JP2001168512A - Conductive ball aligning jig, method of manufacturing same, and conductive ball transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive ball aligning jig which can be reduced in manufacturing cost, a method of manufacturing the jig, and a conductive ball transfer device. SOLUTION: At the time of manufacturing the conductive ball aligning jig which holds conductive balls and aligns the balls in a prescribed arrangement, protective films 10h are formed on both surfaces of a substrate section 10B in which metallic films are formed on a resin substrate and through holes are formed through the substrate and films. Then, the protective films 10h are etched off by only leaving prescribed portions. Metallic films 10g are formed on the portions from which the protective films 10h are removed by plating a metal. Thereafter, recessed sections 10a and 10b are formed at the positions corresponding to the prescribed alignment of the metallic layers 10g by removing the protective films 10h of the substrate section 10B. Consequently, the working cost required for the formation of the recesses sections 10a and 10b can be reduced, because no expensive working is required for forming the recessed sections.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball aligning jig for aligning conductive balls in a predetermined arrangement, a method of manufacturing the aligning jig, and transfer of a conductive ball using the aligning jig. It concerns the device.

[0002]

2. Description of the Related Art As a method of forming a metal bump on an electrode of a substrate or an electronic component, there is known a method of transferring a conductive ball such as a solder ball onto an electrode and soldering the electrode. For transferring the conductive balls, a method of vacuum-sucking the conductive balls by a transfer head is widely used. This method
The conductive balls are sucked into a large number of suction holes provided on the lower surface of the suction tool of the transfer head, the suction tool is moved onto the work, and the vacuum ball is released to transfer the conductive balls to the work. Things. The suction tool is provided with a plurality of through holes for vacuum suction in a predetermined arrangement on a plate-like substrate portion, and generally, a concave portion for introducing a conductive ball is formed on an opening surface of the through hole. .

When picking up a conductive ball by a suction tool, the conductive ball may be aligned in advance according to the arrangement of suction holes of the suction tool in order to promote the suction of the conductive ball. In this case, an alignment jig is used in which concave portions capable of accommodating one conductive ball in a predetermined arrangement are provided corresponding to the arrangement of the suction tools.

[0004]

[Problems to be Solved by the Invention] However, with the miniaturization of electronic components and the reduction in the diameter of conductive balls, the size of introduction holes and recesses formed in suction tools and alignment jigs tends to be further miniaturized. It is in. Therefore, the difficulty of processing these introduction holes and recesses increases, and the manufacturing cost of these parts is extremely high accordingly. For this reason, it has been strongly desired to reduce the cost of components such as a suction tool and an alignment jig.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a conductive ball alignment jig, a method of manufacturing the alignment jig, and a conductive ball transfer apparatus capable of reducing the manufacturing cost.

[0006]

According to a first aspect of the present invention, there is provided a conductive ball aligning jig for holding a conductive ball and aligning the conductive ball in a predetermined arrangement. A substrate portion, a metal layer provided on at least one surface of the substrate portion, and a concave portion provided in the metal layer corresponding to the arrangement and capable of accommodating one conductive ball are provided.

A conductive ball alignment jig according to a second aspect is the conductive ball alignment jig according to the first aspect,
The substrate is formed by forming a metal film on a surface of a resin substrate.

According to a third aspect of the present invention, there is provided a conductive ball alignment jig according to the second aspect.
Metal layers are provided on both surfaces of the substrate portion.

A conductive ball alignment jig according to a fourth aspect is the conductive ball alignment jig according to any one of the first to third aspects, wherein the substrate portion is provided at the position of the concave portion. A through hole is formed.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a conductive ball aligning jig for holding conductive balls and aligning the conductive balls in a predetermined arrangement. A step of forming a protective film on the surface, a step of removing the protective film on the surface of the substrate portion leaving only a predetermined portion corresponding to the arrangement, and applying a metal plating to the substrate portion from which the protective film has been partially removed. Forming a metal layer in the portion where the protective film has been removed, and forming a concave portion at a position corresponding to the arrangement of the metal layer by removing the protective film on the surface of the substrate after forming the metal layer. Including.

