JP2001184610A - Magnetic head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic head capable of effectively using a magnetic recording medium when a high-frequency signal is processed, and a magnetic head manufacturing method capable of reducing the number of manufacturing steps and increasing yield. SOLUTION: A core having a magnetic gap 11a being non-horizontal to a substrate surface is formed in a step shape on the substrate. Thus, when a high-frequency signal is processed, the signal is recorded in the entire area of a magnetic recording medium, and the magnetic recording medium is effectively used. In addition, since plural magnetic heads are simultaneously formed in one chip in the step of forming one magnetic head, the number of manufacturing steps is reduced and yield is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sliding or floating magnetic head having a core having a magnetic gap and a method of manufacturing the same, and more particularly to a helical scan type magnetic head device using a magnetic tape as a recording medium. The present invention relates to a yoke type magnetoresistive or inductive type thin film magnetic head mounted on a rotating drum and a method of manufacturing the same.

[0002]

2. Description of the Related Art When a high-frequency signal of, for example, 100 MHz or more is handled by a magnetic tape device using a magnetic tape as a recording medium, the high-frequency signal may be divided into a plurality of magnetic heads for magnetic recording / reproduction. Generally, magnetic tape devices
A helical scan type rotary drum having a magnetic head is provided. When handling high frequency signals, it is necessary to mount a large number of magnetic heads on this rotary drum.

[0003] When a bulk magnetic head is used as the magnetic head, the size of the rotary drum becomes extremely large. Therefore, the rotary drum is reduced in size by using a thin-film magnetic head having a multi-track structure. Such a thin film magnetic head is manufactured on a wafer substrate by a semiconductor forming technique.

[0004]

However, in the conventional thin-film magnetic head, the magnetic gap is formed horizontally with respect to the wafer substrate. Can not. For this reason,
As in the conventional fixed head system, the heads are formed with a certain distance between the heads, but there are areas where signals are recorded on the magnetic tape and areas where no signals are recorded, and the magnetic tape is used effectively. There is a problem that you can not.

To solve this problem, for example, as shown in FIG. 29, a shield 5 and a magnetoresistive (MR) element 6 are used.
Should be repeated to form a multi-track thin-film magnetic head, but the thin-film forming process must be repeated as many times as the number of tracks, resulting in a significant increase in man-hours and an extremely low yield. is there.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and it is an object of the present invention to reduce the number of man-hours and man-hours for effectively using a magnetic recording medium when handling a high-frequency signal, and to increase the yield. It is an object of the present invention to provide a method of manufacturing a magnetic head capable of performing the above.

[0007]

According to the present invention, there is provided a magnetic head including a core having a magnetic gap that is non-horizontal with respect to a substrate surface, the magnetic head including a plurality of the magnetic gaps. This is achieved when the core is formed in a step shape on the substrate.

The object of the present invention is to provide a method for manufacturing a magnetic head having a core having a magnetic gap, comprising the steps of: forming a multi-step on a substrate; This is achieved by forming the magnetic gap in each of the steps so as to be non-horizontal with respect to the substrate surface.

According to the above configuration, a plurality of magnetic heads are formed in multiple stages on the substrate such that the magnetic gaps are substantially perpendicular to the substrate surface to form a multitrack. Signals can be recorded over the entire area of the recording medium, and the magnetic recording medium can be used effectively. Further, since a plurality of magnetic heads can be simultaneously formed in one chip in the step of forming one magnetic head, the number of steps can be reduced and the yield can be increased.

[0010]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention, and therefore, various technically preferable limitations are added. It is not limited to these forms unless otherwise stated.

FIG. 1 is a perspective view showing an embodiment of the magnetic head of the present invention. The magnetic head 10 is a multi-track thin film yoke type MR head mounted on a rotating drum 4 rotating on a fixed drum 3 of a helical scan type magnetic head device 2 using a magnetic tape 1 as a recording medium.

The magnetic head 10 has a yoke core 11 having a magnetic gap 11a exposed on a sliding surface of a magnetic tape.
And an MR element or GMR element 12 formed at the end of the yoke core 11 on the opposite side to the sliding surface of the magnetic tape.
Are formed in a plurality of steps (three steps in this example) on the wafer substrate in a step-like manner. The magnetic gap 11 of the yoke core 11
a is non-horizontal to the wafer substrate surface (head running direction),
For example, it is formed to be substantially vertical.

