JP2001195587A - Device and method for disassembling printed circuit board with packaged component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To collect a component requested on the market separately from the other component. SOLUTION: This device is provided with a CCD for picking up the image of a fad, where the component is packaged, of a printed circuit board, a product data base 300 for storing the product data of the recyclable component on the second-handed market and order data, a product information identifying part 103 for identifying the product information for specifying the component packaged on the printed circuit board from the image picked up by the CCD and judging whether or not the component packaged on the printed circuit board is to be collected on the basis of the identified product information and the product data and order data stored in the product data base 300, and a recycle component collecting part 105 for collecting the component, for which the necessity of collection is identified by the product information identifying part 103, from the printed circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disassembly apparatus and a disassembly method for a printed circuit board on which components are mounted, and more particularly, to a disassembly apparatus and a disassembly method for a printed circuit board mounted on discarded information equipment and the like.

[0002]

2. Description of the Related Art Many electronic components are mounted on a printed circuit board mounted on an electronic device such as an information device by soldering or the like. On the printed circuit board on which electronic components are mounted,
In addition to precious metals such as gold and silver, many resources with small reserves such as copper and tin are included. In addition, solder used for mounting electronic components on a printed circuit board includes Sn-P
Since b-solders are often used, there is a concern about groundwater contamination due to elution of tin (Sn) and lead (Pb), which are heavy metals, from discarded printed circuit boards. In order to cope with both problems of resource depletion and environmental pollution, there is an increasing need to recycle printed circuit boards.

A method of disassembling a mounted component from a printed circuit board for the purpose of recycling the printed circuit board is disclosed in Japanese Unexamined Patent Publication No. Hei 8-
148823, JP-A-8-139446,
And Japanese Patent Application Laid-Open No. 8-318256.

Japanese Patent Application Laid-Open No. 8-139446 discloses that after a printed circuit board is heated to melt an adhesive such as solder,
A disassembly method is described in which an impact force is applied to a side surface of a substrate and a shearing force for peeling off a mounted component is applied to remove the mounted component from a printed circuit board.

In Japanese Patent Application Laid-Open No. 8-148823, referring to FIG. 9, a printed circuit board 605 is accommodated in a component removing drum 603 formed of a coarse mesh, and the printed circuit board 605 is soldered. A disassembly method is described in which the component 607 and the solder 609 are separated from the printed circuit board by heating to a melting temperature or higher, and the component 607 and the solder 609 are separated and collected by the finer solder removing drum 601 than the component removing drum 603. ing.

Further, in Japanese Patent Application Laid-Open No. 8-318256, referring to FIG. 10, the position of an LSI 707 mounted on a printed circuit board 703 is recognized by an image recognition device.
The printed circuit board 703 is moved so that the SI 707 is below the hollow bar 701, and the LSI 707 is moved by moving the hollow bar 701 downward.
And a disassembly method of hollowing out a part together with a part 709 of the method.

On the other hand, ICs collected from waste printed circuit boards,
A used parts business for recycling semiconductor elements such as LSIs has been started in the United States and other countries.

[0008]

However, in the disassembly method described in Japanese Patent Application Laid-Open No. Hei 8-139446, various types of components are mixed and separated from the printed circuit board. Specific parts must be sorted out, which is a very complicated operation. Further, since the melted solder is also removed together with the mounted components, the solder may adhere to the leads of the semiconductor element package, and the solder must be removed from the leads when the semiconductor element is reused.

Further, a printed circuit board using Pb-free solder, which is expected to be widely used in the future, and a conventionally used S
When printed circuit boards using n-Pb solder are mixed, the solder may be mixed and a scouring step may be required for reuse, which may complicate the process and increase the cost.

In the disassembly method described in Japanese Patent Application Laid-Open No. 8-148823, since various types of components are mixed in the collected mounted components, it is difficult to select components to be reused. Further, since the mounted component is separated from the printed circuit board by the impact of rotating the component removing drum 603 and dropping the printed circuit board 605, the lead of the mounted component may be bent or the mounted component may be damaged by cracks or the like. . Furthermore, a problem arises in that different types of solder are mixed.