According to a sixth aspect of the present invention, there is provided a method of manufacturing an alignment jig according to the fifth aspect, wherein the predetermined jig is formed before the metal layer is formed or after the concave portion is formed. Forming a through-hole in the substrate portion in an array.

According to a seventh aspect of the present invention, there is provided an apparatus for transferring a conductive ball, wherein the conductive ball is transferred to a predetermined position while holding the conductive ball. An alignment jig, and a transfer head that picks up and transfers a plurality of conductive balls aligned to the alignment jig to a predetermined position, wherein the alignment jig has a plate-shaped substrate portion and A metal layer provided on at least one surface of the substrate portion, and a concave portion provided in the metal layer corresponding to the arrangement and capable of accommodating one conductive ball.

The conductive ball transfer device according to claim 8 is the conductive ball transfer device according to claim 7,
The substrate is formed by forming a metal film on a surface of a resin substrate.

According to a ninth aspect of the present invention, there is provided an apparatus for transferring a conductive ball, comprising:
Metal layers are provided on both surfaces of the substrate portion.

According to a tenth aspect of the present invention, there is provided an apparatus for transferring a conductive ball according to any one of the seventh to ninth aspects, wherein: A through hole is formed.

A conductive ball transfer device for transferring a conductive ball to a predetermined position while holding the conductive ball, wherein the ball supply unit supplies the conductive ball. A transfer head for picking up a plurality of conductive balls in an array state and transferring the conductive balls to a predetermined position, the transfer head includes a plate-shaped substrate portion having a plurality of through holes formed therein, At least a metal layer provided on the lower surface and a concave portion provided in the metal layer corresponding to the through hole and capable of accommodating one conductive ball were provided.

According to a twelfth aspect of the present invention, there is provided the conductive ball transferring apparatus according to the eleventh aspect, wherein the substrate is formed by forming a metal film on a surface of a resin substrate. .

According to a thirteenth aspect of the present invention, there is provided the conductive ball transferring apparatus according to the eleventh aspect, wherein a metal layer is provided on both surfaces of the substrate.

According to the present invention, a protective film is formed on at least one surface of the substrate portion, and the protective film on the surface of the substrate portion is removed except for a predetermined portion corresponding to the through-hole. It is necessary to form a metal layer by metal plating on the part of the substrate which has been removed, and remove the protective film on the surface of the substrate part after the formation of the metal layer, thereby performing a process for forming a concave part which requires high cost. And the processing cost can be greatly reduced. Further, by using a resin substrate for the substrate portion, the formation of the through-hole is facilitated, and the processing cost for forming the through-hole can be greatly reduced.

[0020]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an apparatus for transferring conductive balls according to an embodiment of the present invention, FIG. 2 is a perspective view of a ball supply unit of the apparatus for transferring conductive balls, and FIG. FIG. 4A is an enlarged sectional view of an arrangement member of the ball supply unit, FIG. 4B is an enlarged sectional view of a transfer head of the ball supply unit, FIG. FIG. 6 is an explanatory diagram of the operation of the conductive ball transfer device, and FIGS. 7 and 8 are process explanatory diagrams of a method of manufacturing an alignment jig of the conductive ball transfer device.

First, the structure of the transfer device for conductive balls will be described with reference to FIG. In FIG. 1, X is located at the center of the base 1.
A transport path 2 is provided in the direction. The transport path 2 transports and positions the substrate 3. Two Y-axis tables 5 are arranged at both ends of the upper surface of the base 1. An X-axis table 6 is provided on the Y-axis table 5, and a transfer head 7 having an alignment suction plate 8 (alignment jig) is mounted on the X-axis table 6. By driving the X-axis table 6 and the Y-axis table 5, the transfer head 7 moves horizontally.

A ball supply section 9 for the conductive balls 4 is provided in front of the transport path 2. The ball supply unit 9 is an alignment jig 1 for arranging the conductive balls 4 in a predetermined arrangement pattern.
0 is provided. The transfer head 7 is positioned on the alignment jig 10, and the transfer head 7 is lowered with respect to the alignment jig 10 so that the transfer head 7 aligns the conductive balls 4 arranged on the alignment jig 10. The conductive balls 4 are transferred to a predetermined position on the substrate 3 by being picked up by suction by a suction plate 8 (alignment jig).

