によりカンザシ6を介し
てレンズ4を固定砥粒工具1に対して所定の加工圧で押
し付ける。そして、固定砥粒工具1を下軸回転モーター
3により所定の回転数をもって回転駆動させ、また、揺
動軸8とカンザシアーム7を介してレンズ4を固定砥粒
工具1の加工面上を円弧状に揺動させる。
In the processing apparatus configured as described above, when processing the lens 4 using the fixed abrasive tool 1,
The lens holder 5 holding the lens 4 is set on the wrench 6, the lens 4 is brought into contact with the processing surface of the fixed abrasive tool 1, and the lens 4 is fixed to the fixed abrasive tool 1 via the wrench 6 by the air cylinder 9. And press with a predetermined processing pressure. Then, the fixed abrasive tool 1 is rotationally driven at a predetermined number of revolutions by the lower shaft rotating motor 3, and the lens 4 is moved in a circle on the processing surface of the fixed abrasive tool 1 via the swing shaft 8 and the kansashi arm 7. Swing in an arc.

【0020】このとき、制御手段10の一次加工用のレ
ギュレータとタイマーにより、レンズ4は、エアーシリ
ンダー9を介して、固定砥粒工具1に対して高加工圧で
押し付けられ、固定砥粒工具1の曲率半径精度を維持し
つつ高加工圧での加工がタイマーに設定された所定の加
工時間で行なわれる。一次加工用のタイマーに設定され
た所定の加工時間の経過後で加工終了前に、二次加工用
のレギュレータにより図示しない電磁弁を切り換えるこ
とによって、エアーシリンダー9を介する加工圧を加工
時の密着度および加工熱を低減できる圧力、例えば、加
工装置の上軸構成部の自重による圧力あるいはその自重
以下の圧力とし、かつ二次加工用のタイマーで設定され
た時間だけ加工を行なう。
At this time, the lens 4 is pressed against the fixed abrasive tool 1 at a high working pressure via the air cylinder 9 by the primary working regulator and the timer of the control means 10. Is performed at a high processing pressure for a predetermined processing time set in a timer, while maintaining the curvature radius accuracy of. After a predetermined processing time set in the timer for the primary processing has elapsed and before the processing is completed, the solenoid valve (not shown) is switched by a regulator for the secondary processing, so that the processing pressure via the air cylinder 9 is brought into close contact with the processing. The processing is performed for a time set by a timer for secondary processing, with a pressure that can reduce the degree and processing heat, for example, a pressure due to the weight of the upper shaft component of the processing apparatus or a pressure equal to or less than the weight.

【0021】このように研削・研磨等の加工終了直前の
一定時間だけ二次加工用のレギュレータにより加工圧を
加工時の密着度および加工熱を低減することができる圧
力値(加工装置の上軸構成部の自重あるいはその自重以
下の圧力)とすることによって、レンズは、加工終了前
の一定時間だけ高加工圧での加工が解除され、その被加
工面側は、固定砥粒工具との密着が弱まると同時に加工
熱も軽減されあるいは排除される。その結果、固定砥粒
工具の加工面とレンズの被加工面との間に加工進行の過
程で残留したレンズ材料や砥粒等のスラッジが、加工終
了後に、レンズの被加工面に固体砥粒工具の停止と同時
にあるいは瞬時に焼き付き現象状に付着ないしは固着す
ることを防止することができる。
As described above, the processing pressure is reduced by the secondary processing regulator for a certain period of time immediately before the end of the processing such as grinding and polishing. By setting the weight of the component to its own weight or a pressure lower than its own weight), the lens is released from being processed at a high processing pressure for a certain period of time before the end of processing, and the surface to be processed is in close contact with the fixed abrasive tool. At the same time the heat of processing is reduced or eliminated. As a result, sludge such as lens material and abrasive particles remaining during the processing between the processing surface of the fixed abrasive tool and the processing surface of the lens becomes solid abrasive particles after the processing is completed. It is possible to prevent sticking or sticking in a seizure phenomenon at the same time or instantly when the tool is stopped.