In the disassembly method described in Japanese Patent Application Laid-Open No. 8-318256, the LSI 707 is
09 and the printed circuit board 703.
In order to reuse the SI 707, a new step of separating the LSI 707 from a part 709 of the printed board is required. Further, since the LSI 707 is collected regardless of the type of the LSI 707, various types of LSI 707 are collected in a mixed state.
An operation for selecting SI is newly required. Further, when the printed circuit board 703 is hollowed out, a force is applied to the printed circuit board 703 and deformation occurs. Due to this deformation, a force is applied to another mounted semiconductor element, and the other semiconductor element may be damaged such as a crack. In addition, since printed circuit boards have been increasingly mounted at high density in recent years, the intervals between mounted components are narrow, and there are portions where it is difficult to cut out with the cutout bar 701.

On the other hand, the components mounted on the printed circuit board can be manually collected or dismantled using a robot. In the dismantling of the same waste printed circuit board, the types and positions of the mounted components are the same, so that the dismantling can be efficiently performed by a human or a robot. However, since various types of printed circuit boards are actually mixed, instructions for disassembly work must be given to humans and robots for each type of printed circuit board. In addition, there is a problem that an operation error occurs when manual operation is performed, and a disassembling operation becomes complicated when using a robot.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to disassemble a printed circuit board capable of selecting and collecting components required in the market. Is to provide a way.

[0014]

According to one aspect of the present invention, there is provided an image pickup means for picking up an image of a surface of a printed circuit board on which components are mounted, and a reusable component in a used market. Storage means for storing market information;
Specific information identifying means for identifying specific information for identifying a component mounted on a printed circuit board from an image captured by the imaging means, and specific information identified by the specific information identifying means and market information stored in the storage means And a first separating unit that separates the components that need to be recovered from the printed circuit board by the determining unit.

According to the present invention, it is determined whether or not to collect the components mounted on the printed circuit board based on the specific information identified by the specific information identifying means and the market information stored in the storage means. Therefore, it is possible to provide a printed circuit board dismantling apparatus capable of selecting and collecting components required in the market.

Preferably, the apparatus further comprises shape identification means for identifying the shape of the component mounted on the printed circuit board, and the specific information identification means is provided for a component having a predetermined shape whose shape identified by the shape identification means is predetermined. It is characterized by identifying specific information.

According to the present invention, the specific information identifying means includes:
Specific information is identified for a part having a predetermined shape whose shape identified by the shape identification means is predetermined. Therefore,
Since the number of components whose specific information is to be identified by the specific information identifying means can be reduced, the processing speed can be increased.

More preferably, the apparatus further comprises communication means for connecting to an external computer via a network, and the market information stored in the storage means can be registered or updated from the external computer via the network. It is characterized by the following.

According to the present invention, the market information stored in the storage means can be registered or updated from an external computer via a network. Therefore, parts can be collected based on the latest information. As a result, it is possible to prevent the inventory of the collected parts from increasing.

More preferably, second separating means for separating the remaining components and the solder mounted on the printed circuit board from which the components have been separated by the first separating means from the printed circuit board;
The apparatus further includes first separating means for separating the remaining separated components from the solder.

More preferably, X of the separated solder
The apparatus further includes means for measuring the line transmittance, and second separating means for separating the separated solder by type based on the measured X-ray transmittance.

According to another aspect of the present invention, a step of extracting specific information for specifying a component mounted on a printed circuit board, and a step of extracting the extracted specific information and market information of a reusable component in a used market. (A) determining whether or not to collect the components mounted on the printed circuit board, and separating the components required to be collected from the printed circuit board.

According to the present invention, it is determined whether or not the components mounted on the printed circuit board are to be collected based on the extracted specific information and market information of the reusable components in the used market. Therefore, it is possible to provide a method of disassembling a printed circuit board capable of selecting and collecting components required in the market.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed circuit board disassembling apparatus according to one embodiment of the present invention will be described below with reference to the drawings. In the drawings, the same reference numerals indicate the same or corresponding members.