As described above, since a plurality of thin film yoke type MR heads are formed in multiple stages on the wafer substrate so that the magnetic gap 11a is substantially perpendicular to the wafer substrate surface, thereby forming a multi-track, high-frequency signals are transmitted. When handling, the signal can be recorded over the entire area of the magnetic tape 1, and the magnetic tape 1 can be used effectively. Further, a plurality of thin film yoke type MR heads can be simultaneously formed in one chip in the step of forming one thin film yoke type MR head, so that the number of steps can be reduced and the yield can be increased. Further, the size of the magnetic head device 2 and the magnetic tape device including the same can be reduced.

FIGS. 2 to 17 are schematic views showing a method for manufacturing the magnetic head 10 of FIG. 1. The manufacturing steps will be described below with reference to the drawings. In this example, for convenience, the thin film yoke type M
A description will be given of a case where the magnetic head 10 in which the R head is formed in two steps in a step shape on the wafer substrate is described. Further, in the drawings, only the characteristic portion may be shown in an enlarged manner for easy understanding of the characteristic portion, and the dimensional ratio of each member is not necessarily the same as the actual ratio.

First, calcium titanate (Titakari, CaTiO ₃ ) or Altic (Al) having good wear characteristics
_On a substantially half surface of the wafer substrate 20 made of ₃ O ₃ —TiC), silicon dioxide (silica,
An insulating layer 21 made of SiO ₂ ) is formed by lift-off with a thickness corresponding to the track pitch, for example, a thickness of 1.5 μm (see FIG. 2).

Next, a film 22 for forming a yoke core groove made of chromium (Cr), silicon dioxide (silica, SiO ₂ ), and chromium (Cr) is formed in this order on the entire surface of the insulating layer 21 by a sputtering apparatus. (See FIG. 3). The upper chromium (Cr) film is formed with a thickness of 100 nm, and an anisotropic silicon dioxide (silica, SiO ₂ ) film formed with a thickness of 1.7 μm by a reactive ion etching (RIE) device. It plays the role of a mask when performing the reactive etching. The lower chromium (Cr) film has a thickness of 50 mm.
nm of silicon dioxide (silica,
It plays a role in defining the etching amount of the SiO ₂ ) film and restoring the surface roughness of the wafer substrate 20 before forming the head.

Next, an electron beam resist 23 is applied on the entire surface of the film 22 at 2000 rpm by a spin coating apparatus.
(For example, ZEP-520 (12) manufactured by Zeon Corporation)
Is applied and cured, and a mask pattern for forming the yoke core 11 is drawn on the electron beam resist 23 by an electron beam drawing apparatus. In this case, in the pattern, a part of the portion where the magnetic gap 11a is formed on the side of the magnetic tape sliding surface is discontinuously formed.

Next, the electron beam resist 23 is developed by a developing device.
Is developed, and the upper chromium (Cr) film of the film 22 exposed in the pattern portion is etched by an argon (Ar) ion etching apparatus to form a mask 22a for forming the yoke core 11 (see FIG. 4). . The vicinity of the mask 22a for forming the yoke core 11 at this time is as shown in the enlarged view of FIG. 4. Hereinafter, description will be made focusing on the vicinity of the mask 22a for forming the yoke core 11. FIG.
A cross section taken along line AA in the enlarged view of FIG. 4 corresponds to the magnetic tape sliding surface when the magnetic head 10 is formed.

Thereafter, the electron beam resist 23 is peeled off, but may not be peeled off in some cases. At this time, the width d of the portion where the magnetic gap 11a is formed in the mask 22a for forming the yoke core 11 is, for example, 0.2.
μm (see FIG. 5).

Next, a mask 2 for forming the yoke core 11 is formed.
Novolak g-line resist (for example, AZ manufactured by Hoechst Co.)
-4400) 24 and cure at 280 ° C.
The novolak g-line resist 24 at this time is 1 μm to 10 μm thicker than the mask 22 a for forming the yoke core 11.
It is patterned to be m larger (see FIG. 6). The novolak g-line resist 24 is used in the next step.
This is for preventing the generation of an excessive polymer film which makes etching by the IE apparatus impossible, and is used as necessary.

