JP2001168228A - Printed-wiring board and its manufacturing method, semiconductor package and its manufacturing method, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method where the surface of the outermost layer is smooth, wiring density can be increased, and strength is large, and to provide a semiconductor package and its manufacturing method. SOLUTION: An insulation layer 12 that does not contain any glass fiber is laminated on a substrate 9, and a conductive via 17 for interlayer connection is formed on the insulation layer 12 by applying laser beams or by the photo-etching method. An insulation layer 25 including the glass fiber as a reinforcing material is further laminated on the insulation layer 12, and the interlayer connection of the insulation layer 25 is made by forcing in a group of nearly conical conductor bumps 22a, 22,... in the thickness direction of the insulation layer 25. A fine wiring layer is formed on the insulation layer 12 for improving the degree of integration, and the reinforcing material is included in the insulation layer 25 to achieve mechanical and thermal strength. By arranging the insulation layer 25 that is subjected to interlayer connection by the group of conductor bumps 22a, 22,... at the outermost side, the surface becomes smooth, thus obtaining a multilayer board with high wiring density.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly, to a multilayer board in which electrical conduction between a plurality of wiring layers is formed, a method for manufacturing such a multilayer board, and a method for manufacturing such a multilayer board. The present invention relates to a semiconductor package having a semiconductor chip mounted on a multilayer board, a method for manufacturing such a semiconductor package, and a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, in a so-called multilayer board in which a plurality of wiring layers are interposed between a plurality of stacked insulating layers, a through hole called a "via" is formed in the insulating layer, and the inner wall surface of the via is formed. A method of interconnecting a plurality of wiring layers separated by an insulating layer by forming a plating layer thereon has been adopted.

FIG. 31 is a vertical sectional view showing the structure of a conventional typical multilayer board 200. As shown in FIG. As shown in FIG.
In this multilayer board 200, a via 202 is drilled on the outermost insulating layer 201 to form a wiring layer 203 below the insulating layer 201.
And a metal layer 204 is formed from the bottom surface of the via 202 to the outside of the insulating layer 201 via the inner wall surface, and the electrical conduction between the wiring layer 203 and the surface of the insulating layer 201 via the metal layer 204. Is formed.

A semiconductor chip and various elements are mounted on the multilayer board by the outermost wiring layer. To increase the integration of the multilayer board, the multilayer board 200 is required.
It is necessary to make the surface of the outermost layer as smooth as possible.

[0005]

However, in the method in which the metal layer 204 is formed on the inner wall surface by piercing the via 202, the hole of the via 202 remains after the metal layer 204 is formed. The surface has irregularities. Further, since the metal layer 204 protrudes on the surface of the insulating layer 201, there is a problem that the surface of the multilayer board 200 is not smooth.

Furthermore, if glass fibers are included as a reinforcing material in the insulating layer forming the vias, the workability at the time of drilling the vias is reduced, so that the glass fibers cannot be used. For this reason, there is a problem that the mechanical strength and durability against heat of the insulating layer in which the via is perforated are not sufficiently obtained. In particular, when a semiconductor chip or the like is mounted on a multilayer board, there is a problem that mechanical stress or thermal stress acts when connecting with a gold wire, so that it cannot be used for this purpose.

Therefore, as another method for interlayer connection, instead of drilling a via, a conductive composition such as a silver paste is printed using a printing technique to form a group of substantially conical conductive bumps on a conductive plate such as a copper foil. A prepreg of an insulating substrate is placed on the conductive bump group and pressed by a roller press or the like, and the conductive bump group is pressed into the insulating substrate prepreg in a thickness direction to penetrate the conductive bump group. There has been proposed a so-called through-conductor type multi-layer board for interlayer connection via a bump group. The conductor bump has the advantage that the surface becomes smooth and the mechanical strength is high.

However, the conductor bump group is substantially conical,
Since the bottom surface of the conductor bump requires a relatively large area, when the conductor plate on which the conductor bump is formed is arranged on the outermost layer, the surface of the outermost layer is occupied by the bottom surface on which the conductor bump is formed. Therefore, there is a problem that it is difficult to improve the wiring density of the outermost layer.

The present invention has been made to solve such a problem. That is, the present invention provides a printed wiring board having a smooth outermost layer, a high wiring density, and a high strength, a method for manufacturing such a printed wiring board,
An object of the present invention is to provide a semiconductor package and a method of manufacturing the semiconductor package.

