JP2001184732A - Method for manufacturing optical information recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure the reproducibility of recording and reproducing characteristics even when waste of protection liquid is reused as the protection liquid and to make it possible to realize low costs in manufacture. SOLUTION: The waste 452 of the protection liquid generated by the treatment for applying the protection liquid to a substrate 202 with a spinning device 300 is recovered, then the concentration of dyestuff in the waste 452 of the protection liquid is adjusted to a desirable value by a concentration adjusting stage 602 to reuse the resultant liquid as a regenerated protection liquid 604.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a heat mode optical information recording medium capable of recording and reproducing information by using a laser beam.

[0002]

2. Description of the Related Art Usually, as a method of forming a protective layer for protecting a dye recording layer capable of recording information and a light reflecting layer, a light-emitting layer laminated on the dye recording layer while rotating a substrate is used. A spin coating method of applying a protective liquid on the reflective layer has been adopted. In this spin coating method, a solution is dropped on the inner peripheral side of a rotating substrate, and the solution is cast on the outer peripheral side by centrifugal force to form a coating film. This is a type of thin film forming method that includes a process of shaking off a part to release it to the surroundings, and then drying and removing a solvent from the coating film.

[0003] For example, as disclosed in Japanese Patent Application Laid-Open No. 5-6581, spin coating is performed by using a solution in which a UV resin is dissolved in a solvent such as methanol or ethanol as a protective liquid, and a dye recording layer and light reflection are performed. Methods for encapsulating layers are known. In this case, the dye recording layer formed so as to protrude from a predetermined range on the substrate is dissolved by the action of the solvent to form a protective layer in a desired range.

Further, when the protective layer is formed by spin coating, the protective waste liquid that has been shaken off from the outer peripheral edge of the substrate under the action of rotation of the substrate and discharged to the periphery thereof is recovered by a recovery means, and the protective liquid is recovered. Japanese Patent Application Laid-Open No.
No. 25523.

[0005]

However, in the method of forming a protective layer described in JP-A-5-6581, the protective solution containing a solvent such as methanol or ethanol is coated on the light reflecting layer by spin coating. During coating, the solvent partially evaporates in the process. Therefore, even if the protective waste liquid shaken off from the outer peripheral edge of the substrate is collected, the concentration of the methanol, ethanol, etc. in the protective waste liquid cannot be reused as the protective liquid because the concentration thereof is not constant, and the production cost rises. There is a disadvantage.

In the method of forming a protective layer described in Japanese Patent Application Laid-Open No. H11-25523, since a dissolved dye is contained in the protective waste liquid reused as the protective liquid, When the number of times of reuse increases, the concentration of the dye contained in the protection waste liquid increases, causing a problem that the mechanical strength of the protection layer is reduced.

The present invention has been made in view of such problems, and can ensure the reproducibility of the recording / reproducing characteristics even when the protection waste liquid is reused as the protection liquid. It is an object of the present invention to provide a method for manufacturing an optical information recording medium capable of efficiently realizing the optical information recording medium.

Another object of the present invention is to provide a method of manufacturing an optical information recording medium capable of improving the recovery rate of a protected waste liquid and improving production efficiency in addition to the above-mentioned conditions. It is in.

[0009]

According to the present invention, there is provided a dye recording layer on which light can be recorded by irradiating a laser beam on a substrate, and a light reflection layer. In the method for manufacturing a heat mode optical information recording medium in which a protective layer is formed, a coating step of coating a protective liquid for forming the protective layer on the light reflection layer while rotating the substrate; Recovering the protective waste liquid discharged in the application step, wherein the protective waste liquid is reused as a protective liquid.

That is, since the protection waste liquid discharged in the protection liquid application step (the protection waste liquid recovered in the recovery step) is reused as the protection liquid, the utilization rate of the protection liquid can be greatly increased. Production efficiency can be improved.

As the protective liquid, an ultraviolet curable resin containing no volatile solvent component may be used, and the discharge amount of the protective liquid may be controlled so as to cover the entire light reflecting layer.

The method may further include a step of adjusting the concentration of the dye in the protection waste liquid. Thereby, even when the protection waste liquid is reused as the protection liquid, reproducibility of the recording / reproducing characteristics can be secured.

When the protective layer is formed by applying the protective liquid on the light reflecting layer, the amount of the protective liquid applied is set to 1.0.
To 3.0 g / sheet, more preferably 1.0 to 2.0 g / sheet.

When the protective liquid is applied on the light reflecting layer to form the protective layer, the time for rotating the substrate is preferably 3 to 5 seconds, more preferably 3 seconds. Thereby, the protective liquid is applied well on the substrate, and the difference in film thickness between the inner circumference and the outer circumference of the protective layer can be made substantially uniform. .

When the protective liquid is applied on the light reflecting layer to form the protective layer, the number of revolutions or the relative number of revolutions of the substrate at the time of applying the protective liquid is preferably 20 to 100 rpm. , More preferably 30-60 rp
m. On the other hand, the number of rotations of the substrate at the time of shaking off the protective liquid applied on the light reflection layer was set to 4,000 to 600.
0 rpm, more preferably 45 rpm.
It is 00 to 5500 rpm.

