JP2001189371A - Load port adjusting tool, foup-measuring tool, foup wafer plane measuring tool, kinematic pin shape evaluating tool, kinematic pin position evaluating tool, and adjustment/measurement/evaluation method using them - Google Patents

Abstract

PROBLEM TO BE SOLVED: To smooth the transfer of a substrate on the FIMS surface of a load port when manufacturing a semiconductor, improve switching reliability of a FOUP switching mechanism, and improve compatibility and switching reliability of an interface door. SOLUTION: The position measurement mechanism for measuring a registration pin position on an FIMS surface, a position measurement mechanism for measuring the registration pin hole position of an FOUP door, a distance measurement mechanism for measuring distance from the FIMS surface to a front virtual reference surface, and the like are combined, thus obtaining a load port adjusting took, an FOUP-measuring tool, and the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a FOUP (Front Openi) which is a next-generation substrate storage jig for storing, transporting and storing a substrate (wafer) such as a semiconductor substrate.
ng Unified Pod) technology, especially FO
The present invention relates to a technology for improving UP compatibility, improving the opening / closing reliability of an FOUP interface door, and improving the substrate transfer reliability.

[0002]

2. Description of the Related Art Conventionally, as a substrate storage jig (wafer carrier) used in the manufacture of semiconductors, there is one as shown in FIG. In FIG. 23, reference numeral 20 denotes FOUP, 1
Reference numeral 4 denotes a pod shell (pod main body) serving as a wafer holding unit of the FOUP 20, and 1A denotes a position of a V-groove (not visible in this figure) installed on the lower surface of the bottom plate of the pod shell 14. Reference numeral 12 denotes an interface door which is an opening / closing door portion, 11 denotes a latch key for fixing the door 12 to the pod shell 14, 10 denotes a registration pinhole provided on the surface of the interface door 12, and 13 denotes the interface door. 3 shows a latch keyhole provided on the surface. The information such as the dimensions is based on the SEMI standard (E57, E1.9, E47.1).
, Etc.), and will be omitted. In addition, in this specification, FOUP stands for Front Opening.
It is an abbreviation of Unified Pod and means what is called a substrate storage jig, a wafer carrier, a horizontal door opening / closing integrated wafer carrier used for storing, transporting and storing substrates. Regarding this, the specification is defined in the SEMI standard.

[0003] A FOUP 20 shown in FIG.
It is described in the catalog of OWARE, and differs from the conventional open cassette used before 8 inches (information such as dimensions is omitted because it is described in SEMI standard E1.9). By holding the wafer in a closed space, the wafer is protected from foreign substances in the atmosphere and chemical contamination. Therefore, a seal member is provided on the interface door 12 in order to maintain the airtightness, and a mechanical opening / closing mechanism called a retainer, such as a wafer presser and a latch, is used. Further, in order to fix the interface door 12 to the pod shell 14, a clamping mechanism having a stopper and a latch is required, which has a complicated structure, and a hole needs to be formed on the interface door 12 side for the clamping mechanism. was there. Further, on the pod shell 14 side, an opposing clamp hole for fixing the door, a thick portion, and a seal portion are required.

In order to open and close such an interface door of the FOUP 20 in a semiconductor manufacturing apparatus (substrate processing apparatus), a load port having a FIMS surface specified by the SEMI standard is required. Here, FIMS is
Front-opening Int. Mechanical Standard (Front-opening Int)
erface Mechanical Standard
Abbreviation of d). FIG. 24 is a view showing a state in which the FOU is mounted on a load port having a FIMS surface in the substrate processing apparatus of the prior invention.
It is a block diagram which shows the opening and closing method of P FOUP door.

In FIG. 24, reference numeral 20 denotes a FOUP, 14 denotes a FOUP shell, 12 denotes a FOUP door, and 15 denotes a FOUP.
P seal surface, 16 is a door clamping mechanism, 17 is V
5 shows a V-groove member having a groove (V-groove).
Reference numeral 18 denotes a wafer housed in the FOUP shell unit 14. 23 is a load port, 5 is a kinematic pin (reference pin), 24 is a FIMS surface, and 24S is a FIM.
An S seal surface, 24D is a load port door, 25 is a latch key, 4A is a registration pin, 26 is a load port door opening / closing mechanism, and 27 is a substrate processing apparatus.

[0006] The substrate processing apparatus 27 includes a housing 28 for separating the mini-environment from the outside, a load port 23 on which the transported FOUP 20 is placed, and a FOUP.
A FIMS door 24D (load port door) facing the 20 doors 12 is provided. Load port 23 is FO
Kinematic pin 5 for placing UP20 in a fixed position
And a FIMS door 14 which is fitted into the FOUP door 12 and is taken into the apparatus mini-environment after the door opening operation (latch key rotation). Substrate processing device 27
A part of the housing surface that fits with the FOUP door 12 of the FOUP system 20 is called a FIMS surface, and a surface that fits with the FOUP seal surface is called a FIMS seal surface.

A V-groove member 17 is provided on the bottom of the FOUP main body 14.
The V-groove member 17 is formed with a V-groove (V-groove) 1 which opens downward. Load port 2
A kinematic pin (reference pin) 5 is provided on the upper surface of 3. By fitting the V groove 1 of the V groove member 17 provided on the bottom surface of the FOUP main body 14 to the kinematic pin 5 protruding from the load port 23,
The position of P20 is determined. The load port door 24D is FOUP from the load port 23 to the inside of the substrate processing apparatus 27.
An entrance for loading the door 12 and the wafer 18, the FIMS sealing surface 24 S and the FOUP sealing surface 15
Can be opened and closed by the load port door opening / closing mechanism 16 in a state where the abutment is in contact.

A latch key 25 is provided on the surface of the load port door 24D, and is used to open and close the FOUP door 12 while being inserted into a latch key hole 5 (see FIG. 1) for opening and closing the FOUP door 12. Can be Also,
A registration pin 4A is provided on the surface of the load port door 24D, and fits into the registration pin hole 10 on the surface of the FOUP door 12.

[0009]

However, the above-mentioned prior art has the following problems. First, the first problem is that in an actual manufacturing site, a plurality of types of load ports (FIMS surfaces) and a plurality of types of FOUPs (wafer carriers) are used in combination. Due to the lack of compatibility of the interface door 12, there is a problem in opening / closing reliability when opening / closing the interface door 12, and it is difficult to maintain compatibility and opening / closing reliability of the interface door 12. The reason is that the dimensions of the opening / closing mechanism of the FIMS surface on the load port side are fixed, but the FOUP door 12 side is not specified, so at present the load port side is adjusted to the FOUP to be used. This is because, as a result, compatibility with a plurality of types of FOUPs is lowered, and the evaluation adjustment method of each load port and FOUP is unified.

The above description relates to the interface door 12, but there is also a problem on the load port side, which is a reference surface for substrate transfer. That is, F for 300 mm wafer
OUP is based on the SEMI standard (Standards E5).
It is placed on the kinematic pins specified in 7). However, at present, the design is based on the assumption that the shapes of the kinematic pins are all the same. Position) cannot be made constant. This is the second problem.

On the other hand, on the FOUP side, the shape of the kinematic pin is SEMI standard (Standards E57).
The design is based on the premise that it conforms to the above. The design flexibility of the shape of the V-groove, which is the connection part with the kinematic pins, is large. There is a problem that the establishment of the system is indispensable. This is the third problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems.
It is an object of the present invention to obtain a technology for improving the reliability of opening and closing the UP interface door and the reliability of transferring a wafer, and specifically, a load port adjusting jig and a FOUP measuring jig in semiconductor manufacturing. , FOUP wafer plane measurement jig, kinematic pin shape evaluation jig, kinematic pin position evaluation jig, and an adjustment, measurement, and evaluation method using these.