Next, the ball supply unit 9 will be described with reference to FIGS. In FIG. 2, the ball tank 12
Is a substantially box-shaped container with no bottom, and a box member 11 is disposed inside a ball tank 12. An alignment jig 10 is mounted on the upper part of the box member 11, and the inside of the box member 11 is formed airtight. FIG. 3 shows an AA cross section of FIG. 2, and an extension 12 a extending inward from four sides is provided at the upper part of the ball tank 12. The box member 11 is inserted into an opening formed by the end face of the extension 12a. The upper surface of the extending portion 12a is an inclined surface 12b inclined inward, and a recess formed by the side surface and the inclined surface 12b of the box member 11 is a storage portion 12c for storing the conductive balls 4. ing.

A rack member 14 is attached to the bottom surface of the box member 11 in a vertical direction, and a pinion 15 that is driven to rotate by a motor 16 meshes with the rack member 14. The box member 11 is driven by driving the motor 16.
Moves up and down. When the box member 11 is lowered and the alignment jig 10 is positioned below the ball storage level of the storage part 12c, the conductive balls 4 in the storage part 12c
The upper jig falls down and moves to the upper surface of the alignment jig 10 (see FIG. 5A). That is, the motor 1 for vertically moving the storage part 12 c for storing the conductive balls 4 and the box member 11.
Reference numeral 6 denotes a ball supply means for supplying the conductive balls 4 on the alignment jig 10.

The alignment jig 10 mounted on the ball supply unit 9 and the alignment suction plate 8 mounted on the transfer head 7 will now be described with reference to FIG. As shown in FIG. 4A, a plurality of circular concave portions 10a and 10b are provided on the upper and lower surfaces of the alignment jig 10 in a lattice shape.
The arrangement pitch of the recesses 10a and 10b is set to a predetermined arrangement, that is, equal to the arrangement pitch of the recesses 8a provided on the alignment suction plate 8 (see FIG. 4B) of the transfer head 7.

A through hole 10c penetrating through the alignment jig 10 is provided on the bottom surface of the concave portion 10a, and the conductive ball 4 is present in the concave portion 10a. Sex ball 4 is held in concave portion 10a. Therefore, the recess 10a and the through hole 10
c denotes a ball holding portion for holding the conductive ball 4.

Here, the structure of the alignment jig 10 will be described. As shown in the cross-sectional view of FIG.
Is a metal film 1 made of copper or the like on both sides of the plate-like resin substrate 10d.
It is manufactured based on the substrate portion 10B on which 0f is formed. The substrate portion 10B is provided with a plurality of through holes 10c in a predetermined arrangement, and a metal layer 10g made of a metal such as nickel is formed on both surfaces of the substrate portion 10B. The metal layer 10g is provided with concave portions 10a and 10b large enough to accommodate one conductive ball 4 corresponding to the arrangement of the through holes 10c.

The alignment suction plate 8 has substantially the same structure as the alignment jig 10, and as shown in the cross-sectional view of FIG. 4B, a substrate portion in which metal films 8f are formed on both front and back surfaces of a resin substrate 8d. 8B as a base, and a similar through hole 8c is formed in the substrate portion 8B.
The metal layer 8g similarly formed on both surfaces of the substrate portion 8B has a size that can accommodate one conductive ball 4 corresponding to the arrangement of the through holes 8c. Recesses 8a and 8b are formed. By vacuum suction from the concave portion 8b side (the transfer head 7 side), the conductive balls 4 are sucked and held in an aligned state in the concave portion 8a as an introduction hole. That is, in this case, the alignment jig is mounted on the transfer head 7 and used as the alignment suction plate 8.

The upper surface of the ball tank 12 is an overhang 13 protruding in both left and right directions (X direction), and a guide rail 17 is arranged on the upper surface of the overhang 13 in the Y direction. A slider 18 is slidably fitted in the guide rail 17 in the horizontal direction, and a nut 19 is fixed to a side surface of the slider 18 on the near side. A feed screw 20 rotationally driven by a motor 21 is screwed into the nut 19.