[0010]

A printed wiring board according to the present invention is formed on a base, an inner insulating layer provided on the base and provided with a via exposing the base, and formed on an inner wall of the via. A metal layer for electrically connecting the exposed substrate to the upper surface of the inner insulating layer; an inner wiring layer formed on the upper surface of the inner insulating layer; and an outer insulating layer formed on the inner insulating layer And an outer wiring layer formed on the outer insulating layer, and a conductive bump group formed in the outer insulating layer so as to electrically connect the inner wiring layer and the outer wiring layer. Have.

In the above printed wiring board, the outer insulating layer is preferably a layer containing glass fiber as a reinforcing material.

The printed wiring board is manufactured by the following manufacturing method of the present invention.

That is, in the method of manufacturing a printed wiring board according to the present invention, a step of laminating an inner insulating layer on a base, a step of forming a via hole in the inner insulating layer to expose the base, Forming a metal layer inside to electrically connect the exposed substrate and the upper surface of the inner insulating layer, and forming an inner wiring layer on the inner insulating layer; and forming an outer wiring layer on the inner insulating layer. A step of placing an insulating layer, a step of placing a conductive plate having a substantially conical conductive bump group formed on the outer insulating layer, and pressing the inner insulating layer and the conductive plate to form the conductive plate. A step of electrically connecting the inner wiring layer to the conductor plate by penetrating the conductor bump group through the outer insulating layer; and a step of patterning the conductor plate to form an outer wiring layer.

In the method for manufacturing a printed wiring board, the step of forming the via may be a step of piercing by irradiating a laser beam.

In the method for manufacturing a printed wiring board, the inner insulating layer is a layer made of a photosensitive resin, and the step of forming the via includes exposing the inner insulating layer to light, and thereafter, exposing the inner insulating layer. A step of drilling a via by developing the layer may be used.

In the above-mentioned printed wiring board and its manufacturing method, the "base" means a conductor layer such as a copper foil and a heat-dissipating metal layer such as aluminum, copper and iron disposed on an insulating substrate.

Further, another printed wiring board of the present invention comprises:
Three insulating layers, two wiring layers formed one by one between the insulating layers, and a first core wiring layer and a second core formed on both outer sides of the three insulating layers, respectively. A core material having a wiring layer, a through-hole plating layer for electrically connecting the wiring layer and the core wiring layer, a first inner insulating layer laminated on the first core wiring layer,
A first via that is perforated in the inner insulating layer to expose the first core wiring layer; and a first via formed on an inner wall of the first via and exposing the first core wiring layer and the first via. A first metal layer electrically connecting the upper surface of the inner insulating layer, a first inner wiring layer formed on the upper surface of the first inner insulating layer, and a first metal layer on the first inner insulating layer. A first outer insulating layer formed, a first outer wiring layer formed on the first outer insulating layer, and a first inner wiring layer in the first outer insulating layer. A first group of conductive bumps formed so as to electrically connect to a first outer wiring layer, a second inner insulating layer laminated on the second core wiring layer; A second via formed in the inner insulating layer to expose the second core wiring layer, and a second via formed on an inner wall of the second via, and A second metal layer for electrically connecting the upper surface of the second core wiring layer a second inner insulating layer,
A second inner wiring layer formed on the upper surface of the second inner insulating layer, a second outer insulating layer formed on the second inner insulating layer, and a second inner wiring layer formed on the second outer insulating layer. Second formed
And the second outer insulating layer and the second outer insulating layer.
And a second group of conductive bumps formed so as to electrically connect the inner wiring layer and the second outer wiring layer.