Next, silicon dioxide (silica, Si) in the mask 22a for forming the yoke core 11 is formed by the RIE apparatus.
O ₂ ) film is anisotropically etched down to the lower chromium (Cr) film. The etching gas used at this time is a fluorocarbon (CF ₄ ) gas or a mixed gas of fluorocarbon (CF ₄ ) and oxygen (O ₂ ), and the etching power is reduced to prevent a rise in surface temperature. The time is set to be about 10% to 20% longer than the etching time of the chromium (Cr) film (see FIG. 7). Since this etching stops at the lower chromium (Cr) film in the film 22, the surface roughness of the wafer substrate 20 is reproduced. Then, the novolak g-line resist 24 is peeled off (see FIG. 8).

Next, the upper chromium (C
r) On the film and the lower chromium (Cr) film exposed by the anisotropic etching, a magnetic layer 25 for the yoke core 11 is formed by a collimator, an RF bias sputtering device or a plating device (see FIG. 9). At this time, the magnetic layer 25 includes an upper chromium (Cr) film and a lower chromium (Cr) film as shown in the cross-sectional view taken along the line AA in FIG.
Each is formed with a predetermined thickness on the film.

Thereafter, the magnetic layer 2 is buffed until the yoke core 11 has a predetermined thickness, for example, 1.5 μm.
5 is flattened and polished (see FIG. 10). At this time, the entirety including the thin-film yoke type MR heads of the other stages is as shown in the overall view of FIG. 10, and the following description will focus on the entirety including the thin-film yoke type MR heads of the other stages.

Next, silicon dioxide (silica, SiO ₂ ) for insulating between the yoke core 11 and the MR element or the GMR element 12 to be formed in the next step by a sputtering device on the entire surface of the film 22 and the yoke core 11. Alternatively, an insulating layer 26 made of aluminum oxide (alumina, Al ₃ O ₃ ) is formed, and the upper surface of the insulating layer 26 is flattened and polished by a buffing device (see FIG. 11). An MR element or GMR element 12 is formed on the end of the yoke core 11 (see FIG. 12).

Next, the first electrode 27 is lifted off by a sputtering device, and the terminal 28 is formed by a plating device. The first electrodes 27 and the terminals 28 at this time are as shown in FIGS. 13 and 14 showing the entire wafer substrate 20. Hereinafter, the description will be given focusing on the entire wafer substrate 20.

Next, silicon dioxide (silica, SiO ₂ ) or aluminum oxide (alumina, alumina, etc.) is coated on the entire surface of the film 22, the yoke core 11, the MR element or the GMR element 12, the first electrode 27 and the terminal 28 by an RF bias sputtering apparatus. Al ₃ O ₃ ) is formed,
The upper surface of the terminal 28 is flattened and polished by a mechanical polishing device, and the terminal is exposed and flattened (see FIG. 15).

Finally, on the surface including the yoke core 11 and the MR element or the GMR element 12, calcium titanate (titanium, CaTiO ₃ ) or altic (Al
₃ O ₃ bonding the upper guard member 20G made by -TiC) (see FIG. 16), by processing the magnetic tape sliding surface by cylindrical grinding apparatus or the like to complete the final magnetic head 10 (see FIG. 17).

In the above embodiment, the multi-track thin film yoke type MR head has been described.
However, the present invention is not limited to this.
Inductive heads, each of which has a composite structure,
Furthermore, the present invention can be similarly applied to a recording / reproducing magnetic head obtained by combining them. Further, the present invention is not limited to the above-described method of forming the yoke core 11, but can be similarly formed by the following method.

FIGS. 18 and 19 show the yoke core 11 shown in FIG.
FIG. 4 is a schematic view showing a first method of forming a magnetic gap 1;
FIG. 2 is a diagram showing a forming method when 1a is perpendicular to a wafer substrate 30. First, a magnetic layer 31 is formed on the entire surface of the wafer substrate 30 by a sputtering apparatus.
(A), a resist 32 for forming a magnetic portion 131 serving as one core of the yoke core 11 is applied on the magnetic layer 31 by a printing device and cured (see FIG. 18B). Then, the exposed magnetic layer 31 is etched by an ion etching apparatus (see FIGS. 18C and 18D).
A magnetic portion 131 serving as one of the cores is formed (FIG. 19).
(A)).

Next, a gap layer 33 is formed on the magnetic portion 131 serving as one core of the yoke core 11 and the wafer substrate 30 by a sputtering apparatus (see FIG. 19B). The magnetic layer 34 is formed by the apparatus (see FIG. 19C). After that, the upper surface of the magnetic layer 34 and the gap layer 33 on the magnetic portion 131 serving as one of the yoke cores 11 are flattened and polished by a mechanical polishing device (see FIG. 19D). Then, the magnetic portion 131, the gap layer 33, and the magnetic layer 34 serving as one of the cores of the yoke core 11 are etched by an ion etching apparatus to form the outer portion 13 of the yoke core 11.
2 (see FIG. 19E).

