JP2001176900A - Method and apparatus for curing resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease danger of resin peeling by improving adhesiveness between resin and tape. SOLUTION: This resin-curing method comprises tape supply and discharge step, where a carrier tape 3 coated with resin 5 used to seal an element 4 from the tape inlet 15 of a furnace 2 and discharged from the tape outlet 16 of the furnace 2 and the heat curing step, where the resin 5 is heated to cure in the furnace 2, while reversing the feed direction of the carrier tape 3 by reverse means 6, 7 that reverse the carrier tape 3 during this tape supply and a discharge step. In the heat-curing step, nitrogen gas for keeping the inside the furnace 2 at a nonoxidizing atmosphere is introduced into the furnace 2, to avoid direct exposure to the carrier tape 3. This resin-curing apparatus realizes this resin curing method as an apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin curing method and a resin curing device for sealing an element of a transport tape with a resin and heating and curing the sealed resin.

[0002]

2. Description of the Related Art A conventional method of heating and curing a sealed resin is to directly heat and cure the resin sealed in a transport tape using far-infrared rays as a heating element, or to blow the resin with warm air. The resin was cured by directly heating and curing the resin.

[0003]

However, in the conventional method, the resin is directly heated by far infrared rays or hot air.
Deterioration of the resin called "burn" has occurred on the surface of the resin, and shape deformation of the resin has frequently occurred. In particular, there is a problem that the resin surface is hardened quickly due to direct heating, and when the solvent trapped by the hardened film on the surface evaporates, the hardened film is pushed up, causing a quality defect called "bloating". Was. In addition, since the peripheral portion of the resin is quickly cured by heating, the resin in the peripheral portion cannot go around to the surface of the transport tape, and has a problem that adhesion to the transport tape is poor and peels off.

SUMMARY OF THE INVENTION The present invention has been made to solve the problems in the conventional method, and a resin curing method and a resin curing method capable of improving the adhesion between a resin and a transport tape and reducing the risk of peeling of the resin. It is intended to provide a device.

[0005]

According to the present invention, there is provided a method for curing a resin, comprising: feeding a supply tape coated with a resin for sealing an element from a tape inlet of a furnace, and discharging the tape from a tape outlet of the furnace. In a resin curing method having a step and a heat curing step of heating and curing the resin in a furnace while reversing the transport direction of the transport tape by a reversing means for reversing the transport tape during the tape supply and discharge step, In the heat curing step, nitrogen gas for maintaining the inside of the furnace in a non-oxidizing atmosphere state is introduced into the furnace so as not to directly hit the transport tape.

According to this configuration, in the heating and curing step, the transport tape is fed in a multistage manner in a furnace, so that the thermal efficiency is improved. Further, according to this resin curing method, the inside of the furnace can be maintained in a non-oxidizing atmosphere state, and the curing of the resin can be stabilized. Further, since the nitrogen gas is introduced into the furnace so as not to directly hit the transport tape, the nitrogen gas does not adversely affect the cooling of the resin portion. For this reason, it is possible to reduce the risk that the resin is separated from the transport tape. In addition, when the nitrogen gas directly hits the transport tape, it becomes difficult to control the temperature of the transport tape portion, and the electrode surface of the element is wavy or dusty on the surface. Disappears.

According to another aspect of the present invention, there is provided a resin curing method in which a transport tape coated with a resin for encapsulating elements is supplied from a tape entrance and discharged from a tape exit. In a resin curing method having a heating and curing step of heating and curing the resin while driving the transport tape, in the heat curing step, nitrogen gas for bringing the periphery of the transport tape into a non-oxidizing atmosphere state is supplied by the transport tape. Is introduced around the transport tape so as not to directly hit the tape.

According to this resin curing method, the periphery of the transport tape can be kept in a non-oxidizing atmosphere state, and the curing of the resin can be stabilized. Further, since the nitrogen gas is prevented from directly hitting the transport tape, the nitrogen gas does not adversely affect the cooling of the resin portion. For this reason, it is possible to reduce the risk that the resin is separated from the transport tape. In addition, when the nitrogen gas directly hits the transport tape, it becomes difficult to control the temperature of the transport tape portion, and the electrode surface of the element is wavy or dusty on the surface. Disappears.

