JP2001192623A - Method for bonding laminated plate material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for bonding a laminated plate material, free from occurrence of change of heating efficiency and occurrence of change, warp, etc., of plate material by heat and capable of shortening bonding time by directly applying high frequency to an adhesive layer. SOLUTION: A laminated plate-like material A is bonded by directly bringing electrode plates into contact with adhesive layers 2 from both sides in a state in which the laminated plate-like material A obtained by superposing plural sheets of wooden plate material 1 through adhesive layers 2 is pressurized from the superposed direction and directly applying high frequency to these adhesive layers 2 to heat-dry the layers 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bonding plate materials, and more particularly, to bonding plate materials which are superimposed via an adhesive layer by directly applying a high frequency to the adhesive layer to improve the bonding efficiency. And a bonding method capable of reducing energy.

[0002]

2. Description of the Related Art As means for laminating and connecting plate materials,
In the cold press method most commonly used, bonding and connection are performed by applying pressure from an overlapping direction in a state where an adhesive is applied to an overlapping surface, and then releasing the pressure after the adhesive is dried.

[0003] However, such a cold press method takes a long time to wait for the adhesive to dry, and is extremely inefficient. For this reason, an adhesive method for forcibly heating and drying the adhesive applied to the overlapping surface by applying a high frequency to improve the efficiency of lamination and connection of plate materials has already been proposed.

FIG. 8 shows a conventional bonding method using a high frequency. The example shown in FIG. 8 (A) is called an entire heating method, and a required number of plate materials 1 are bonded to an adhesive layer 2. The laminated plate 1 is sandwiched between a pair of electrode plates 3 and 4 in the laminating direction and pressed, and a high frequency power supply 5 connected to both electrode plates 3 and 4 applies high frequency to both electrode plates 3 and 4. In this manner, the adhesive layer 2 between the respective plate materials 1 is heated and dried.

The example shown in FIG. 8 (B) is called a selective heating method, in which a required number of plate members 1 are laminated via an adhesive layer 2 and the laminated plate members 1 are paired. Between the electrode plates 3 and 4, the adhesive layer 2 is disposed in such a manner that the direction of the adhesive layer 2 is directed between the two electrode plates 3 and 4, and sandwiched between the electrode plates 3 and 4.
The high frequency power supply 5 connected to the two electrode plates 3 and 4
4 is applied with a high frequency, and thereby the adhesive layer 2 between the respective plate materials 1 is heated and dried.

[0006]

However, in the former overall heating method, there is no direct connection between the adhesive layer and the two electrode plates, so that high frequency passes through the inside of the plate material, and If the thickness, the number of laminated plates, the moisture content of the plate material, and the like change, the heating efficiency will fluctuate, and it will take time for bonding.

[0007] In the latter selective heating method, a high-frequency wave is automatically selected by sandwiching the plate material between the two electrode plates, and the high-frequency wave flows through the adhesive layer. And energy loss occurs,
The bonding efficiency will be reduced accordingly.

Further, in any of the heating methods, there is a problem that the plate material itself is heated by the moisture contained in the plate material due to the high frequency flowing into the plate material, and the heat causes the plate material to deteriorate or warp.

Accordingly, an object of the present invention is to apply a high frequency directly to the adhesive layer, thereby preventing the occurrence of fluctuations in heating efficiency and the occurrence of deterioration or warpage of the plate due to heat, and shortening the bonding time. To provide a bonding method.

[0010]

In order to solve the above-mentioned problems, the invention according to claim 1 is a method of adhering from the both sides in a state where the superposed plate materials are pressed from the superposition direction via an adhesive layer. An electrode is brought into direct contact with the agent layer, and a high frequency is directly applied to the adhesive layer to bond the adhesive layer.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

The first embodiment shown in FIGS. 1 to 3A is an example of a bonding apparatus for bonding a laminated board A in which a large number of wooden boards 1 are stacked, and supports the laminated board A. In order to pressurize, a portal type frame 7 is erected on the support base 6,
A press head 9 that moves up and down by a cylinder 8 is provided on the upper portion of the frame 7 so as to face the support 6, and a pair of electrode devices 10 and 1 are located on both sides of the frame 7 above the support 6.
1 is disposed, and a high frequency generating oscillator 13 is electrically connected to the electrode devices 10 and 11 via a variable condenser 12.

The laminated plate material A supplied on the support 6 is formed by laminating a required number of plate materials 1 up and down between the respective plate materials 1 with an adhesive layer 2 interposed therebetween. It will be pressurized.