Finally, the outer portion 132 of the yoke core 11
The insulating layer 35 is formed on the entire surface of the wafer substrate 30 until the outer surface 132 of the yoke core 11 has a predetermined thickness until the insulating layer 35 is completely covered by the mechanical polishing device.
Is flattened and polished (see FIG. 19F). Through the above steps, the yoke core 11 can be formed.

FIGS. 20 and 21 show the yoke core 11 shown in FIG.
FIG. 3 is a schematic view showing a second method of forming a magnetic gap 1;
FIG. 4 is a diagram showing a forming method when 1a is inclined with respect to the wafer substrate 40. First, a magnetic layer 41 is formed on the entire surface of the wafer substrate 40 by a sputtering device (see FIG. 20A), and a magnetic portion 141 to be one of the yoke cores 11 is formed on the magnetic layer 41 by a printing device. A resist 42 for forming is applied and cured into a mesa shape (see FIGS. 20B and 20C). Then, the exposed magnetic layer 41 is etched by an ion etching apparatus (see FIG. 20D), and a magnetic portion 141 serving as one of the yoke cores 11 is formed in a mesa shape (FIG. 20E).
reference).

Next, the resist 42 is peeled off (FIG. 21).
(See FIG. 21A), a gap layer 43 is formed by a sputtering apparatus on the magnetic portion 141 serving as one core of the yoke core 11 and the wafer substrate 40 (see FIG. 21B), and sputtering is performed on the gap layer 43. The magnetic layer 44 is formed by the apparatus (see FIG. 21C). Thereafter, the upper surface of the magnetic layer 44 and the gap layer 43 on the magnetic portion 141 to be one of the yoke cores 11 are flattened and polished by a mechanical polishing device (see FIG. 21D). Then, the magnetic portion 141, the gap layer 43, and the magnetic layer 44 serving as one of the cores of the yoke core 13 are etched by an ion etching apparatus to form the outer portion 14 of the yoke core 11.
2 (see FIG. 21E).

Finally, the outer portion 142 of the yoke core 11
The insulating layer 45 is formed on the entire surface of the wafer substrate 40 until the outer surface 142 of the yoke core 11 has a predetermined thickness until the insulating layer 45 is completely covered by the mechanical polishing device.
Is flattened and polished (see FIG. 21F). Through the above steps, the yoke core 11 can be formed.

FIGS. 22 to 24 are schematic views showing a third method of forming the yoke core 11. First, chromium (C) is deposited on the entire surface of the wafer substrate 50 by a sputtering apparatus.
r), silicon dioxide (silica, SiO ₂ ), chromium (C
r) is formed in this order (see FIG. 22A), and the yoke core 11 is formed on the film 51 by a printing apparatus.
Resist 52 for forming one of the cores
Is applied and cured (see FIG. 22B).

Next, the upper chromium (Cr) film of the film 51 exposed by the ion etching apparatus is etched, and then the silicon dioxide (silica, SiO ₂ ) film exposed by the RIE apparatus is lowered. (See FIG. 22 (C)). After that, the resist 52 is stripped to form a film portion 151 for forming the yoke core 11 (see FIG. 22D).

Next, a magnetic layer 53 is formed on the wafer substrate 50 and the film portion 151 by a sputtering device (see FIG. 22E) until the upper surface of the film portion 151 appears.
The upper surface of the magnetic layer 53 is flattened and polished by a mechanical polishing device (see FIG. 23A). Then, the magnetic layer 53 around the film portion 151 is etched by a wet etching apparatus to form a magnetic portion 153 which is one of the yoke cores 11 surrounded by the film portion 151 (see FIG. 23B).

Next, a mask resist 54 for forming the other core of the yoke core 11 is applied on the wafer substrate 50, the film portion 151, and the magnetic portion 153 by a printing apparatus and cured (FIG. 23C). )), The exposed film portion 151 is anisotropically etched by the RIE apparatus (see FIG. 23D). Thereafter, the resist 54 is peeled off (see FIG. 24A), and the wafer substrate 50 and the film portion 151 are removed.
And a gap layer 55 is formed on the magnetic portion 153 by a sputtering device (see FIG. 24B).
The magnetic layer 56 is formed on the gap layer 55 (FIG. 24).
(C)).

