JP2001196500A5 - - Google Patents

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Publication number
JP2001196500A5
JP2001196500A5 JP2000002594A JP2000002594A JP2001196500A5 JP 2001196500 A5 JP2001196500 A5 JP 2001196500A5 JP 2000002594 A JP2000002594 A JP 2000002594A JP 2000002594 A JP2000002594 A JP 2000002594A JP 2001196500 A5 JP2001196500 A5 JP 2001196500A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000002594A
Other languages
Japanese (ja)
Other versions
JP2001196500A (ja
JP4013432B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000002594A priority Critical patent/JP4013432B2/ja
Priority claimed from JP2000002594A external-priority patent/JP4013432B2/ja
Publication of JP2001196500A publication Critical patent/JP2001196500A/ja
Publication of JP2001196500A5 publication Critical patent/JP2001196500A5/ja
Application granted granted Critical
Publication of JP4013432B2 publication Critical patent/JP4013432B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000002594A 2000-01-11 2000-01-11 半導体パッケージ Expired - Fee Related JP4013432B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000002594A JP4013432B2 (ja) 2000-01-11 2000-01-11 半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000002594A JP4013432B2 (ja) 2000-01-11 2000-01-11 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2001196500A JP2001196500A (ja) 2001-07-19
JP2001196500A5 true JP2001196500A5 (enExample) 2006-12-21
JP4013432B2 JP4013432B2 (ja) 2007-11-28

Family

ID=18531684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000002594A Expired - Fee Related JP4013432B2 (ja) 2000-01-11 2000-01-11 半導体パッケージ

Country Status (1)

Country Link
JP (1) JP4013432B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006001389A1 (ja) * 2004-06-28 2006-01-05 Mitsubishi Denki Kabushiki Kaisha 多層誘電体基板および半導体パッケージ
KR100650732B1 (ko) 2004-12-28 2006-11-27 주식회사 하이닉스반도체 스택 칩 패키지
EP3324430A1 (en) * 2008-03-17 2018-05-23 Mitsubishi Electric Corporation Multilayer dielectric substrate and semiconductor package
JP5377096B2 (ja) 2008-09-08 2013-12-25 株式会社東芝 高周波パッケージ装置およびその製造方法

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