A gate-shaped frame 22 is provided on the two sliders 18. A squeegee 25 is attached to the center of the frame 22 via an attachment member 24. The squeegee 25 is a plate-shaped member, and the lower end portion is at a height position where a slight gap is maintained from the upper surface of the alignment jig 10 having been raised. The squeegee 2 is driven by driving the motor 21.
Reference numeral 5 relatively horizontally moves along the upper surface of the alignment jig 10.

By moving the squeegee 25 along the upper surface of the alignment jig 10 while the conductive balls 4 are present on the alignment jig 10, the squeegee 25 moves while scraping the conductive balls 4 at the lower end. Then, the conductive balls 4 are made to enter the concave portions 10a provided in the alignment jig 10, and the excess conductive balls 4 located outside the concave portions 10a are moved to be scraped off from the alignment jig 10 and removed. .

A tube 36 is connected to a lower portion of the box member 11, and the tube 36 is connected to a vacuum suction source and an air supply source (not shown) via a switching valve 37. By switching the switching valve 37, the inside of the box member 11 can be vacuum-sucked, or positive-pressure air can be supplied to the inside.

By vacuum-suctioning the inside of the box member 11 in a state where the conductive balls 4 are present in the recesses 10a of the alignment jig 10, the conductive balls 4 are held in the recesses 10a by vacuum suction. Further, by supplying air into the inside of the box member 11, the conductive balls 4 in the concave portions 10a are discharged to the outside by air blow.

The device for transferring conductive balls is configured as described above. The operation of supplying the conductive balls 4 to the transfer head 7 by the ball supply unit 9 will be described below. Prior to the state shown in FIG.
2, a large number of conductive balls 4 are charged into the storage portion 12c.
Is stored inside.

From this state, the box member 11 is lowered as shown in FIG. As a result, the alignment jig 10 sinks into the ball layer of the conductive balls 4 in the storage portion 12c, and the conductive balls 4 move onto the alignment jig 10 and move.
Supplied to At this time, the box member 1 is
The inside of 1 is evacuated, and evacuated from the through hole 10c. As a result, the conductive ball 4 captured in the recess 10a is held. At this time, the squeegee 25 is at a position retracted from above the alignment jig 10.

Next, as shown in FIG.
Increase 1 As a result, a part of the conductive ball 4 located on the alignment jig 10 falls from the end of the alignment jig 10 into the storage portion 12c. Then, an infinite number of conductive balls 4 remain on the alignment jig 10. After this, FIG.
The squeegee 25 is moved as shown in FIG.
The conductive ball 4 on 0 is scraped in the traveling direction.

At this time, if there is a concave portion 10a in which the conductive ball 4 has not yet been captured, the conductive ball 4 is dropped into the non-captured concave portion 10a in this scraping operation. Then, the squeegee 25 moves further, and when it reaches the end of the alignment jig 10, the excess conductive balls 4 are scraped off from the alignment jig 10 and removed. The removed conductive balls 4 fall into the storage portion 12c.

Thereafter, after the squeegee 25 has retreated from above the alignment jig 10, the transfer head 7 is moved onto the alignment jig 10 as shown in FIG. After aligning the concave portion 8a with the concave portion 10a, the alignment suction plate 8 is lowered with respect to the alignment jig 10. When the lower surface of the alignment suction plate 8 is lowered to a predetermined suction height position with respect to the upper surface of the alignment jig 10, the descent is stopped, vacuum suction is performed from the through hole 8c, and vacuum suction inside the box member 11 is performed. To release.

Thus, the conductive balls 4 held in the concave portions 10a are vacuum-sucked into the concave portions 8a of the alignment suction plate 8. At this time, the switching valve 37 may be switched to supply a slightly positive pressure air into the box member 11. This has the effect of facilitating the separation of the conductive ball 4 from the recess 10a and promoting the adsorption of the conductive ball 4 to the recess 8a. Thereafter, as shown in FIG. 6B, the transfer head 7 is raised, and the concave portion 8 of the alignment suction plate 8 is moved.
The transfer head 7 picking up the conductive balls 4 by a transfers the conductive balls 4 to predetermined positions on the substrate 3.