FIG. 1 is a block diagram showing an overall outline of a printed circuit board disassembling apparatus according to one embodiment of the present invention. With reference to FIG.
A shape recognition unit 101 for recognizing the shape of the component mounted on the inserted printed circuit board, a product database 300 storing market information of reusable components, and information displayed on the component package. A product information identification unit 103 that identifies product information and determines whether or not a part can be collected based on the identified product information; a reused part collection unit 105 that collects a part that is determined to be required to be collected; A solder / mounted component collecting unit 107 for collecting the solder and the component mounted on the printed circuit board from which the used component has been collected, a solder / mounted component separating unit 109 for separating the collected solder and the mounted component, And a solder type determining unit 111 that determines and sorts the type of solder that has been performed.

FIG. 2 is a block diagram showing a specific configuration of the shape discriminating unit 101 of the dismantling apparatus according to the present embodiment. Referring to FIG. 2, a shape identification unit 101 includes a charge coupled device (CCD) 150 for capturing an image of a surface of a printed circuit board on which components are mounted, and a CCD.
150 and an image recognition control device 151 connected thereto.
The printed circuit board is carried by a conveyor such as a conveyor, and the surface on which the components are mounted is imaged by the CCD 150 of the shape identification unit 101. The CCD 150 transfers the captured image to the image recognition control device 151.

The image recognition control device 151 identifies a semiconductor element as a reusable component based on the received image. The identification of the semiconductor element is performed based on the shape of the package of the semiconductor element. Further, the type of the semiconductor element is estimated from the shape of the package of the semiconductor element, and is classified into a reusable type and a non-reusable type. The position of a reusable semiconductor element is measured and stored in a memory in the image recognition control device 151.

As a package shape of a reusable semiconductor element, a QFP (quad) which is often used in a microprocessor or a memory and whose lead frame can be visually confirmed can be used.
flat package), QFJ (quad flat J-leaded packag)
e), SOP (small outline package), and SOJ
(Small outline J-leaded package) and PGA (pin grid a) with connection pins and bumps on the underside of the package.
rray), CSP (chipscale package), and BGA
(Ball grid array). Of these shapes, the shape of a reusable component is registered in the memory of the image recognition control device 151 in advance, and the position on the printed circuit board of the component that matches the registered shape is determined by the CCD 150.
Is measured based on the image received from the device, and the position is stored in the memory.

As described above, the shape discriminating unit 101 selects a reusable component from the shape of the component on the printed circuit board. For this reason, a product information identification unit 1 described later
In 03, the parts to be processed are narrowed down to some extent, so that the load on the product information identification unit 103 can be reduced and the processing speed can be increased.

The image recognition control unit 151 is connected to the control unit 201 of the product information identification unit 103, and the position of the component stored in the memory of the image recognition control unit 151 is determined by the control unit of the product information identification unit 103. 201 is transmitted.

Although the shape recognizing unit 101 selects a component having a shape that matches a shape stored in advance in a built-in memory, the shape of the component to be selected is stored in the product database 300. Alternatively, the contents of the memory of the shape recognition unit 101 may be updated each time the product database 300 is updated. The shape recognition unit 10
1 instead of storing it in the memory of the product database 3
The shape stored in 00 may be used.

FIG. 3 is a block diagram showing the overall configuration of the product information identification unit 103 and the reusable parts collection unit 105 of the dismantling apparatus according to the present embodiment. Referring to FIG. 3, a product information identification unit 103 includes a control unit 201 that controls the entire product information identification unit 103, and a CCD connected to the control unit 201.
203 and a communication unit 205. Control unit 201
Are connected to the product database 300.

The reusable part collection unit 105 includes a collection robot control unit 207 and a collection robot 400 connected to the collection robot control unit 207. Collection robot controller 2
Reference numeral 07 is connected to the control unit 201 of the product information identification unit 103.

The CCD 203 is controlled by the control unit 201 and picks up an image of the position transmitted from the image recognition control device 151. Thereby, the package surface of the component determined to be reusable by the shape identification unit 101 is imaged.

An image of the package surface of the semiconductor device taken by the CCD 203 is transmitted to the control unit 201. The control unit 201 recognizes information drawn on the package surface of the semiconductor element by character recognition from the image received from the CCD 203. This is product information for specifying the part, such as information drawn on the package surface, a manufacturer name and a product number. For example, “M XC68040R
When the character “C25M” is drawn, the control unit 201 recognizes the character by character recognition, recognizes that the manufacturer name is “Motorola” from the character “M”, and recognizes the character from the character “XC68040RC25M”. Recognize the product number. If the information drawn on the package surface includes a logo mark or the like, the logo mark or the like is identified by pattern matching.