【0022】次に、本実施例の具体例について加工サイ
クルを示す図2を用いて説明する。被加工材としてのガ
ラスブランクの材料はLaSF016であり、該ブラン
ク材の有効直径寸法は6.5mm、加工曲率半径は4.
1mmとした。研磨加工工程での固定砥粒工具の主軸回
転数は2000rpmとし、レンズホルダーは従属連れ
回り回転とする。
Next, a specific example of this embodiment will be described with reference to FIG. 2 showing a processing cycle. The material of the glass blank as the workpiece is LaSF016, the effective diameter of the blank is 6.5 mm, and the radius of curvature of the workpiece is 4.
1 mm. The main spindle rotation speed of the fixed abrasive tool in the polishing process is set to 2000 rpm, and the lens holder is driven to rotate in a subordinate manner.

【0023】そして、研磨加工のサイクルは、図2に例
示するように、研磨工程での一次加工は、加工圧が12
Nで、一次加工時間は120秒とした。そして、加工開
始から120秒経過後に、二次加工を行なうこととし、
加工圧を二次加工圧に切り換えて、2.5Nの低圧と
し、加工時間を20秒とした。
As shown in FIG. 2, the cycle of the polishing process is as follows.
At N, the primary processing time was 120 seconds. Then, after a lapse of 120 seconds from the start of processing, secondary processing is performed,
The working pressure was switched to the secondary working pressure to a low pressure of 2.5 N, and the working time was 20 seconds.

【0024】このように固定砥粒工具を使用して研磨加
工を行なうことにより、レンズの被加工面にレンズ材料
や砥粒等のスラッジが付着ないしは固着することがな
く、良好な光学性能を持つレンズを作製することができ
た。
By performing polishing using a fixed abrasive tool as described above, sludge such as lens material and abrasive grains does not adhere or adhere to the surface to be processed of the lens, and has good optical performance. A lens could be made.

【0025】また、固定砥粒工具を使用した研削・研磨
等の加工においての付着物の組成分析や加工プロセスに
ついて、加工を実施しその結果を検討した事例を図3に
図示する。図3は、固定砥粒工具での研磨加工における
加工圧(二次加工圧)とレンズの被加工面への付着物の
発生比率を表したものであり、二次加工において、低圧
方向での付着物発生率の低減が顕著であり、本事例での
付着物の発生率が0%になったのは、二次加工圧を3.
5N以下に設定したときであり、レンズの単位面積当た
りの二次加工圧においては、レンズの表面積が0.42
cm2 であるから、8.3×104 Pa以下に設定した
ときであった。
FIG. 3 shows an example in which the composition analysis and the processing process of the deposits in the processing such as grinding and polishing using a fixed abrasive tool are processed and the results are examined. FIG. 3 shows the processing pressure (secondary processing pressure) in the polishing process using a fixed abrasive tool and the ratio of the amount of deposits on the surface to be processed of the lens. The rate of occurrence of deposits is remarkably reduced, and the rate of occurrence of deposits in this case was 0% because the secondary processing pressure was 3.
5N or less, and the surface area of the lens is 0.42 at the secondary processing pressure per unit area of the lens.
cm 2 , so that it was set to 8.3 × 10 4 Pa or less.

【0026】(第2の実施例)次に、本発明の光学素子
の研削・研磨等の加工方法の他の実施例について説明す
る。本実施例においては、図1に図示する加工装置にお
ける制御手段の構成が前述した実施例と異なるけれど
も、その他の構成は前述した実施例と同様であるので、
図1を用いて説明する。
(Second Embodiment) Next, another embodiment of a processing method such as grinding and polishing of an optical element of the present invention will be described. In this embodiment, although the configuration of the control means in the processing apparatus shown in FIG. 1 is different from that of the above-described embodiment, the other configuration is the same as that of the above-described embodiment.
This will be described with reference to FIG.

