JP2001198513A - Substrate coating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remarkably improve the utilization efficiency of a coating liquid by efficiently depositing the coating liquid on the whole treating surface of a substrate. SOLUTION: This substrate coating device is provided with a supply head 1 for forming a liquid film of the coating liquid on a supply surface, a cup 5, a spin chuck 23 for holding the substrate W to make the treating surface Ws face downward and rotatably driving the substrate W and a vertical moving means for vertically moving the spin chuck 23 to the supply head 1. A coating film is formed by allowing the treating surface Ws of the substrate W to contact with the liquid film formed on the supply surface to deposit the coating liquid R on the whole surface of the treating surface Ws and rotatably driving. The whole treating surface of the substrate is coated with the coating liquid without rotating the substrate by allowing the treating surface of the substrate to contact with the liquid film of the coating liquid. Therefore, the utilization efficiency of the coating liquid is remarkably improved compared with the conventional example.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a substrate for an optical disk (hereinafter simply referred to as a substrate), and the like. The present invention relates to a substrate coating apparatus for applying a coating liquid such as a glass, a silica-based film forming material), a photoresist liquid, and a polyimide resin.

[0002]

2. Description of the Related Art Conventional substrate coating apparatuses of this type include:
For example, a chuck for holding the substrate with the processing surface of the substrate facing upward, a scattering prevention cup arranged so as to surround the periphery of the chuck, a nozzle for supplying a coating liquid from above the chuck, and a vertical A motor having a motor that rotates around the axis.

In the conventional apparatus configured as described above, first, a motor is driven to rotate a chuck holding a substrate at a low speed, and a coating liquid is supplied from a nozzle near a rotation center of the substrate. Then, when the application liquid spreads over the entire surface of the substrate by centrifugal force, the rotation is switched to high-speed rotation, whereby excess coating liquid is shaken around and a coating film is formed on the processing surface of the substrate.

[0004]

However, the prior art having such a structure has the following problems. That is, before the coating film is formed on the processing surface of the substrate, most of the coating liquid scatters around the substrate, so that the coating film can be formed with good film thickness uniformity, There is a problem that the use efficiency of the coating liquid is extremely low.

[0005] Since this coating solution is generally expensive, it directly affects the production cost. Therefore, it is desired to increase the use efficiency of the coating liquid as much as possible.

[0006] The present invention has been made in view of such circumstances, and a substrate capable of extremely increasing the use efficiency of a coating liquid by adhering the coating liquid efficiently to the entire processing surface of the substrate. An object is to provide a coating device.

[0007]

The present invention has the following configuration in order to achieve the above object. That is, the substrate coating apparatus according to claim 1 is a substrate coating apparatus that forms a coating film by applying a coating liquid to a processing surface of a substrate and then rotating the substrate to form a coating film. A supply head that forms a liquid film of the coating liquid on the supply surface, a cup disposed so as to surround the supply head, and a holding unit that holds the substrate with the processing surface facing downward. Rotating drive means for rotating the substrate held by the holding means, and elevating means for vertically moving the holding means relative to the supply head, wherein the processing surface of the substrate held by the holding means is supplied to the supply means. The coating liquid is attached to the processing surface by contacting the liquid film formed on the supply surface of the head, and is rotated by the rotation driving means to form a coating film on the processing surface of the substrate. In things That.

[0008] The substrate coating apparatus according to claim 2 is
2. The substrate coating apparatus according to claim 1, wherein the cup has a recovery zone for storing the coating liquid, a circulation path communicating with the recovery zone and the supply head, and the supply head with the coating liquid stored in the recovery zone. 3. And a circulation pump for circulating again.

Further, the substrate coating apparatus according to claim 3 is
3. The substrate coating apparatus according to claim 1, further comprising a seal cap for closing an upper opening of the cup.

Further, the substrate coating apparatus according to claim 4 is
4. The substrate coating apparatus according to claim 3, wherein the seal cap is fixedly provided so as to close the cup, and a side of the cup is provided with a transfer port for loading and unloading the substrate. It is characterized by having.