[0013]

According to the first aspect of the present invention, there is provided a load port adjusting jig having a front virtual reference plane.
A load port adjusting jig disguised as P, mounted on a load port of the substrate processing apparatus, abutted against a FIMS surface, and configured to measure a registration pin position of the FIMS surface; And a distance measuring mechanism for measuring a distance from the front virtual reference plane to the front virtual reference plane.

According to a second aspect of the present invention, in the load port adjusting jig of the first aspect, the position measuring mechanism includes a micrometer displaced by a registration pin on a FIMS surface.

According to a third aspect of the present invention, there is provided a load port adjusting jig according to the first aspect, wherein the position measuring mechanism captures an image of a registration pin on a FIMS surface.
It has a CD camera.

According to a fourth aspect of the present invention, there is provided a load port adjusting jig according to the first aspect, wherein the distance measuring mechanism includes a laser interferometer for measuring a distance from a FIMS surface.

According to a fifth aspect of the present invention, there is provided a FOUP measuring jig which disguises a load port having a front virtual reference plane.
An OUP measuring jig, a position measuring mechanism for measuring a registration pinhole position of a FOUP door with respect to a FOUP placed on the simulated load port;
A distance measuring mechanism for measuring a distance from the FOUP door surface to the front virtual reference surface.

A FOUP measuring jig according to a sixth aspect of the present invention is the FOUP measuring jig according to the fifth aspect, wherein the position measuring mechanism includes a microscope for observing a registration pinhole of the FOUP door through a transparent scale.

A FOUP measuring jig according to a seventh aspect of the present invention is the FOUP measuring jig according to the fifth aspect, wherein the position measuring mechanism includes a CCD camera for imaging a registration pinhole of the FOUP door.

According to an eighth aspect of the present invention, in the FOUP measuring jig according to the fifth aspect, a laser interferometer for measuring a distance from a FOUP door surface is provided as the distance measuring mechanism.

A FOUP wafer plane measuring jig according to a ninth aspect of the present invention is a FOUP wafer plane measuring jig imitating a load port having a front virtual reference plane, wherein the FOUP mounted on the impersonated load port is provided. On the other hand, the FOUP is provided with a plane measurement mechanism for non-contact measurement of a wafer plane of a wafer housed in the FOUP.

A FOUP wafer plane measuring jig according to a tenth aspect of the present invention is the FOUP wafer plane measuring jig according to the ninth aspect, wherein the plane measuring mechanism includes a CCD camera for imaging a wafer housed in the FOUP.

According to the eleventh aspect of the present invention, there is provided a kinematic pin shape evaluation jig which is disposed at a load port of a substrate processing apparatus and which fits into a groove formed on a bottom surface of a FOUP mounted on the load port. Is a kinematic pin shape evaluation jig for evaluating the shape of the kinematic pin, and is a member formed by hollowing out the projected shape of the kinematic pin.

A kinematic pin shape evaluation jig according to a twelfth aspect of the present invention is a kinematic pin position evaluation jig composed of a plate-like member fitted to a kinematic pin disposed at a load port of a substrate processing apparatus. A hole is formed at a position corresponding to the kinematic pin, and lines indicating the positions of the front virtual reference plane and the both-side virtual reference plane are drawn on the surface.

According to a thirteenth aspect of the present invention, there is provided a load port adjusting method, comprising:
A load port adjusting jig according to any one of claims 1 to 4, wherein the position of a registration pin on a FIMS surface and a distance from the FIMS surface to the front virtual reference surface are adjusted.

According to a fourteenth aspect of the present invention, in the FOUP measuring method, the FOUP to be measured is placed on the FOUP measuring jig according to any one of the fifth to eighth aspects, and registration of the FOUP door is performed by the FOUP measuring jig. A pinhole position and a distance from the FOUP door surface to the front virtual reference plane are measured.

The FOUP wafer plane measuring method according to the fifteenth aspect of the present invention provides a FOUP wafer plane measuring method in which a FOUP door is separated.
Is mounted on the FOUP wafer plane measuring jig according to claim 9 or 10, and the FOUP wafer plane measuring jig measures the wafer plane of the wafer housed in the FOUP in a non-contact manner.

According to a kinematic pin shape evaluation method according to a sixteenth aspect of the present invention, the kinematic pin shape evaluation jig according to the eleventh aspect is fitted to a kinematic pin arranged at a load port of a substrate processing apparatus. And the shape of the kinematic pin is evaluated. Claim 17
The kinematic pin position evaluation method according to the invention of the present invention is characterized in that the kinematic pin position evaluation jig according to claim 12 is fitted to a kinematic pin arranged in a load port of a substrate processing apparatus, and the kinematic pin is evaluated. It evaluates the position.

[0029]

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a load port FIM.
FOUP, FIM for smooth substrate transfer on S side
An evaluation / measurement / adjustment jig for an S surface, a kinematic pin or the like is comprehensively manufactured, and various evaluations / measurements / adjustments can be systematically performed using these jigs. Embodiments of the present invention will be described below in detail with reference to the drawings. In the drawings, the same or corresponding portions are denoted by the same reference characters, and description thereof will be appropriately simplified or duplicate description will be omitted.

Embodiment 1 Hereinafter, a load port adjusting jig (FOUP door opening and closing machine adjusting jig) according to Embodiment 1 of the present invention will be described in detail with reference to the drawings. here,
Load port adjustment jig is FOU from load port side
Adjustment jig for switchgear that opens and closes P door. Standard FOU
It is a jig that should also be called P. FIG. 1 is a configuration diagram for explaining a load port adjusting jig according to a first embodiment of the present invention. FIG. 1 (a) is a top view, FIG. 1 (b) is a front view, and FIG. ) Is a side view.

In FIG. 1, reference numeral 30 denotes a load port adjusting jig of this embodiment, 5A denotes a base plate,
B indicates a front plate. Reference numeral 1 denotes a V-groove formed on the lower surface of the base plate 5A. Also, 2
Denotes a micrometer provided on the front plate 5B so as to face each other, and 4 denotes a reference rod for registration pin evaluation, which is sandwiched between the micrometers 2. Reference numeral 3 denotes a pinhole provided in a peripheral portion of the front plate 5B for passing a long side (a pressing pin may be provided instead of the pinhole). Reference numeral 5 denotes a kinematic pin protruding from the load port side.

HD is a horizontal virtual datum plane also called a horizontal datum plane, FD is a front virtual datum plane also called a facial datum plane, and BD is a bilateral datum plane. 2 shows a virtual reference plane on both sides, also called a plane. These are defined in the SEMI standard, and the horizontal virtual reference plane H
D is defined by the horizontal plane consisting of the protruding position of the kinematic pin on which the carrier is placed on the load port. The front virtual reference plane FD is defined as a plane that is parallel to the front surface of the carrier where the wafer is loaded and unloaded and that is perpendicular to the horizontal reference plane. The virtual reference plane BD on both sides is
The wafer is bisected and defined by a plane perpendicular to both the horizontal reference plane HD and the front virtual reference plane FD. These are determined by the configuration of the kinematic pins on the load port.

Referring to FIG. 1, the load port adjusting jig 30 of the present embodiment is provided on the lower surface of the base plate 5A.
A micrometer 2 including a V-groove 1 which is a connection portion with a kinematic pin 5 and a total of eight micrometers 2 provided on a front plate 5B erected on a base plate 5A in an opposed state for evaluating registration pin positions. A pinhole (or pressing pin) 3 for measuring the distance between the door 12 and the front virtual reference plane FD, and a reference rod 4 for evaluating a registration pin are provided. Then, using the adjustment jig 30, the positions of the registration pin 4A and the latch key 25 on the FIMS surface of the load port are adjusted, and they are arranged so that they can operate reliably.