The control unit 201 refers to product data and order data, which will be described later, stored in the product database 300 based on the recognized product information. Then, it is determined whether or not the part has a reuse value. This determination will be described later in detail.

If the control unit 201 determines that it is worth reusing, the control unit 201 transmits an instruction to collect the parts to the collection robot control unit 207 of the reusable parts collection unit 105. The collection robot control unit 207 controls the collection robot 400 based on an instruction from the control unit 201, separates components from the printed circuit board, and collects the separated components.

The communication unit 205 is controlled by the control unit 201 via the network 209 to the external reuse product handling company 113.
Communication with the computers 113A to 113C. As a result, the data of the product database 300 can be registered and updated in the control unit 201 from the computers 113A to 113C of the reused goods dealer 113.

The network to which the communication unit 205 can be connected is, for example, the Internet, a public line, a dedicated line, or the like. In addition, local area networks (LA
N).

FIG. 4 is a diagram showing a schematic configuration of a collection robot 400 provided in the reusable part collection unit 105 of the dismantling apparatus according to the present embodiment. Referring to FIG. 4, collection robot 400 heats substrate holder 407 for holding printed circuit board 1, infrared panel heater 409 for heating printed circuit board 1, and component 411 mounted on printed circuit board 1. A nozzle 403 for blowing gas,
A suction head 405 for sucking the component 411 and an arm 401 holding the nozzle 403 and the suction head 405
And

The arm 401 is held by an XY robot that can move in two horizontal axes and one vertical axis, and can move the nozzle 403 and the suction head 405 to arbitrary positions on the printed circuit board 1. When the arm 401 moves in the vertical direction, the nozzle 403 and the suction head 405 can move vertically on the printed circuit board 1 in the vertical direction.

The board holder 407 conveys the printed board 1 onto the infrared panel heater 409 while holding the printed board 1 with the surface on which the components are mounted facing up. The printed circuit board 1 is heated to about 170 ° C. from the lower surface side of the printed circuit board 1 by the infrared panel heater 409.

Then, based on an instruction from the collection robot control unit 207, the arm 401 is moved by the XY robot. The collection robot control unit 207 receives the position of the component on the printed board from the control unit 201. Then, the nozzle 403 and the suction head 405 are connected to the component 41 to be collected.
Moved up one. The nozzle 403 supplies heated gas to the component 4
11 to melt the solder at the joint between the printed circuit board 1 and the component.

The arm 401 descends and the suction head 405
Sucks the upper surface of the package of the component 411. And
The component 411 is separated from the printed circuit board 1 by raising the arm 401. The solder adhering to the lead of the separated component is blown off by the heated gas blown by the nozzle 403 and separated from the component. The separated parts are collected for each product. This separation operation is performed by the number of parts to be collected according to an instruction from the control unit 201.

Note that the processing performed by the shape recognition unit 101 is performed by the product information identification unit 103, so that the number of apparatuses can be reduced to one. In this case, the shape recognition unit 10
One CCD 150 is the CCD 20 of the product information identification unit 103.
The processing performed by the image recognition control device 151 instead of 3 is performed by the control unit 201.

FIG. 5 is a diagram showing an example of product data stored in the product database 300 of the dismantling apparatus according to the present embodiment. FIG. 6 is a diagram illustrating an example of order data stored in the product database 300 of the dismantling apparatus according to the present embodiment. Referring to FIG. 5, the product data is:
It consists of product name, manufacturer name, product number, minimum price, and stock quantity. The data of these items is stored for each product. For example, the product data on the first line in FIG. 5 indicates that “IC” of the part number “A001” of Company A has the minimum price of “1,500 yen” and the stock quantity of “500”. As described above, the lowest price and the stock quantity are stored for each product, each maker, and each product number.
The item of “demand” is data calculated from order data described later, and may or may not be included in product data. Here, the case where it is included for the sake of explanation is shown.