This printed wiring board is manufactured by the following method. That is, the method for manufacturing a printed wiring board according to the present invention includes the three insulating layers, the two wiring layers formed between the insulating layers, and the first insulating layer formed on both outer sides of the three insulating layers. Forming a core material having a core wiring layer and a second core wiring layer, and a through-hole plating layer for electrically connecting the wiring layer and the core wiring layer;
Laminating a first inner insulating layer on the core wiring layer and laminating a second inner insulating layer on the second core wiring layer; and piercing the first inner insulating layer to form the first inner insulating layer. Forming a first via for exposing the first core wiring layer and forming a second via for exposing the second core wiring layer by piercing the second inner insulating layer; Forming a metal layer in the via and electrically connecting the exposed first core wiring layer to the upper surface of the first inner insulating layer, and forming a metal layer in the second via. Electrically connecting the exposed second core wiring layer to the upper surface of the second inner insulating layer, and simultaneously forming a first inner wiring layer on the first inner insulating layer, Forming a second inner wiring layer on the second inner insulating layer; and forming a second inner wiring layer on the first inner insulating layer. Placing the second outer insulating layer on the second inner insulating layer and placing the second outer insulating layer on the first outer insulating layer; and forming a substantially conical first conductive bump on the first outer insulating layer. Placing the first conductor plate on which the group is formed and placing the second conductor plate on which the substantially conical second conductor bump group is formed on the second outer insulating layer; When,
Pressing the first conductor plate and the second conductor plate,
The first conductor bump group is made to penetrate through the first outer insulating layer to electrically connect the first inner wiring layer and the first conductor plate, and the second conductor bump group is A step of penetrating the second outer insulating layer to electrically connect the second inner wiring layer and the second conductor plate, and patterning the first conductor plate to form a first outer wiring Forming a layer and patterning the second conductive plate to form a second outer wiring layer.

A semiconductor package according to the present invention comprises: a heat-dissipating metal plate; a first insulating layer disposed on the heat-dissipating substrate;
A first wiring layer formed on the first insulating layer, and an electric or thermal connection between the heat-dissipating metal plate and the first wiring layer press-fit into the first insulating layer; A first conical bump group having a substantially conical shape to be disposed on the first insulating layer;
A second insulating layer provided with a via for exposing the first wiring layer; and a first insulating layer formed on an inner wall of the via, and
A metal layer for electrically connecting the wiring layer to the upper surface of the second insulating layer; a second wiring layer formed on the upper surface of the second insulating layer; A third insulating layer formed on the third insulating layer, a third wiring layer formed on the third insulating layer, and press-fitted into the third insulating layer to form the second wiring layer and the third wiring layer. And a substantially conical second conductive bump group that electrically connects the second conductive bumps to the second wiring layer.

The semiconductor device according to the present invention also includes a heat dissipating metal plate, a first insulating layer disposed on the heat dissipating substrate, and a first wiring layer formed on the first insulating layer. And the heat dissipating metal plate press-fitted into the first insulating layer and
Of a substantially conical shape for electrically or thermally connecting the
A conductive bump group, a second insulating layer provided on the first insulating layer and provided with a via for exposing the first wiring layer, and a conductive bump group formed on an inner wall of the via, A metal layer for electrically connecting the first wiring layer to the upper surface of the second insulating layer; and a second layer formed on the upper surface of the second insulating layer.
Wiring layer, a third insulating layer formed on the second insulating layer, a third wiring layer formed on the third insulating layer, and press-fitted into the third insulating layer. A substantially conical second conductive bump group that electrically connects the second wiring layer and the third wiring layer, and is disposed on the heat-dissipating metal plate;
A semiconductor chip connected to the third wiring layer.

This semiconductor package is manufactured by the following method.

That is, according to the method of manufacturing a semiconductor package of the present invention, a step of forming a substantially conical first conductive bump group on a conductive plate and mounting the first insulating layer on a heat-dissipating metal plate. A step of mounting the conductive plate on the first insulating layer with the surface on which the conductive bumps are formed facing, and pressing the heat-dissipating metal plate and the conductive plate to form the second conductive plate. A step of penetrating one conductive bump group through the first insulating layer to electrically or thermally connect the conductive plate and the heat-dissipating metal plate; and patterning the conductive plate to form a first wiring layer. Forming a second insulating layer on the first insulating layer; and forming a via hole on the second insulating layer to expose the first wiring layer. And a top surface of the exposed first wiring layer and the second insulating layer formed by forming a metal layer in the via. Forming a second wiring layer on the second insulating layer, placing a third insulating layer on the second insulating layer, Placing a second conductor plate on which a substantially conical second conductor bump group is formed on the insulating layer of (3) with the surface on which the conductor bump group is formed facing; Pressing a plate and the second conductor plate to penetrate the second conductor bump group through the third insulating layer, and electrically connecting the second wiring layer and the second conductor plate And the second step
Patterning the conductive plate to form a third wiring layer.