Further, the substrate coating apparatus according to claim 5 is
5. The substrate coating apparatus according to claim 4, further comprising a transport mechanism that transports the substrate through the transport port, wherein the transport mechanism is driven to reverse the upper and lower surfaces of the support unit that supports the substrate and the support unit. Reversing drive means, and forward / backward drive means for moving the support portion forward / backward with respect to the cup, and when loading the substrate into the cup, the processing surface of the substrate is placed on the side of the cup. The substrate is placed on the support with the substrate facing, the inversion driving means is driven to invert the support so that the processing surface of the substrate faces downward, and the advance / retreat driving means is driven to move the substrate into the cup. After moving the substrate into the holding means, the substrate is transferred to the holding means, and when the substrate is carried out of the cup, the substrate is transferred from the holding means to the support portion, and the advance / retreat driving means is driven. The substrate out of the cup It is characterized in that the inverting the support portion so as to direct upward the treated surface of the substrate at a side of the cup by driving the reversing drive means.

Further, the substrate coating apparatus according to claim 6 is
6. The substrate coating apparatus according to claim 5, wherein the transport mechanism includes a closing member that closes the transport port in a state where the support portion enters the inside of the cup.

The substrate coating apparatus according to claim 7 is
The substrate coating apparatus according to any one of claims 2 to 6, wherein the circulation path is provided with two pressure sensors for measuring the pressure of the flowing coating liquid, and based on a pressure difference therebetween, the coating liquid. In which the solvent is replenished.

Further, the substrate coating apparatus according to claim 8 is
The substrate coating apparatus according to any one of claims 2 to 7, further comprising: a buffer having a flow path cross-sectional area larger than a cross-sectional area of the circulation path in a part of the circulation path. A stirring means for stirring the water.

Further, the substrate coating apparatus according to claim 9 is
The substrate coating apparatus according to any one of claims 3 to 8, wherein the seal cap is provided with a heating means for maintaining the temperature above the dew point.

According to a tenth aspect of the present invention, in the substrate coating apparatus according to any one of the second to ninth aspects, the cup is provided with cooling means for maintaining the dew point or lower. It is characterized by having.

According to the first aspect of the present invention, a liquid film of the coating liquid is formed on the supply surface of the supply head, and the processing surface of the substrate held downward is brought into contact with the liquid film. Thus, the entire processing surface of the substrate can be covered with the coating liquid without rotating the substrate. Thereafter, the thickness of the coating solution adhering to the processing surface of the substrate is adjusted by rotating the substrate and dried to form a coating film.

According to the second aspect of the present invention, the coating liquid stored in the recovery zone is circulated again to the supply head by the circulation path and the circulation pump, thereby directly contributing to the formation of the coating film. Instead, it is possible to reuse the coating liquid that has overflowed from the supply head or scattered around during rotation.

According to the third aspect of the present invention, by volatilizing the solvent contained in the coating liquid, the upper opening of the cup is closed.

According to the fourth aspect of the present invention, even when the seal cap is fixedly provided to suppress the evaporation of the solvent, the transfer of the substrate can be freely performed by providing the transfer port on the side surface of the cup. It is possible to suppress the volatilization of the solvent while performing.

According to the fifth aspect of the present invention, after receiving the processing surface of the substrate upward, the substrate is transferred into the cup with the upper and lower surfaces turned upside down so that the processing surface faces downward. Can be.

According to the sixth aspect of the present invention, since the transport port is closed by the closing member, the solvent can be prevented from being volatilized during the processing.

According to the seventh aspect of the present invention, it is possible to know the change in the viscosity of the coating liquid based on the pressure difference of the pressure sensor provided in the circulation path. Therefore, the viscosity of the coating liquid can be kept constant by replenishing the coating liquid with the solvent based on this change.

According to the eighth aspect of the present invention, by stirring with the stirring means in the buffer section, it is possible to suppress the occurrence of the bias of the components in the circulating coating liquid and to make it uniform. .

According to the ninth aspect of the present invention, dew condensation on the lower surface of the seal cap can be prevented.

According to the tenth aspect of the present invention,
It is possible to prevent the coating liquid from adhering to the inner surface of the cup and drying.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a main part of the substrate coating apparatus according to the embodiment.

A supply head 1 having a larger diameter than the substrate W is provided near the center of the apparatus. This supply head 1
Has a storage section 3 for storing the coating liquid R therein, and supplies the coating liquid R so as to flow out to the supply surface 1b through a large number of pores 1a formed on the upper surface thereof. As a result, a liquid film of the coating liquid R is formed on the supply surface 1b. The supply surface 1b of the supply head 1 is connected to the processing surface Ws of the substrate W.
And the size thereof is required to be at least as large as that of the substrate W. In the supply head 1, the supply surface 1b may be formed using a filter material instead of the large number of pores 1a.