Preferably, the viscosity of the protective liquid is from 120 to 400 cP. More preferably 130 to 200
cP.

[0017] The concentration of the dye in the protective waste liquid is 0.1% by weight or less, preferably 0.05% by weight or less, more preferably 0.01% by weight or less. Thereby, the protective layer can be formed without lowering the mechanical strength of the protective layer.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment in which a method for manufacturing an optical information recording medium according to the present invention is applied to a system for manufacturing an optical disk such as a CD-R (hereinafter simply referred to as a manufacturing system according to the embodiment). Will be described with reference to FIGS. 1 to 9.

The manufacturing system 10 according to the present embodiment
As shown in FIG. 1, for example, two molding equipments (first and second molding apparatuses) for producing a substrate by injection molding, compression molding or injection compression molding.
And a second molding facility) 12A and 12B, a coating facility 14 for forming a dye recording layer on the substrate by applying and drying a dye solution on one main surface of the substrate, and a dye recording layer on the substrate. There is a post-processing facility 16 for forming a light reflecting layer on the light reflecting layer by, for example, sputtering, then applying an ultraviolet curing liquid on the light reflecting layer, and then irradiating ultraviolet rays to form a protective layer on the light reflecting layer. It is configured.

First and second molding equipment 12A and 12B
Is made by injection molding, compression molding, or injection compression molding of a resin material such as polycarbonate, and a groove (unevenness) 20 representing information such as a tracking groove or an address signal is formed on one main surface.
0, a cooling unit 22 for cooling the substrate 202 taken out of the molding machine 20, and a stack pole 24 for stacking and storing the cooled substrate 202. Has a stacking section (stack-pole rotating table) 26 in which a plurality of pieces are installed.

The coating equipment 14 has three processing units 30, 32
And 34, the first processing section 30 includes a stack pole storage section 40 for storing the stack poles 24 transported from the first and second molding facilities 12A and 12B, and a stack pole storage section 40 for storing the stack poles. The first transport mechanism 42 that takes out the substrates 202 one by one from the stack poles 24 accommodated in the unit 40 and transports them to the next process, and the one substrate 202 transported by the first transport mechanism 42 And an electrostatic blow mechanism 44 for removing static electricity.

The second processing section 32 includes a second transport mechanism 46 for sequentially transporting the substrate 202 that has been subjected to the electrostatic blow processing in the first processing section 30 to the next step, and a second transport mechanism 4.
6, a dye coating mechanism 48 for applying a dye solution to each of the plurality of substrates 202 conveyed by the printer 6;
And a transfer mechanism 50. This dye application mechanism 48 has six
It has two spin coating devices 52.

The third processing unit 34 includes a back surface cleaning mechanism 54 for cleaning the back surface of the single substrate 202 transported by the third transport mechanism 50, and a substrate 202 after the back surface cleaning.
Transport mechanism 56 for transporting the substrate to the next process, a numbering mechanism 58 for marking the lot number and the like on the substrate 202 transported by the fourth transport mechanism 56, and finishing the marking of the lot number and the like. Transport mechanism 60 that transports the substrate 202 to the next process, and an inspection mechanism 62 that inspects the substrate 202 transported by the fifth transport mechanism 60 for the presence or absence of a defect and the thickness of the dye recording layer. And a sorting mechanism 68 for sorting the substrate 202 into a stack pole 64 for normal products or a stack pole 66 for NG according to the inspection result of the inspection mechanism 62.

A first partition plate 70 is provided between the first processing unit 30 and the second processing unit 32, and similarly between the second processing unit 32 and the third processing unit 34. The second partition plate 72
Is installed. The lower part of the first partition plate 70
An opening (not shown) is formed so as not to block the transfer path of the substrate 202 by the transfer mechanism 46 of the second partition plate 72.
An opening (not shown) is formed in the lower part of the opening so as not to block the transfer path of the substrate 202 by the third transfer mechanism 50.

The post-processing equipment 16 includes a stack pole accommodation portion 80 for accommodating a stack pole 64 for normal products transported from the coating equipment 14, and a substrate from the stack pole 64 accommodated in the stack pole accommodation portion 80. Sixth transport mechanism 8 that takes out 202 one by one and transports it to the next process
2, a first electrostatic blow mechanism 84 that removes static electricity from one substrate 202 transported by the sixth transport mechanism 82, and a substrate 202 that has been subjected to the electrostatic blow processing to the next step. A seventh transport mechanism 86 for sequentially transporting, and a sputtering mechanism 8 for forming a light reflection layer by sputtering on one main surface of the substrate 202 transported by the seventh transport mechanism 86
8, an eighth transport mechanism 90 for sequentially transporting the substrate 202 after the sputtering of the light reflection layer to the next step, and cleaning the periphery (edge portion) of the substrate 202 transported by the eighth transport mechanism 90. And an edge cleaning mechanism 92.