Finally, the film portion 151 and the magnetic portion 153
The upper surface of the magnetic layer 56 is flattened and polished by a mechanical polishing device until the upper surface of the yoke core 11 appears, thereby forming a magnetic portion 253 serving as the other core of the yoke core 11 surrounded by the film portion 151 (see FIG. 24D). 24), the magnetic layer 56 around the film portion 151 is etched by a wet etching apparatus (FIG. 24).
(E)). Through the above steps, the yoke core 11 can be formed.

FIGS. 25 and 26 show the yoke core 11.
It is the schematic which shows the 4th formation method of. First, a film 6 made of silicon dioxide (silica, SiO ₂ ) and chromium (Cr) is formed on the entire surface of the wafer substrate 60 by a sputtering apparatus.
1 are formed in this order (see FIG. 25A).
A mask resist 6 for forming a gap 11a of the yoke core 11 by a printing device on a substantially half upper surface.
2 is applied and cured (see FIG. 25B).

Next, the exposed film 61 is etched by an etching device (see FIG. 25C), and a gap layer 63 is formed on the wafer substrate 60 and the resist 62 by a sputtering device (FIG. 25D). )reference). Then, the resist 62 and the gap layer 63 thereon are removed by lift-off (see FIG. 25E), and the film 61 and the gap layer 63 other than the center gap layer 63 are anisotropically etched by the RIE apparatus (FIG. F)).

Next, the wafer substrate 60 and the gap layer 63
A magnetic layer 64 is formed thereon by a sputtering device (see FIG. 25G), and the magnetic layer 64 is formed by a mechanical polishing device.
Is planarized and polished (see FIG. 26A). Then, the magnetic layer 64 is etched by an ion etching apparatus to form a magnetic portion 164 having the shape of the yoke core 11 (see FIG. 26B). Finally, an insulating layer 67 is formed on the wafer substrate 60 and the magnetic portion 164 by a sputtering device, and then, the upper surface of the magnetic layer 67 is planarized and polished by a mechanical polishing device until the upper surface of the magnetic portion 164 appears ( FIG. 26 (C)). Through the above steps, the yoke core 11 can be formed.

FIG. 27 is a perspective view showing an example of a magnetic head device provided with an embodiment of the magnetic head of the present invention, and FIG. 28 is a plan view showing an example of a magnetic tape device provided with the magnetic head device. It is. The magnetic head device 70 includes a fixed drum 71, a rotating drum 72, a motor, and the like.
This is a rotary magnetic head device mounted on a helical scan type magnetic tape device using a magnetic tape as an information recording medium. The magnetic tape device 80 is an information recording / reproducing device including the magnetic head device 70.

As shown in FIG. 27, the rotating drum 72
For example, two reproducing heads 10 having a phase difference of 180 degrees
And a recording head 10R. Rotating drum 72
Rotates in the direction of arrow R with respect to the fixed drum 71 by the operation of the motor M. Magnetic tape TP is fixed drum 7
The tape is sent obliquely from the inlet side IN to the outlet side OUT along the tape running direction E along one lead guide portion 73.
That is, as shown in FIG. 28, the magnetic tape TP travels obliquely along the lead guide 73 of the fixed drum 71 from the supply reel 81 via the rollers 82a, 82b, and 82c. And is wound on a take-up reel 83 via rollers 82d, 82e, 82f and 82g.

Thus, the reproducing head 10 and the recording head 10R are guided in contact with the magnetic tape TP by the helical scanning method. A capstan 52h is provided corresponding to the roller 52f, and the capstan 52h is rotated by a capstan motor M1. In the above-described embodiment, the case where the present invention is applied to a helical scan type magnetic head device has been described. However, the present invention is not limited to this, and is applicable to a fixed type magnetic head device that slides at high speed or a floating type magnetic head device. Is also applicable.

[0046]

As described above, according to the present invention, a magnetic recording medium can be effectively used when handling a high-frequency signal. Further, the number of steps can be reduced and the yield can be increased.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a magnetic head according to the present invention.