A cup 5 for preventing the application liquid R from scattering around the supply head 1 is provided around the supply head 1. The cup 5 has an upper opening 5 near its center.
a is formed, and an inclined surface 5b for guiding the scattered coating liquid R downward is formed at a lower portion thereof. A cooling channel 5c for flowing a cooling solvent is formed on the inclined surface 5b. As the cooling solvent, for example,
Cooling water is used, and the temperature is set such that the inclined surface 5b is maintained at the dew point or lower. Between the supply head 3 and the cup 5 located therebelow, a recovery zone 5d for storing the coating liquid R which overflows from the supply head 3 and is guided downward at the time of rotating off is formed in an annular shape in plan view.
The collection zone 5 d and the storage section 3 of the supply head 1 are connected to each other through a circulation path 7.

As described above, the cooling channel 5c is provided in the cup 5.
Is provided, it is possible to prevent the coating liquid R from adhering to the inner surface of the cup 5 and drying the same, thereby preventing contamination of the substrate W by particles. Instead of providing the cooling channel 5c as a cooling means, a Peltier element may be attached to absorb the heat of the cup 5. Also,
A liquid absorber such as a cloth or a sponge-like porous material may be attached to the inclined surface 5b of the cup 5 to prevent the application liquid R from rebounding.

A circulating pump 9 is provided at one portion of the circulating path 7 so as to be able to send out a fixed amount by a single drive. A branch pipe 13 is provided between the recovery zone 5d and the circulation pump 9 so that the solvent from the solvent tank 11 can flow in. The branch pipe 13 is charged with the solvent from the solvent tank 11. On-off valve 15 for adjusting the amount
Are arranged. The solvent tank 11 stores the same or the same kind of solvent as the solvent contained in the coating liquid R.

On the supply head 1 side of the circulation path 7, that is, on the downstream side of the circulation pump 9, two pressure sensors 17 are attached at a fixed distance. These pressure sensors 17 measure the pressure of the coating liquid R flowing through the circulation path 7, and the measured pressure value is output to the control unit 19. The control unit 19 controls various motors and the like (not shown), and controls so that the viscosity does not change based on the number of times of driving of the circulation pump 9 and the difference between the pressure values. Specifically, when the pressure difference is large, it means that the viscosity of the flowing coating solution R is high. Therefore, the on-off valve 15 is opened according to the pressure difference, and the required amount of the solvent is reduced. Only throw. Thereby, the viscosity of the coating liquid R can be kept constant, and the coating treatment can be performed under the same conditions over a long period of time.

A seal cap 21 is provided above the cup 5 so as to be able to move up and down with respect to the cup 5. The seal cap 21 has a lower surface in close contact with the upper opening 5a and closes the inside of the cup 5. An opening 21a is formed in the vicinity of the center thereof, and a spin chuck 23 having a suction portion on the lower surface on the lower end side is inserted into the supply head 1 by a lifting means (not shown) so as to be able to move up and down. ing. The spin chuck 23 is used for the substrate W
A function of rotating the substrate W in a horizontal plane with the processing surface Ws facing downward.

Instead of the seal cap 21 moving up and down with respect to the cup 5 as in this embodiment, the cup 5 may be moved up and down with respect to the seal cap 21. The supply head 1 may be moved up and down with respect to the spin chuck 23.

The above-mentioned spin chuck 23 corresponds to the holding means and the rotation driving means in the present invention.

Further, on the upper surface of the seal cap 21,
A planar heater 21b corresponding to a heating unit is attached. Since the heater 21b is set so that the temperature of the lower surface of the seal cap 21 is equal to or higher than the dew point,
Dew condensation on the lower surface of the seal cap 21 can be prevented. Therefore, the substrate W and the supply head 1 carried into the cup 5
Are not adversely affected by dew. As a heating means for heating the seal cap 21, for example, a configuration may be adopted in which a pipe is attached to the upper surface to allow a high-temperature fluid to flow.

Next, the operation of the substrate coating apparatus configured as described above will be described with reference to FIGS.