The post-processing equipment 16 includes a second electrostatic blow mechanism 94 for removing static electricity from the substrate 202 after the edge cleaning processing, and a main part of the substrate 202 after the electrostatic blowing processing. An ultraviolet curing liquid application mechanism 96 for applying the ultraviolet curing liquid to the surface and rotating the substrate 202 having applied the ultraviolet curing liquid at a high speed to make the applied thickness of the ultraviolet curing liquid on the substrate 202 uniform; An ultraviolet irradiation mechanism 100 for irradiating the substrate 202 after the application of the liquid with ultraviolet light to cure the ultraviolet curing liquid to form a protective layer on one main surface of the substrate 202;
The ninth transport unit 2 transports the second to the second electrostatic blow mechanism 94, the ultraviolet curing liquid application mechanism 96, and the ultraviolet irradiation mechanism 100 respectively.
Transport mechanism 104, a tenth transport mechanism 104 for transporting the substrate 202 irradiated with ultraviolet rays to the next process,
A defect inspection mechanism 106 for inspecting the coating surface and the protective layer surface of the substrate 202 transported by the transport mechanism 104 for defects on the substrate 202 and grooves (unevenness) formed on the substrate 202
Characteristic inspection mechanism 1 for inspecting signal characteristics by means of signal 200
08, the defect inspection mechanism 106 and the characteristic inspection mechanism 1
In response to the inspection result at step 08, the substrate 202 is replaced with a stack pole 110 for a normal product or a stack pole 1 for an NG.
12 and a sorting mechanism 114 for sorting.

Here, the structure of the ultraviolet curing liquid application mechanism 96 will be described with reference to FIGS.

The ultraviolet curing liquid application mechanism 96 has a spin device 300. As shown in FIGS. 2 and 3, the spin device 300 includes a coating liquid application device 400, a spinner head device 402, and a scattering prevention wall 404. The coating liquid application device 400 includes a pressurized tank (not shown) filled with a protective liquid, a pipe (not shown) drawn from the pressurized tank to a nozzle 406, and discharged from the nozzle 406. A discharge amount adjusting valve 408 for adjusting the amount of the protective liquid;
The predetermined amount is dropped on the surface of the substrate 202 through 06.

The coating liquid application device 400 includes a nozzle 40
Plate 410 supporting support member 6 downward and supporting plate 41
The substrate 202 is moved from the standby position by a handling mechanism 414 having a motor 412 for horizontally rotating the substrate 202.
Is configured to be able to pivotally move to a position above.

The spinner head device 402 is disposed below the coating liquid applying device 400. The spinner head device 402 holds the substrate 202 horizontally by a detachable fixing member 420, and the shaft is driven by a driving motor (not shown). It is possible to rotate.

The protective liquid dropped from the nozzle 406 of the coating liquid applying device 400 onto the rotating substrate 202 held horizontally by the spinner head device 402 flows on the surface of the substrate 202 to the outer peripheral side. Postpone. And
Excess protection liquid is shaken off at the outer peripheral edge of the substrate 202 and discharged to the outside.

At the periphery of the spinner head device 402, a scattering prevention wall 404 for preventing the extra protective liquid discharged outside from the outer peripheral edge of the substrate 202 from scattering around.
Is provided, and an opening 422 is formed in the upper part. Excess protection liquid collected through the scattering prevention wall 404, that is, protection waste liquid, is collected in the collection container 450 through the drain 424. The processing after recovery of the protection waste liquid will be described later.

The local exhaust of the spin device 300 in the post-processing facility 16 (see FIG. 1)
After air introduced through an opening 422 formed above the substrate 4 flows over the surface of the substrate 202, the air is exhausted through an exhaust pipe 426 attached below the spinner head device 402.

Next, a process of manufacturing an optical disk by the manufacturing system 10 will be described with reference to the process diagrams of FIGS. 4A to 5B.

First, in a molding machine 20 in the first and second molding facilities 12A and 12B, a resin material such as polycarbonate is subjected to injection molding, compression molding or injection compression molding, and as shown in FIG. (Grooves) 2 representing information such as tracking grooves or address signals
The substrate 202 on which the “00” is formed is manufactured.

Examples of the material for the substrate 202 include acrylic resins such as polycarbonate and polymetal methacrylate, vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymer, epoxy resins, amorphous polyolefin and polyester. They can be used together if desired. Among the above materials, polycarbonate is preferred from the viewpoints of moisture resistance, dimensional stability, cost, and the like. The depth of the groove 200 is 0.0
It is preferably in the range of 1 to 0.3 μm, and its half width is preferably in the range of 0.2 to 0.9 μm.

The substrate 202 taken out of the molding machine 20
After being cooled in the cooling unit 22 in the subsequent stage, the wafer is stacked on the stack pole 24 with one main surface directed downward. At the stage when a predetermined number of substrates 202 are stacked on the stack pole 24, the stack pole 24 is taken out from the molding facilities 12A and 12B, and is conveyed to the next coating facility 14, where the stack pole storage section 40 in the coating facility 14 is placed.
To be housed. This transfer may be performed by a trolley or by a self-propelled automatic transfer device.

