JP2001174991A - Photosensitive resin composition, photosensitive element using same, method for producing resist pattern and method for producing printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition ensuring a short removal time and excellent in adhesion and resolution, a photosensitive element, a method for producing a resist pattern and a method for producing a printed wiring board. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having a 2C or 3C alkylene oxide group and at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator. The photosensitive element is formed from the photosensitive composition. This element is laminated on a substrate for circuit formation and imagewise irradiated with active light, the exposed part is photo-cured and the unexposed part is removed by development to produce the resist pattern. The substrate with the produced resist pattern is etched or plated to produce the printed wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive resin composition, a photosensitive element using the same, a method for producing a resist pattern, and a method for producing a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, a so-called dry film resist (hereinafter referred to as DF) comprising a support layer and a photopolymerized layer has been used as a resist in fields such as printed wiring boards and precision metal processing.
R). DFR is generally formed by laminating a photopolymerizable layer made of a photopolymerizable composition on a support layer, and in many cases, further laminating a protective film on the photopolymerizable layer. The applications of DFR can be broadly divided into two types, one for circuit formation and the other for solder resist.

The DFR for forming a circuit is used to form a circuit by a method called a subtractive method or an etched foil method. The subtractive method is a method of forming a circuit by using a circuit forming substrate such as a glass epoxy substrate whose surface and inner walls of through holes are covered with a copper layer and removing excess copper by etching. The method is further divided into a method called a tenting method (etching method) and a method called a plating method.

In the tenting method (etching method), a copper through hole for mounting a chip component is protected by a resist, and a circuit is formed through etching and peeling of the resist. Desirably strong. On the other hand, the plating method, contrary to the tenting method (etching method), covers the resist except for the through-hole portion and the portion to be a circuit, and solder-plates the copper surface of the portion not covered with the resist, The resist is peeled off, a solder plating pattern is formed, and the solder plating pattern is etched as a resist to an etching solution to form a circuit.

In the tenting method (etching method), the adhesion between the resist and copper is important in order to prevent the etchant from infiltrating between the resist and copper. When the etchant infiltrates between the resist and the copper, the desired portion of the copper is etched, and the circuit is disconnected.
In the plating method as in the tenting method (etching method), the adhesion between the resist and copper is important in order not to allow plating to pass between the resist and copper. If plating is stripped between the resist and copper, a plating pattern is formed in an undesired portion, and copper in an undesired portion remains in the subsequent etching.

A method for manufacturing a printed wiring board using the subtractive DFR is as follows. First, after removing the protective film, DFR is laminated on a circuit-forming substrate such as a copper-clad laminate. Next, if necessary, the support layer is peeled off, and exposure is performed through a positive or negative film such as a wiring pattern mask film to cure the exposed portion of the resist. If there is a support layer after exposure, the support layer is removed as necessary, and the unexposed portion of the photopolymerized layer is dissolved or dispersed and removed with a developer to form a cured resist image on the circuit-forming substrate. As the photopolymerizable layer, an alkali developing type using an aqueous alkali solution as a developing solution and a solvent developing type using an organic solvent are known. In recent years, the demand for the alkali developing type DFR has been growing from the viewpoint of environmental problems or costs. .

[0007] The cured resist formed by exposure and development is peeled off after etching or plating with an aqueous alkali solution such as sodium hydroxide. The peeling speed is preferably high from the viewpoint of workability, handleability and productivity. In addition, when the solubility of the resist cured film in the stripping solution is high, the viscosity of the stripping solution increases, and foaming becomes remarkable. Therefore, the processing ability of the stripping solution is reduced. further,
Since the BOD (Biochemical Oxygen Demand) and COD (Chemical Oxygen Demand) of the stripping solution increase, the cost required for waste liquid treatment increases. From the above points, it is desirable that the cured resist film is hardly soluble in the stripping solution.

Further, in recent years, as the density of printed wiring has increased, the DF has been required in view of resolution, adhesion to the underlying metal, and cost.
R tends to be thin. Therefore, the resist is required to have excellent adhesion to the underlying metal and to have higher resolution. In order to improve the adhesion, there is a technique for improving the chemical resistance. As DFR with improved chemical resistance,
For example, those using a binder polymer obtained by copolymerizing a styrene monomer are disclosed in JP-B-55-38961.
JP-B-54-25957, JP-A-2-28960
7, JP-A-4-347859, JP-A-4-34759.
285960. However, these DFRs have improved chemical resistance, and therefore have poor resolution and tend to be difficult to cope with high density printed wiring boards. In addition, there is a tendency that workability such as a long stripping time in stripping and removing is inferior.

[0009]

SUMMARY OF THE INVENTION Claims 1, 2, 3,
4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 1
The inventions described in 4, 15, and 16 provide a photosensitive resin composition having a short peeling time, and having excellent adhesion and resolution. The inventions according to claims 17, 18 and 19 provide a photosensitive element having a short peeling time and excellent in adhesion and resolution. The twentieth aspect of the present invention is to provide a method of manufacturing a resist pattern having a short peeling time, and excellent in adhesion and resolution. The invention according to claim 21 provides a method for manufacturing a printed wiring board having excellent adhesion and resolution.

[0010]

The present invention relates to (A) a binder polymer, and (B) at least one polymerizable ethylenically unsaturated group having an alkylene oxide group having 2 or 3 carbon atoms in the molecule. Having a photopolymerizable compound and (C)
A photosensitive resin composition containing a photopolymerization initiator,
The component (B) contains (B1) a compound having only an ethylene oxide group as a C2 or C3 alkylene oxide group and (B2) a compound having only a propylene oxide group as a C2 or C3 alkylene oxide group. The present invention relates to a photosensitive resin composition.

The present invention also provides (B1) a compound having 2 or 3 carbon atoms.
And wherein the number of repeating ethylene oxide groups in one molecule of the compound having only an ethylene oxide group as the alkylene oxide group is 3 to 30. The present invention also relates to (B2) the photosensitive resin composition, wherein the number of repeating propylene oxide groups in one molecule of the compound having only a propylene oxide group as the alkylene oxide group having 2 or 3 carbon atoms is 3 to 30.