Next, the alignment jig 10 will be described with reference to FIGS.
A method of manufacturing the device will be described. 7 (a), (b),
(C), (d), FIGS. 8 (a), (b), (c), (d)
Shows the manufacturing method of the alignment jig in the order of steps. First, FIG. 7 (a) shows a copper metal film 10 on both surfaces of a resin substrate 10d.
The substrate portion 10B on which f is formed is shown. The board portion 10B is similar to a mounting resin board used for mounting electronic components. Next, as shown in FIG. 7B, a through hole 10c is formed in the substrate portion. This through-hole formation is performed by the same method as the through-hole formation step in the mounting substrate manufacturing step.

The through-holes can be formed by applying a special technique established and specialized in the manufacture of a mounting substrate, and therefore, a large number of fine-diameter holes can be formed very efficiently. Therefore, the cost can be remarkably reduced as compared with the through-hole forming step required in the manufacture of the alignment jig using the conventional metal parts.

Next, as shown in FIG. 7C, protective films 10h are formed on both surfaces of the substrate portion 10B after the formation of the through holes.
Thereafter, as shown in FIG. 7D, the surface of the protective film 10h is
Masked by the photomask 10i. Here, a range other than the predetermined portion corresponding to the concave portion 10a in the alignment jig 10 is a masking range.

Next, as shown in FIG.
The substrate portion 10B on which h is formed is exposed in a masking state to cure the protective film 10h outside the masking range. Then, by performing an etching process thereafter, FIG.
As shown in (b), the photomask 10i and the protective film 10h in the masking area are removed. Thereafter, a metal layer is formed. As shown in FIG. 8C, the substrate portion 10B after the protective film 10h is partially removed by etching.
By performing electrolytic metal plating, a metal layer 10g of copper, nickel, or the like is formed at a predetermined thickness in the removed portion of the protective film 10h.

Next, as shown in FIG. 8D, by removing the protective film 10h from the surface of the substrate portion 10B,
The alignment jig 10 in which the concave portions 10a are formed in a predetermined arrangement on the metal layer 10g is completed. The recess 10a formed by the above method is not formed by counterboring as in the case of the conventional metal component alignment jig, so that the conventionally required high-cost counterboring can be omitted.

After forming the concave portion, it is desirable to perform a surface coating process on the entire alignment jig 10, for example, a process of forming a gold film on the surface of the nickel layer after plating the nickel layer. This can prevent rust on the surface of the metal film 10g of the substrate portion 10B due to exposure to the air during use.

As described above, when forming the concave portions 10a corresponding to the arrangement of the through holes 10c formed in the lattice-like arrangement, the fine diameter required in the conventional manufacturing process of the alignment jig for the metal parts is obtained. Since no through-hole processing or counterboring processing is required, the manufacturing cost of the alignment jig can be significantly reduced. Although the above description has been made with reference to the example of the alignment jig 10, the alignment suction plate 8 is also manufactured by the same process.

In this embodiment, an example in which the metal layer is formed on both the front and back surfaces of the substrate is shown, but the metal layer may be formed only on one side. However, since the effect of preventing deformation due to heat in the metal plating step can be obtained by forming the metal layers on both surfaces, it is desirable to form the metal layers on both surfaces.

[0048]

According to the present invention, a protective film is formed on at least one surface of a substrate in which a through hole is formed, and the protective film on the surface of the substrate is left only at a predetermined portion corresponding to the through hole. A metal layer is formed by metal plating on the substrate portion from which the protective film has been partially removed, and after the metal layer is formed, the protective film on the surface of the substrate portion is removed to a position corresponding to the through hole of the metal layer. Since the concave portion is formed, it is not necessary to perform machining for forming the concave portion which requires high cost, and the processing cost can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a conductive ball transfer device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a ball supply unit of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 3 is a sectional view of a ball supply unit of the conductive ball transfer device according to one embodiment of the present invention;

4A is an enlarged cross-sectional view of an arrangement member of a ball supply unit according to one embodiment of the present invention. FIG. 4B is an enlarged cross-sectional view of a transfer head of the ball supply unit according to one embodiment of the present invention.