【0027】本実施例における制御手段10は、固定砥
粒工具1を回転駆動する下軸回転モータ3を制御して、
固定砥粒工具1の回転数(回転速度)を少なくとも二段
階に変更させるように構成されており、研削・研磨加工
の一次加工においては、固定砥粒工具の曲率半径精度の
維持と加工時間の短縮を両立させることができるように
高速の回転速度に設定し、研削・研磨加工の二次加工に
おいては、研磨加工時の密着度および加工熱を低減する
ことができる低速の回転速度に設定するように、回転数
を制御するインバーターを備え、そして、一次加工およ
び二次加工の加工時間をそれぞれ設定する一次加工用の
タイマーと二次加工用のタイマーを備え、図示しないシ
ーケンサにより各々の加工時間毎に固定砥粒工具の回転
速度を切り換えるようにプログラムされている。
The control means 10 in the present embodiment controls the lower shaft rotation motor 3 for driving the fixed abrasive tool 1 to rotate.
The number of rotations (rotation speed) of the fixed abrasive tool 1 is configured to be changed in at least two steps. In the primary processing of the grinding / polishing processing, maintenance of the radius of curvature of the fixed abrasive tool and maintenance of the processing time are performed. Set a high rotation speed so that both shortening can be achieved, and set a low rotation speed that can reduce the degree of adhesion and processing heat during polishing in the secondary processing of grinding and polishing. In this way, an inverter for controlling the number of rotations is provided, and a timer for primary processing and a timer for secondary processing for setting the processing times of the primary processing and the secondary processing are provided. It is programmed to switch the rotation speed of the fixed abrasive tool every time.

【0028】以上のように構成される加工装置におい
て、固定砥粒工具1を用いてレンズ4を加工する際に、
レンズ4を保持するレンズホルダー5をカンザシ6にセ
ットするとともにレンズ4を固定砥粒工具1の加工面に
当接させ、エアーシリンダー9によりカンザシ6を介し
てレンズ4を固定砥粒工具1に対して所定の加工圧で押
し付ける。そして、固定砥粒工具1を下軸回転モーター
3により所定の回転数をもって駆動回転させ、また、揺
動軸8とカンザシアーム7を介してレンズ4を固定砥粒
工具1の加工面上を円弧状に揺動させる。
In the processing apparatus configured as described above, when processing the lens 4 using the fixed abrasive tool 1,
The lens holder 5 holding the lens 4 is set on the wrench 6, the lens 4 is brought into contact with the processing surface of the fixed abrasive tool 1, and the lens 4 is fixed to the fixed abrasive tool 1 via the wrench 6 by the air cylinder 9. And press with a predetermined processing pressure. Then, the fixed abrasive tool 1 is driven and rotated by the lower shaft rotating motor 3 at a predetermined number of rotations, and the lens 4 is moved in a circle on the processing surface of the fixed abrasive tool 1 via the swing shaft 8 and the kansashi arm 7. Swing in an arc.

【0029】このとき、固定砥粒工具1は、制御手段1
0により、インバーターを介して、下軸回転モーター3
が制御されて、一次加工としての高速回転速度で回転駆
動され、一次加工用のタイマーにより設定された加工時
間の間にレンズの加工を行なう。そして、一次加工とし
ての高速回転速度での所定の加工時間の経過後で加工終
了前に、固定砥粒工具1の回転速度は二次加工としての
低速の回転速度に変更され、二次加工用のタイマーによ
り設定された加工時間だけ加工を行なう。
At this time, the fixed abrasive tool 1 is
0, the lower shaft rotating motor 3 via the inverter
Is controlled to rotate at a high rotational speed as the primary processing, and the lens is processed during the processing time set by the timer for the primary processing. Then, after a lapse of a predetermined machining time at a high rotational speed as the primary machining and before the machining is completed, the rotational speed of the fixed abrasive tool 1 is changed to a low rotational speed as the secondary machining, and The machining is performed for the machining time set by the timer.

【0030】このように研削・研磨等の加工終了直前の
一定時間だけ固定砥粒工具1を低速回転速度で回転させ
ることにより、レンズの被加工面は、加工終了前の一定
時間だけ高速回転速度での加工が解除され、固定砥粒工
具との密着が弱まると同時に加工熱も軽減される。その
結果、固定砥粒工具の加工面とレンズ等の光学素子の被
加工面との間に加工進行の過程で残留したレンズ材料や
砥粒等のスラッジが、加工終了後に、レンズの被加工面
に固定砥粒工具の停止と同時にあるいはその瞬時に焼き
付き現象状に付着ないしは固着することを防止すること
ができる。
As described above, by rotating the fixed abrasive tool 1 at a low rotation speed for a certain time immediately before the end of the processing such as grinding and polishing, the surface to be processed of the lens is rotated at a high speed for a certain time before the end of the processing. Is released, and the contact with the fixed abrasive tool is weakened, and at the same time, the processing heat is reduced. As a result, sludge such as lens material or abrasive particles remaining in the process of processing between the processing surface of the fixed abrasive tool and the processing surface of the optical element such as a lens is formed after the processing is completed. In addition, it is possible to prevent the fixed abrasive tool from sticking or sticking simultaneously or immediately at the instant of the seizure phenomenon.