The FOUP, which is a substrate storage jig for storing, transporting, and storing substrates, usually has a structure in which the interface door 12 and the pod main body 14 are separated from each other. Therefore, the door angle and the hole position change and cannot be used as an adjustment prototype. On the other hand, since the load port adjusting jig 30 of the present embodiment has an integrated structure, the door surface of the interface door 12 and the vertical virtual reference plane FD and the horizontal virtual reference plane HD, which are associated with opening and closing of the interface door 12, are provided. Can be used as an adjustment prototype without any angle change.

FIG. 2 is a sectional view of the V-groove 1 in FIG. In FIG. 2, θ indicates the angle at which the V-groove 1 clamps the kinematic pin 5 (pin clamping angle). As shown in FIG. 2, in the present embodiment, the pin holding angle θ of the V groove 1 is optimized to about 96 degrees 30 minutes (that is, 48 degrees 15 minutes on one side). The pin holding angle θ is an angle for leading in the side surface of the tip of the kinematic pin 5 (that is, the belly portion), and has the widest lead-in margin. The shape of the kinematic pin 5 is based on the SEMI standard (Standards E5).
7), the angle θ (pin holding angle) of the V groove 1 is not specified by the SEMI standard and can be set arbitrarily. For this reason, when the variation in the shape of the pin is large or the shape is out of the standard, the FOUP placement accuracy is deteriorated,
Transport error or interface door 12 (see Fig. 23)
In this embodiment, the lead-in margin can be increased by optimizing the shape of the V-groove 1.

Next, a method of using the load port adjusting jig 30, that is, an adjusting method using the jig will be described. 3A and 3B show an operation of reading the displacement amount of the reference rod 4 for evaluating the registration pin. FIG. 3A shows a state before reading, and FIG. 3B shows a state at the time of reading. In the present embodiment, first, the load port adjustment jig 3
0 is set facing the FIMS surface of the load port to be adjusted. At this time, as shown in FIG. 3A, the registration pin 4A on the FIMS surface of the load port is
Facing. At this time, the micrometer 2 is in contact with the surface of the registration pin evaluation reference rod 4, and this position is set as a reference point (zero point). In the present embodiment, the registration pin evaluation reference rod 4 has a thickness (diameter) of about 9 mm and the center of the pin is set to a standard value (standard value).

Next, the load port adjusting jig 30 is
Move to docking position with MS. At this time, FIG.
As shown in (b), the load port FIM to be adjusted
The tip of the S-side registration pin 4A hits the micrometer 2. Further, the load port adjusting jig 30
, The registration pin 4A displaces the registration pin evaluation reference rod 4 and displaces the micrometer 2 while passing between the micrometer 2. This displacement is displayed as the amount of deviation from the reference point (zero point). Next, the arrangement of the registration pins 4A on the FIMS surface of the load port, the height of the kinematic pins 5, and the like are adjusted so as to minimize the display amount.

At this time, the distance between the FIMS surface and the door surface is measured through a plurality of (specifically, about ten) pinholes 3 by applying, for example, calipers to the FIMS surface of the load port. If the interface door surface of the load port adjusting jig 30 and the FIMS surface of the load port are completely parallel, the measured amounts will be the same. In the present embodiment, the docking stroke is set such that the measured amounts through the pinholes are equal and the distance between the front virtual reference plane FD and the FIMS plane of the load port is about 165.5 ± 0.5 mm. Adjust volume and FIMS surface of load port. Note that the distance between the FD and the caliper reference surface of the jig is accurately measured at the time of manufacturing the jig, and is a known value.

In place of the pinhole 3, a pressing pin may be set up at this position. The pressing pin 3 comes into contact with the FIMS surface of the load port and slides by the moving amount. If the interface door surface of the load port adjustment jig 30 and the FIMS surface of the load port are completely parallel, the amount of movement of each pin will be the same. The displacement amount of each pin is equal, and the distance between the front virtual reference plane FD and the FIMS plane t of the load port is 165.5 ± 0.5 mm
The docking stroke amount and the FIMS surface of the load port are adjusted so as to be approximately the same.

By using the load port having the FIMS surface adjusted by the adjustment method using the load port adjustment jig 30 as described above, the reference position can be reliably determined. Therefore, even if a plurality of types of FOUPs are used, a reliable operation is guaranteed, and the open / close reliability of the interface door 12 can be improved.

As described above, according to the first embodiment, the positions of the registration pin and the latch key on the FIMS surface of the load port can be adjusted, so that the FOUP door can be reliably opened and closed. Standardization of jigs,
It is possible to unify the measurement or unify the pin holding angle of the FOUP V-groove. As a result, the FO
The open / close reliability and compatibility of the UP interface door can be improved and open / close failure can be eliminated. Further, thereby, the wafer transfer reliability (substrate transfer reliability) can be improved and the open / close failure can be eliminated.

Embodiment 2 Hereinafter, a FOUP measurement jig (a FOUP evaluation jig) according to a second embodiment of the present invention will be described in detail with reference to the drawings. FOU of the present embodiment
The P measuring jig provides a pseudo FIMS surface for FOUP measurement / evaluation. 4A and 4B are configuration diagrams for explaining a FOUP measuring jig 40 according to a second embodiment of the present invention. FIG. 4A is a top view, FIG. 4B is a front view, and FIG. () Is a side view, and (d) is an enlarged view of the scale plate 8.

In FIG. 4, 40 is a FOUP measuring jig, 5A is a base plate, 5B is a front plate, and 5C is a stage plate. Reference numeral 5 denotes a kinematic pin projecting from the stage plate 5C. Reference numeral 3 denotes a pinhole (or pressing pin) provided in a peripheral portion of the front plate 5B, and reference numeral 8 denotes a position corresponding to the FOUP latch keyhole 13 and the registration pinhole 10 (see FIG. 23) on the front plate 5B. The transparent plate with scale provided, 8A is a scale provided on the transparent plate 8, and 6 is a pseudo FIMS surface formed by the surface of the front plate 5B. In addition, 7
Is a microscope provided at a position facing each transparent plate 8 for evaluating the position of the latch keyhole 13 of the FOUP and for evaluating the position of the registration pinhole 10, and is attached to, for example, the front plate 5B. Also, BD indicates a virtual reference plane on both sides, FD indicates a virtual front reference plane, and HD indicates a virtual reference plane.

Referring to FIG. 4, the FO of this embodiment is
The UP measuring jig 40 has a base plate 5A and a front plate 5B erected on the base plate 5A. The stage plate 5 is placed on the base plate 5A.
C is arranged, and the kinematic pins 5 protrude from the base plate 5A onto the stage plate 5C. The surface of the front plate 5B on the kinematic pin 5 side forms a pseudo FIMS surface 6 whose verticality with respect to the horizontal virtual reference plane HD is accurately determined. Further, the FOUP interface door 12 is provided on the front plate 5B.
A pinhole 3 used for measuring the distance between the imaginary front reference plane FD and the verticality is formed (or a pressing pin as a length measuring gauge may be arranged), and a transparent plate 8 with a scale 8A is further provided. Is arranged. Further, a microscope 7 is provided toward the transparent plate 8.