In the present invention, an insulating layer for drilling a via is provided inside. Therefore, the outermost layer has no irregularities due to vias, and defects in the etching or printing process of the outer layer processing caused by invasion of chemicals or air into the concave portions are prevented beforehand. In addition, defects during mounting of components on vias do not occur, which is advantageous in mounting components and designing.

Further, it is possible to reduce the thickness of the outermost metal layer, and it becomes easy to form a high-definition wiring layer.

Since the vias can be formed with a small diameter of the through holes, a wiring layer with a high degree of integration can be formed on this insulating layer.

Further, in the present invention, an insulating layer for press-fitting the conductor bump is provided outside. Since the conductive bumps can be pressed into an insulating layer containing a reinforcing material such as glass fiber, an insulating layer having high mechanical strength and high strength against heat can be formed by including glass fiber.

Therefore, by disposing the insulating layer having the above-described vias on the inside and disposing the insulating layer press-fitted with the conductor bumps on the outside, a high degree of integration and
A printed wiring board having high strength can be provided.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) Hereinafter, a method for manufacturing a printed wiring board according to an embodiment of the present invention will be described. FIG. 1 is a flowchart showing a flow of a method for manufacturing a printed wiring board according to the present embodiment, and FIGS. 2 to 17 are vertical cross-sectional views schematically showing steps of the method for manufacturing the printed wiring board. .

As shown in FIG. 2, first, a prepreg of an insulating substrate on which an insulating layer at the center of a core material is formed (hereinafter, the prepreg of the insulating substrate is simply referred to as “prepreg”) 1
The metal plates 2 and 3 such as copper foil are placed on both sides of the prepreg (Step 1), and the prepreg 1 is cured by pressing under heating (Step 2). A so-called two-layer plate 4 is formed as shown in FIG. Next, the metal plates 2 and 3 of the two-layer plate 4 are patterned by etching or the like (step 3), and the wiring layers 2a and 3a are formed as shown in FIG. Get.

Next, as shown in FIG. 5, a prepreg 5 and a metal plate 6 such as a copper foil are placed on the upper side of the two-layer plate 4a. Similarly, the prepreg 7 is placed on the lower side of the two-layer plate 4a. Then, a metal plate 8 such as a copper foil is placed thereunder (step 4).

In this state, when pressed under heating in the same manner as described above (step 5), the metal layers 2a and 3 as shown in FIG.
A core material 9 having four layers a, 6, and 8 is formed.

Next, metal plates 6 and 8 on both outer sides of the core material 9
Is patterned by performing an etching process or the like (step 6) to form wiring patterns 6a and 8a.
Four-layer core material 9 patterned as shown in FIG.
a is obtained.

Next, in order to form through holes for interlayer connection of the core material 9a, as shown in FIG.
A through-hole (through hole) 10 is pierced in the thickness direction of a by a known method such as drilling or laser beam irradiation to obtain a core material 9b having the through hole (step 7).

The metal layer 11 is formed in the through hole 10 of the core material 9b by a known method such as electroless plating.
Through hole plating is performed (step 8).
A core material 9c on which through-hole plating is performed as shown in FIG. 9 is obtained.

Next, as shown in FIG. 10, a prepreg 12 as a first inner insulating layer and a prepreg 13 as a second inner insulating layer are placed on each of the upper and lower surfaces of the core material 9c (step 9). Pressing under heating in the same manner as described above (step 10) to obtain a laminate 14 as shown in FIG.
Is formed.

The insulating layers 12, 1 on both outer sides of the laminated body 14
Drilling is performed at a predetermined position 3 by, for example, laser beam irradiation (step 11) to obtain a laminated body 14a having vias 15, 15,... And vias 16, 16,.

The insulating layers 12 on both outer sides of the laminated pair 14a,
When a metal layer is formed on the inner walls of the vias 13 and vias 15, 15,... And vias 16, 16,... By a known method such as electroless plating (step 12), the interlayer connection shown in FIG. Conductive via 1 as metal layer 1
7, 17, ..., 19, 19, ... as the second metal layer
A laminate 14 in which a wiring layer 18 as a first inner wiring layer and a wiring layer 20 as a second inner wiring layer are respectively formed.
b is formed.