【0031】次に、本実施例の具体例について加工サイ
クルを示す図4を用いて説明する。被加工材としてのガ
ラスブランクの材料はLaSF016であり、該ブラン
ク材の有効直径寸法は6.5mm、加工曲率半径は4.
1mmとした。研磨加工工程での加工圧は12Nとし、
固定砥粒工具の主軸回転数は、図4に例示するように、
一次加工での回転数を2000rpm、一次加工の加工
時間は120秒とし、二次加工での回転数は200rp
m、二次加工の加工時間は20秒とした。レンズホルダ
ーは従属連れ回り回転とする。
Next, a specific example of this embodiment will be described with reference to FIG. The material of the glass blank as the workpiece is LaSF016, the effective diameter of the blank is 6.5 mm, and the radius of curvature of the workpiece is 4.
1 mm. The processing pressure in the polishing process is 12N,
The spindle rotation speed of the fixed abrasive tool is, as exemplified in FIG.
The number of revolutions in the primary machining is 2000 rpm, the machining time of the primary machining is 120 seconds, and the number of revolutions in the secondary machining is 200 rpm
m, and the processing time of the secondary processing was 20 seconds. The lens holder is subordinately rotated.

【0032】このように固定砥粒工具を使用して研磨加
工を行なうことにより、固定砥粒工具を回転させる回転
数を二段階に変更して回転させ、特に、加工終了前の一
定時間を低速の回転数で加工することで、レンズの被加
工面にレンズ材料や砥粒等のスラッジが付着ないしは固
着することがなく、良好な光学性能を持つレンズを作製
することができた。
By performing polishing using the fixed abrasive tool as described above, the number of rotations of the fixed abrasive tool is changed in two stages, and the fixed abrasive tool is rotated. By processing at a rotational speed of, sludge such as lens material and abrasive grains did not adhere or adhere to the surface to be processed of the lens, and a lens having good optical performance could be produced.

【0033】また、固定砥粒工具を使用した研削・研磨
等の加工においての付着物の組成分析や加工プロセスに
ついて、種々の条件で加工を実施しその結果を検討した
事例を図5に図示する。図5は、固定砥粒工具での研磨
加工における工具軸回転数(二次加工での回転数)とレ
ンズの被加工面への付着物の発生比率を表したものであ
り、二次加工において、低速方向での付着物発生率の低
減が顕著であり、本事例での付着物の発生率が0%にな
ったのは、加工終了前である二次回転数を200rpm
以下に設定し、20秒間加工した場合の条件時であっ
た。
FIG. 5 shows an example in which processing was performed under various conditions for the composition analysis of a deposit and a processing process in processing such as grinding and polishing using a fixed abrasive tool, and the results were examined. . FIG. 5 shows the tool shaft rotation speed (the rotation speed in the secondary processing) in the polishing process using the fixed abrasive tool and the ratio of the amount of deposits on the surface to be processed of the lens. The rate of occurrence of deposits in the low-speed direction is remarkably reduced, and the rate of occurrence of deposits in this case is 0% because the secondary rotation speed before the end of processing is 200 rpm.
The conditions were set as follows and processing was performed for 20 seconds.

【0034】上述した各実施例においては、研削・研磨
加工中の加工熱の低減あるいは排除や密着度の軽減への
対策として、加工圧と固定砥粒工具の回転数を個別に低
下させているが、両者を同時に適宜低下させることも可
能であり、さらに、上述した各実施例においては、加工
圧や回転数等の加工条件を二段階に変更するようにして
いるが、加工条件を二段階以上に変更させることも可能
である。
In each of the above-described embodiments, the processing pressure and the number of rotations of the fixed abrasive tool are individually reduced as a measure to reduce or eliminate the processing heat during grinding and polishing and to reduce the degree of adhesion. However, it is also possible to simultaneously reduce both of them appropriately. Further, in each of the above-described embodiments, the processing conditions such as the processing pressure and the number of rotations are changed in two steps. It is also possible to change the above.