According to another aspect of the invention, in addition to the resin curing method of each of the above-described inventions, a reflection plate for indirectly heating one side of the transport tape is provided between the transport tape and an inlet for nitrogen gas.
The reflection plate prevents the nitrogen gas from directly hitting the transport tape. In this configuration, the reflection plate plays a role of both heating and a role of weakening the momentum of the nitrogen gas. You can enjoy it.

According to another aspect of the present invention, in addition to the resin curing method of each of the above-mentioned inventions, in the heating and curing step, one side of the transport tape is indirectly connected to a reflector disposed on a side opposite to the heating element with the transport tape interposed therebetween. And an indirect heating step of indirectly heating the other side of the transport tape with a hot plate heated by a heating element. With this configuration, since the transport tape is indirectly heated, the resin is uniformly and appropriately heated, so that the resin can be cured without “burning”, “bloating”, and shape deformation. Also, since both sides of the transport tape are indirectly heated by the hot plate and the reflective plate, respectively,
"Burning", "swelling", and resin curing without shape deformation are possible. Further, by providing the hot plate and the reflection plate, both sides of the transport tape can be easily heated by the same heat source. Further, when the resin is cured by one of the heat sources, the other surface side of the transport tape is indirectly heated, so that the resin peripheral portion can easily wrap around the transport tape, and the transport tape and the resin Adhesion can be improved.

According to the resin curing apparatus of the present invention, a tape entrance through which a transfer tape coated with a resin for sealing the element is supplied into a furnace and a feed direction of the transfer tape supplied into the furnace are reversed. In a resin curing device having a reversing means, a heat curing means arranged inside the furnace to heat and cure the resin, and a tape outlet for discharging the transport tape from the furnace,
The structure is such that nitrogen gas introduced to bring the inside of the furnace into a non-oxidizing atmosphere state does not directly hit the transport tape at the time of introduction.

According to this configuration, since the transport tape is fed in a multistage manner in the furnace, the thermal efficiency is improved. Further, according to the resin curing device, the inside of the furnace can be kept in a non-oxidizing atmosphere state, and the curing of the resin can be stabilized. Further, since the nitrogen gas is introduced into the furnace so as not to directly hit the transport tape, the nitrogen gas does not adversely affect the cooling of the resin portion.
For this reason, it is possible to reduce the risk that the resin is separated from the transport tape. In addition, when nitrogen gas directly hits the transport tape, it is difficult to control the temperature of the transport tape portion, and the electrode surface of the element is wavy or dusty, but this configuration has such a problem. Disappears.

In another aspect of the present invention, there is provided a resin curing device, comprising: a tape inlet to which a transport tape coated with a resin for sealing an element is supplied; and a heating and curing means disposed therein for heating and curing the resin. And a resin curing device having a tape outlet for discharging the transport tape, so that the nitrogen gas introduced to bring the periphery of the transport tape into a non-oxidizing atmosphere state does not directly hit the transport tape at the time of introduction. ing.

According to this resin curing device, the periphery of the transport tape can be kept in a non-oxidizing atmosphere, and the curing of the resin can be stabilized. Further, since the nitrogen gas is prevented from directly hitting the transport tape, the nitrogen gas does not adversely affect the cooling of the resin portion. For this reason, it is possible to reduce the risk that the resin is separated from the transport tape. In addition, when nitrogen gas directly hits the transport tape, it becomes difficult to control the temperature of the transport tape portion, and the electrode surface of the element is wavy or dusty, but this device has such a problem. Disappears.

Further, in another invention, in addition to the resin curing device of the above-mentioned invention, a reflection plate for indirectly heating one side of the transport tape is provided between the transport tape and a nitrogen gas inlet, The reflection plate prevents the nitrogen gas from directly hitting the transport tape. Due to this configuration, the reflection plate has a role of heating and a role of weakening the momentum of nitrogen gas.
And the structure is simplified. Further, both advantages of good indirect heating and goodness of not directly applying nitrogen gas to the transport tape can be enjoyed.