The FOUP to be measured is placed on the stage plate 5
C, and using a microscope 7, FOUP
The position of the latch keyhole 13 or the registration pinhole 10 of the interface door 12 (see FIG. 23) is measured, and the amount of deviation from the original position of the door surface is read using the scale 8A of the scaled transparent plate 8. In addition, the parallelism between the FOUP door surface and the pseudo FIMS surface, and the distance between the FD and the door surface can be measured from the sliding amount of the pressing pin 3 or measurement using a length measurement through the pinhole 3. In addition, the degree of orthogonality with the horizontal virtual reference plane HD can be measured. Thereby, the displacement of the FOUP door surface can be evaluated. Further, by feeding back the measurement result and correcting the mold for manufacturing the FOUP, the compatibility of the FOUP and the reliability of opening and closing the door are improved. In the actual load port, the registration pin 4A and the latch key 25 are provided as projections. However, in the FOUP measuring jig 40 of the present embodiment, the transparent plate 8 with the scale 8A is inserted into the transparent plate. Therefore, such a projection does not exist and the structure is flat. In addition, F
The distance between D and the caliper reference plane of the jig is accurately measured at the time of manufacturing the jig, and is a known value.

Next, a method of using the FOUP measuring jig 40, that is, an adjusting method using the jig 40 will be described. In the present embodiment, first, the evaluated FOUP with the interface door 12 attached to the stage plate 5C is placed. Next, the difference between the position of the registration pinhole 10 of the FOUP and the gauge placed in the transparent plate 8 with a scale is measured by the microscope 7. Further, the difference between the position of the latch keyhole 13 and the gauge placed in the transparent plate 8 with scale is measured by the microscope 7. Thereby, the deviation of the hole position from the standard value can be evaluated. Also, F
This is fed back to the optimization of the mold design of the OUP interface door 12.

By reading the displacement of the pressing pin 3, the parallelism between the door surface of the FOUP interface door 12 and the FIMS surface of the load port is measured.
The distance between the front virtual reference plane FD and the interface door surface can be measured. In the present embodiment, particularly, the distance between the front virtual reference plane FD and the FOUP interface door 12, that is, the distance between the front virtual reference plane FD and the seal portion on the surface of the FOUP door is about 165.5 ± 0.5 mm. Is fed back to the design of the FOUP interface door 12 and the fabrication of the FOUP mold. Instead of reading the amount of displacement of the pressing pin 3, the pinhole 3 is used as the pinhole 3, for example, a caliper is brought into contact with the pseudo FIMS surface from the pinhole 3 to measure the distance between the pseudo FIMS surface and the door surface. Is also good.

The FOUP interface door 12
Of the registration pinhole 10, the position of the latch keyhole 13, and the front virtual reference plane FD-FOUP
The distance between the door surfaces of the interface door 12 and the degree of parallelism (and the degree of orthogonality with the horizontal virtual reference plane HD) are evaluated and fed back to the FOUP mold manufacturing so that the reference amount is obtained. Thereby, the compatibility of the FOUP and the open / close reliability of the FOUP interface door 12 can be improved.

As described above, according to the second embodiment, the positions of the registration pinhole and the latch keyhole on the FOUP door surface can be accurately and quickly measured. In addition, standardization of measurement and adjustment jigs and unification of measurement can be achieved. This allows FOUP compatibility, FO
It is possible to improve the open / close reliability of the UP interface door to eliminate the open / close failure, and improve the wafer transfer reliability (substrate transfer reliability) to eliminate the open / close failure.

Embodiment 3 Hereinafter, a kinematic pin shape evaluation jig according to Embodiment 3 of the present invention will be described in detail with reference to the drawings. FIGS. 5A and 5B are configuration diagrams for explaining the kinematic pin shape evaluation jig according to the third embodiment of the present invention. FIG. 5A is a top view, and FIG. 5B is a front view. is there. 6A and 6B are configuration diagrams for explaining another example of the kinematic pin evaluation tool according to the third embodiment. FIG. 6A is a top view, and FIG.
Is a front view

In FIG. 5, reference numeral 50 denotes a kinematic pin shape evaluation jig. As shown in FIGS. 5A and 5B, the pin-shaped evaluation adjustment jig 50 shown in FIG.
The projection shape of the pin (central sectional shape) is drawn on a thick plate 50 having a thickness of about m or more, and the projected shape 50a is cut out from the thick plate. In other words, the cross-sectional shape passing through the center line of the kinematic pin has the shape shown in FIG.

In FIG. 6, reference numeral 50 denotes another shape evaluation jig for a kinematic pin. As shown in FIGS. 6A and 6B, the pin-shaped evaluation adjustment jig 50 shown in FIG.
Pin shape 50b from thick plate 50 with a thickness of about 2 mm or more
It has a hollow structure. In other words,
The external shape of the kinematic pin has the shape shown in FIG. The shape of the kinematic pin is based on the SEMI standard (St
standards E57), but processing and shape evaluation are difficult, and evaluation has been conventionally performed using an expensive three-dimensional measuring machine. In the case of one pin at a time, the shape can be evaluated even by enlarged projection or the like, but cannot be used for the evaluation of the actual product on the actual load port. On the other hand, the pin shape evaluation adjustment jig 50 of the present embodiment can easily evaluate the pin shape. In the case of shaving the projected shape like the pin-shaped shape evaluation jig 50 shown in FIG. 5, the shape can be simply formed by a straight line and a circle having a radius of about 15 mm, so that the evaluation is easy.

Next, a method of using the pin-shaped evaluation jig 50,
That is, an evaluation method using the jig 50 will be described. In the present embodiment, first, a hollow portion of the pin-shaped evaluation jig 50 shown in FIGS. 5 and 6 is rotated while sliding over the kinematic pin 5 on the load port. Next, the shape finish of the pin is investigated by evaluating the difference between the pin curved surface and the jig curved surface. At this time, if the height of the bottom surface of the jig is the distance to the horizontal virtual reference plane HD and a gap is formed, it is understood that the distance from the horizontal virtual reference plane HD is insufficient. With such a structure, the shape (curved surface, height, thickness) of the pin can be easily evaluated without using an expensive three-dimensional measuring device.

As described above, according to the third embodiment, it is possible to obtain a simple evaluation jig and an evaluation method having a kinematic pin shape. This allows the kinematic pin on the load port side to have an accurate shape,
The FOUP can be accurately placed. Therefore, the open / close reliability of the interface door 12 can be improved and the open / close failure can be eliminated. This also makes it possible to improve the wafer transfer reliability (substrate transfer reliability). Also,
Standardization of jigs and unification of measurement can be achieved.

Embodiment 4 Hereinafter, a kinematic pin position evaluation jig according to Embodiment 4 of the present invention will be described in detail with reference to the drawings. FIG. 7 shows Embodiment 4 of the present invention.
FIG. 8 is a configuration diagram for explaining a kinematic pin position evaluation jig according to the fourth embodiment of the present invention, and FIG. 8 is a configuration diagram for explaining a kinematic pin comprehensive evaluation jig according to the fourth embodiment of the present invention.

In FIG. 7, reference numeral 60 denotes a jig for evaluating and adjusting the position of the kinematic pin 5; 5A, a base plate; 9, a kinematic pin arrangement hole provided in the base plate 5A; FD indicates a line through which the front virtual reference plane passes. In FIG. 8, 70
Is a comprehensive evaluation adjustment jig for kinematic pin 5,
5A is a base plate, 1 is a V-groove formed on the lower surface of the base plate 5A, BD is a virtual reference plane on both sides, FD is a virtual front reference plane, and HD is a virtual virtual reference plane.
Reference numeral 5 denotes a kinematic pin protruding from the load port side.