【0035】(第3の実施例)次に、本発明の光学素子
の研削・研磨等の加工方法のさらに他の実施例について
図6を参照して説明する。
(Third Embodiment) Next, still another embodiment of a processing method for grinding and polishing an optical element of the present invention will be described with reference to FIG.

【0036】図6に図示する本実施例において、前述し
た実施例と同様の部材には同一符号を付して説明する。
In this embodiment shown in FIG. 6, the same members as those in the above-described embodiment are denoted by the same reference numerals and described.

【0037】固定砥粒工具1は、工具軸2に取り付けら
れ、主軸回転モーター3により回転駆動されるように構
成され、レンズ4は、カンザシアーム7に保持されるカ
ンザシ6の先端突起部にセットされるレンズホルダー5
に保持されて、固定砥粒工具1の加工面に当接される。
カンザシアーム7は、不図示のエアーシリンダーにより
上下方向に移動してカンザシ6を介してレンズ4を固定
砥粒工具1に対して押圧し、さらに、不図示の揺動軸を
介して揺動してレンズ4を固定砥粒工具1上で円弧状に
揺動させるように構成されている。
The fixed abrasive tool 1 is mounted on a tool shaft 2 and is configured to be driven to rotate by a main shaft rotating motor 3. The lens 4 is set on a tip projection of a kanshi 6 held by a kanshi arm 7. Lens holder 5
And is brought into contact with the processing surface of the fixed abrasive tool 1.
The kansashi arm 7 is moved up and down by an air cylinder (not shown) to press the lens 4 against the fixed abrasive tool 1 via the kansashi 6 and further oscillates via an oscillating shaft (not shown). The lens 4 is configured to swing on the fixed abrasive tool 1 in an arc shape.

【0038】水あるいは低濃度の研磨液(以下、これら
を総称して単に研磨液という。)を噴出するノズル11
が固定砥粒工具1とレンズ4の当接する部分に近接して
配設され、ノズル11は研磨液供給手段12に連通され
る。本実施例では、研磨液供給手段12として、クーリ
ングポンプ(タイテック株式会社製のCH−151A
F)を用い、研磨液の液温を低温化管理する。
A nozzle 11 for jetting water or a low-concentration polishing liquid (hereinafter, these are collectively simply referred to as a polishing liquid).
Is disposed in the vicinity of the portion where the fixed abrasive tool 1 and the lens 4 are in contact with each other, and the nozzle 11 is communicated with the polishing liquid supply means 12. In this embodiment, a cooling pump (CH-151A manufactured by Taitec Co., Ltd.) is used as the polishing liquid supply means 12.
Using F), the temperature of the polishing liquid is controlled to be low.

【0039】以上のように構成される加工装置を用いる
本実施例の研削・研磨加工について説明する。レンズ4
はカンザシ6を介して固定砥粒工具1に押圧され、固定
砥粒工具1は、曲率半径精度の維持と加工時間の短縮を
両立させることができるように高速回転数で駆動され、
さらに、レンズ4を固定砥粒工具1の加工面上を円弧状
に揺動させながら、レンズ4の研削・研磨を行なう。同
時に、ノズル11から研磨液を固定砥粒工具1とレンズ
4に向けて噴出させる。この研磨液は、研磨液供給手段
としてのクーリングポンプ12で低温化管理されてお
り、研磨液の液温は10℃以下であることが好ましい。
このように、レンズ4を固定砥粒工具1により研削・研
磨加工する際に、低温化された研磨液を用いることによ
り、研削・研磨加工中の加工熱を軽減あるいは排除する
ことができ、加工されたレンズの被加工面側は、固定砥
粒工具との加工熱が軽減され、レンズ材料や砥粒等のス
ラッジの焼き付きをなくすることができる。
A description will be given of the grinding / polishing processing of the present embodiment using the processing apparatus configured as described above. Lens 4
Is pressed by the fixed abrasive tool 1 via the wrench 6, and the fixed abrasive tool 1 is driven at a high rotational speed so as to maintain the curvature radius accuracy and shorten the processing time.
Further, the lens 4 is ground and polished while swinging the lens 4 in an arc shape on the processing surface of the fixed abrasive tool 1. At the same time, the polishing liquid is jetted from the nozzle 11 toward the fixed abrasive tool 1 and the lens 4. The polishing liquid is controlled to a low temperature by a cooling pump 12 as a polishing liquid supply means, and the liquid temperature of the polishing liquid is preferably 10 ° C. or lower.
As described above, when the lens 4 is ground and polished by the fixed abrasive tool 1, the use of a polishing liquid at a low temperature can reduce or eliminate the processing heat during the grinding and polishing. On the processed surface side of the lens, the processing heat with the fixed abrasive tool is reduced, and the seizure of sludge such as lens material and abrasive grains can be eliminated.