Next, a metal plate 21 made of copper foil or the like is prepared separately from the laminate 14b, and one surface of this metal plate 21 is formed along a predetermined wiring pattern as a first conductive bump group. Are formed using a conductive composition such as a silver paste and a printing technique (step), and a metal plate 21a with bumps as shown in FIG. 14 is formed.
Is obtained (step 13).

In the same manner, a metal plate 23a with bumps on which conductive bumps (group) 24, 24,... As a second conductive bump group are formed on a metal plate 23 is formed.

As shown in FIG. 15, these metal plates 21a and 23a with bumps are connected to a prepreg 25 as a first outer insulating layer and a prepreg 2 as a second outer insulating layer.
6 is placed at a position facing the above-mentioned laminated body 14b with each of them interposed therebetween (step 14), and pressed under heating in the same manner as above (step 15).
When the prepreg 25 penetrates 2, 22,.
Are brought into contact with the wiring layer 18 and the conductive vias 17, 17,..., So that the conductive plate 21 and the wiring layer 18, the conductive via 17,
The interlayer connection between 17,... Is formed.

Similarly, by contacting the tip ends of the conductor bump groups 24, 24,... With the wiring layer 20 and the conductive vias 19, 19,.
The laminated body 27 having the interlayer connection between 9, 19,... Is obtained.

The metal plates 21 and 23 forming the outermost layer of the laminate 27 are patterned by etching or the like to form a wiring layer 21b as a first outer wiring layer and a wiring layer 21b as a second outer wiring layer. When the wiring layers 23b are formed (step 16), a multilayer board 27a as shown in FIG. 17 is obtained.

In the printed wiring board according to the present embodiment,
Since the insulating layers 12 and 13 in which the vias 17 and 18 were formed were disposed inside the outermost insulating layers 25 and 26, the via 1
Unevenness due to the metal layer forming the holes and the conductive vias 17 and 18 when the holes 5 and 16 are formed does not appear on the surface as the outermost layer. The holes formed when the vias 17 and 18 were formed correspond to the outer insulating layer 2.
Since steps 5 and 26 are filled with the resin that flows when the layers are stacked, a step of filling the holes is unnecessary. In addition, via 17,
Reference numeral 18 denotes a fine hole having a fine diameter, for example, about several tens to 100 μm. Since the interlayer can be connected by such a small via, the wiring density of this layer can be increased. Therefore, by forming a fine wiring layer over the insulating layer, the degree of integration can be improved.

In the printed wiring board according to the present embodiment, the conductor bump groups 22, 22,.
Since the insulating layers 25 and 26 formed with 4, 24,... Are arranged on the outermost sides, both outer sides of the multilayer board 27a can be made smooth surfaces. Therefore, the wiring density of the wiring layers 21a and 23a on the insulating layers 25 and 26 can be improved, and the degree of integration can be improved.

Furthermore, since an insulating layer containing glass fiber as a reinforcing material can be used for these insulating layers 25 and 26, an insulating layer having excellent mechanical and thermal strength can be used as the outermost layer. It can be formed as As a result, a multilayer board 27a having excellent mechanical and thermal strength can be formed as the multilayer board 27a.

The present invention is not limited to the contents of the above embodiment.

For example, in the above embodiment, the insulating layer 12,
As a method of forming the vias 15 and 16 in the hole 13, a method of irradiating a laser beam and perforating the hole was used, but it is also possible to form the via by exposing and developing the photosensitive resin. That is, a photosensitive resin is used as a material of the insulating layers 12 and 23, and is cured by partially irradiating ultraviolet rays or the like, and the uncured portions are developed and removed to thereby remove the vias 15 and 16.
Can also be used.

In this embodiment, the insulating substrate used to penetrate the conductor bumps is made of a synthetic resin based on a reinforcing material such as glass cloth or mat, organic synthetic fiber cloth or mat, or paper. Sheet.
The thickness is preferably about 20 to 400 μm. here,
As the synthetic resin, for example, a polycarbonate resin, a polysulfone resin, a thermoplastic polyimide resin, a polytetrafluoroethylene hexafluoropropylene resin, a thermoplastic resin such as a polyetheretherketone resin, an epoxy resin, a bismaleimide triazine resin, a polyimide resin, Thermosetting resins such as phenolic resins, polyester resins, and melamine resins, and rubbers such as butadiene rubber, butyl rubber, natural rubber, neoprene rubber, and silicone rubber are exemplified.