Generally, even if the shape of the kinematic pin 5 on the load port is accurate,
If the position of the wafer is incorrect, the FOUP and the wafer plane of the stored wafer (wafer position)
Shifts. Therefore, as shown in FIG. 7, the kinematic pin position evaluation jig 60 includes three circular kinematic pin arrangement holes 9 having a diameter of about 12 mm in the base plate 5A corresponding to the exact positions of the kinematic pins 5. It has a structure in which a line is drawn between the front virtual reference plane FD and the virtual reference planes BD on both sides. The kinematic pin comprehensive evaluation jig 70 shown in FIG. 8 draws straight lines representing the front virtual reference plane FD and the both-side virtual reference plane BD as shown in FIG. 8A, and is shown in FIG. 8B. Thus, the V groove 1 is desirably formed on the lower surface of the base plate 5A,
It has a grooved and carved structure.

The position of the kinematic pin 5 can be evaluated by using the jig 60 for evaluating the position of the kinematic pin 5 shown in FIG. Also, by using the comprehensive evaluation adjustment jig 70 of the kinematic pin 5 shown in FIG. 8 mounted on the kinematic pin 5 on the load port, the height and the level of the horizontal virtual reference plane HD from the floor surface can be improved. Can be evaluated.

Next, a method of using the position evaluation jig 60 of the kinematic pin 5, that is, an evaluation method using the jig 60 will be described. In the present embodiment, first, the kinematic pin position evaluation jig 60 shown in FIG. 7 is set on the kinematic pin 5 on the load port. Even if the pin arrangement is incorrect, if the three pins do not fit in the kinematic pin arrangement holes 9, or if they can be set,
Lines indicating the front virtual reference plane FD and both side virtual reference planes BD (front virtual reference plane evaluation line, both sides virtual reference plane evaluation line)
When it is shifted from the load port, it is determined that the pin arrangement is inappropriate.

Next, after the kinematic pin position evaluation jig 60 is set, the kinematic pin comprehensive evaluation jig 70 is mounted so that the V-groove 1 and the kinematic pin 5 are fitted. At this time, if the pin arrangement and the pin shape are correct, the kinematic pin position evaluation adjustment jig 60 and the kinematic pin comprehensive evaluation jig 70
Lines of front virtual reference plane FD and both sides virtual reference plane BD (front virtual reference plane evaluation line, both sides virtual reference plane evaluation line)
Overlap. On the other hand, the front virtual reference plane FD and the both-side virtual reference plane BD of the kinematic pin position evaluation adjustment jig 60 and the kinematic pin comprehensive evaluation adjustment jig 70.
(The front virtual reference plane evaluation line, the both-side virtual reference plane evaluation line) do not overlap, it is determined that there is a problem with the pin shape.

When the front virtual reference plane FD and the both-side virtual reference plane BD are drawn on the load port in advance, the pin position can be evaluated only by the evaluation jig 60, so that the kinematics shown in FIG. It is not necessary to overlap the tick pin with the comprehensive evaluation adjustment jig 70.

As described above, according to the fourth embodiment, a simple evaluation jig for the position and shape of the kinematic pin can be obtained. As a result, the kinematic pins on the load port side can be adjusted, and the FOUP can be accurately placed. Therefore, the open / close reliability of the interface door 12 can be improved and the open / close failure can be eliminated.
This also makes it possible to improve the wafer transfer reliability (substrate transfer reliability).

Embodiment 5 FIG. Hereinafter, a load port adjusting jig according to a fifth embodiment of the present invention will be described in detail with reference to the drawings. Here, the load port adjustment jig is an adjustment jig for a switchgear that opens and closes the FOUP door from the load port side, and is also a jig that should be called a standard FOUP. FIG. 9 is a configuration diagram for explaining a load port adjusting jig according to a fifth embodiment of the present invention. FIG.
10B is a front view, FIG. 10C is a side view, and FIG. 10 is a schematic side view of a main part showing a state where the load port adjusting jig is placed on the load port.

In FIG. 9, reference numeral 30A denotes a load port adjusting jig (standard FOUP, evaluation of FIMS / FIMS) of the present embodiment.
5A indicates a base plate, and 5B indicates a front plate. Reference numeral 1 denotes a V-groove (that is, a connection portion with a kinematic pin) formed on the lower surface of the base plate 5A. Also, 3
2 is a CCD camera for measuring a registration pin position,
Reference numeral 34 denotes a CCD camera for evaluating a latch key position, which is attached to the front plate 5B. Also, 3
Reference numeral 3 denotes a laser interferometer, 33A denotes a slit through which laser light passes, and the laser interferometer 33 is installed so as to be movable in the horizontal and vertical directions along the slit 33A. Also,
Reference numeral 5 denotes a kinematic pin protruding from the load port side. The FD plane indicates a front virtual reference plane, the BD plane indicates a virtual reference plane on both sides, and the HD plane indicates a horizontal virtual reference plane. In FIG. 10, reference numeral 23 denotes a load port, and 24 denotes a FIMS.
The surface, 24D is a FIMS door, 4A is a registration pin, and 25 is a latch key.

The load port adjusting jig 30A shown in FIG.
Is a jig for evaluating / adjusting the FIMS surface 24 of the load port shown in FIG. 10. By adjusting the FIMS surface 24 of the load port using this jig 30A, the optimum setting of the registration pin 4A and the latch key 25 is achieved. An arrangement can be obtained, resulting in a load port FIMS surface 24 that can operate reliably.

Load port adjusting jig 30 of the present embodiment
A is an integral structure, and there is no change in the angle between the HD surface and the door surface as the door is opened and closed, and there is no change in the hole position.

Next, an adjusting method using the load port adjusting jig 30A of the present embodiment will be described. In the present embodiment, first, the load port adjusting jig 30A is set to the load port 23 for adjusting. Subsequently, the load port adjusting jig 30A is moved to a docking position with the FIMS. The distance from the FD surface to the load port (FIMS surface) 22 is defined by the SEMI standard (see E62) y33, and its value is 165.5 ± 0.5 mm.

In the load port adjusting jig 30 according to the first embodiment, the F of the load port is measured using a caliper at the time of measurement.
The distance from the IMS surface was measured. Further, the pressing force of the caliper differs depending on the measurer, the measuring place, and the state of the caliper itself, and therefore, the amount of deformation for each measurement was not constant. For this reason, the measurement reproducibility was about 80 μm, and there was an error in using it for adjustment.

Therefore, in the load port adjusting jig 30A of the present embodiment, the deformation due to contact is reduced by using a non-contact type laser interferometer 33 (displacement meter) instead of a contact type such as a caliper and a depth gauge. Prevention and high-precision measurement. The center (zero point) of the laser interferometer 33 is formed to be about 165.5 mm (y33) from the FD plane. The indicated value of the laser interferometer 3 is indicated by a voltage, and the displacement is obtained at about 1 mm / V. That is, if the voltmeter can display mV, 1 μm
Unit dimensions will be obtained.

For example, the value (numerical value) obtained by the load port adjusting jig 30A of the present embodiment is 165.5 ± 0.
The docking stroke amount and the FIMS surface 24 of the load port are adjusted to be about 5 mm. At this time,
By moving the laser interferometer 33 in the x direction and the z direction, as compared with the load port adjustment jig 30 in which the measurement locations are limited as in the first embodiment, the entire door area (all seal zones in the figure) is moved. Can be evaluated.

In the load port adjusting jig 30 of the first embodiment, the position of the latch key 25 and the position of the registration pin 4A are measured by a contact type micrometer. For this reason, deformation due to contact,
There was rubbing and reproducibility was a problem. Therefore, in the load port adjusting jig 30A of the present embodiment, the edges of the measurement object (registration pin 4A and latch key 25) are image-recognized by the CCD cameras 32 and 34 in a non-contact manner.
By performing image processing in the computer, the thickness, center coordinates, verticality, and the like of the pin are obtained.