In the present invention, the component (B1) may have a carbon number of 2
Alternatively, the present invention relates to the photosensitive resin composition, which is an EO-modified (meth) acrylate compound having only an ethylene oxide group as the alkylene oxide group. The present invention also relates to the photosensitive resin composition, wherein the EO-modified (meth) acrylate compound is an EO-modified bisphenol A-based (meth) acrylate compound. In the present invention, the EO-modified bisphenol A-based (meth) acrylate compound has the general formula (I)

Embedded image(Where R¹And R^TwoAre each independently a hydrogen atom or a methyl group
And m¹And n¹Is m ¹+ N¹= 3 to 30
Is a positive integer selected)
About adult.

Further, the present invention provides that the component (B2) has 2 carbon atoms.
Or the PO-modified (meth) acrylate compound having only a propylene oxide group as the alkylene oxide group 3. The present invention also relates to the photosensitive resin composition, wherein the PO-modified (meth) acrylate compound is a PO-modified bisphenol A-based (meth) acrylate compound. In addition, the present invention relates to a PO
The modified bisphenol A (meth) acrylate compound has the general formula (II)

Embedded image (Wherein, R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group, Y ¹ and Y ² each independently represent an n-propylene group or an isopropylene group, and m ² and n ² represent m ² + n ² = 3 ~
A positive integer selected to be 30).

The present invention also relates to the photosensitive resin composition wherein (A) the binder polymer contains styrene or a styrene derivative as a copolymer component. Also, the present invention
(A) The photosensitive resin composition wherein a binder polymer containing styrene or a styrene derivative as a copolymer component is obtained as a copolymer component of 0.1 to 40% by weight of styrene or a styrene derivative based on the total amount of the copolymer component. About. The present invention also relates to the photosensitive resin composition, wherein (A) the weight average molecular weight of the binder polymer is from 20,000 to 300,000. The present invention also relates to the photosensitive resin composition, wherein (A) the binder polymer has an acid value of 100 to 500 mgKOH / g. Also, the present invention
(C) The photosensitive resin composition, wherein the photopolymerization initiator is a 2,4,5-triarylimidazole dimer.

[0015] The present invention also relates to the present invention, wherein the component (A), the component (B) and the component (C) are added in an amount of 100 parts by weight based on the total amount of the component (A) and the component (B). Is 40 to 80
Parts by weight, the component (B) is 20 to 60 parts by weight, the component (C) is 0.1 to 20 parts by weight, and the component (B1) is 5 to 95 parts by weight based on the total amount of the component (B). %, Wherein the component (B2) is 5 to 95% by weight.

Further, the present invention relates to (A) a binder polymer, (B) a general formula (II)

Embedded image (Wherein, R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group, Y ¹ and Y ² each independently represent an n-propylene group or an isopropylene group, and m ² and n ² represent m ² + n ² = 3 ~
A photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule represented by the formula (C) and a photopolymerization initiator: The present invention relates to a photosensitive resin composition.

The present invention also relates to a photosensitive element in which the photosensitive resin composition is applied on a support and dried to form a photosensitive resin composition layer. The present invention also relates to the photosensitive element, wherein the haze of the support is 0.001 to 5.0%. Further, the present invention provides a photosensitive resin composition layer having a transmittance of 5 to 75% for ultraviolet rays having a wavelength of 365 nm.
Wherein the photosensitive element is:

Further, in the present invention, the photosensitive element is laminated on a circuit-forming substrate so that the photosensitive resin composition layer is in close contact with the photosensitive element, and is irradiated with actinic rays in an image-like manner, and the exposed portion is photocured. And a method of manufacturing a resist pattern, wherein unexposed portions are removed by development. Further, the present invention relates to a method for manufacturing a printed wiring board, wherein a circuit forming substrate on which a resist pattern is manufactured is etched or plated by the method for manufacturing a resist pattern.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. In the present invention, (meth) acrylic acid means acrylic acid and methacrylic acid corresponding thereto,
(Meth) acrylate means acrylate and its corresponding methacrylate, and (meth) acryloyl group means acryloyl and its corresponding methacryloyl group.

The photosensitive resin composition of the present invention comprises (A) a binder polymer, and (B) an alkylene oxide group having 2 or 3 carbon atoms in the molecule, and at least one polymerizable ethylenically unsaturated group. (B) a compound having only an ethylene oxide group as an alkylene oxide group having 2 or 3 carbon atoms as the component (B); B2) It is necessary to contain a compound having only a propylene oxide group as an alkylene oxide group having 2 or 3 carbon atoms.

On the other hand, the photosensitive resin composition of the present invention comprises (A)
It is necessary to contain a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in a molecule represented by the general formula (II), and (C) a photopolymerization initiator. .

As the binder polymer (A),
For example, acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin and the like can be mentioned. From the viewpoint of alkali developability, an acrylic resin is preferred. These can be used alone or in combination of two or more.

The binder polymer of the component (A) is
For example, it can be produced by radically polymerizing a polymerizable monomer. Examples of the polymerizable monomer include, for example, styrene, vinyl toluene, a polymerizable styrene derivative substituted at the α-position or an aromatic ring such as α-methylstyrene, acrylamide such as diacetone acrylamide, acrylonitrile, and vinyl. Esters of vinyl alcohol such as -n-butyl ether, alkyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, ( Meth) acrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, (meth) acrylic acid, α
-Bromo (meth) acrylic acid, α-chloro (meth) acrylic acid, β-furyl (meth) acrylic acid, β-styryl (meth) acrylic acid, maleic acid, maleic anhydride,
Maleic acid monoesters such as monomethyl maleate, monoethyl maleate and monoisopropyl maleate, fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, propiolic acid and the like can be mentioned.