At the stage when the stack pawl 24 is accommodated in the stack pawl accommodating section 40, the first transport mechanism 42 operates, and the substrates 202 are taken out one by one from the stack pawl 24 and sent to the subsequent electrostatic blow mechanism 44. Transport. After the static electricity is removed by the electrostatic blow mechanism 44, the substrate 202 transported to the electrostatic blow mechanism 44 is transported to the next dye coating mechanism 48 via the second transport mechanism 46, and is subjected to six spin coatings. One of the devices 52 is supplied to one of the spin coaters 52.

The substrate 2 placed in the spin coater 52
In No. 02, after a dye solution is applied on one main surface thereof, it is rotated at a high speed to make the thickness of the coating solution uniform, and then a drying process is performed. As a result, as shown in FIG.
02, the dye recording layer 204 is formed on one main surface. The thickness of the dye recording layer 204 is generally 20 to 500.
nm, preferably in the range of 50 to 300 nm.

As the dye solution, a solution in which a dye is dissolved in an appropriate solvent is used. The concentration of the dye in the dye solution is generally in the range from 0.01 to 15% by weight, preferably in the range from 0.1 to 10% by weight, particularly preferably 0.5% by weight.
-5% by weight, most preferably 0.5-3% by weight.

Here, the dye used in the dye recording layer 204 is not particularly limited. Examples of dyes that can be used include:
Cyanine dye, phthalocyanine dye, imidazoquinoxaline dye, pyrylium / thiopyrylium dye, azulenium dye, squalilium dye, N
i, Cr and other metal complex dyes, naphthoquinone dyes,
Examples include anthraquinone dyes, indophenol dyes, indoaniline dyes, triphenylmethane dyes, merocyanine dyes, oxonol dyes, aminium / diimmonium dyes, and nitroso compounds. Among these dyes, cyanine dyes, phthalocyanine dyes, azulhenium dyes, squalilium dyes, oxonol dyes, and imidazoquinoxaline dyes are preferred.

Examples of the solvent for the coating agent for forming the dye recording layer 204 include esters such as butyl acetate and cellosolve acetate; ketones such as methyl ethyl ketone, cyclohexanone and methyl isobutyl ketone; dichloromethane, 1,2-dichloroethane, chloroform. Chlorinated hydrocarbons such as amides; amides such as dimethylformamide;
Hydrocarbons such as cyclohexane; tetrahydrofuran,
Ethers such as ethyl ether and dioxane; alcohols such as ethanol, n-propanol, isopropanol, n-butanol and diacetone alcohol;
Fluorinated solvents such as 2,3,3-tetrafluoro-1-propanol; and glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether and propylene glycol monomethyl ether.

The above solvents can be used alone or in combination of two or more in consideration of the solubility of the dye used. Preferably, it is a fluorinated solvent such as 2,2,3,3-tetrafluoro-1-propanol. In the dye solution, an anti-fading agent or a binder may be added if desired, and various additives such as an antioxidant, an ultraviolet absorber, a plasticizer, and a lubricant may be added according to the purpose. May be.

Representative examples of the anti-fading agent include nitroso compounds, metal complexes, diimmonium salts and aminium salts. These examples are described in, for example, JP-A-2-300288, JP-A-3-224793, and JP-A-4-224793.
No. 146189.

Examples of the binder include natural organic high molecular substances such as gelatin, cellulose derivatives, dextran, rosin and rubber; and hydrocarbon resins such as polyethylene, polypropylene, polystyrene and polyisobutylene, polyvinyl chloride and polyvinyl chloride. Vinylidene, polyvinyl chloride
Vinyl resins such as polyvinyl acetate copolymer, acrylic resins such as polymethyl acrylate and polymethyl methacrylate, polyvinyl alcohol, chlorinated polyethylene, epoxy resin, butyral resin, rubber derivatives, phenol
Synthetic organic polymers such as precondensates of thermosetting resins such as formaldehyde resins can be mentioned.

When a binder is used, the amount of the binder used is generally 20 parts by weight or less, preferably 10 parts by weight or less, more preferably 5 parts by weight, based on 100 parts by weight of the dye.
Not more than parts by weight.

It should be noted that an undercoat layer is provided on the surface of the substrate 202 on the side where the dye recording layer 204 is provided, for the purpose of improving the flatness, improving the adhesive strength, and preventing the deterioration of the dye recording layer 204. You may.

Examples of the material of the undercoat layer include polymethyl methacrylate, acrylic acid / methacrylic acid copolymer,
Styrene / maleic anhydride copolymer, polyvinyl alcohol, N-methylol acrylamide, styrene / vinyl toluene copolymer, chlorosulfonated polyethylene,
Nitrocellulose, polyvinyl chloride, chlorinated polyolefin, polyester, polyimide, vinyl acetate-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, polyethylene, polypropylene, polycarbonate and other high-molecular substances, and silane coupling agents Surface modifiers can be mentioned.

The undercoat layer is prepared by dissolving or dispersing the above substance in an appropriate solvent to prepare a dye solution, and then applying the dye solution to the substrate 202 by a coating method such as spin coating, dip coating, or extrusion coating. It can be formed by coating on the surface of the substrate. The thickness of the undercoat layer is generally in the range of 0.005 to 20 μm, preferably 0.0
It is provided in the range of 1 to 10 μm.