The load port adjusting jig 30 of the present embodiment.
In A, an image processing method is selected according to the required reproducibility. That is, when performing high-precision measurement, the CCD cameras 32 and 34 are provided for each measurement target, and the optical axis center is adjusted to the FIMS standard. On the other hand, when the measurement accuracy can be reduced, the entire image of the FIMS door is photographed by one or two CCD cameras 32 and 34, and the above-described image capturing is performed.

Subsequently, edges are detected based on the captured image, the center and outer dimensions of a circular shape or a rectangle are obtained, and the coordinates are converted into coordinate positions based on the results. After that, the calculation result (shift amount) is displayed as numerical data. Also, the deviation from the standard center value is displayed. Subsequently, the FIMS surface 24 is adjusted in the shift direction so that the displayed shift amount (numerical data) is minimized.

FIG. 13 and FIG. 14 are diagrams showing how to recognize an image for each shape of a measurement object. For example, as shown in FIG. 13, when the shape of the measurement target is circular, an image is captured for image recognition (see FIG. 13A), and edge detection is performed based on the captured image (see FIG. b)), and based on the result, the center coordinates (x1,
y1) and the diameter d1 are calculated and the deviation amount (numerical data) is displayed (see FIG. 13C).

Similarly, as shown in FIG. 14, when the shape of the object to be measured is rectangular, an image is captured for image recognition (see FIG. 14A), and edge detection is performed based on the captured image. (See FIG. 14B.) Based on the result, the center coordinates (x2, y2) and the lengths d2 and d3 of the sides are calculated, and the deviation amount (numerical data) is displayed (see FIG. 14C). .

As described above, according to the present embodiment, the FIMS adjusted by the load port adjusting jig 30A is used.
By using, even if you use multiple types of FOUP,
Since the reference position can be reliably determined, the compatibility of the FOUP can be improved, and the open / close reliability of the FOUP door can be improved.

Embodiment 6 FIG. Hereinafter, a load port adjusting jig according to Embodiment 6 of the present invention will be described in detail with reference to the drawings. FIG. 11 is a configuration diagram for explaining a load port adjusting jig according to the sixth embodiment of the present invention.
FIG. 2A is a top view, FIG. 2B is a front view, and FIG.
FIG. 12 is a side view, and FIG. 12 is a schematic side view of an essential part for explaining an example of use of the load port adjusting jig of FIG.

In this embodiment, as a modification of the fifth embodiment, a plate corresponding to the door of the FOUP, that is, the front plate 5B is removed, and the base plate 5
CDCD cameras 32 and 34, laser interferometer 3 directly on A
3 (displacement meter) or a guide attached thereto. The laser interferometer 33 is installed so as to be movable in the horizontal and vertical directions along a process 33B. The other components are the same as those in the fifth embodiment, and thus the description will be omitted. The load port adjusting jig thus configured has the same operation and effect as the fifth embodiment.

Embodiment 7 FIG. Hereinafter, a FOUP measuring jig according to Embodiment 7 of the present invention will be described in detail with reference to the drawings. This FOUP measuring jig provides a pseudo FIMS surface for FOUP evaluation. 13A and 13B are configuration diagrams for explaining the FOUP measuring jig according to the seventh embodiment. FIG. 13A is a top view, FIG. 13B is a front view, and FIG. 13C is a side view. FIG. 14 is a schematic side view of an essential part for explaining an example of use of the FOUP measuring jig of FIG.

In FIG. 13, 40A is a FOUP measuring jig, 5A is a base plate, and 5B is a front plate. 5 is a kinematic pin projecting from the base plate 5A. Reference numeral 8 denotes a transparent plate or opening provided in the front plate 5B corresponding to the position of the latch keyhole 13 and the registration pinhole 10 of the FOUP (see FIG. 23), and 6 denotes a pseudo FIMS formed by the surface of the front plate 5B. Surface.

Further, reference numeral 32 denotes a CCD camera provided with a microscope for evaluating the position of the latch keyhole 13 of the FOUP provided at a position facing the transparent plate 8, and reference numeral 34 denotes a microscope for evaluating the position of the registration pinhole 10. The CCD camera is attached to, for example, a front plate 5B. 33 is a laser interferometer (displacement meter), 33A is a slit provided on the upper and lower sides of the front plate 5B, and the laser interferometer 33 is arranged to face the slit 33A and can move in the horizontal direction along the slit 33A. It is installed in. FD is a front virtual reference plane, BD is a virtual reference plane on both sides, and HD is a horizontal virtual reference plane.

In the FOUP measuring jig 40A of the second embodiment, the position of the registration pinhole 10 and the latch keyhole 13 is measured by a contact type micrometer. For this reason, deformation and rubbing due to contact occurred, and reproducibility was a problem. Therefore, in the FOUP measuring jig 40A of the present embodiment, the edges of the measurement target are image-recognized by the CCD cameras 32 and 34 in a non-contact manner, and image processing is performed in a computer, so that the pin thickness, center coordinates, and verticality are obtained. And so on. Therefore, in the FOUP measuring jig 40A according to the present embodiment, there is no error because the magnitude of the displacement is displayed as numerical data.

In the present embodiment, the display center (zero point) of the laser interferometer 33 is formed so as to be about 165.5 mm from the FD plane (see y33 of SEMI standard E47.1). In addition, the laser interferometer 33 of the present embodiment
Is indicated by a voltage display, and the displacement is obtained at about 1 mm / V. In other words, a voltmeter capable of displaying mV can provide a size in units of 1 μm. By analyzing this value, the degree of orthogonality and the degree of parallelism with the HD plane and the FD plane can be obtained. Thereby, the displacement can be evaluated. Further, if this is fed back to the manufacture of the FOUP mold and the mold is modified, any type of FOUP can be used and the compatibility is improved.

Next, the FOUP measuring jig 40 of the present embodiment
The adjustment method using A will be described. In the present embodiment, first, the evaluated FOUP with the door attached is placed on the kinematic pin 5 of the jig 40A. Subsequently, images of the registration pinhole 10 and the latch keyhole 13 are captured and measured by the evaluation CCD cameras 32 and 34. Subsequently, the deviation of the hole position from the standard value is evaluated. Further, the distance to the door surface is measured by the laser interferometer 3.
These results are fed back to optimize the mold design of the FOUP door. The distance (y52) from the FD surface to the door surface (or door seal surface) is 165.5 ±
The door is designed to be about 0.5 mm, and the mold is optimized.

As described above, according to this embodiment, the registration pin hole position, the latch key hole position, the distance between the FD surface and the FOUP door surface, the parallelism, and the orthogonality between the FOUP door and the HD surface are described. Can be evaluated. Then, these are fed back to the mold production, and the mold is modified so that each value becomes a reference value, thereby obtaining the FOU.
The compatibility of P and the reliability of opening and closing the FOUP door can be improved.

Embodiment 8 FIG. Hereinafter, a FOUP measuring jig according to Embodiment 8 of the present invention will be described in detail with reference to the drawings. This FOUP measuring jig provides a pseudo FIMS surface for FOUP evaluation. FIG. 15 is a configuration diagram for explaining a FOUP measuring jig according to the eighth embodiment of the present invention. FIG. 15A is a top view, FIG. 15B is a front view, and FIG. Is a side view, and FIG. 16 is the FOU of FIG.
It is a principal part side schematic diagram for explaining the example of use of a P measuring jig.