Examples of the alkyl (meth) acrylate include those represented by the general formula (III):

Embedded image (Wherein, R ⁵ represents a hydrogen atom or a methyl group, and R ⁶ represents an alkyl group having 1 to 12 carbon atoms), and the alkyl group of these compounds includes a hydroxyl group, an epoxy group, a halogen group, and the like. And the like. Examples of the alkyl group having 1 to 12 carbon atoms represented by R ⁶ in the general formula (III) include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group,
Examples include an octyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, and structural isomers thereof.

Examples of the monomer represented by the general formula (III) include (meth) acrylic acid methyl ester,
Ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, (meta) ) Octyl acrylate,
2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, and the like. These can be used alone or in combination of two or more.

The binder polymer (A) preferably contains a carboxyl group from the viewpoint of alkali developability. For example, the polymerizable monomer having a carboxyl group is radically polymerized with another polymerizable monomer. It can be manufactured by the following.

The acid value of the binder polymer (A) is 1
It is preferably from 100 to 500 mgKOH / g, and
More preferably, it is 200 mgKOH / g,
Particularly preferred is 95 mg KOH / g. This acid value is 1
If it is less than 00 mgKOH / g, the development time tends to be long,
If it exceeds 500 mgKOH / g, the photocured resist tends to have poor developer resistance.

The binder polymer as the component (A) preferably contains styrene or a styrene derivative as a polymerizable monomer from the viewpoint of adhesion and peeling properties. In order to improve both the adhesion and the peeling properties by using the styrene or styrene derivative as a copolymer component, 0.1
The content is preferably from 40 to 40% by weight, more preferably from 0.1 to 30% by weight, particularly preferably from 2 to 30% by weight, very preferably from 10 to 30% by weight. It is most preferred that the content be contained in an amount of about 25% by weight. If this content is less than 0.1% by weight,
Adhesion tends to be inferior, and if it exceeds 40% by weight, a peeled piece tends to be large and a peeling time tends to be long.

The binder polymer (A) has a weight average molecular weight of 20,000 from the viewpoint of coating properties and resolution.
~ 300,000, preferably 25,000
~ 200,000, more preferably 30,0
It is particularly preferred that it is from 00 to 150,000. If the weight average molecular weight is less than 20,000, the developer resistance tends to decrease, and if it exceeds 300,000, the development time tends to be long. In the present invention, the weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve. These binder polymers are used alone or in combination of two or more.

The compound (B1) having only an ethylene oxide group as a C 2 or C 3 alkylene oxide group is not particularly limited as long as it is a compound having only an ethylene oxide group as a C 2 or C 3 alkylene oxide group. For example, EO-modified (meth) acrylate compounds and the like can be mentioned. EO indicates ethylene oxide, and the EO-modified compound has a block structure of an ethylene oxide group.

(B1) The number of repeating ethylene oxide groups in one molecule of the compound having only an ethylene oxide group as the alkylene oxide group having 2 or 3 carbon atoms is preferably 3 to 30, and preferably 4 to 25. Is more preferably 4 to 20, particularly preferably 6 to 20.
It is very preferably from 16 to 16, and particularly preferably from 6 to 12. When the number of repetitions is less than 3, the resolution tends to decrease, and when it exceeds 30, the photocured resist tends to have poor developer resistance.

Examples of the EO-modified (meth) acrylate compound include, for example, the EO-modified bisphenol A-based (meth) acrylate compound represented by the aforementioned general formula (I) and the general formula (IV)

Embedded image (Wherein, R ⁷ represents a hydrogen atom or a methyl group, and p ¹ represents 3 to
An EO-modified phenyl (meth) acrylate compound represented by the general formula (V):

Embedded image (Wherein, R ⁸ and R ⁹ each independently represent a hydrogen atom or a methyl group, and q ¹ is an integer of 3 to 30).
Modified di (meth) acrylate compound, general formula (VI)

Embedded image (Wherein, R ¹⁰ , R ¹¹ and R ¹² each independently represent a hydrogen atom or a methyl group, and r ¹ , r ² and r ³ represent r ¹ + r ² + r ³ = 3)
An EO-modified trimethylolpropane triacrylate compound represented by the general formula (VII):

Embedded image (Wherein, R ¹³ and R ¹⁴ each independently represent a hydrogen atom or a methyl group, Z ¹ represents a hydrocarbon group having 2 to 16 carbon atoms,
s ¹ and s ² are positive integers selected so that s ¹ + s ² = 3 to 30), an EO-modified urethane di (meth) acrylate compound represented by the general formula (VIII):

Embedded image (Wherein, R ¹⁵ , R ¹⁶ and R ¹⁷ each independently have 1 to 1 carbon atoms)
0 represents an alkylene group, R ¹⁸ , R ¹⁹ and R ²⁰ each independently represent a hydrogen atom or a methyl group, and t ¹ , t ² and t ³ are such that t ¹ + t ² + t ³ = 3 to 30. Or an EO-modified urethane tri (meth) acrylate compound represented by the following formula (I), and is preferably an EO-modified bisphenol A (meth) acrylate compound. These are used alone or in combination of two or more.

In the general formula (I), R ¹ and R ² each independently represent a hydrogen atom or a methyl group, and is preferably a methyl group from the viewpoint of availability. In the general formula (I), m ¹ and n ¹ are preferably positive integers selected so that m ¹ + n ¹ = 3 to 30, and m ¹ + n ¹ is 4 to 25. Is more preferably 4 to 20, particularly preferably 6 to 16, and very preferably 6 to 12.

The aromatic ring in the general formulas (I) and (IV) may have a substituent. Examples of the substituent include a halogen atom and an alkyl group having 1 to 20 carbon atoms. A cycloalkyl group having 3 to 10 carbon atoms, 6 to 6 carbon atoms
18 aryl groups, phenacyl group, amino group, 1 carbon atom
An alkylamino group having 10 to 10 carbon atoms, a dialkylamino group having 2 to 20 carbon atoms, a nitro group, a cyano group, a carbonyl group, a mercapto group, an alkylmercapto group having 1 to 10 carbon atoms, an allyl group, a hydroxyl group, and having 1 to 20 carbon atoms. A hydroxyalkyl group, a carboxyl group, a carboxyalkyl group having an alkyl group having 1 to 10 carbon atoms, and an alkyl group having 1 to 10 carbon atoms.
Acyl group, an alkoxy group having 1 to 20 carbon atoms, 1 carbon atom
An alkoxycarbonyl group having 20 to 20 carbon atoms, an alkylcarbonyl group having 2 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms,
Examples thereof include an N-alkylcarbamoyl group having 2 to 10 carbon atoms, a group containing a heterocyclic ring, and an aryl group substituted with these substituents. When there are two or more substituents, those two or more substituents may be the same or different.