The substrate 202 on which the dye recording layer 204 is formed
Is transferred to the next back surface cleaning mechanism 54 via the third transport mechanism 50.
And the other side of the main surface of the substrate 202 (back side)
Is washed. Thereafter, the substrate 202 is transported to the next numbering mechanism 58 via the fourth transport mechanism 56, and the substrate 2
02 is engraved with a lot number or the like on one main surface or the back surface.

Thereafter, the substrate 202 is moved to the fifth transport mechanism 6
Then, the substrate 202 is transported to the next inspection mechanism 62 through which the presence or absence of a defect in the substrate 202 and the thickness of the dye recording layer 204 are inspected. This inspection is performed by irradiating light from the back surface of the substrate 202 and performing image processing on the transmission state of the light using, for example, a CCD camera. The inspection result of the inspection mechanism 62 is sent to the next sorting mechanism 68.

The substrate 202 that has been subjected to the above-described inspection processing is sorted by the sorting mechanism 68 into a stack pole 64 for normal products or a stack pole 66 for NG based on the inspection result.

At the stage when a predetermined number of substrates 202 are stacked on the stack pole 64 for normal products, the stack pole 64 for normal products is taken out from the coating equipment 14 and transported to the next post-processing equipment 16. It is housed in the stack pole housing section 80 of the post-processing facility 16. This transfer may be performed by a trolley or by a self-propelled automatic transfer device.

At the stage when the stack poles 64 for normal products are accommodated in the stack pole accommodating section 80, the sixth transport mechanism 82 operates, and the substrates 2 are stacked one by one from the stack poles 64.
02 is taken out and transported to the first electrostatic blow mechanism 84 at the subsequent stage. After the static electricity is removed by the first electrostatic blow mechanism 84, the substrate 202 transported to the first electrostatic blow mechanism 84 is transported to the next sputtering mechanism 88 via the seventh transport mechanism 86. You.

The substrate 202 put in the sputtering mechanism 88
As shown in FIG. 4C, a light reflection layer 208 is formed on one main surface of the entire surface except for a peripheral portion (edge portion) 206 by sputtering.

The light-reflective substance, which is the material of the light-reflective layer 208, is a substance having a high reflectance with respect to laser light, and examples thereof include Mg, Se, Y, Ti, Zr, Hf, V, and N.
b, Ta, Cr, Mo, W, Mn, Re, Fe, Co,
Ni, Ru, Rh, Pd, Ir, Pt, Cu, Ag, A
u, Zn, Cd, Al, Ga, In, Si, Ge, T
e, Pb, Po, Sn, Bi, and other metals and semi-metals or stainless steel.

Of these, preferred are Cr, N
i, Pt, Cu, Ag, Au, Al and stainless steel. These substances may be used alone, in combination of two or more, or may be used as an alloy. Particularly preferred is Ag or an alloy thereof.

The light reflecting layer 208 can be formed on the dye recording layer 204 by, for example, vapor deposition, sputtering or ion plating of the light reflecting substance. The thickness of the reflective layer is generally set in the range of 10 to 800 nm, preferably in the range of 20 to 500 nm, and more preferably in the range of 50 to 300 nm.

The substrate 202 on which the light reflecting layer 208 is formed
Is transferred to the next edge cleaning mechanism 9 via the eighth transport mechanism 90.
5A, the edge portion 206 is cleaned on one main surface of the substrate 202, and the edge portion 2
The dye recording layer 204 formed at 06 is removed.
Thereafter, the substrate 202 is transported to the next second electrostatic blow mechanism 94 via the ninth transport mechanism 102, and the static electricity is removed.

Thereafter, the substrate 202 is transported to the ultraviolet curing liquid application mechanism 96 via the ninth transport mechanism 102, and the ultraviolet curing liquid is dropped on a part of one main surface of the substrate 202. By rotating the substrate 202 on which the ultraviolet curing liquid is dropped at a high speed, the applied thickness of the ultraviolet curing liquid dropped on the substrate 202 is made uniform over the entire surface of the substrate 202.

That is, the substrate 202 loaded into the spin device 300 is mounted on a spinner head device 402 shown in FIG. Next, the protection liquid supplied from the pressurized tank is adjusted to a predetermined amount by the discharge amount adjustment valve 408, and is dropped on the inner peripheral side of the substrate 202 through the nozzle 406. At this time, the discharge amount of the protective liquid adjusted by the discharge amount adjustment valve 408 is preferably 1.0 to 3.0 g / sheet, more preferably 1.0 to 2.0 g / sheet. is there. The number of rotations of the substrate 202 when the protective liquid is dropped is 2
0 to 100 rpm is preferable, and 30 to 100 rpm is more preferable.
60 rpm. In addition, with the substrate 202 fixed,
The nozzle 406 may be turned to drop the protective liquid.

The spinner head device 402 can be rotated at a high speed by a drive motor. The protection liquid dropped on the substrate 202 is rotated by the rotation of the spinner head device 402.
It is cast on the surface of the substrate 202 in the outer peripheral direction, and reaches the outer peripheral edge of the substrate 202 while forming a coating film. The extra protective liquid that has reached the outer peripheral edge is further shaken off by centrifugal force and scattered around the edge of the substrate 202. The extra protective liquid scattered collides with the scattering prevention wall 404, is collected in a tray provided below the protective liquid 404, and is then collected in the collection container 450 through the drain 424.