As shown in FIG. 2A, first, the seal cap 21 is raised with respect to the cup 5, and the upper opening 5a of the cup 5 is opened. Then, the substrate W with the processing surface Ws facing downward is transported to a transport mechanism (not shown) and enters the lower part of the spin chuck 23, and the spin chuck 23
To hold the substrate W by suction. In this state, it is assumed that a liquid film of the coating liquid R has already been formed on the supply surface 1b of the supply head 1.

Next, as shown in FIG. 2B, the seal cap 21 is lowered together with the spin chuck 23 with respect to the cup 5 by an elevating mechanism (not shown) so that the upper opening 5 is formed.
After closing a, only the spin chuck 23 is lowered. The lowered position is a position where the processing surface Ws of the substrate W contacts the liquid film of the coating liquid R formed on the supply surface 1b of the supply head 1. As a result, the entire processing surface Ws of the substrate W is instantaneously covered with the coating liquid R.

As shown in FIG. 3A, the spin chuck 23 is moved up by a lifting mechanism (not shown) to separate the substrate W from the supply surface 1b of the supply head 1. The ascending position is near the position where the peripheral edge of the substrate W is located on the inclined surface 5b.

As shown in FIG. 3 (b), the spin chuck 23 is rotated around a vertical axis, and excess coating liquid R adhering to the processing surface Ws of the substrate W is shaken off by centrifugal force to remove the solvent. Is dried to form a coating film on the processing surface Ws. Note that the number of rotations and the rotation time at this time may be determined according to the thickness of the coating film to be formed on the substrate W.

By bringing the processing surface Ws of the substrate W into contact with the liquid film of the coating liquid R formed on the supply head 1 as described above, the entire processing surface Ws of the substrate W is rotated without rotating the substrate W. Can be covered in a short time. Thereafter, the processing surface Ws of the substrate W is rotated by rotating the substrate W.
The coating film is formed by adjusting the film thickness of the coating liquid R adhering to the substrate and drying it. In this way, the substrate W
By applying the coating liquid R to the entire processing surface Ws of
The utilization efficiency of the coating liquid R can be made extremely high as compared with the conventional example. As a result, the amount of the expensive coating liquid R used can be reduced, so that the production cost can be suppressed.

Further, since the application liquid R that has been shaken off is configured to circulate from the recovery zone 5d to the supply head 1 via the circulation path 7, it does not directly contribute to the formation of the coating film, but overflows. The coating solution R scattered around can be reused. Therefore, the use efficiency of the coating liquid R can be further increased.

<Modification> Next, a modification of the substrate coating apparatus according to the present invention will be described. FIG. 4 is a schematic configuration diagram showing a modified example. The same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description is omitted.

In this configuration, a buffer section 31 having a larger cross-sectional area than the cross-sectional area of the circulation path 7 is provided in the middle of the circulation path 7. The buffer 31 has an internal coating solution R
And a motor 35 for driving the fan 33 to rotate.

The fan 33 and the motor 35 correspond to the agitating means in the present invention.

By adopting such a configuration, the bias of the coating solution R circulating in the buffer section 31 can be suppressed and made uniform, and the uniformity of the coating film can be improved.

<Another Modification> Next, another modification will be described with reference to FIG. In this modification, a transport mechanism is added to the above-described substrate coating apparatus, and the cup 5 and the seal cap 21 on the receiving side are modified.

In this modification, the seal cap 21
Are fixedly provided to the cup 5. Further, the seal cap 21 is formed with a guide groove 21c through which a guide shaft 47 of the transport mechanism 41 described later is inserted. A transfer port 5e for loading and unloading the substrate W is formed on a side surface of the cup 5 on the transfer mechanism 41 side.

The transport mechanism 41 includes a support portion 43 for holding the substrate W in a horizontal posture by sucking or holding the lower surface of the substrate W, a shutter 45 formed near the base end of the support portion 43, A guide shaft 47 is formed at a position facing the lower side of the support portion 43 with the base end therebetween, and is inserted into the guide groove 21c.

The shutter 45 is formed to have a size to close the transfer port 5e, and corresponds to a closing member in the present invention.

As shown in FIG. 6, the transport mechanism 41 is in a standby state in which the support portion 43 is on the upper side, and receives the substrate W in a state in which the processing surface Ws of the substrate W faces upward.
Then, as shown in FIG. 7, the support portion 43 is driven by an inversion driving means (not shown) so that the upper and lower surfaces are inverted. As a result, the posture of the substrate W is reversed, and the processing surface Ws is changed downward.