Examples of the compound represented by the general formula (I) include 2,2-bis (4-((meth) acryloxydiethoxy) phenyl) propane and 2,2-bis (4
-((Meth) acryloxytriethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytetraethoxy) phenyl) propane, 2,2-bis (4
-((Meth) acryloxypentaethoxy) phenyl)
Propane, 2,2-bis (4-((meth) acryloxyhexaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyheptaethoxy) phenyl) propane, 2,2-bis ( 4-((meth) acryloxyoctaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxynonaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxy) Decaethoxy) phenyl), 2,2-bis (4-
((Meth) acryloxyundecaethoxy) phenyl)
Propane, 2,2-bis (4-((meth) acryloxydodecaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytridecaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytetradecaethoxy) phenyl) propane, 2,
2-bis (4-((meth) acryloxypentadecaethoxy) phenyl) propane and the like, and 2,2-bis (4- (methacryloxypentaethoxy) phenyl) propane is BPE-500 (Shin-Nakamura Chemical) It is commercially available as Industrial Co., Ltd. product name). These are used alone or in combination of two or more.

The compound (B2) having only a propylene oxide group as the alkylene oxide group having 2 or 3 carbon atoms is not particularly limited as long as it is a compound having only a propylene oxide group as the alkylene oxide group having 2 or 3 carbon atoms. No, for example, PO modified (meta)
An acrylate compound is exemplified. PO represents propylene oxide, and the PO-modified compound has a block structure of a propylene oxide group.

(B1) The number of repeating propylene oxide groups in one molecule of the compound having only a propylene oxide group as an alkylene oxide group having 2 or 3 carbon atoms is preferably 3 to 30, and preferably 3 to 15. Is more preferably 3 to 12, particularly preferably 3 to 10, and very preferably 3 to 8. If the number of repetitions is less than 3, the adhesiveness tends to decrease, and if it exceeds 30, the developer resistance improves, and the resolution tends to decrease.

Examples of the PO-modified (meth) acrylate compound include the PO-modified bisphenol A-based (meth) acrylate compound represented by the general formula (II) and the general formula (IX)

Embedded image (Wherein, R ²¹ represents a hydrogen atom or a methyl group, and Y ³ represents n
Represents a propylene group or an isopropylene group, and p ² is 3
PO-modified phenyl (meth) acrylate compound represented by the general formula (X):

Embedded image (Wherein, R ²² and R ²³ each independently represent a hydrogen atom or a methyl group, Y ⁴ represents an n-propylene group or an isopropylene group, and q ² is an integer of 3 to 30) P
O-modified di (meth) acrylate compound, general formula (XI)

Embedded image (Wherein, R ²⁴ , R ²⁵ and R ²⁶ each independently represent a hydrogen atom or a methyl group, Y ⁵ , Y ⁶ and Y ⁷ each independently represent an n-propylene group or an isopropylene group, r ⁴ , r ⁵ and r ⁶ are positive integers selected such that r ⁴ + r ⁵ + r ⁶ = 3 to 30), and a PO-modified trimethylolpropane triacrylate compound represented by the general formula (XII):

Embedded image (Wherein, R ²⁷ and R ²⁸ each independently represent a hydrogen atom or a methyl group, Y ⁸ and Y ⁹ each independently represent an n-propylene group or an isopropylene group, and Z ² has 2 to 16 carbon atoms. A PO-modified urethane di (meth) acrylate compound represented by the general formula (XII), which represents a hydrocarbon group, and s ³ and s ⁴ are positive integers selected so that s ³ + s ⁴ = 3 to 30).
I)

Embedded image (Wherein, R ²⁹ , R ³⁰ and R ³¹ each independently have 1 to 1 carbon atoms)
0 represents an alkylene group; R ³² , R ³³ and R ³⁴ each independently represent a hydrogen atom or a methyl group, and Y ¹⁰ , Y ¹¹ and Y ¹²
Each independently represents an n-propylene group or an isopropylene group, and t ⁴ , t ⁵ and t ⁶ are positive integers selected so that t ⁴ + t ⁵ + t ⁶ = 3 to 30). A PO-modified urethane tri (meth) acrylate compound may be mentioned, but a PO-modified bisphenol A-based (meth) acrylate compound is preferred. These can be used alone or 2
Used in combination of more than one type.

In the general formula (II), R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group, and is preferably a methyl group from the viewpoint of availability. In the general formula (II), m ² and n ² are preferably positive integers selected so that m ² + n ² = 3 to 30, and m ² + n ² is 3 to 15. Is more preferably 3 to 12, particularly preferably 3 to 10, and very preferably 3 to 8.

The aromatic ring in the general formulas (II) and (IX) may have a substituent. Examples of the substituent include those substituted with the aromatic ring in the general formula (I). Examples of the substituent that may be included include those exemplified above. When there are two or more substituents, those two or more substituents may be the same or different.

Examples of the compound represented by the general formula (II) include 2,2-bis (4-((meth) acryloxydipropoxy) phenyl) propane and 2,2-bis (4-(( (Meth) acryloxytripropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytetrapropoxy) phenyl) propane, 2,2-
Bis (4-((meth) acryloxypentapropoxy)
Phenyl) propane, 2,2-bis (4-((meth) acryloxyhexapropoxy) phenyl) propane,
2,2-bis (4-((meth) acryloxyheptapropoxy) phenyl) propane, 2,2-bis (4-
((Meth) acryloxyoctapropoxy) phenyl)
Propane, 2,2-bis (4-((meth) acryloxynonapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxydecapropoxy) phenyl), 2,2-bis (4 -((Meth) acryloxyundecapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxide decapropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxy) Tridecapropoxy) phenyl) propane, 2,
2-bis (4-((meth) acryloxytetradecapropoxy) phenyl) propane, 2,2-bis (4-
((Meth) acryloxypentadecapropoxy) phenyl) propane and the like. These are used alone or in combination of two or more.