【0040】次に、本実施例の具体例について説明す
る。被加工材としてのガラスブランクの材料はLaSF
016であり、該ブランク材の有効直径寸法は6.5m
m、加工曲率半径は4.1mmとした。研磨加工工程で
の加工圧は12Nとし、固定砥粒工具の主軸回転数は2
000rpmであり、加工時間は120秒である。研磨
液の液温は10℃±2℃となるように管理した。なお、
レンズホルダーは従属連れ回り回転とする。このように
低温化された研磨液を用い固定砥粒工具を使用して研磨
加工を行なうことにより、レンズの被加工面にレンズ材
料や砥粒等のスラッジが付着ないしは固着することがな
く、良好な光学性能を持つレンズを作製することができ
た。
Next, a specific example of this embodiment will be described. The material of the glass blank as the workpiece is LaSF
016, and the effective diameter of the blank material is 6.5 m
m and the radius of curvature of the processing were 4.1 mm. The processing pressure in the polishing step is 12N, and the spindle speed of the fixed abrasive tool is 2
000 rpm, and the processing time is 120 seconds. The liquid temperature of the polishing liquid was controlled to be 10 ° C. ± 2 ° C. In addition,
The lens holder is subordinately rotated. By performing polishing using a fixed abrasive tool using the polishing liquid thus cooled, sludge such as lens material or abrasive grains does not adhere or adhere to the surface to be processed of the lens. A lens with excellent optical performance was produced.

【0041】また、固定砥粒工具を使用した研削・研磨
等の加工においての付着物の組成分析や加工プロセスに
ついて、種々の条件で加工を実施しその結果を検討した
事例を図7に図示する。図7は、水あるいは低濃度の研
磨液等の液温の変化に対するレンズの被加工面への付着
物の発生比率を表したものであり、研磨液の低温方向で
の付着物発生率の低減が顕著であり、特に、本事例での
付着物の発生率が0%になったのは、研磨液の液温を1
0℃以下にして加工をした場合の条件時であった。
FIG. 7 shows an example in which processing was performed under various conditions with respect to the composition analysis and processing of the deposits in processing such as grinding and polishing using a fixed abrasive tool, and the results were examined. . FIG. 7 shows the rate of occurrence of deposits on the surface to be processed of the lens with respect to a change in the temperature of water or a low-concentration polishing solution. In particular, the rate of occurrence of deposits in this case was 0% because the temperature of the polishing liquid was 1%.
This was the condition when processing was performed at 0 ° C. or less.

【0042】[0042]

【発明の効果】以上説明したように、本発明によれば、
固定砥粒工具を使用したレンズ等の光学素子の研削・研
磨等の加工において、加工終了前の一定時間に、加工圧
を低圧化するまたは固定砥粒工具の回転数を低速化する
など加工条件を変更することによって、あるいは、水や
低濃度の研磨液の液温を低温化することによって、固定
砥粒工具と光学素子との間で発生する加工熱を抑えさら
に両者間の密着を弱くすることができ、これによって、
光学素子の被加工面に光学素子材料のスラッジ、固定砥
粒工具の樹脂や砥粒等のスラッジが付着ないしは固着す
ることを防止することができ、レンズ等の光学素子の研
削・研磨加工において所定精度の光学素子を確実に効率
よく作製することができる。
As described above, according to the present invention,
In processing such as grinding and polishing of optical elements such as lenses using a fixed abrasive tool, processing conditions such as lowering the processing pressure or reducing the rotation speed of the fixed abrasive tool for a certain period of time before the end of processing Or by lowering the temperature of the water or low-concentration polishing liquid to reduce the processing heat generated between the fixed abrasive tool and the optical element, and further weaken the adhesion between the two. This allows
Prevents sludge of optical element material, sludge of resin and abrasive grains of fixed abrasive tool from adhering or sticking to the surface to be processed of optical element, and is required for grinding and polishing of optical elements such as lenses. An optical element with high accuracy can be reliably and efficiently manufactured.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の光学素子の研削・研磨等の加工方法を
実施するための加工装置の概略構成図である。
FIG. 1 is a schematic configuration diagram of a processing apparatus for performing a processing method such as grinding and polishing of an optical element of the present invention.