In the present embodiment, as a modification of the seventh embodiment, the plate constituting the pseudo FIMS surface, that is, the front plate 5B is removed, and the base plate 5
CCD camera 32, 34 directly to A, laser interferometer 33
(Displacement meter) or its guide. The laser interferometer 33 is installed movably in the horizontal direction. The other components are the same as those in the seventh embodiment, and a description thereof will not be repeated. The FOUP measuring jig thus configured has the same operation and effect as the seventh embodiment.

Embodiment 9 Hereinafter, a wafer plane evaluation jig according to Embodiment 6 of the present invention will be described in detail with reference to the drawings.

FIG. 17 is a configuration diagram for explaining a wafer plane evaluation jig according to the ninth embodiment of the present invention. FIG. 17 (a) is a top view, FIG. 17 (b) is a front view, and FIG. FIG. 18C is a side view, and FIG. 18 is a schematic side view of a main part for describing an example of use of the wafer plane evaluation jig of FIG.

In FIG. 17, reference numeral 80 denotes a wafer plane evaluation jig, 5A denotes a base plate, and 5B denotes a front plate. 5 is a kinematic pin projecting from the base plate 5A. Reference numeral 35A denotes a vertically long slit provided at the center of the front plate 5B, and 6 denotes a pseudo FI formed by the surface of the front plate 5B.
The MS plane is shown. Reference numeral 35 denotes a CCD camera with a microscope, which is disposed so as to face the slit 35A, and is installed so as to be vertically movable along the slit 35A. The FD plane is a front virtual reference plane, the BD plane is a virtual reference plane on both sides, and the HD plane is a horizontal virtual reference plane. Note that the pseudo F
The degree of perpendicularity of the IMS surface 6 to the HD surface is accurately obtained.
In FIG. 18, reference numeral 18 denotes a wafer to be measured stored in the FOUP 20. Also, when measuring a plane, it is desirable to measure not a silicon wafer but a wafer-shaped disk without warpage such as glass and ceramic.

In the present embodiment, the wafer position in the FOUP is evaluated using a CCD camera 35 for measuring a wafer plane with a microscope whose optical axis is aligned with the BD plane. Also, remove the FOUP door,
The carrier, which is stored in the OUP cassette at the maximum, is placed on the kinematic stage. The inside of the cassette is observed by the CCD camera 35 for wafer plane measurement, the lower edge of the wafer is detected, the wafer pitch is measured, and the deviation (numeric data) from the original position is displayed. If the accuracy requirement is high, CCD for wafer plane measurement
The camera 35 is moved up and down along the BD plane to capture an image for each part.

In the conventional wafer plane evaluation technology,
Since the contact position measuring device, such as a height gauge or a three-dimensional measuring device, was used to determine the wafer position and determine the pitch, the wafer moved due to contact, and the accurate position could not be determined. Wafer plane evaluation jig 80 of the present embodiment
In this example, the height of each wafer and the distance between the front end of the wafer (the distance from the FD surface) can be obtained without contact. In addition, the wafer plane evaluation jig 80 of the present embodiment
Since the magnitude of the deviation is displayed as numerical data, there is also an effect that there is no error.

In the wafer plane evaluation jig 80 of the present embodiment, the position of the front end of the wafer is obtained by focusing on the measurement of the wafer edge. The diameter of the wafer is accurate, and there is also an effect that the coincidence between the center of the wafer and the center of the carrier (the amount of deviation based on numerical data) can be confirmed.

As described above, according to the present embodiment, it is possible to evaluate the displacement of the wafer stored in the FOUP. This is fed back to the mold making,
By modifying the mold, any type of FOUP can be used and compatibility is improved.

Embodiment 10 FIG. Hereinafter, a wafer plane evaluation jig according to Embodiment 10 of the present invention will be described in detail with reference to the drawings. FIG. 19 shows Embodiment 10 of the present invention.
19 (a) is a top view, FIG. 20 (b) is a front view, FIG. 20 (c) is a side view, and FIG. 20 is FIG. FIG. 10 is a schematic side view of a main part for describing an example of use of a wafer plane evaluation jig (FOUP evaluation / adjustment jig).

In the present embodiment, as a modification of the ninth embodiment, the plate corresponding to the FIMS door, that is, the front plate 5B is removed, and the base plate 5A
A CCD camera and its guide are directly attached to the camera. The other components are the same as those in the ninth embodiment, and a description thereof will be omitted. The wafer plane evaluation jig thus configured has the same operation and effect as the ninth embodiment.

In the above embodiments, a single jig has been described. However, for example, if the jigs of the ninth and tenth embodiments are combined with the jigs of the seventh and eighth embodiments, the base plate 5A is shared. Will be able to In addition, by comprehensively producing load port adjustment jig, FOUP measurement jig, FOUP wafer plane measurement jig, kinematic pin shape evaluation jig, kinematic pin position evaluation jig, etc. The function as a system can be assured by making and using it in a reliable manner, and the reliability can be ensured.

Each of the above embodiments is not particularly limited to a wafer used for a semiconductor device, but includes a substrate for a photo reticle (reticle: circuit original), a substrate for a liquid crystal display panel, a substrate for a plasma display panel, and the like. Display panel substrate, hard disk substrate,
The present invention is applicable to a substrate storage jig for storing, transporting, and storing various substrates such as a substrate for an electronic device such as a semiconductor device, and an evaluation adjustment jig and a jig adjustment method for such a substrate storage jig. Furthermore, it is clear that the present invention is not limited to the above embodiments, and that the embodiments can be appropriately modified within the scope of the technical idea of the present invention. Further, the number, position, shape, and the like of the constituent members are not limited to the above-described embodiment, and can be set to numbers, positions, shapes, and the like suitable for carrying out the present invention.

[0099]

Since the present invention is configured as described above, the following effects can be obtained. According to the present invention, a load port adjusting jig, a FOUP measuring jig, and a
An OUP wafer plane measurement jig, a kinematic pin shape evaluation jig, a kinematic pin position evaluation jig, and the like can be obtained comprehensively and systematically. In addition, a comprehensive adjustment, measurement, and evaluation method of the load port and the FOUP using these can be obtained. As a result, it is possible to improve the opening / closing reliability of the FOUP switch, to improve the compatibility of the FOUP, and to improve the opening / closing reliability of the FOUP interface door.

Further, a load port adjusting jig (standard FOU)
By using FIMS adjusted in P), multiple types of F
Even if the OUP is used, since the reference position can be reliably determined, the reliability of opening and closing can be improved. In addition, the registration pin hole position of the FOUP door, the position of the latch keyhole hole, the distance between the FD surface and the FOUP door surface (parallelism, orthogonality with the HD surface) are evaluated, and the mold is corrected so as to be a reference amount. Thereby, the compatibility of the FOUP and the open / close reliability of the FOUP door can be improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram for explaining a FOUP measurement jig according to a first embodiment of the present invention.

FIG. 2 is a V-groove sectional view for explaining the angle of the V-groove of the FOUP measuring jig according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating an operation of reading a displacement amount of a reference rod for evaluating a registration pin in the first embodiment of the present invention.

FIG. 4 is a configuration diagram for explaining a FOUP measuring jig according to a second embodiment of the present invention.

FIG. 5 is a configuration diagram for explaining a kinematic pin shape evaluation jig according to a third embodiment of the present invention.

FIG. 6 is a configuration diagram for explaining another example of the kinematic pin shape evaluation jig according to the third embodiment of the present invention.

FIG. 7 is a configuration diagram for explaining a kinematic pin position evaluation jig according to a fourth embodiment of the present invention.