Thereafter, height adjustment is performed by a lifting / lowering driving means (not shown) so that the support portion 43 coincides with the transport port 5e, and as shown in FIG. 8, the transport mechanism 41 is moved by an advance / retreat driving means (not shown). Let go into cup 5. At this time, since the guide shaft 47 slides in the guide groove 21c of the seal cap 21, the support portion 43 can smoothly enter. Further, since the shutter 45 of the transport mechanism 41 closes the transport port 5e, volatilization of the solvent of the coating liquid R is suppressed, and the subsequent coating process can be performed under favorable conditions. In this state, the spin chuck 23 is slightly lowered to adsorb the substrate W, and the support of the substrate W by the transport mechanism 41 is released.
Transfer.

Next, as shown in FIG. 9, the spin chuck 23 is lowered to bring the processing surface Ws of the substrate W into contact with the liquid film on the supply surface 1b. And the support part 4 waiting above
After raising the spin chuck 23 to a height about halfway between the feed chuck 3 and the supply surface 1b, the rotary chuck is shaken off and the solvent is dried. Then, the spin chuck 23 is raised to the height of the upper support 43, and the substrate W is transferred to the support 43. After that, the respective parts are operated in the reverse order of the procedure for loading the substrate W, and the substrate W is unloaded.

According to this modified example, the transfer of the substrate W to the spin chuck 23 in the cup 5 can be facilitated, so that the throughput of the apparatus can be improved.

[0055]

As is apparent from the above description, according to the first aspect of the present invention, the processing surface of the substrate held downward is brought into contact with the liquid film of the coating liquid formed on the supply head. Thus, the entire processing surface of the substrate can be covered with the coating liquid without rotating the substrate. Thereafter, the thickness of the coating solution adhering to the processing surface of the substrate is adjusted by rotating the substrate and dried to form a coating film. By efficiently applying the coating liquid to the entire processing surface of the substrate in this manner, the usage efficiency of the coating liquid can be extremely increased as compared with the conventional example. As a result, the amount of expensive coating liquid used can be reduced, and production costs can be reduced.

According to the second aspect of the present invention, by adopting a configuration in which the coating liquid is circulated again to the supply head by the circulation pump, the coating liquid does not directly contribute to the formation of the coating film, but overflows and surrounds. The coating solution that has scattered on the surface can be reused. Therefore, the use efficiency of the coating liquid can be further improved.

Further, according to the third aspect of the present invention, by closing the upper opening of the cup, the solvent contained in the coating liquid can be suppressed from volatilizing. Therefore, a change in viscosity can be suppressed, and the coating treatment can be performed under favorable conditions.

According to the fourth aspect of the present invention, even when the seal cap is fixedly provided to suppress the evaporation of the solvent, the transfer of the substrate can be freely performed by providing the transfer port on the side surface of the cup. It is possible to suppress the volatilization of the solvent while performing. Therefore, a change in the viscosity of the coating liquid can be suppressed, and the coating treatment can be performed under favorable conditions.

According to the fifth aspect of the present invention, after receiving the processing surface of the substrate upward, the substrate is transferred into the cup with the upper and lower surfaces turned upside down so that the processing surface faces downward. And the transfer of the substrate to the holding means in the cup can be facilitated. Therefore, the throughput of the device can be improved.

According to the sixth aspect of the present invention, since the transfer port is closed by the closing member, the solvent can be prevented from volatilizing during the process, and the coating process can be performed under favorable conditions. Can be.

According to the seventh aspect of the present invention, a change in the viscosity of the coating solution can be known based on the pressure difference of the pressure sensor. Can be kept constant. Therefore, the coating treatment can be performed under the same conditions over a long period of time.

According to the eighth aspect of the present invention, the stirring of the circulating coating solution can be suppressed and made uniform by stirring with the stirring means in the buffer section, and the coating film can be made uniform. Properties can be improved.

According to the ninth aspect of the present invention, it is possible to prevent dew condensation on the lower surface of the seal cap, and to prevent adverse effects on the coating liquid and the substrate caused by the dew.

According to the tenth aspect of the present invention,
It is possible to prevent the application liquid from adhering to the inner surface of the cup and drying it, thereby preventing contamination of the substrate by particles.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a main part of a substrate coating apparatus according to an embodiment.

FIG. 2 is a diagram provided for explanation of operation.