The general formula (VII) and the general formula (XII)
Examples of the hydrocarbon group having 2 to 16 carbon atoms include an alkylene group such as an ethylene group, a hexylene group, a 2-ethylhexylene group, a trimethylhexylene group, and a decylene group;
Cyclohexylene group, cycloalkylene group such as bicyclohexylene group, phenylene group, biphenylene group, arylene group such as naphthylene group and the like, hexylene group, 2,4,4-trimethylhexylene group, tolylene group and the like. preferable.

In the propylene oxide group, there are two bonding directions between the propylene group and oxygen. However, one bonding direction may be used, or two bonding directions may be mixed.

As the component (B), a photopolymerizable compound other than the components (B1) and (B2) may be contained as long as the effects of the present invention are not impaired. Compounds obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol, bisphenol A-based (meth) acrylates such as 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane Compounds, compounds obtained by reacting an α, β-unsaturated carboxylic acid with a glycidyl group-containing compound, urethane monomers such as (meth) acrylate compounds having a urethane bond, and alkyl (meth) acrylates are exemplified. These are used alone or in combination of two or more.

Examples of the photopolymerization initiator (C) include benzophenone, N, N'-tetramethyl-4,
4'-diaminobenzophenone (Michler's ketone),
N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4
-Morpholinophenyl) -butanone-1, 2-ethylanthraquinone, aromatic ketones such as phenanthrenequinone, benzoin methyl ether, benzoin ethyl ether, benzoin ether compounds such as benzoin phenyl ether, benzoin compounds such as methylbenzoin and ethylbenzoin, benzyl Benzyl derivatives such as dimethyl ketal, 2,2'-bis (o-chlorophenyl)-
4,5,4 ', 5'-tetraphenyl-1,2'-biimidazole, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5 Di- (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer , 2-
(O-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5
-Diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer,
2,4,5-triaryl such as 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer and 2- (p-methylmercaptophenyl) -4,5-diphenylimidazole dimer Imidazole dimer, 9-
Examples include phenylacridine, acridine derivatives such as 1,7-bis (9,9'-acridinyl) heptane, and N-phenylglycine. These are used alone or in combination of two or more. Further, from the viewpoint of adhesion, 2,4,5-triarylimidazole dimer is preferable.

The amount of the component (A) is from 40 to 80 based on 100 parts by weight of the total of the components (A) and (B).
It is preferable that the amount be 45 parts by weight, more preferably 45 to 70 parts by weight, and particularly preferably 50 to 65 parts by weight. When the amount is less than 40 parts by weight, the photocured product becomes brittle, and when used as a photosensitive element, the coating properties tend to be inferior. When the amount exceeds 80 parts by weight, the adhesion and the resolution tend to decrease. .

The amount of the component (B) is 20 to 60 parts by weight based on 100 parts by weight of the total of the components (A) and (B).
It is preferable that the amount be 30 parts by weight, more preferably 30 to 55 parts by weight, and particularly preferably 35 to 50 parts by weight. The compounding amount of the component (B1) is preferably 5 to 95% by weight, more preferably 30 to 70% by weight, and more preferably 40 to 70% by weight, based on the total amount of the component (B).
It is particularly preferred that the content is ６０60% by weight. If the amount is less than 5% by weight, the resolution tends to decrease, and if it exceeds 95% by weight, the peeling time tends to be long. The amount of the component (B2) is based on the total amount of the component (B).
It is preferably from 5 to 95% by weight, more preferably from 30 to 70% by weight, and particularly preferably from 40 to 60% by weight. If the amount is less than 5% by weight, the peeling time tends to be long, and if it exceeds 95% by weight, the resolution tends to decrease.

The amount of the component (C) is 0.1 to 2 parts by weight based on 100 parts by weight of the total amount of the components (A) and (B).
The amount is preferably 0 parts by weight, more preferably 0.15 to 15 parts by weight, and particularly preferably 0.2 to 10 parts by weight. If the amount is less than 0.1 part by weight, the sensitivity tends to be insufficient. If the amount is more than 20 parts by weight, the light absorption on the surface of the composition during exposure increases, and the internal photo-curing increases. It tends to be insufficient.

The photosensitive resin composition of the present invention may contain, if necessary, a dye such as malachite green, a photochromic agent such as tribromophenylsulfone or leucocrystal violet, a thermochromic inhibitor, p-toluenesulfone. Plasticizers such as amides, pigments, fillers, defoamers, flame retardants, stabilizers,
Each of the adhesion-imparting agent, the leveling agent, the peeling accelerator, the antioxidant, the fragrance, the imaging agent, the thermal crosslinking agent, etc. is added to each of the components (A) and (C) in an amount of 0.0
About 1 to 20 parts by weight may be contained. They are,
Used alone or in combination of two or more.

If necessary, the photosensitive resin composition of the present invention may contain a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether or the like. And a solution having a solid content of about 30 to 60% by weight.

The photosensitive resin composition of the present invention is not particularly limited, but may be a metal surface, for example, an iron-based alloy such as copper, a copper-based alloy, nickel, chromium, iron, or stainless steel, and preferably copper or a copper-based alloy. Preferably, it is applied as a liquid resist on the surface of the iron-based alloy and dried, and then coated with a protective film if necessary, or used in the form of a photosensitive element.