When forming the substantially conical conductive bumps by using a conductive composition, for example, a substantially conical conductive bump group having a high aspect ratio is formed by a printing method using a relatively thick metal mask. Can be formed. The height of the group of substantially conical conductive bumps is generally 20 to 500 μm.
Degrees are possible.

In the present invention, as a means for forming a substantially conical conductive bump group with a conductive metal, for example, a gold or copper ball is pressed to a predetermined position on a supporting base surface such as a copper foil and then separated. Thereby, a conductor (element) group having a substantially conical shape with a sharp tip can be formed. Further, it is also possible to inject molten metal into a plate in which a concave portion corresponding to the shape of a substantially conical conductor is formed beforehand to form a substantially conical conductor bump group. As still another means, a photosensitive resist is applied thickly on the support film surface, and the support film is removed after forming a group of depressions having a trapezoidal concave portion with a sharp tip by exposing from the support film side. Then, a metal film may be formed on the support film-removed surface, and plated with copper, gold, silver, solder, or the like to form minute substantially conical conductive bumps at predetermined positions.

In the present invention, examples of the substrate supporting the group of substantially conical conductive bumps include a releasable film or a metal foil.
It may be a single sheet or a patterned sheet, and its shape is not particularly limited.

Further, in the present invention, as means for penetrating the substantially conical conductive bumps through the synthetic resin-based sheet, for example, a support base having a group of substantially conical conductive bumps formed thereon and a synthetic resin-based sheet may be rolled. While rewinding,
Heating to soften the resin component, for example, a metal with small dimensions and deformation, a hard heat-resistant resin, or a ceramic roller, and a roller that elastically deforms when pressed on the synthetic resin side, for example, By passing between the rubber rollers as described above, a substantially conical conductive bump penetrates, and a multilayer board having both ends exposed on the surface of the synthetic resin sheet can be continuously manufactured. .

(Second Embodiment) Next, a second embodiment of the present invention will be described. Note that, of the embodiments after this embodiment, the description of the same parts as the preceding embodiment will be omitted.

FIG. 18 is a flowchart showing the flow of the method for manufacturing a semiconductor package according to the present embodiment.
19 to 29 are vertical sectional views schematically showing each step of the method for manufacturing the semiconductor package.

To manufacture the semiconductor package according to the present embodiment, first, a metal plate 31 such as a copper foil is prepared, and a conductive composition such as a silver paste is coated on one surface of the metal plate 31. Using a printing technique, conductor bumps (group) 32, 32,... Having a substantially conical diameter as shown in FIG. 19 are formed (step 1a).

Next, as shown in FIG. 20, a prepreg 33 is placed on a heat-dissipating metal plate 34 made of, for example, aluminum, copper, iron, or the like, and the metal plate 31 is further placed thereon with conductive bumps (groups) 32. , 32,... Are placed face down in the figure (step 2a), and pressed under heating (step 3a) in this state, for example, by passing between roller presses, as shown in FIG. Conductor bumps (group) 32,
Are penetrated through the prepreg 33, and the front ends of the conductor bumps (groups) 32, 32,.
4 form an electrically and thermally connected laminate 40.

Next, the metal plate 31 on the upper surface of the stacked body 40 is patterned by, for example, etching (step 4a) to obtain the stacked body 40a having the wiring layer 31a as shown in FIG.

The prepreg 3 is further placed on the laminate 40a.
5 are laminated (Step 5a) and cured to form a laminate 40b on which the insulating layer 35 is laminated as shown in FIG.

At predetermined positions of the insulating layer 35 of the laminated body 40b, via holes 36, 36,... For interlayer connection are pierced by irradiating, for example, a laser beam (step 6).
a) A part of the wiring layer 31a as shown in FIG.
The laminated body 40c exposed at the bottoms of 6, 36,... Is formed.

A metal layer is formed on the inner walls of the vias 36, 36,... Thus formed and the upper surface of the insulating layer 35 by, for example, electroless plating (step 7a), and FIG.
Conductive vias 37, 3 for interlayer connection as shown in FIG.
A laminate 40d on which the wiring layers 38 are formed is obtained.

Next, a metal plate 41 such as a copper foil such as a copper foil is prepared separately from the laminate 40d, and a conductive composition such as a silver paste is coated on one surface of the metal plate 41. A substantially conical conductive bump (group) 42 as shown in FIG. 26 is formed by using a printing technique (step 8a).