【図2】本発明の光学素子の研削・研磨等の加工方法の
一実施例における具体例としての加工サイクルを示す図
である。
FIG. 2 is a view showing a processing cycle as a specific example in one embodiment of a processing method such as grinding and polishing of an optical element of the present invention.

【図3】本発明の光学素子の研削・研磨等の加工方法の
一実施例における二次加工の加工圧差による付着物の発
生比率を示す図である。
FIG. 3 is a view showing the rate of occurrence of deposits due to a processing pressure difference in secondary processing in one embodiment of a processing method such as grinding and polishing of an optical element of the present invention.

【図4】本発明の光学素子の研削・研磨等の加工方法の
他の実施例における具体例としての加工サイクルを示す
図である。
FIG. 4 is a view showing a processing cycle as a specific example in another embodiment of a processing method such as grinding and polishing of an optical element of the present invention.

【図5】本発明の光学素子の研削・研磨等の加工方法の
他の実施例における二次加工の工具回転数差による付着
物の発生比率を示す図である。
FIG. 5 is a diagram showing the rate of occurrence of deposits due to a difference in the number of rotations of a tool in secondary processing in another example of a processing method such as grinding and polishing of an optical element of the present invention.

【図6】本発明の光学素子の研削・研磨等の加工方法の
さらに他の実施例を実施するための加工装置の概略構成
図である。
FIG. 6 is a schematic configuration diagram of a processing apparatus for performing still another embodiment of a processing method such as grinding and polishing of an optical element of the present invention.

【図7】本発明の光学素子の研削・研磨等の加工方法の
さらに他の実施例における研磨液の液温差による付着物
の発生比率を示す図である。
FIG. 7 is a diagram showing the rate of occurrence of deposits due to a difference in the temperature of a polishing liquid in still another example of a processing method such as grinding and polishing of an optical element of the present invention.

【符号の説明】[Explanation of symbols]

1 固定砥粒工具 2 工具軸 3 主軸回転モーター 4 レンズ(光学素子) 5 レンズホルダー 6 カンザシ 7 カンザシアーム 8 揺動軸 9 エアーシリンダー 10 制御手段 11 ノズル 12 研磨液供給手段(クーリングポンプ) DESCRIPTION OF SYMBOLS 1 Fixed abrasive tool 2 Tool axis 3 Spindle rotation motor 4 Lens (optical element) 5 Lens holder 6 Kansashi 7 Kansashi arm 8 Swing axis 9 Air cylinder 10 Control means 11 Nozzle 12 Polishing liquid supply means (cooling pump)