The number of rotations when rotating the substrate 202 after dripping of the ultraviolet curing liquid at a high speed is 4000 to 6000 r.
pm, more preferably 4500 to 5500
rpm. In addition, the protective liquid shaking-off time (substrate 20
(2 rotation times) is preferably 3 to 5 seconds, and more preferably 3 seconds.

The protection waste liquid collected in the recovery container 450 contains a small amount of dye contained in the dye recording layer 204 eluted when the protection liquid is applied onto the substrate 202.

The protective layer 210 is provided on the light reflecting layer 208 for the purpose of physically and chemically protecting the dye recording layer 204 and the like. The protective layer 210 can also be provided on the side of the substrate 202 where the dye recording layer 204 is not provided for the purpose of improving scratch resistance and moisture resistance.

Materials used for the protective layer 210 include:
For example, SiO, SiO_Two , MgF _Two , SnO_Two , Si
_Three N_Four Inorganic substances such as, thermoplastic resin, thermosetting resin
Fats, and organic substances such as UV-curable resins
it can. In the present embodiment, the viscosity is 120 to
Ultraviolet rays free of volatile solvent components in the range of 400 cP
Use a cured resin. The UV-cured tree further used
The viscosity of the fat should be in the range of 120 to 350 cP.
Is preferred.

The thickness of the protective layer 210 is generally 5 to
It is provided within a range of 15 μm. Further, the light reflection layer 20
The thickness difference between the inner peripheral surface and the outer peripheral surface of the protective layer 210 formed on the substrate 8 is preferably 2 μm or less.

In this embodiment, the time from the formation of the light reflection layer 208 to the application of the ultraviolet curing liquid is controlled so as to be 2 seconds or more and 5 minutes or less.

Thereafter, the substrate 202 is transported to the next ultraviolet irradiation mechanism 100 via the ninth transport mechanism 102, and the ultraviolet curing liquid on the substrate 202 is irradiated with ultraviolet rays. As a result, as shown in FIG.
2, a protective layer 210 made of an ultraviolet curable resin so as to cover the dye recording layer 204 and the light reflecting layer 208 formed on one main surface.
Is formed to constitute the optical disc D.

The optical disc D is loaded on the tenth transport mechanism 104
Through the next defect inspection mechanism 106 and characteristic inspection mechanism 108
The optical disc D is inspected for defects on the surface of the dye recording layer 204 and the surface of the protective layer 210 and the signal characteristics of the groove 200 formed on the substrate 202 of the optical disc D. These inspections are performed by irradiating light to both sides of the optical disc D and processing the reflected light by, for example, a CCD camera. These defect inspection mechanisms 10
6 and each inspection result in the characteristic inspection mechanism 108 are sent to the next sorting mechanism 114.

The optical disc D that has been subjected to the above-described defect inspection processing and characteristic inspection processing is subjected to a sorting mechanism 1 based on each inspection result.
By 14, a stack pole 110 for normal products or a stack pole 112 for NG is selected.

When a predetermined number of optical discs D are loaded on the stack pole 110 for normal products, the stack pole 110 is taken out of the post-processing equipment 16 and put into a label printing step (not shown).

Further, manufacturing system 1 according to the present embodiment
0, the reprocessing chamber 600 for performing the recovery processing of the protection waste liquid 452 separately from the coating equipment 14 and the post-processing equipment 16
Having. A collection container 450 containing the collected protection waste liquid 452 is carried into the reprocessing chamber 600 periodically or when necessary.

The protection waste liquid 452 collected in the collection container 450 contains the substrate 202 when the protection layer 210 is formed.
Since the dye contained in the upper dye recording layer 204 is eluted in the protective solution, a small amount of the dye is mixed.

In the present embodiment, at a desired stage,
In the concentration adjusting step 602, the concentration of the dye in the protection waste liquid 452 in the collection container 450 is adjusted by diluting the replenisher with the mother liquid of the protection liquid, and the protection waste liquid 452 after the concentration adjusting step 602 is regenerated protection liquid Reused as 604 (see FIG. 6). In the concentration adjusting step 602, the protection waste liquid 452 is subjected to a filtration treatment.

This concentration adjusting step 602 is performed in the protective layer 210.
Is performed to ensure sufficient mechanical strength. For example, if the concentration of the dye contained in the protection waste liquid 452 is too high, the mechanical strength of the protective layer 210 becomes weak, and the dye recording layer 204 cannot be protected.

The concentration of the dye contained in the protection waste liquid 452 is 0.1% by weight or less, preferably 0.05% by weight or less, more preferably 0.01% by weight or less.

As described above, in the manufacturing system 10 according to the present embodiment, the protection waste liquid 452 (the protection waste liquid collected in the recovery step) discharged in the protection liquid application step is reused as the regeneration protection liquid 604. Therefore, the use rate of the protective liquid can be significantly increased, and the production efficiency can be improved.