According to another aspect of the present invention, in addition to the resin curing device of each of the above-described inventions, a reflector disposed on the opposite side of the heating element with the transport tape therebetween, and indirectly heating one side of the transport tape, A heating plate that is heated by the heating element and indirectly heats the other side of the transport tape. With this configuration, since the transport tape is indirectly heated, the resin is uniformly and appropriately heated, so that the resin can be cured without “burning”, “bloating”, and shape deformation. Further, since both surfaces of the transport tape are indirectly heated by the hot plate and the reflection plate, respectively, the resin can be hardened further without "burn", "bulge" and shape deformation. Further, by providing the hot plate and the reflection plate, both sides of the transport tape can be easily heated by the same heat source. Further, when the resin is cured by one of the heat sources, the other surface side of the transport tape is indirectly heated, so that the resin peripheral portion can easily wrap around the transport tape, and the transport tape and the resin Adhesion can be improved.

[0017]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a housing and a furnace body showing an embodiment according to the present invention. FIG. 2 is an enlarged sectional view taken along the line AA of FIG. 1 showing the embodiment of the present invention.

In the figure, 1 is a housing, 2 is a furnace body provided on the housing 1, 3 is a transport tape, and an element 4 is bonded and sealed with a resin 5. 6, 7
The curing guides 8 and 9 for reversing the transport tape 3 in the furnace are heat generated as a part of the heat curing means provided between the transport tape 3 and the transport tape 3 reversed by the cure guide 6. The body 10 is a heating element that is a part of the heating and curing means provided above the transport tape 3 inverted by the cure guide 7.

Reference numeral 11 denotes a heating plate which is a part of the heating and curing means provided between the transport tape 3 and the heating element 8 and also serves as an indirect heating means. The hot plate 13 which becomes a part of the heat-curing means provided therebetween and also serves as an indirect heating means, is provided with a part of the heat-curing means provided between the transport tape 3 and the heating element 10. The hot plate 14 serving as the indirect heating means is a transport tape 3
The reflector is a part of the heat-curing means disposed at a position facing the hot plate 11 with respect to the heating plate 11 and also serves as an indirect heating means.

The transport tape 3 is supplied from a tape inlet 15, reversed by cure guides 6 and 7 as reversing means, and discharged from a tape outlet 16. Tape entrance 1
The transport tape 3 supplied from 5 is heated as follows in a heating start stage until it is reversed by the cure guide 6.

That is, the resin 5 sealing the element 4 is indirectly heated by the heating plate 11 heated by the heating element 8 such as far infrared rays, and is disposed at a position facing the heating plate 11. The heat of the heating plate 11 is radiated by the reflection plate 14 to indirectly heat the back side of the transport tape 3. As a result, the front side and the back side of the transport tape 3 are uniformly heated. Thereby, since the resin 5 is indirectly heated by the hot plate 11, it is possible to cure the resin without "burn", "bulge", and shape deformation. Further, the resin 5 can be easily wrapped around the surface of the transport tape 3, and the adhesiveness between the transport tape 3 and the peripheral portion of the resin 5 can be increased, so that the resin 5 can be adhered to the transport tape 3.

In a heating intermediate stage before being reversed by the cure guide 7, the transport tape 3 is indirectly heated by the hot plate 12 heated by the heating element 9. This allows
Curing of the resin 5 is promoted. At the final stage of heating up to the tape outlet 16 after being inverted by the cure guide 7, the transport tape 3 is indirectly heated by the hot plate 13 heated by the heating element 10. Thereby, the curing of the resin 5 is further promoted. Since the furnace body 2 is kept airtight, nitrogen gas or the like is introduced from an inlet 17 provided in the housing 1 and discharged from an outlet 18 provided in the furnace body 2. By doing so, the inside of the furnace body 2 can be kept in a non-oxidizing atmosphere state, and the curing of the resin can be stabilized.

As shown in FIG. 1, an inlet 17 for introducing a nitrogen gas or the like for maintaining the inside of the furnace body 2 in a non-oxidizing atmosphere state is provided with a resin coating surface of the transport tape 3. And on the opposite side to the lower side of the transport tape 3. In addition, a discharge port 18 for discharging the introduced nitrogen gas or the like is provided at a position above the furnace body 2 so that the heated nitrogen gas or the like can be easily discharged when it rises. Also,
A reflection plate 14 is arranged between the transport tape 3 and the inlet 17 for nitrogen gas or the like so that the nitrogen gas or the like does not directly hit the transport tape 3 when the nitrogen gas or the like is introduced.