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 光学素子の被加工面を固定砥粒工具に当
接させて、固定砥粒工具を回転させるとともに光学素子
を所定の加工圧で押し付けて光学素子を研削・研磨加工
する光学素子の研削・研磨加工方法において、光学素子
の加工条件を少なくとも二段階に変更するようにし、加
工終了前の一定時間を、光学素子の被加工面と固定砥粒
工具との間に発生する加工熱や密着度を低減するような
加工条件に変更して加工することを特徴とする光学素子
の研削・研磨加工方法。
1. An optical element for grinding and polishing an optical element by bringing a surface to be processed of an optical element into contact with a fixed abrasive tool, rotating the fixed abrasive tool, and pressing the optical element at a predetermined processing pressure. In the grinding / polishing processing method, the processing conditions of the optical element are changed in at least two stages, and a predetermined time before the processing is completed is a processing heat generated between the processing surface of the optical element and the fixed abrasive tool. A method for grinding and polishing an optical element, characterized in that processing is performed by changing the processing conditions so as to reduce the degree of adhesion or the degree of adhesion.
【請求項2】 光学素子の被加工面を固定砥粒工具に当
接させて、固定砥粒工具を回転させるとともに光学素子
を所定の加工圧で押し付けて光学素子を研削・研磨加工
する光学素子の研削・研磨加工方法において、前記加工
圧を少なくとも二段階に変更して加圧するようにし、加
工終了前の一定時間を低加工圧で加工することを特徴と
する光学素子の研削・研磨加工方法。
2. An optical element for grinding and polishing an optical element by bringing a surface to be processed of the optical element into contact with a fixed abrasive tool, rotating the fixed abrasive tool, and pressing the optical element at a predetermined processing pressure. Grinding / polishing processing method, wherein the processing pressure is changed to at least two stages and pressurized, and processing is performed at a low processing pressure for a certain period of time before processing is completed. .
【請求項3】 加工終了前の一定時間にかける低加工圧
は、加工装置の上軸構成部の自重ないしは自重以下に設
定されることを特徴とする請求項2記載の光学素子の研
削・研磨加工方法。
3. The grinding / polishing of an optical element according to claim 2, wherein the low working pressure applied for a predetermined time before the completion of the working is set to be equal to or less than the own weight of the upper shaft component of the working apparatus. Processing method.
【請求項4】 光学素子の被加工面を固定砥粒工具に当
接させて、固定砥粒工具を回転させるとともに光学素子
を所定の加工圧で押し付けて光学素子を研削・研磨加工
する光学素子の研削・研磨加工方法において、前記固定
砥粒工具を回転させる回転数を少なくとも二段階に変更
して回転させるようにし、加工終了前の一定時間を低速
の回転数で加工することを特徴とする光学素子の研削・
研磨加工方法。
4. An optical element for grinding and polishing an optical element by bringing a surface to be processed of an optical element into contact with a fixed abrasive tool, rotating the fixed abrasive tool, and pressing the optical element at a predetermined processing pressure. In the grinding / polishing method, the number of rotations for rotating the fixed abrasive tool is changed in at least two stages so that the rotation is performed, and processing is performed at a low speed for a certain period of time before the end of the processing. Grinding of optical elements
Polishing method.
【請求項5】 光学素子の被加工面を固定砥粒工具に当
接させて、固定砥粒工具を回転させるとともに光学素子
を所定の加工圧で押し付けて光学素子を研削・研磨加工
する光学素子の研削・研磨加工方法において、低温度に
管理された水あるいは低濃度の研磨液を光学素子と固定
砥粒工具の間に供給して、光学素子を研削・研磨加工す
ることを特徴とする光学素子の研削・研磨加工方法。
5. An optical element for grinding and polishing an optical element by bringing a surface to be processed of the optical element into contact with a fixed abrasive tool, rotating the fixed abrasive tool, and pressing the optical element at a predetermined processing pressure. Grinding / polishing method, comprising supplying water controlled at a low temperature or a low concentration polishing liquid between an optical element and a fixed abrasive tool to grind / polish the optical element. Grinding / polishing method of the element.
【請求項6】 前記水あるいは低濃度の研磨液の温度は
10℃以下に設定され管理されていることを特徴とする
請求項5記載の光学素子の研削・研磨加工方法。
6. The method for grinding and polishing an optical element according to claim 5, wherein the temperature of the water or the low-concentration polishing liquid is set and controlled at 10 ° C. or lower.
JP2000008475A 2000-01-18 2000-01-18 Method of grinding and polishing optical element Pending JP2001198784A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000008475A JP2001198784A (en) 2000-01-18 2000-01-18 Method of grinding and polishing optical element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000008475A JP2001198784A (en) 2000-01-18 2000-01-18 Method of grinding and polishing optical element

Publications (1)

Publication Number Publication Date
JP2001198784A true JP2001198784A (en) 2001-07-24

Family

ID=18536736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000008475A Pending JP2001198784A (en) 2000-01-18 2000-01-18 Method of grinding and polishing optical element

Country Status (1)

Country Link
JP (1) JP2001198784A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103331671A (en) * 2013-07-25 2013-10-02 长春设备工艺研究所 Point-line envelope grinding method applied to medium/large-aperture aspheric optical element
CN117020831A (en) * 2023-10-08 2023-11-10 河南百合特种光学研究院有限公司 High-precision curved mirror processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103331671A (en) * 2013-07-25 2013-10-02 长春设备工艺研究所 Point-line envelope grinding method applied to medium/large-aperture aspheric optical element
CN117020831A (en) * 2023-10-08 2023-11-10 河南百合特种光学研究院有限公司 High-precision curved mirror processing method

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