FIG. 3 is a diagram provided for explanation of operation.

FIG. 4 is a schematic configuration diagram showing a modified example.

FIG. 5 is a schematic configuration diagram showing another modified example.

FIG. 6 is an explanatory diagram of an operation of the transport mechanism.

FIG. 7 is an explanatory diagram of the operation of the transport mechanism.

FIG. 8 is a diagram provided for explanation of operation.

FIG. 9 is a diagram provided for explanation of operation.

[Explanation of symbols]

 W ... substrate Ws ... processing surface 1 ... supply head 1b ... supply surface 3 ... storage section 5 ... cup 5d ... recovery zone 7 ... circulation path 9 ... circulation pump 11 ... solvent tank 15 ... opening and closing valve 17 ... pressure sensor 19 ... control section

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/31 H01L 21/30 564C 5F046 F term (Reference) 2H025 AA18 EA05 4D075 AC64 AC84 AC95 AC96 CA48 DA08 DB14 DC22 EA45 4F040 AA12 AB20 AC01 CC02 CC20 4F042 AA07 BA05 BA07 CB26 EB29 EB30 5F045 BB08 DP28 EB20 EN04 5F046 JA12 JA14

Claims (10)

[Claims] 1. A substrate coating apparatus for forming a coating film by rotating a substrate after applying a coating liquid on a processing surface of a substrate, comprising: a supply surface facing at least a processing surface of the substrate; A supply head for forming a liquid film of the liquid, a cup arranged so as to surround the supply head, a holding unit for holding the substrate with the processing surface facing downward, and a holding unit for holding the substrate. A rotation driving unit that rotates the substrate; and a lifting unit that raises and lowers the holding unit relative to the supply head. The processing surface of the substrate held by the holding unit is formed on the supply surface of the supply head. A substrate coating apparatus, wherein a coating liquid is attached to a processing surface by contacting with a liquid film, and is rotationally driven by the rotation driving means to form a coating film on the processing surface of the substrate. 2. The substrate coating apparatus according to claim 1, wherein the cup has a recovery zone for storing the coating liquid, a circulation path communicating with the recovery zone and the supply head,
A circulating pump for circulating the coating liquid stored in the recovery zone to the supply head again. 3. The substrate coating apparatus according to claim 1, further comprising a seal cap for closing an upper opening of the cup. 4. The substrate coating apparatus according to claim 3, wherein the seal cap is fixedly provided so as to close the cup, and is provided on a side surface of the cup for loading and unloading the substrate. A substrate coating apparatus comprising a transfer port. 5. The substrate coating apparatus according to claim 4, further comprising a transport mechanism for transporting the substrate through the transport port, wherein the transport mechanism includes a support for supporting the substrate, and upper and lower surfaces of the support. Inversion driving means for driving to invert,
Reciprocating drive means for reciprocating the support portion with respect to the cup, and when loading the substrate into the cup, the substrate is placed with the processing surface of the substrate facing upward on the side of the cup. After being placed on a support section, the support section is reversed so that the processing surface of the substrate is turned downward by driving the reversing drive means, and the substrate is advanced into the cup by driving the advance / retreat drive means. When the substrate is transferred to the holding means and the substrate is carried out of the cup, the substrate is transferred from the holding means to the supporting portion, and the advance / retreat driving means is driven to move the substrate out of the cup. A substrate coating apparatus for driving the reversing drive means to reverse the support so that the processing surface of the substrate faces upward on the side of the cup. 6. The substrate coating apparatus according to claim 5, wherein the transport mechanism includes a closing member that closes the transport port with the support portion entering the cup. Substrate coating equipment. 7. The substrate coating apparatus according to claim 2, wherein two pressure sensors for measuring the pressure of the flowing coating liquid are provided in the circulation path, and a pressure difference between the pressure sensors is measured. A substrate coating apparatus characterized in that a solvent is replenished to a coating liquid based on the following. 8. The substrate coating apparatus according to claim 2, wherein a buffer section having a flow path cross-sectional area larger than a cross-sectional area of the circulation path is provided in a part of the circulation path. And a stirring means for stirring the inside of the buffer section. 9. The substrate coating apparatus according to claim 3, wherein the seal cap is provided with a heating unit for maintaining the dew point or higher. . 10. The substrate coating apparatus according to claim 2, wherein the cup is provided with cooling means for maintaining the cup at a dew point or lower.