[0024]

According to each invention, the periphery of the transfer tape, the inside of the furnace, and the like can be maintained in a non-oxidizing atmosphere state, and the curing of the resin can be stabilized, and the adhesion between the resin and the transfer tape can be improved. it can. Further, since the nitrogen gas is prevented from directly hitting the transport tape, the nitrogen gas does not adversely affect the cooling of the resin portion.
In addition, when the nitrogen gas directly hits the transport tape, it is difficult to control the temperature of the transport tape portion, and the electrode surface of the element is wavy or the surface is dusty. Disappears.

[Brief description of the drawings]

FIG. 1 is a sectional view of a housing and a furnace body showing an embodiment according to the present invention.

FIG. 2 is an enlarged sectional view taken along the line AA of FIG. 1 showing the embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Case 2 Furnace body 3 Conveying tape 4 Element 5 Resin 6,7 Cure guide (inversion means) 8,9,10 Heating element (part of heat hardening means) 11,12,13 Heat plate (one of heat hardening means) Part and indirect heating means) 14 Reflector (part of heating and curing means and indirect heating means) 15 Tape inlet 16 Tape outlet 17 Inlet 18 Outlet

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Claims (8)

[Claims] 1. A tape supply / discharge step of supplying a transport tape coated with a resin for sealing an element from a tape inlet of a furnace and discharging the tape from a tape outlet of the furnace; While reversing the feed direction of the transport tape by reversing means for reversing the transport tape,
A heat curing step of heating and curing the resin in the furnace, and a resin curing method, comprising: in the heat curing step, a nitrogen gas for maintaining the furnace in a non-oxidizing atmosphere state, the carrier tape A resin curing method, wherein the resin is introduced into the furnace so as not to be directly hit. 2. A tape supply / discharge step of supplying a transport tape coated with a resin for sealing an element from a tape inlet and discharging the tape from a tape outlet, and driving the transport tape during the tape supply / discharge step. A heating and curing step of heating and curing the resin while heating, wherein in the heating and curing step, a nitrogen gas for bringing the periphery of the transport tape into a non-oxidizing atmosphere state is directly applied to the transport tape. A resin curing method, wherein the resin is introduced around the transport tape so as not to be hit. 3. A reflector for indirectly heating one side of the transport tape is provided between the transport tape and the nitrogen gas inlet, and the reflector allows the nitrogen gas to flow to the transport tape. The resin curing method according to claim 1 or 2, wherein direct contact is prevented. 4. In the heat curing step, one side of the transport tape is indirectly heated by the reflection plate disposed on the opposite side of the heating element with respect to the transport tape, and the heating element is 4. The resin curing method according to claim 1, further comprising an indirect heating step of indirectly heating the other side of the transport tape with a heated hot plate. 5. A tape inlet through which a transfer tape coated with a resin for sealing elements is supplied into a furnace, a reversing means for reversing a feed direction of the transfer tape supplied into the furnace, and a furnace. In a resin curing device having a heat curing means for heating and curing the resin, which is disposed inside, and a tape outlet for discharging the conveyance tape from the furnace, the resin curing device is introduced to make the inside of the furnace a non-oxidizing atmosphere. Wherein the nitrogen gas does not directly hit the transport tape when introduced. 6. A tape inlet to which a transport tape coated with a resin for encapsulating the element is supplied, a heat-curing means disposed therein for heating and curing the resin, and discharging the transport tape. In a resin curing device having a tape outlet, a nitrogen gas introduced to bring the periphery of the transport tape into a non-oxidizing atmosphere state is configured not to directly hit the transport tape at the time of introduction. Resin curing device. 7. A reflector for indirectly heating one side of the transport tape is provided between the transport tape and the nitrogen gas inlet, and the reflector allows the nitrogen gas to flow to the transport tape. 7. The resin curing device according to claim 5, wherein direct contact is prevented. 8. The reflection plate, which is disposed on the opposite side of the heating element with respect to the transport tape and indirectly heats one surface of the transport tape, and the reflection plate which is heated by the heating element, 8. The resin curing device according to claim 5, further comprising: a hot plate for indirectly heating the other side.