The thickness of the photosensitive resin composition layer depends on the intended use, but is preferably 1 to 200 μm, more preferably 1 to 100 μm, and more preferably 1 to 30 μm in terms of thickness after drying. Is particularly preferred. If the thickness is less than 1 μm, it tends to be difficult to coat industrially,
If it exceeds 00 μm, the effect of the present invention is small, the sensitivity becomes insufficient, and the photocurability at the bottom of the resist tends to deteriorate. When a liquid resist is coated with a protective film, the protective film is, for example, an inactive polyolefin film such as polyethylene and polypropylene.However, from the standpoint of releasability from the photosensitive resin composition layer, a polyethylene film is used. preferable.

The photosensitive element is prepared by, for example, applying a photosensitive resin composition on a heat- and solvent-resistant polymer film such as polyethylene terephthalate, polypropylene, polyethylene, or polyester as a support, and drying. can get. From the viewpoint of transparency, it is preferable to use a polyethylene terephthalate film. The coating can be performed by a known method such as a roll coater, a comma coater, a gravure coater, an air knife coater, a die coater, a bar coater, and a sleigh coater. Drying is performed at 70 to 150 ° C. and 5 to 30 ° C.
It can be done in about a minute. Further, the amount of the residual organic solvent in the photosensitive resin composition layer is preferably 2% by weight or less from the viewpoint of preventing the diffusion of the organic solvent in a later step.

The haze of the support is 0.001-5.
It is preferably 0%, more preferably 0.001 to 3.0%, particularly preferably 0.001 to 2.0%, and preferably 0.001 to 1.0%. Very preferred. If the haze is less than 0.001%, the ease of production tends to be poor, and if it exceeds 1.0%, the sensitivity and resolution tend to deteriorate. The haze in the present invention is measured according to JIS K7105, and is, for example, NDH-1001DP (Nippon Denshoku Industries)
It can be measured with a commercially available turbidity meter such as a product name of Co., Ltd.).

Further, since these polymer films must be removable from the photosensitive resin composition layer later, they may be subjected to a surface treatment that makes removal impossible, or may be made of a material. Don't be. The thickness of these polymer films is preferably 1 to 100 μm, more preferably 1 to 30 μm. If the thickness is less than 1 μm, the mechanical strength tends to decrease, and problems such as breakage of the polymer film during coating tend to occur. If the thickness exceeds 30 μm, the resolution tends to decrease and the price tends to increase. One of these polymer films may be laminated on both surfaces of the photosensitive resin composition layer as a support film for the photosensitive resin composition layer, and the other as a protective film for the photosensitive resin composition layer. As the protective film, one having a smaller adhesive force between the photosensitive resin composition layer and the protective film than the adhesive force between the photosensitive resin composition layer and the support is preferable.

The transmittance of the photosensitive resin composition layer to ultraviolet rays having a wavelength of 365 nm is preferably 5 to 75%, more preferably 7 to 60%, and more preferably 10 to 40%.
% Is particularly preferred. If the transmittance is less than 5%, the adhesion is poor, and if it exceeds 75%, the resolution is poor. The transmittance can be measured with a UV spectrometer, and examples of the UV spectrometer include a 228A W-beam spectrophotometer manufactured by Hitachi, Ltd.

The photosensitive element of the present invention comprising two layers of the photosensitive resin composition layer and the polymer film thus obtained can be used, for example, as it is or on the other surface of the photosensitive resin composition layer on a protective film. Are further laminated, wound up in a roll shape, and stored.

In producing a resist pattern using the photosensitive element, if the above-mentioned protective film is present, the protective film is removed and the photosensitive resin composition layer is heated while forming a circuit. For example, a method of laminating by press-bonding to a substrate may be mentioned, and it is preferable to laminate under reduced pressure from the viewpoint of adhesion and followability. The surface to be laminated is usually a metal surface, but is not particularly limited. The heating temperature of the photosensitive resin composition layer is preferably 70 to 130 ° C., and the pressing pressure is 0.1 to 1 MPa (1 to 10 k
gf / cm ² ), but these conditions are not particularly limited. In addition, if the photosensitive resin composition layer is heated to 70 to 130 ° C. as described above, it is not necessary to pre-heat the circuit forming substrate in advance. Preheating of the substrate can also be performed.

The photosensitive resin composition layer thus laminated is irradiated with actinic rays imagewise through a negative or positive mask pattern called an artwork. At this time, when the polymer film present on the photosensitive resin composition layer is transparent, it may be irradiated with actinic light as it is, and when it is opaque, it is necessary to remove it naturally. As a light source of the actinic ray, a known light source, for example, a carbon arc lamp, a mercury vapor arc lamp, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a xenon lamp, or the like that effectively emits ultraviolet rays is used. In addition, those that effectively emit visible light, such as a flood light bulb for photography and a sun lamp, are also used.

Next, after the exposure, if a support is present on the photosensitive resin composition layer, the support is removed.
Unexposed portions are removed by wet development, dry development, or the like, and developed to produce a resist pattern. In the case of wet development, using a developer corresponding to a photosensitive resin composition such as an alkaline aqueous solution, an aqueous developer, or an organic solvent, for example, developing by a known method such as spraying, rocking immersion, brushing, and scraping. I do. As the developer, a safe and stable one having good operability, such as an alkaline aqueous solution, is used.

Examples of the base of the alkaline aqueous solution include alkali hydroxides such as lithium, sodium or potassium hydroxide, alkali carbonates such as lithium, sodium, potassium or ammonium carbonate and bicarbonate, and potassium phosphate. And alkali metal phosphates such as sodium phosphate and potassium pyrophosphate, and the like.
Further, as an alkaline aqueous solution used for development, 0.1
Dilute solution of -5 wt% sodium carbonate, dilute solution of 0.1-5 wt% potassium carbonate, dilute solution of 0.1-5 wt% sodium hydroxide, dilute solution of 0.1-5 wt% sodium tetraborate Solutions and the like are preferred. The pH of the alkaline aqueous solution used for development is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive resin composition layer. A surfactant, an antifoaming agent, a small amount of an organic solvent for promoting development, and the like may be mixed in the alkaline aqueous solution.