In each of the pair of electrode devices 10 and 11, an insulator 15 is attached to a base plate 14 arranged vertically, and a large number of electrode plates 16 are vertically arranged on the surface of the insulator 15.
Are formed at a pitch corresponding to the interval between the adhesive layers 2 of the laminated plate material A, and are formed with an insulating member 17 interposed between the electrode plates 16, while the electrode device 10 is fixed to the frame 7, The other electrode device 11 is arranged so as to be movable forward and backward with respect to the one electrode device 10. The electrode plate 16 is a conductive metal plate thin enough to match the thickness of the adhesive layer 2 and has a length corresponding to the entire length of the laminated plate material A in the width direction.

Therefore, when the laminated plate material A is supplied onto the support base 6 and the other electrode device 11 is moved forward and the laminated plate material A is sandwiched between the pair of electrode devices 10 and 11 from both sides, the two electrode devices 10 Numeral 11 indicates that the tip of the electrode plate 16 comes into direct contact with the end of the adhesive layer 2 located between the upper and lower plate members 1. The ten electrode plates 16 and the electrode plate 16 of the other electrode device 11 are connected at a high frequency.

Next, a bonding method using the bonding apparatus according to the first embodiment will be described.

The laminated plate material A stacked between the respective plate materials 1 with the adhesive layer 2 interposed therebetween is supplied onto the support 6, and the other electrode device 11 is provided.
Is moved forward, and the laminated plate material A is
Is pressed from both sides, and the laminated plate material A is pressed in the laminating direction by lowering the press head 9.

When the laminated plate material A is sandwiched between the pair of electrode devices 10 and 11 from both sides, as shown in FIG. 3A, both electrode devices 10 and 11 are positioned between the laminated plate materials 1 at the tips of the electrode plates 16. In this state, the oscillator 13 is started, and the two electrode devices 10 and 11 are activated.
When a high frequency is applied for a predetermined period of time, the high frequency is directly applied to each of the adhesive layers 2, and each adhesive layer 2 is directly heated and dried while being pressed in the laminating direction, and dried. The plate material 1 is bonded, and after the bonding is completed, the laminated plate material A may be taken out from the support base 6 by raising the press head 9 and retreating the other electrode device 11.

As described above, the thickness of the electrode plate 16 is set thin enough to match the thickness of the adhesive layer 2.
Is brought into direct contact with the end of the adhesive layer 2, the applied high frequency does not flow to the plate 1, but directly flows only to the adhesive layer 2, thereby greatly reducing the energy loss of the high frequency. In addition to the reduction, the plate material 1 is not deteriorated or deformed by heat, and the efficiency of the bonding operation can be improved by heating and drying only the adhesive layer 2 at a high frequency.

Next, a second embodiment shown in FIGS. 3B to 7 is an example of a bonding apparatus for performing lamination bonding of a scarf joint in which the ends of plate materials 1a and 1b are cut obliquely. The two plate members 1a and 1b are arranged so that the obliquely cut portion is arranged upside down, and the obliquely cut portion is overlapped with an adhesive applied, and the overlapped portion is pressed, The high frequency is directly applied to the adhesive layer 2 to bond the adhesive layer 2.

In this bonding apparatus, a clamping plate 24 which moves up and down by a cylinder 23 is attached to a gate-shaped frame 22 provided on an upper portion of a fixed base 21, and one electrode device 31 is mounted on the upper surface of the fixed base 21. The other electrode device 32 is provided on the lower surface of the fastening plate 24,
A high frequency generating oscillator 33 is electrically connected to both electrode devices 31 and 32 via a variable condenser.

As shown in FIG. 3B, the two electrode devices 31 and 3
2 is formed by providing an electrode plate 35 on an insulator 34, and in a state where the pressing plate 24 presses the two plate members 1a and 1b together with the fixed platen 21, the electrode plate 35 of one electrode device 31 is formed. Is in contact with the adhesive layer 2 at the lower end of the overlapping portion of the two plates 1a and 1b, and the electrode plate 35 of the other electrode device 32 is at the upper end of the overlapping portion of the two plates 1a and 1b. 2 will come into contact.

Behind the fixed platen 21, plate members 1a,
A carry-in conveyor 25 for feeding 1b, a pinch roller 26 which can move up and down are arranged, a carry-out conveyor 27 which takes out the plate materials 1a and 1b in front of the fixed surface plate 21, and a pinch roller 28 which can move up and down are arranged. I have.

A bonding method using the bonding apparatus according to the second embodiment will be described.

FIG. 4 shows a process of feeding the first plate 1a. The pressing plate 24 waits at the raised position, and the loading conveyor 25
The first sheet material 1a sent onto the fixed platen 21 by the pinch roller 26 and the unloading conveyor 27 and the pinch roller 2
8 and is pulled out.
When it reaches the electrode plate 35 of the electrode device 31, the unloading conveyor 27 and the pinch roller 28 stop feeding, and hold the first sheet material 1a sandwiched therebetween.

FIG. 5 shows a process of feeding the second plate 1b. The second plate 1b is fed onto the fixed platen 21 by the carry-in conveyor 25 and the pinch roller 26.