Referring to FIG. 6, order data is created for each order from a reused goods dealer. The order data includes items of the ordering trader name, product name, manufacturer name, product number, desired price, delivery date, and quantity. For example,
The order data on the first line in FIG. 6 indicates the order content of the company name “Company X”, which includes “IC” of the part number “A001” of Company A, the desired price “1600”, Delivery date is "20
January 1, 2000 ", indicating that the quantity is" 400 ".

Based on the product data and the order data, it is determined whether the stock quantity exceeds the demand and whether the desired price of the reused goods dealer is higher than the minimum price. Is determined. If the quantity of stock is larger than the quantity ordered by the reused goods dealer,
The part does not need to be collected. In this case, even if it is collected, only the number of stocks increases, resulting in useless stocks.

For example, referring to the product data on the first line in FIG. 5, the part with the part number “A001” of Company A has a stock number of “500”, whereas the order data in FIG. The number of parts with part number “A001” of Company A is “4
00 ”. Therefore, the stock quantity becomes larger than the quantity required by the reused goods handling company. In such a case, there is no need to collect the part with the part number “A001” of Company A.

Also, if the price desired by the reused goods dealer is lower than the lowest price of the product data, the parts cannot be sold to the reused goods dealer at a price lower than the lowest price. In such cases, there is no need to collect. For example, referring to the product data on the third line in FIG. 5, the part with the part number “C011” of the company C has a minimum price of “550”, whereas the order data of the company X on the fourth line in FIG. Then, the desired price of the part with the part number “C011” of Company C is “450”. The lowest price is "55
Since the desired price is "450" while the desired price is "450", it is not possible to fulfill the order of company X.

Similarly, in the order data of Company Z in the third row of FIG. 6, the desired price of “IC” of the product number “C011” of Company C is “500”. Also in this case, the desired price is lower than the lowest price “550” of the product data. Therefore, it is not possible to meet the order of Company Z. When the order cannot be fulfilled, the data of the item “demand” in FIG. 5 may be set to “0”. In the above example, 3 in FIG.
The item of “demand” of the product data in the row is “0”.

The solder / mounted component collecting section 107 heats the printed circuit board 1 to a temperature higher than the melting temperature of the solder, for example, about 190 to 250 ° C. by a heater. And the printed circuit board 1
Applying an impact force to the printed circuit board 1
Remove from As a method for removing the mounted components and the solder from the printed circuit board, a device that rubs the mounting surface of the components of the printed circuit board with a brush or a spatula can be used.

The solder / mounted component separating unit 109 separates the mixture of the mounted component and the solder collected by the solder / mounted component collecting unit 107 into the mounted component and the solder. The solder / mounted component separating unit 109 is separated by, for example, an apparatus having sieves having different mesh sizes. Large elements such as semiconductor elements and connectors remain on the coarse sieve. The mixture of the solder and the chip component that has passed through the sieve having the coarse mesh size is heated again to the solder melting temperature, and then is passed through a sieve having a finer mesh size. As a result, the chip component remains on a fine sieve having a mesh size and is separated from the solder.

Valuable materials such as gold are recovered from the semiconductor elements and connectors remaining on the sieve having a coarse mesh size. By separating these components that contain gold from those that do not contain gold, the gold content in the collection can be increased. Thereby, the efficiency of collecting gold can be increased.

Valuable materials such as platinum (Pt) and silver (Ag) can be recovered from the chip components remaining on the sieve having a fine mesh size. By separating such parts containing Pt and Ag from other parts, P
The content of t and Ag can be increased, and as a result, Pt
And the efficiency of recovering Ag is improved.

FIG. 7 is a diagram showing a schematic configuration of the solder type discriminating section 111 of the dismantling apparatus according to the present embodiment. Referring to FIG. 7, solder type determination unit 111
07, and a tray 503 for holding the solder particles 507.
An X-ray tube 501 for irradiating the X-ray with the X-ray, and a picture tube 505 for receiving the X-ray are included.

Since the X-ray transmittance of lead (Pb) is smaller than the transmittance of tin (Sn), the X-ray transmittance of the Pb-free solder containing no lead (Pb) is higher than that of tin (Sb). Utilizing the increase, the type of solder is separated.