Further, since the concentration of the dye in the protection waste liquid 452 is adjusted to a desired value, the reproducibility of the recording / reproducing characteristics is ensured even when the protection waste liquid 452 is reused as the reproduction protection liquid 604. Can be.

The light reflecting layer 208 formed on the dye recording layer 204 may be a reflecting film having a reflectance of 70% or more, but may be a reflecting film containing gold or silver. It is particularly preferable that the main component is a silver or gold reflective film. The thickness of the light reflection layer 208 is 10 nm or more,
It is 800 nm or less, and preferably 20 nm or more and 500 nm or less.

[0081]

Next, three experimental examples will be described. In these three experimental examples, samples were prepared in Examples 1 to 7 and Comparative Examples 1 to 8, and the production system 10 shown in FIG.
As a result, an optical disc D was produced. At this time, Daicure Clear SD-318 (manufactured by Dainippon Ink and Chemicals, Inc., viscosity = 135 cP), which is an ultraviolet curable resin containing no volatile solvent component, was used as a protective liquid. The diameter of the nozzle 406 for discharging the protective liquid was 0.3 mm.

In the first experimental example, the protection layer 2 having a thickness of 9 μm was used.
10 was formed and the number of defective molding defects of the protective layer 210 (the number of optical discs D was 1).
) Were inspected for each sample. In the first experimental example, the regenerating protection solution 604 obtained by the recovery treatment was also used. The number of rotations of the substrate 202 was set to 50 rpm when applying the protective liquid, and 5000 rpm when shaking off the protective liquid.

In Example 1 of the first experimental example, the discharge amount of the protective solution was 1.5 g / sheet, and the concentration of the dye contained in the regenerating protective solution 604 in the recovery process was 0.01% by weight. On the other hand, in Comparative Example 1, the discharge amount of the protective liquid was 0.8 g /
The concentration of the dye contained in the regenerating protection solution 604 in the recovery processing was set to 0.01% by weight.

In Example 2 of the first experimental example, the discharge amount of the protective solution was 1.5 g / sheet, and the concentration of the dye contained in the regenerating protective solution 604 in the recovery process was 0.04% by weight. On the other hand, in Comparative Example 2, the discharge amount of the protective liquid was 1.
5 g / sheet, the concentration of the dye contained in the regenerating protection solution 604 in the recovery treatment was 0.2% by weight.

In the second experimental example, the discharge amount of the protective liquid was set at 1.
The mechanical strength (pencil strength) when the protective layer 210 having a thickness of 9 μm was formed by changing the number of rotations of the substrate 202 during the application of the protective liquid and the number of defective molding defects of the protective layer 210 (When 100 optical discs D are manufactured)
Was tested for each sample. However, in the second experimental example, the regenerating protection solution 60 obtained by the recovery process was used.
4 was not used.

In Example 3 of the second experimental example, the rotation speed of the substrate 202 was set to 50 rpm. On the other hand, in Comparative Example 3, the rotation speed of the substrate 202 was set to 80 rpm.

In the third experimental example, the discharge amount of the protective liquid was set at 1.
0 g / sheet, the inner layer, the inner layer, and the outer layer of the protective layer 210 formed by changing the number of rotations of the substrate 202 when the protective liquid is shaken off and the shake-off time of the protective liquid, and the inner and outer circumferences. The difference in film thickness was checked for each sample. In the third experimental example, as in the second experimental example, the regenerating protection solution 604 obtained in the recovery treatment was not used. The rotation speed of the substrate 202 at the time of applying the protective liquid was set to 50 rpm.

In Example 4 of the third experimental example, the number of revolutions of the substrate 202 was set to 5000 rpm, and the shaking-off time was set to 3 seconds. In Example 5, the rotation speed of the substrate 202 was set to 5000 rpm, and the swing-out time was set to 5 seconds. In the sixth embodiment, the number of rotations of the substrate 202 is set to 7000 rpm, and the shake-off time is set to 3 seconds. In the seventh embodiment, the substrate 2
02 was set to 7000 rpm, and the swing-out time was set to 5
Seconds.

On the other hand, in Comparative Example 4, the number of revolutions of the substrate 202 was set to 5000 rpm, and the shake-off time was set to 1 second. In Comparative Example 5, the number of revolutions of the substrate 202 was 3000 rpm, and the shake-off time was 1 second. In Comparative Example 6, the substrate 2
02 is 3000 rpm, and the shake-off time is 3
Seconds. In Comparative Example 7, the number of rotations of the substrate 202 was set to 300
0 rpm, and the shake-off time was 5 seconds. In Comparative Example 8, the rotation speed of the substrate 202 was set to 7000 rpm, and the swing-off time was set to 1 second.

The results of these three experiments are shown in FIGS.
As will be understood from the first experimental result, by setting the discharge amount of the protective liquid to 1.0 g / sheet or more, it is possible to prevent the occurrence of molding defect of the protective layer 210 as much as possible.
In addition, by making the concentration of the dye contained in the regenerating protection solution 604 obtained by the collection process 0.1% by weight or less,
The protective layer 210 can be formed without lowering the mechanical strength of the protective layer 210.