FIG. 2 is a first schematic view illustrating a method for manufacturing the magnetic head of FIG. 1;

FIG. 3 is a second schematic view showing a method for manufacturing the magnetic head of FIG. 1;

FIG. 4 is a third schematic view showing a method for manufacturing the magnetic head of FIG. 1;

FIG. 5 is a fourth schematic view showing a method for manufacturing the magnetic head of FIG. 1;

FIG. 6 is a fifth schematic view showing the method for manufacturing the magnetic head of FIG. 1;

FIG. 7 is a sixth schematic view illustrating the method for manufacturing the magnetic head of FIG. 1;

FIG. 8 is a seventh schematic view showing the method for manufacturing the magnetic head of FIG. 1;

FIG. 9 is an eighth schematic view showing the method for manufacturing the magnetic head of FIG. 1;

FIG. 10 is a ninth schematic view showing the method for manufacturing the magnetic head of FIG. 1;

FIG. 11 is a tenth schematic view showing a method for manufacturing the magnetic head of FIG. 1;

FIG. 12 is an eleventh schematic view showing a method for manufacturing the magnetic head of FIG. 1;

FIG. 13 is a twelfth schematic diagram showing the method for manufacturing the magnetic head of FIG. 1;

FIG. 14 is a thirteenth schematic diagram illustrating the method for manufacturing the magnetic head in FIG. 1;

FIG. 15 is a fourteenth schematic diagram showing a method for manufacturing the magnetic head of FIG. 1;

FIG. 16 is a fifteenth schematic diagram showing a method for manufacturing the magnetic head of FIG. 1;

FIG. 17 is a sixteenth schematic view showing a method for manufacturing the magnetic head of FIG. 1;

FIG. 18 is a first schematic view showing a first method of forming a yoke core of the magnetic head of FIG. 1;

FIG. 19 is a second schematic view showing a first method of forming a yoke core of the magnetic head of FIG. 1;

FIG. 20 is a first schematic diagram showing a second method of forming the yoke core of the magnetic head of FIG. 1;

FIG. 21 is a second schematic view showing a second method of forming the yoke core of the magnetic head of FIG. 1;

FIG. 22 is a first schematic view showing a third method of forming a yoke core of the magnetic head of FIG. 1;

FIG. 23 is a second schematic view showing a third method of forming the yoke core of the magnetic head of FIG. 1;

FIG. 24 is a third schematic view showing a third method of forming the yoke core of the magnetic head of FIG. 1;

FIG. 25 is a first schematic view showing a fourth method of forming the yoke core of the magnetic head of FIG. 1;

FIG. 26 is a second schematic view showing a fourth method of forming the yoke core of the magnetic head of FIG. 1;

FIG. 27 is a perspective view showing an example of a magnetic head device provided with a magnetic head embodiment of the present invention.

FIG. 28 is a plan view showing an example of a magnetic tape device including the magnetic head device of FIG. 27;

FIG. 29 is a perspective view showing a conventional multi-track thin-film magnetic head in which shields and MR elements are alternately stacked.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Magnetic tape, 2 ... Magnetic head device, 3 ...
・ Fixed drum, 4 ・ ・ ・ Rotary drum, 10 ・ ・ ・ Magnetic head, 11 ・ ・ ・ Yoke core, 11a ・ ・ ・ Magnetic gap, 12 ・ ・ ・ MR (GMR) element

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5D034 AA03 BA03 BA16 BB02 BB11 DA07 5D036 BB02 CC08 5D054 AA02 AB15 BA08 BA61 BB11 BB36

Claims (6)

[Claims] 1. A magnetic head comprising a core having a magnetic gap that is non-horizontal with respect to a substrate surface, wherein the core having a plurality of the magnetic gaps is formed in a step shape on the substrate. A magnetic head comprising: 2. The magnetic head according to claim 1, wherein a plurality of magnetoresistive elements are formed on each of the cores having the magnetic gap. 3. The magnetic head according to claim 1, wherein a plurality of cores and a plurality of electromagnetic conversion coils that are horizontal with respect to the substrate surface are formed as composites on each of the cores having the magnetic gap. 4. A method for manufacturing a magnetic head having a core having a magnetic gap, comprising forming a multi-step on a substrate, wherein the core having the magnetic gap is non-horizontal with respect to a substrate surface. A method of manufacturing a magnetic head, wherein the magnetic head is formed for each of the steps so that 5. The method of manufacturing a magnetic head according to claim 4, wherein a plurality of magnetoresistive elements are formed in a composite on each core having the magnetic gap. 6. The method of manufacturing a magnetic head according to claim 4, wherein a plurality of cores and a plurality of electromagnetic conversion coils, each of which is horizontal to the substrate surface, are formed on each of the cores having the magnetic gap.