The aqueous developer comprises water or an aqueous alkali solution and one or more organic solvents. Here, as the alkaline substance, other than the above substances, for example, borax or sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-2-hydroxymethyl-1,
3-propanediol, 1,3-diaminopropanol-2, morpholine and the like. The pH of the developing solution is preferably as low as possible within a range where the development of the resist can be sufficiently performed.
More preferably, it is set to 9 to 10.

Examples of the organic solvent include triacetone alcohol, acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, and the like.
Examples thereof include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether. These are used alone or in combination of two or more. Usually, the concentration of the organic solvent is preferably 2 to 90% by weight,
The temperature can be adjusted according to the developability.
Further, a small amount of a surfactant, an antifoaming agent and the like can be mixed in the aqueous developer.

The organic solvent-based developer used alone includes:
For example, 1,1,1-trichloroethane, N-methylpyrrolidone, N, N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, γ-butyrolactone and the like can be mentioned. It is preferable to add water to these organic solvents in a range of 1 to 20% by weight to prevent ignition. If necessary, two or more developing methods may be used in combination. Development methods include dip method, battle method,
There are spray method, brushing, slapping, etc.
The high pressure spray method is most suitable for improving the resolution.

As processing after development, if necessary,
The resist pattern may be further cured by heating at about 250 ° C. or exposure at about 0.2 to 10 mJ / cm ² .

For the etching of the metal surface after the development, a cupric chloride solution, a ferric chloride solution, an alkali etching solution, and a hydrogen peroxide-based etching solution can be used. It is desirable to use a ferric solution.

When a printed wiring board is manufactured using the photosensitive element of the present invention, the surface of the circuit forming substrate is treated by a known method such as etching or plating using the developed resist pattern as a mask. Examples of the plating method include copper plating such as copper sulfate plating and copper pyrophosphate, solder plating such as high-throw solder plating,
There are nickel plating such as Watt bath (nickel sulfate-nickel chloride) plating and nickel sulfamate plating, and gold plating such as hard gold plating and soft gold plating. Next, the resist pattern can be stripped with, for example, a more alkaline aqueous solution than the alkaline aqueous solution used for development. As this strongly alkaline aqueous solution,
For example, a 1 to 10% by weight aqueous sodium hydroxide solution,
A 10% by weight aqueous solution of potassium hydroxide or the like is used. Examples of the peeling method include an immersion method and a spray method. The immersion method and the spray method may be used alone or in combination. Further, the printed wiring board on which the resist pattern is formed may be a multilayer printed wiring board.

[0068]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to Examples of the present invention and Comparative Examples thereof, but the present invention is not limited to these Examples.

Examples 1 to 3 and Comparative Examples 1 to 3 The components (A), (C) and other additives shown in Table 1 were mixed to prepare solutions.

[0070]

[Table 1]

Next, the component (B) was mixed with the above solution in the amount shown in Table 2 to obtain a solution of the photosensitive resin composition.

[0072]

[Table 2]

Next, the solution of the photosensitive resin composition was added to 2
A photosensitive film was obtained by uniformly coating a 0 μm-thick polyethylene terephthalate film (haze: 1.8) and drying with a hot air convection dryer at 100 ° C. for 10 minutes. The dried film thickness of the photosensitive resin composition layer was 25 μm.
Here, the haze of the support film is JIS K 7105
Haze meter (TC-H3 manufactured by Tokyo Denshoku Co., Ltd.)
DP). Further, the transmittance of the layer of the photosensitive resin composition to ultraviolet rays having a wavelength of 365 nm was measured using a UV spectrometer (Model 228A W-beam spectrophotometer manufactured by Hitachi, Ltd.). The transmittance was measured by placing a photosensitive element composed of a support film and a layer of the photosensitive resin composition on the measurement side, placing the support film on the reference side, and continuously measuring from 700 to 300 μm in T% mode.
It was measured by reading the value of.

On the other hand, a copper-clad laminate (Hitachi Chemical Industries, Ltd.) which is a glass epoxy material in which copper foil (thickness: 35 μm) is laminated on both sides
Copper surface of # 600 manufactured by MCL-E-61)
Polished using a polishing machine with a considerable brush (manufactured by Sankei Co., Ltd.), washed with water, dried in an air stream, and the obtained copper-clad laminate was heated to 80 ° C. Layer of the photosensitive resin composition on the copper surface using
Lamination was performed at 0 ° C. and 0.4 MPa.

Then, the copper-clad laminate was cooled, and when the temperature of the copper-clad laminate reached 23 ° C., a photo tool (a 21-step step tablet of a stofer was brought into close contact with the polyethylene terephthalate surface, and a 3 KW high-pressure mercury lamp (Oak) was used. HMW-590 manufactured by Seisakusho Co., Ltd. and a wiring pattern with a line width / space width of 10/10 to 47/47 (unit: μm) (unit: μm) (a smaller value is better) as a 21-step stofer tablet and a resolution evaluation negative The exposure was performed with an energy amount such that the number of remaining steps after development of the 21-step tablet of the stofer was 7.0. 10/400-47/400 (unit: μm)
A photo tool having a wiring pattern (the smaller the numerical value, the better) was used.

Next, the polyethylene terephthalate film was removed, and an unexposed portion was removed by spraying a 1.0% by weight aqueous solution of sodium carbonate at 30 ° C. for 30 seconds. Next, the results of the obtained adhesion and resolution are summarized in Table 3.

The resist stripping time was measured by 200 mm ×
Using the photosensitive element obtained above on a 250 mm substrate, a layer of the photosensitive resin
Laminated at 0.4 ° C. and 0.4 MPa, and the number of steps remaining after development of the 21-step tablet of the stofer was 7.
The whole surface is exposed with an energy amount of 0, and then 50
The resist cured film was removed from the substrate by spraying a 3.0% by weight aqueous solution of sodium hydroxide at a temperature of ° C for a predetermined time, and the time required at that time was measured. Table 3 shows the results.
Shown in

[0078]

[Table 3]

As is evident from the results shown in Table 3, the photosensitive resin compositions used in the examples have characteristics that are superior in adhesion and resolution to those in comparative examples 1 to 3, and furthermore, the peeling time is shorter. It can be seen that the workability is short and excellent.