Next, as shown in FIG.
A prepreg 39 is placed on the upper side in the figure, and the metal plate 41 is further placed on the prepreg 39 so that the conductive bumps (group) 42 are on the lower side in the figure (step 9a). Press under heating (step 10a).
As shown in the figure, the conductor bump (group) 42 is made to penetrate through the prepreg 39, and the tip side of the conductor bump (group) 42 is
By making contact with the conductive vias 37 and the wiring layers 38 formed on the upper surface side, electrical connection between the metal plate 41 and the conductive vias 37 and the wiring layers 38 formed on the upper surface side of the insulating layer 35 is established. To form a laminated body 40e that is electrically connected.

Next, the metal plate 41 on the upper surface of the laminate 40e is patterned by, for example, etching (step 11a) to obtain a laminate 40f on which the wiring layer 41a is formed as shown in FIG.

A semiconductor chip 43 such as an IC or an LSI is set in a space of the heat-dissipating metal plate 34 of the laminate 40f thus formed so that its wiring side faces upward (step 12a). The wiring layer 41 is connected to the wiring layer 41 by, for example, a gold wire 44 (step 13).
a), a semiconductor package 40g as shown in FIG. 30 is formed.

According to the semiconductor package of this embodiment, the wiring layer 41 connected to the semiconductor chip 43 is formed on the insulating layer 39 buried with the conductor bumps (group) 41 and reinforced with glass fiber. ing. Therefore, even if wire bonding is performed using a gold wire with the semiconductor chip 43, the insulating layer 39 itself has excellent mechanical and thermal strength. It is possible to sufficiently withstand thermal stress, and it is possible to obtain an effect that troubles such as destruction of interlayer connection and deterioration of reliability are prevented beforehand.

(Example) An example of manufacturing a printed wiring board according to this embodiment will be described below.

A hole having a diameter of 0.2 mm was drilled in a double-sided laminated board having a thickness of 0.5 mm and a copper foil thickness of 18 μm to form a through-hole plating layer having a plating thickness of about 20 μm.
A laminate having circuits formed on both sides by an etching method was obtained. Next, a resin sheet having a thickness of about 50 μm and a copper foil having a thickness of 12 μm were laminated, a hole having a diameter of 0.1 mm was made with a carbon dioxide laser, and conduction between layers was secured by plating. Then 18μ
A substantially conical conductive bump group having a bottom diameter of 0.2 mm is formed on a copper foil having a thickness of 0.2 m by a printing method, and a prepreg having a thickness of 60 μm is pressed into the conductive bump group to form a copper foil with bumps. The laminate was pressed with heating with the copper foil side facing outside and pressed under heating, and a circuit was formed on the outermost layer of the obtained laminate by an etching method to obtain a printed wiring board having six metal layers.

When the initial conductivity of this substrate was inspected,
It was confirmed that conduction was formed in all cases.

[0069]

According to the present invention, an insulating layer for drilling a via is provided inside. Therefore, the outermost layer has no irregularities due to vias, and defects in the etching or printing process of the outer layer processing caused by invasion of chemicals or air into the concave portions are prevented beforehand. In addition, defects during mounting of components on vias do not occur, which is advantageous in mounting components and designing.

Further, it is possible to reduce the thickness of the outermost metal layer, and it becomes easy to form a high-definition wiring layer.

Since the vias can be formed with a small diameter of the through-hole, a wiring layer with a high degree of integration can be formed on this insulating layer.

In the present invention, the insulating layer for press-fitting the conductor bump is provided outside. Since the conductive bumps can be pressed into an insulating layer containing a reinforcing material such as glass fiber, an insulating layer having high mechanical strength and high strength against heat can be formed by including glass fiber.

Therefore, by disposing the insulating layer having the above-described vias on the inside and disposing the insulating layer press-fitted with the conductive bumps on the outside, a high degree of integration and
A printed wiring board having high strength can be provided.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating a flow of a method for manufacturing a printed wiring board according to a first embodiment.

FIG. 2 is a vertical sectional view showing a manufacturing process of the printed wiring board according to the first embodiment.

FIG. 3 is a vertical sectional view showing a manufacturing process of the printed wiring board according to the first embodiment.