FIG. 5 is an operation explanatory view of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 6 is an explanatory diagram of the operation of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 7 is a process explanatory view of a method of manufacturing an alignment jig of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 8 is a process explanatory view of a method for manufacturing an alignment jig of the conductive ball transfer device according to one embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 3 substrate 4 conductive ball 7 transfer head 8 alignment suction plate 8a, 8b recess 9 ball supply unit 10 alignment jig 10B substrate unit 10a, 10b recess 10c through hole 10g metal layer 10h protective film 10i photomask 11 box member 25 squeegee

 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Shoji Sakami 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5E319 AC01 BB04 CD04 CD07 CD25 GG15

Claims (13)

[Claims] 1. A conductive ball alignment jig for holding conductive balls and aligning the conductive balls in a predetermined arrangement, comprising: a plate-shaped substrate portion; and a metal provided on at least one surface of the substrate portion. And a layer provided on the metal layer corresponding to the arrangement.
A conductive ball aligning jig, comprising: a recess capable of accommodating individual conductive balls. 2. A jig for arranging conductive balls according to claim 1, wherein said substrate portion is formed by forming a metal film on a surface of a resin substrate. 3. The jig for arranging conductive balls according to claim 2, wherein metal layers are provided on both surfaces of said substrate portion. 4. A jig for arranging conductive balls according to claim 1, wherein a through hole is formed in the substrate at the position of the recess. 5. A method for manufacturing a conductive ball aligning jig for holding conductive balls and aligning them in a predetermined arrangement, comprising: forming a protective film on at least one surface of a substrate portion; Removing the protective film on the surface of the portion while leaving only a predetermined portion corresponding to the arrangement, and applying a metal plating to the substrate portion from which the protective film has been partially removed to form a metal layer on the portion where the protective film has been removed. Forming an alignment jig, comprising: forming the metal layer and removing the protective film on the surface of the substrate after forming the metal layer to form a concave portion at a position corresponding to the arrangement of the metal layers. Method. 6. The alignment jig according to claim 5, further comprising the step of forming through holes in said substrate portion in said predetermined arrangement before forming said metal layer or after forming said concave portions. Manufacturing method of the tool. 7. A conductive ball transfer apparatus for holding and transferring a conductive ball to a predetermined position, comprising: an alignment jig for aligning a plurality of conductive balls in a predetermined arrangement; and an alignment jig. A transfer head for picking up and transferring a plurality of conductive balls aligned to a predetermined position, wherein the alignment jig is provided on a surface of at least one side of the plate-shaped substrate portion and the substrate portion. A conductive ball transfer device, comprising: a metal layer provided in said metal layer; and a recess provided in said metal layer in correspondence with said arrangement and capable of accommodating one conductive ball. 8. The conductive ball transfer apparatus according to claim 7, wherein said substrate portion is formed by forming a metal film on a surface of a resin substrate. 9. An apparatus according to claim 7, wherein metal layers are provided on both surfaces of said substrate portion. 10. The conductive ball transfer device according to claim 7, wherein a through hole is formed in the substrate at the position of the recess. 11. A conductive ball transfer apparatus for holding and transferring a conductive ball to a predetermined position, wherein a plurality of conductive balls are picked up in an array from a ball supply unit for supplying the conductive ball. And a transfer head for transferring to a predetermined position, the transfer head includes a plate-shaped substrate portion having a plurality of through holes, a metal layer provided on at least a lower surface of the substrate portion, A conductive ball transfer device, comprising: a recess provided in the layer corresponding to the through hole and capable of accommodating one conductive ball. 12. The conductive ball transfer device according to claim 11, wherein said substrate portion is formed by forming a metal film on a surface of a resin substrate. 13. An apparatus according to claim 11, wherein metal layers are provided on both surfaces of said substrate portion.