[0080]

According to the present invention, claims 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, and 16
The photosensitive resin composition described above has a short peeling time, and is excellent in adhesion and resolution. The photosensitive elements according to claims 17, 18 and 19 have a short peeling time and are excellent in adhesion and resolution. In the method for manufacturing a resist pattern according to the twentieth aspect, the stripping time is short, and the adhesion and the resolution are excellent. The method for manufacturing a printed wiring board according to claim 21 is excellent in adhesion and resolution.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G03F 7/004 512 G03F 7/004 512 7/031 7/031 7/033 7/033 H05K 3/06 H05K 3/06 H 3/18 3/18 D

Claims (21)

[Claims] (A) a binder polymer, (B) an alkylene oxide group having 2 or 3 carbon atoms in the molecule,
A photosensitive resin composition comprising at least one photopolymerizable compound having a polymerizable ethylenically unsaturated group and (C) a photopolymerization initiator, wherein (B)
1) A photosensitive resin composition containing a compound having only an ethylene oxide group as an alkylene oxide group having 2 or 3 carbon atoms and (B2) a compound having only a propylene oxide group as an alkylene oxide group having 2 or 3 carbon atoms. (B1) a compound having only an ethylene oxide group as an alkylene oxide group having 2 or 3 carbon atoms, wherein the number of repeating ethylene oxide groups in one molecule of the compound is 3;
The photosensitive resin composition according to claim 1, wherein the number is from 30 to 30. 3. The photosensitive composition according to claim 1, wherein (B2) the number of repeating propylene oxide groups in one molecule of the compound having only a propylene oxide group as the alkylene oxide group having 2 or 3 carbon atoms is 3 to 30. Resin composition. 4. The photosensitive resin composition according to claim 1, wherein the component (B1) is an EO-modified (meth) acrylate compound having only an ethylene oxide group as an alkylene oxide group having 2 or 3 carbon atoms. 5. The photosensitive resin composition according to claim 4, wherein the EO-modified (meth) acrylate compound is an EO-modified bisphenol A-based (meth) acrylate compound. 6. An EO-modified bisphenol A-based (meth) a
The acrylate compound is represented by the general formula (I):(Where R¹And R^TwoAre each independently a hydrogen atom or a methyl group
And m¹And n¹Is m ¹+ N¹= 3 to 30
6. The sense according to claim 5, wherein the positive integer is selected.
Light resin composition. 7. The method according to claim 1, wherein the component (B2) is a PO-modified (meth) acrylate compound having only a propylene oxide group as an alkylene oxide group having 2 or 3 carbon atoms. Photosensitive resin composition. 8. The photosensitive resin composition according to claim 7, wherein the PO-modified (meth) acrylate compound is a PO-modified bisphenol A-based (meth) acrylate compound. 9. The PO-modified bisphenol A-based (meth) acrylate compound represented by the general formula (II): (Wherein, R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group, Y ¹ and Y ² each independently represent an n-propylene group or an isopropylene group, and m ² and n ² represent m ² + n ² = 3 ~
The photosensitive resin composition according to claim 8, which is a positive integer selected to be 30. 10. The method according to claim 1, wherein (A) the binder polymer contains styrene or a styrene derivative as a copolymer component.
The photosensitive resin composition according to 2, 3, 4, 5, 6, 7, 8 or 9. 11. The binder polymer containing (A) styrene or a styrene derivative as a copolymer component may have a styrene or styrene derivative content of 0.1% based on the total amount of the copolymer component.
The photosensitive resin composition according to claim 10, which is obtained as a 1 to 40% by weight copolymer component. 12. The photosensitive material according to claim 1, wherein (A) the binder polymer has a weight average molecular weight of 20,000 to 300,000. Resin composition. 13. An acid value of (A) the binder polymer is 1
Claims 1, 2, 3, 4, and 100-500 mgKOH / g.
The photosensitive resin composition according to 5, 6, 7, 8, 9, 10, 11 or 12. 14. The method according to claim 1, wherein (C) the photopolymerization initiator is a 2,4,5-triarylimidazole dimer.
3, 4, 5, 6, 7, 8, 9, 10, 11, 12, or 1
3. The photosensitive resin composition according to 3. 15. The compounding amount of the component (A), the component (B) and the component (C) is 100 in total of the component (A) and the component (B).
Component (A) is 40 to 80 parts by weight with respect to parts by weight,
20 to 60 parts by weight of component (B) and 0.1 of component (C)
２０20 parts by weight, and based on the total amount of the component (B), the component (B1) is 5 to 95% by weight and the component (B2) is 5% by weight.
Claims 1, 2, 3, 4, 5, 6, and 95% by weight.
The photosensitive resin composition according to 7, 8, 9, 10, 11, 12, 13 or 14. 16. (A) a binder polymer, (B) a general formula (II) (Wherein, R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group, Y ¹ and Y ² each independently represent an n-propylene group or an isopropylene group, and m ² and n ² represent m ² + n ² = 3 ~
A photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule represented by the formula (C) and a photopolymerization initiator: Photosensitive resin composition. 17. The method of claim 1, 2, 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, or 16
Applying and drying the photosensitive resin composition described on the support,
A photosensitive element having a photosensitive resin composition layer formed thereon. 18. The support has a haze of 0.001 to 5.0.
18. The photosensitive element of claim 17, wherein 19. The photosensitive element according to claim 17, wherein a transmittance of the photosensitive resin composition layer to ultraviolet rays having a wavelength of 365 nm is 5 to 75%. 20. The photosensitive element according to claim 17, 18 or 19 is laminated on a circuit-forming substrate so that the photosensitive resin composition layer is in close contact with the circuit, and is irradiated with actinic rays in an image-like manner. A method for producing a resist pattern, comprising: photo-curing portions and removing unexposed portions by development. 21. A method for manufacturing a printed wiring board, comprising etching or plating a circuit-forming substrate on which a resist pattern has been manufactured by the method for manufacturing a resist pattern according to claim 20.