Further, as will be understood from the results of the second experiment, the rotation speed of the substrate 202 at the time of applying the protective liquid was set to 50 rpm.
By doing so, it is possible to prevent the occurrence of defective molding defects of the protective layer 210 as much as possible.

Further, as will be understood from the results of the third experiment, the number of rotations of the substrate 202 when shaking off the protective liquid was set to 50.
When the rotation time of the protective liquid is set to 3 seconds or 5 seconds at 00 rpm or 7000 rpm, the difference in the film thickness between the inner periphery and the outer periphery of the protective layer 210 can be reduced, and the uniform protective layer 210 can be formed. it can.

The method of manufacturing an optical information recording medium according to the present invention is not limited to the above-described embodiment, but can adopt various configurations without departing from the gist of the present invention.

[0094]

As described above, according to the optical information recording medium manufacturing method of the present invention, the reproducibility of the recording / reproducing characteristics can be ensured even when the protection waste liquid is reused as the protection liquid.
It is possible to efficiently reduce the manufacturing cost. In addition, the recovery rate of the protection waste liquid can be improved,
Production efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram illustrating an example of a manufacturing system according to an embodiment.

FIG. 2 is a configuration diagram showing a spin device installed in an ultraviolet curing liquid application mechanism.

FIG. 3 is a perspective view showing the spin device.

4A is a process diagram showing a state in which a groove is formed on a substrate, FIG. 4B is a process diagram showing a state in which a dye recording layer is formed on the substrate, and FIG. 4C is a light reflecting layer on the substrate. FIG. 4 is a process diagram showing a state in which is formed.

FIG. 5A is a process diagram showing a state where an edge portion of the substrate is cleaned, and FIG. 5B is a process diagram showing a state where a protective layer is formed on the substrate.

FIG. 6 is a process chart showing a reproduction process of the manufacturing system according to the present embodiment.

FIG. 7 is a table showing the results of a first experimental example.

FIG. 8 is a table showing the results of a second experimental example.

FIG. 9 is a table showing the results of a third experimental example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Manufacturing system 96 ... UV curable liquid coating mechanism 202 ... Substrate 204 ... Dye recording layer 208 ... Light reflection layer 210 ... Protective layer 300 ... Spin device 450 ... Recovery container 452 ... Protective waste liquid 600 ... Reprocessing chamber 602 ... Concentration adjustment process 604: Reproduction protection liquid D: Optical disk

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4D075 AC64 AC84 AC91 AC94 AC96 DA08 DB36 DB38 DB43 DB47 DB48 DC27 EA21 EB07 EB08 EB13 EB15 EB19 EB22 EB33 EB35 EB42 EC37 5D121 AA04 EE22 EE28 GG02 GG02 GG30

Claims (10)

[Claims] A substrate having a dye recording layer on which information can be recorded by irradiating a laser beam, and a light reflecting layer;
In a method for manufacturing a heat mode optical information recording medium, wherein a protective layer for protecting the dye recording layer is formed, a protective liquid for forming the protective layer while rotating the substrate is coated with the light reflecting layer. A method for producing an optical information recording medium, comprising: a coating step of applying the protective waste liquid on the upper side; and a collecting step of collecting a protective waste liquid discharged in the coating step, wherein the protective waste liquid is reused as a protective liquid. 2. The method for manufacturing an optical information recording medium according to claim 1, wherein an ultraviolet curable resin containing no volatile solvent component is used as the protective liquid. 3. The method for manufacturing an optical information recording medium according to claim 1, wherein the discharge amount of the protective liquid is controlled so as to cover the entire light reflecting layer. Method of manufacturing a medium. 4. The method for manufacturing an optical information recording medium according to claim 1, further comprising the step of adjusting the concentration of a dye in said protective waste liquid. Manufacturing method. 5. The method for manufacturing an optical information recording medium according to claim 1, wherein the protective liquid is applied on the light reflecting layer to form the protective layer. The coating amount of the protective liquid is 1.0 to 3.0 g /
A method for producing an optical information recording medium, comprising: 6. The method for manufacturing an optical information recording medium according to claim 1, wherein the protective liquid is applied on the light reflecting layer to form the protective layer. A method for manufacturing an optical information recording medium, wherein the time for rotating the substrate is 3 to 5 seconds. 7. The method for manufacturing an optical information recording medium according to claim 1, wherein the protective liquid is applied on the light reflecting layer to form the protective layer. A method for manufacturing an optical information recording medium, wherein the number of rotations or the relative number of rotations of the substrate at the time of applying the protective liquid is 20 to 100 rpm. 8. The method for manufacturing an optical information recording medium according to claim 1, wherein the protective liquid is applied on the light reflecting layer to form the protective layer. The number of rotations of the substrate at the time of shaking off the protective liquid applied on the light reflection layer is set to 4000 to 6000 rpm
m. A method for producing an optical information recording medium, wherein m is 9. The method for manufacturing an optical information recording medium according to claim 1, wherein said protective liquid has a viscosity of 120 to 400 cP. . 10. The method for manufacturing an optical information recording medium according to claim 1, wherein the concentration of the dye in the protective waste liquid is 0.1% by weight or less. Manufacturing method of recording medium.