As shown in FIG. 6, this second plate 1
When the leading end of b reaches immediately below the electrode plate 35 of the electrode device 32 of the pressing plate 24 and comes into contact with the rear end of the plate 1a, the carry-in conveyor 25 and the pinch roller 26 stop.

The rear end of the first plate 1a is supplied such that the obliquely cut portion is directed upward, and the front end of the second plate 1b is supplied such that the obliquely cut portion is directed downward.
An adhesive is applied to each cut portion in advance, and the cut portions of both plate materials 1a and 1b overlap.

FIG. 6 shows the bonding step, in which the pressing plate 24 is lowered, the two plate members 1a, 1b are fixed to the fixed platen 21, and the obliquely cut portions of the two plate members 1a, 1b are put through the adhesive. And the pinch rollers 26 and 28 are separated upward.

As shown in FIG. 3B, in the electrode devices 31 and 32, the electrode plate 35 of one electrode device 31 contacts the lower end of the adhesive layer 2, and the electrode plate 35 of the other electrode device 32 It comes into contact with the upper end of the layer 2 and the oscillator 3
3 is activated and a high frequency is applied between the electrode devices 31 and 32 for a predetermined time, the high frequency is directly applied to the adhesive layer 2, and the adhesive layer 2 is directly heated in a state of being pressed in the overlapping direction. Then, the overlapped portions of the two plate members 1a and 1b are bonded, and after the bonding is completed, the pressing plate 24 is lifted to release the pressing of the both plate members 1a and 1b, and the pinch roller 26 of the carry-in conveyor 25 and the unloading device Pinch roller 28 of conveyor 27
Is lowered to activate the respective rollers, whereby the two plate materials 1a and 1b are sent out to the carry-out conveyor 27 side, and are prepared for the next bonding.

Also in the overlap bonding of the scarf joint according to the second embodiment, the applied high frequency flows to the plate members 1a and 1b by bringing the tip of the electrode plate 35 into direct contact with the end of the adhesive layer 2. Therefore, not only the high-frequency energy loss can be significantly reduced, but also the plate materials 1a and 1b are not deteriorated or deformed by heat, and the adhesive layer 2 By concentrating and drying only the material at a high frequency, the efficiency of the bonding operation can be improved.

[0032]

As described above, according to the present invention, the electrodes are brought into direct contact with the adhesive layer from both sides in a state in which the plate materials laminated via the adhesive layer are pressed from the overlapping direction. Since the high frequency is applied directly to the adhesive layer and bonded, the high frequency applied directly to the adhesive layer without flowing to the plate material by directly contacting the tip of the electrode plate with the edge of the adhesive layer. By flowing, for this reason, not only can the high-frequency energy loss be significantly reduced, but also the plate material is not deteriorated or deformed by heat, and by heating and drying only the adhesive layer at high frequency, The efficiency of the bonding operation can be improved.

[Brief description of the drawings]

FIG. 1 is a front view showing a first embodiment of a bonding apparatus.

FIG. 2 is a plan view of the above.

FIG. 3A is an enlarged front view showing the bonding state of the electrode device in the above embodiment, and FIG. 3B is an enlarged front view showing the bonding state of the electrode device in the second embodiment;

FIG. 4 is a front view of a first sheet material feeding process showing a second embodiment of the bonding apparatus.

FIG. 5 is a front view of a second plate material feeding process showing the second embodiment of the bonding apparatus;

FIG. 6 is a front view of a connection process showing a second embodiment of the bonding apparatus.

FIG. 7 is a side view showing a second embodiment of the bonding apparatus.

FIG. 8A is a front view showing the bonding state of the electrode apparatus of the whole heating system in the conventional bonding apparatus, and FIG. 8B is a front view showing the bonding state of the electrode apparatus of the selective heating system.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plate material 1a Plate material 1b Plate material 2 Adhesive layer 6 Support base 9 Press head 10 Electrode device 11 Electrode device 13 Oscillator 16 Electrode plate 21 Fixed surface plate 24 Clamping plate 31 Electrode device 32 Electrode device A Plate material

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Shiya Nakahara 2-33 Midori, Suminoe-ku, Osaka F-term in the Taihei Seisakusho Osaka Division (reference) 2B200 AA07 BA01 CA02 CA04 DA04 EA06 EC18 EE13 EF01 EF02 FA12 FA15 FA24 FA31 HA01 4F211 AD08 AG03 AK08 TA03 TC01 TD11 TN13 TQ04 4J040 LA11 MA08 MB05 MB14 NA13 PA31

Claims (1)

[Claims] 1. An electrode is brought into direct contact with an adhesive layer from both sides in a state where a plate material that has been stacked via an adhesive layer is pressed from the overlapping direction, and a high frequency is directly applied to the adhesive layer so as to be bonded. A method of bonding plate materials, comprising: