JP2001196597A5 - - Google Patents
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- JP2001196597A5 JP2001196597A5 JP2000326049A JP2000326049A JP2001196597A5 JP 2001196597 A5 JP2001196597 A5 JP 2001196597A5 JP 2000326049 A JP2000326049 A JP 2000326049A JP 2000326049 A JP2000326049 A JP 2000326049A JP 2001196597 A5 JP2001196597 A5 JP 2001196597A5
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- JP
- Japan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000326049A JP4776766B2 (ja) | 1999-10-26 | 2000-10-25 | 半導体装置の作製方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-304722 | 1999-10-26 | ||
JP30472299 | 1999-10-26 | ||
JP1999304722 | 1999-10-26 | ||
JP2000326049A JP4776766B2 (ja) | 1999-10-26 | 2000-10-25 | 半導体装置の作製方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011051223A Division JP5412454B2 (ja) | 1999-10-26 | 2011-03-09 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001196597A JP2001196597A (ja) | 2001-07-19 |
JP2001196597A5 true JP2001196597A5 (es) | 2007-12-20 |
JP4776766B2 JP4776766B2 (ja) | 2011-09-21 |
Family
ID=26564026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000326049A Expired - Fee Related JP4776766B2 (ja) | 1999-10-26 | 2000-10-25 | 半導体装置の作製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4776766B2 (es) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4683691B2 (ja) * | 2000-05-16 | 2011-05-18 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2002368224A (ja) * | 2001-06-04 | 2002-12-20 | Sony Corp | 機能性デバイスおよびその製造方法 |
TW552645B (en) * | 2001-08-03 | 2003-09-11 | Semiconductor Energy Lab | Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device |
JP4008716B2 (ja) * | 2002-02-06 | 2007-11-14 | シャープ株式会社 | フラットパネル表示装置およびその製造方法 |
US7541617B2 (en) | 2003-02-14 | 2009-06-02 | Canon Kabushiki Kaisha | Radiation image pickup device |
JP2004265933A (ja) * | 2003-02-14 | 2004-09-24 | Canon Inc | 放射線検出装置 |
JP2006203121A (ja) * | 2005-01-24 | 2006-08-03 | Seiko Epson Corp | 半導体装置、アクティブマトリクス型電気光学装置、電子機器、および半導体装置の製造方法 |
KR101460869B1 (ko) | 2009-09-04 | 2014-11-11 | 가부시끼가이샤 도시바 | 박막 트랜지스터 및 그 제조 방법 |
US10522784B2 (en) * | 2017-03-08 | 2019-12-31 | Sakai Display Products Corporation | Method for producing organic electroluminescent device and film deposition apparatus |
WO2019142261A1 (ja) * | 2018-01-17 | 2019-07-25 | シャープ株式会社 | 表示装置及びその製造方法 |
JP2020161580A (ja) * | 2019-03-26 | 2020-10-01 | 株式会社ブイ・テクノロジー | デバイス基板およびその製造方法 |
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2000
- 2000-10-25 JP JP2000326049A patent/JP4776766B2/ja not_active Expired - Fee Related