The X-rays emitted from the X-ray tube 501 pass through the solder particles 507 and irradiate the picture tube 505, and an X-ray projection image is output from the picture tube 505. The X-ray projected image is taken into a control unit (not shown) as a monochrome gray-scale image, and the difference in X-ray transmittance is determined from the gray-scale difference.

Eutectic solder (component ratio Sn: Pb = 60:
40) and Pb-free solder (component ratio Sn: Ag = 9)
When the X-ray transmission amount is compared with that of 7: 3), there is a slight difference in the X-ray transmission amount of about several percent to about 20%, although the influence of the solder particle size and the like is somewhat observed. By detecting the difference in the amount of X-ray transmission, eutectic solder and Pb-free solder can be distinguished.

In the case of the mixture of the eutectic solder and the Pb-free solder, a grayscale distribution corresponding to the solder particles is seen in the monochrome grayscale image. The mixture can be determined based on this light and shade distribution.

The solder collected by separation is refined and reused. Further, metals such as tin (Sn) and silver (Ag) having high resource depletion properties are collected.

Copper can be recovered from the printed circuit board from which the mounted components and the solder have been removed. As a method of recovering, for example, using an echo separation device manufactured by NEC Corporation, the powder is separated into copper-rich powder and resin / glass powder. Metals such as copper are recovered from the copper-rich powder and can be recycled. Resin and glass powder can be reused as fillers for building materials and the like.

Further, the printed board is burned and then pulverized, and then supplied to the copper refining step together with the copper ore to recover copper and the like. This is a technique called so-called Yamamoto reduction. Further, the metal contained in the printed circuit board can be dissolved with an acid or the like, and the metal can be recovered by an electrolytic method.

Next, the flow of processing performed in the printed circuit board disassembly apparatus according to the present embodiment will be described. FIG. 8 is a flowchart showing a flow of processing performed by the printed circuit board disassembly apparatus according to the present embodiment. Referring to FIG. 8, first, the shape of the component mounted on the inserted printed circuit board is identified by shape identifying section 101 (step S01).

Then, it is determined whether or not the identified shape matches a predetermined shape (step S02). This is performed by pattern recognition, and it is determined whether or not the shape matches a shape stored in the memory of the image recognition control device 151 of the shape identification unit 101 in advance. The position on the printed circuit board of a component having a shape that matches the shape stored in the memory of the image recognition control device 151 is detected based on the position in the captured image (step S03). As a result, among the components mounted on the printed circuit board 1, the position of a component having a shape that is often found in a microprocessor or a memory is detected.

Then, the product information is extracted by the product information identification section 103 (step S04). The product information is extracted by imaging the position on the printed circuit board 1 detected in step S03 with the CCD 203, and extracting the product information drawn on the package surface of the semiconductor element from the captured image by character recognition or pattern matching. I do. And
A product database 300 based on the extracted product information
Is retrieved (step S05).

It is determined whether or not product data corresponding to the extracted product information exists in product database 300 (step S06). If the product data exists, the process proceeds to step S07; otherwise, the process proceeds to step S07.
Go to 10.

In step S07, it is determined whether or not the stock quantity of the product corresponding to the product information in the product data is larger than the demand quantity obtained from the order data. If the stock quantity is larger than the demand quantity, the process proceeds to step S10; otherwise, the process proceeds to step S08. This is because if the stock is large, there is no need to collect the parts.

In step S08, the lowest price of the product data corresponding to the product information extracted in step S04 is
It is determined whether the price is higher than the desired price of the order data.
If the minimum price is higher than the desired price, step S1
0, otherwise, to step S09.
If the minimum price is higher than the desired price, it is not necessary to collect the parts because the parts cannot be sold to the reuse dealer at the desired price.

In step S09, the collection robot 400
To collect parts. As described above, the part of the product information extracted in step S04 is the case where the stock quantity is lower than the demand quantity and the lowest price of the part is higher than the price desired by the reuse dealer. Only in step S09, the part is collected. Therefore, parts with sufficient stocks and parts whose minimum price is higher than the desired price and cannot be sold to the reuse dealer are not collected, so that the stock quantity does not increase.

In step S10, the mounted components and the solder remaining on the printed circuit board are removed by the solder / mounted component collection unit 1
After being collected at 07, it is separated and collected into solder and mounted components by a solder / mounted component separation unit 109.