FIG. 8 is a configuration diagram for explaining a kinematic pin comprehensive evaluation jig according to a fourth embodiment of the present invention.

FIG. 9 is a configuration diagram for explaining a load port adjustment jig according to a fifth embodiment of the present invention.

FIG. 10 is a side view for explaining a usage example of the load port adjusting jig according to the fifth embodiment of the present invention.

FIG. 11 is a configuration diagram for explaining a load port adjusting jig according to a sixth embodiment of the present invention.

FIG. 12 is a side view for explaining an example of use of the load port adjusting jig according to the sixth embodiment of the present invention.

FIG. 13 is a configuration diagram for explaining a FOUP measurement jig according to a seventh embodiment of the present invention.

FIG. 14 is a side view for explaining a usage example of the FOUP measuring jig according to the seventh embodiment of the present invention.

FIG. 15 is a configuration diagram for explaining a FOUP measurement jig according to an eighth embodiment of the present invention.

FIG. 16 is a side view for explaining a usage example of the FOUP measuring jig according to the eighth embodiment of the present invention.

FIG. 17 is a configuration diagram for explaining a wafer plane evaluation jig according to a ninth embodiment of the present invention.

FIG. 18 is a side view for explaining a usage example of the wafer plane evaluation jig according to the ninth embodiment of the present invention;

FIG. 19 is a configuration diagram for explaining a wafer plane evaluation jig according to a tenth embodiment of the present invention.

FIG. 20 is a side view for explaining an example of use of the wafer plane evaluation jig according to the tenth embodiment of the present invention.

FIG. 21 is a diagram illustrating image recognition according to Embodiments 5 to 10 of the present invention.

FIG. 22 is a diagram illustrating image recognition according to the fifth to tenth embodiments of the present invention.

FIG. 23 shows a conventional substrate storage jig (wafer carrier).
FIG.

FIG. 24: FOUP on the load port of the substrate processing apparatus
FIG. 4 is a side cross-sectional view showing a state where is coupled to a FIMS surface.

[Explanation of symbols]

1 V groove, 2 micrometers, 3 pressing pin or pinhole, 4 reference rod for evaluation of registration pin, 4A registration pin, 5 kinematic pin, 5A base plate, 5B front plate, 5C stage plate, 6 pseudo FIMS surface , 7 microscopes,
8 Transparent plate with scale, 8A scale, 9
Kinematic pin placement hole, 10 Registration pinhole, 11 Latch key, 12 Interface door (FOUP door), 13 Latch keyhole, 14 Pod shell (Pod body, FOUP shell), 15 FOUP seal surface, 16 Door clamping mechanism Part, 17 V groove member, 18 wafer,
20 FOUP, 23 load port, 24 F
IMS surface, 24S FIMS seal surface, 24D load port door, 25 latch key, 26 load port door opening / closing mechanism, 27 substrate processing device, 28 housing, 32 CCD camera for evaluation of registration pin (or hole), 33 laser interferometer ( Displacement meter),
33A slit, 34 CCD camera for evaluating latch key (or hole), 30, 30A load port adjustment jig, 40, 40A FOUP measurement jig, 5
0 Kinematic pin shape evaluation jig, 60 Kinematic pin position evaluation jig, 70 Nematic pin comprehensive evaluation jig, 80 Wafer plane evaluation jig, BD Both sides virtual reference plane, FD front virtual reference plane,
HD Horizontal virtual reference plane, θ Pin angle of V groove.

Continued on front page (54) [Title of Invention] Load port adjustment jig, FOUP measurement jig, FOUP wafer plane measurement jig, kinematic pin shape evaluation jig, kinematic pin position evaluation jig, and adjustment using these・ Measurement / evaluation method

Claims (17)

[Claims] 1. A load port adjustment jig simulating a FOUP having a front virtual reference plane, wherein the jig is mounted on a load port of a substrate processing apparatus, abuts on a FIMS surface, and a registration pin position on the FIMS surface. And a distance measurement mechanism for measuring a distance from the FIMS surface to the front virtual reference plane. 2. The load port adjusting jig according to claim 1, wherein a micrometer displaced by a registration pin on a FIMS surface is provided as the position measuring mechanism. 3. The load port adjusting jig according to claim 1, wherein the position measuring mechanism includes a CCD camera for imaging a registration pin on a FIMS surface. 4. The load port adjusting jig according to claim 1, wherein the distance measuring mechanism includes a laser interferometer for measuring a distance from a FIMS surface. 5. A FOUP measuring jig imitating a load port having a front virtual reference plane, wherein a position of a registration pinhole of a FOUP door is measured with respect to a FOUP placed on the imitated load port. F comprising: a position measuring mechanism; and a distance measuring mechanism for measuring a distance from the FOUP door surface to the front virtual reference plane.
OUP measurement jig. 6. The FOUP measuring jig according to claim 5, wherein a microscope for observing a registration pinhole of the FOUP door through a transparent scale is provided as the position measuring mechanism. 7. The FOUP according to claim 5, wherein the position measuring mechanism includes a CCD camera for imaging a registration pinhole of the FOUP door.
Measurement jig. 8. The FOUP measuring jig according to claim 5, wherein a laser interferometer for measuring a distance from a FOUP door surface is provided as the distance measuring mechanism. 9. A FOUP wafer plane measurement jig imitating a load port having a front virtual reference plane,
A FOUP wafer plane measurement jig, comprising: a plane measurement mechanism for measuring a wafer plane of a wafer housed in the FOUP in a non-contact manner with respect to the FOUP placed on the simulated load port. 10. An FOU as the plane measuring mechanism.
10. The FOUP wafer plane measuring jig according to claim 9, further comprising a CCD camera for imaging a wafer housed in the P. 11. A kinematic pin shape evaluation jig which is arranged at a load port of a substrate processing apparatus and which evaluates the shape of a kinematic pin fitted into a groove formed on a bottom surface of a FOUP placed on the load port. A kinematic pin shape evaluation jig comprising a member obtained by hollowing out a projected shape of a kinematic pin. 12. A kinematic pin position evaluation jig comprising a plate-like member fitted to a kinematic pin disposed in a load port of a substrate processing apparatus, wherein a hole is formed at a position corresponding to the kinematic pin. A kinematic pin position evaluation jig which is formed and has drawn on its surface lines indicating the positions of a front virtual reference plane and both side virtual reference planes. 13. The FIM of a load port of a substrate processing apparatus.
The S surface is measured by the load port adjusting jig according to any one of claims 1 to 4, and a registration pin position on the FIMS surface and a distance from the FIMS surface to the virtual front reference surface are adjusted. A load port adjustment method characterized by the above-mentioned. 14. A FOUP to be measured is placed on the FOUP measuring jig according to claim 5, and the FOUP is measured.
A FOUP measuring method comprising: measuring a registration pinhole position of a FOUP door and a distance from the FOUP door surface to the virtual front reference surface with a measuring jig. 15. The FOUP with the FOUP door separated,
The FOUP is mounted on the FOUP wafer plane measuring jig according to claim 9, and the FOUP wafer plane measuring jig measures the wafer plane of the wafer housed in the FOUP in a non-contact manner.
UP wafer plane measurement method. 16. A method for evaluating the shape of the kinematic pin by fitting the kinematic pin shape evaluation jig according to claim 11 to a kinematic pin arranged on a load port of a substrate processing apparatus. Characteristic kinematic pin shape evaluation method. 17. A method for evaluating the position of the kinematic pin by fitting the kinematic pin position evaluation jig according to claim 12 to a kinematic pin arranged on a load port of a substrate processing apparatus. Characteristic kinematic pin position evaluation method.