The type of solder is determined by the solder type determining unit 111, and the solder is classified by type (step S).
11).

As described above, the printed circuit board disassembly apparatus according to the present embodiment can collect and collect semiconductor elements that are in demand in the market from other parts. Then, by collecting the remaining mounted components separately into chip components and other components, it is possible to increase the recovery efficiency of valuable resources.

Further, the recovered solder was replaced with Sn-Pb
It can be separated into solder, Pb-free solder, and mixtures thereof. Therefore, the solder can be reused. In addition, metals such as Sn and Ag having high resource depletion can be efficiently recovered from the recovered solder.

The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an overall outline of a printed circuit board disassembly apparatus according to one embodiment of the present invention.

FIG. 2 is a block diagram illustrating a specific configuration of a shape identification unit 101 of the dismantling device according to the present embodiment.

FIG. 3 is a block diagram illustrating an overall configuration of a product information identification unit 103 and a reusable parts collection unit 105 of the dismantling apparatus according to the present embodiment.

FIG. 4 is a diagram showing a schematic configuration of a collection robot 400 included in a reusable part collection unit 105 of the dismantling apparatus according to the present embodiment.

FIG. 5 is a diagram illustrating an example of product data stored in a product database 300 of the dismantling apparatus according to the present embodiment.

FIG. 6 is a diagram showing an example of order data stored in a product database 300 of the dismantling apparatus according to the present embodiment.

FIG. 7 is a diagram illustrating a schematic configuration of a solder type determining unit 111 of the dismantling apparatus according to the present embodiment.

FIG. 8 is a flowchart showing a flow of a process performed by the printed circuit board disassembling apparatus in the present embodiment.

FIG. 9 is a first view showing a conventional printed circuit board disassembly apparatus.

FIG. 10 shows a second example of a conventional printed circuit board disassembly apparatus.
FIG.

[Explanation of symbols]

101 Shape identification unit, 103 Product information identification unit, 105
Reused part collection unit, 107 Solder / mounted component collection unit, 109 Solder / mounted component classification unit, 111 solder type discrimination unit, 300 product database.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G001 AA01 BA11 CA01 CA07 FA06 HA04 HA13 JA16 KA01 KA12 LA02 LA11 MA04 4D004 AA24 BA10 CA02 DA16 5B057 AA03 DA07 DA12 DB06 DC09 5E319 CD51 CD57 GG20

Claims (6)

[Claims] An imaging unit configured to image a surface of a printed circuit board on which components are mounted; a storage unit configured to store market information of a reusable component in a second-hand market; Specific information identifying means for identifying specific information for identifying a component mounted on the board; and the printed circuit board based on the specific information identified by the specific information identifying means and market information stored in the storage means. Device for disassembling a printed circuit board, comprising: determining means for determining whether or not to recover the components mounted on the printed circuit board; and first separating means for separating the components required to be recovered by the determining means from the printed board. . 2. The apparatus according to claim 1, further comprising a shape identification unit configured to identify a shape of a component mounted on the printed circuit board, wherein the specific information identification unit has a shape identified by the shape identification unit having a predetermined shape. The printed circuit board disassembly apparatus according to claim 1, wherein the specific information is identified for a component. 3. A communication device for connecting to an external computer via a network, wherein the market information stored in the storage device can be registered or updated from the external computer via the network. The printed circuit board disassembly apparatus according to claim 1, wherein the printed circuit board is disassembled. 4. A second separating means for separating the remaining components mounted on the printed circuit board and the solder from the printed circuit board from which the components have been separated by the first separating means, and the separated remaining components and the solder. The disassembly apparatus for a printed circuit board according to any one of claims 1 to 3, further comprising a first separation unit that separates the solder from the solder. 5. The apparatus further comprises means for measuring the X-ray transmittance of the separated solder, and second separating means for separating the separated solder by type based on the measured X-ray transmittance. An apparatus for dismantling a printed circuit board according to claim 4. 6. A step of extracting specific information for specifying a component mounted on a printed circuit board, based on the extracted specific information and market information of a reusable component in a used market. A method of disassembling a printed circuit board, comprising: determining whether or not to collect components mounted on a printed circuit board; and separating the components that need to be collected from the printed circuit board.