FIG. 4 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 5 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 6 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 7 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 8 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 9 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 10 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 11 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 12 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 13 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 14 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 15 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 16 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 17 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 18 is a flowchart illustrating a flow of a method of manufacturing a semiconductor package according to a second embodiment.

FIG. 19 is a vertical sectional view showing a manufacturing process of the semiconductor package according to the second embodiment.

FIG. 20 is a vertical sectional view illustrating a manufacturing process of the semiconductor package according to the second embodiment;

FIG. 21 is a vertical sectional view showing a manufacturing process of the semiconductor package according to the second embodiment.

FIG. 22 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment.

FIG. 23 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment.

FIG. 24 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment.

FIG. 25 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment;

FIG. 26 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment;

FIG. 27 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment.

FIG. 28 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment.

FIG. 29 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment;

FIG. 30 is a vertical sectional view showing the manufacturing process of the semiconductor package according to the second embodiment.

FIG. 31 is a vertical sectional view showing steps of a conventional method for manufacturing a printed wiring board.

[Explanation of symbols]

 Reference numeral 9: core material (base), 15: via, 16: via, 12: insulating layer (inside insulating layer), 13: insulating layer (inside insulating layer), 17: conductive via (first metal layer), 19 ... conductive via (second metal layer), 18 ... wiring layer (first inner wiring layer), 20 ... wiring layer (second inner wiring layer), 25 ... insulating layer (first outer insulating layer) 26, an insulating layer (second outer wiring layer); 21b, a wiring layer (first outer wiring layer); 23b, a wiring layer (second outer wiring layer); 22, a conductor bump (first conductor bump) ), 24... Conductor bumps (second conductor bumps).

Claims (10)

[Claims] An inner insulating layer formed on the base and provided with a via for exposing the base; an upper surface of the exposed base and the inner insulating layer formed on an inner wall of the via; A metal layer electrically connecting the inner insulating layer, an inner wiring layer formed on the upper surface of the inner insulating layer, an outer insulating layer formed on the inner insulating layer, and an outer formed on the outer insulating layer. A printed wiring board, comprising: a wiring layer; and a conductive bump group formed in the outer insulating layer so as to electrically connect the inner wiring layer and the outer wiring layer. 2. The printed wiring board according to claim 1, wherein said outer insulating layer is a layer containing glass fiber as a reinforcing material. 3. A step of laminating an inner insulating layer on a substrate, a step of forming a via in which the substrate is exposed by piercing the inner insulating layer, and forming a metal layer in the via and exposing the exposed layer. Electrically connecting the base and the upper surface of the inner insulating layer and forming an inner wiring layer on the inner insulating layer; placing an outer insulating layer on the inner insulating layer; Placing a conductive plate on which a substantially conical conductive bump group is formed on the insulating layer; and pressing the inner insulating layer and the conductive plate so that the conductive bump group penetrates the outer insulating layer. A method of electrically connecting the inner wiring layer and the conductor plate; and a step of patterning the conductor plate to form an outer wiring layer. 4. The method of manufacturing a printed wiring board according to claim 3, wherein the step of forming the via is a step of piercing by irradiating a laser beam. Method. 5. The method according to claim 3, wherein the inner insulating layer is a layer made of a photosensitive resin, and the step of forming the via includes exposing the inner insulating layer to light. And a step of forming a via by developing the inner insulating layer thereafter. 6. Three insulating layers, two wiring layers formed one by one between the insulating layers, and first core wiring layers formed on both outer sides of the three insulating layers, respectively. And a core material having a second core wiring layer, a through-hole plating layer for electrically connecting the wiring layer and the core wiring layer, and a first inner insulating layer laminated on the first core wiring layer A first via formed in the first inner insulating layer to expose the first core wiring layer; and a first via formed on an inner wall of the first via, and
A first metal layer for electrically connecting the core wiring layer to the upper surface side of the first inner insulating layer; a first inner wiring layer formed on the upper surface of the first inner insulating layer; A first outer insulating layer formed on the first inner insulating layer, a first outer wiring layer formed on the first outer insulating layer, and a first outer insulating layer. A first conductive bump group formed so as to electrically connect the first inner wiring layer and the first outer wiring layer; and a second conductive bump group stacked on the second core wiring layer. An inner insulating layer; a second via formed in the second inner insulating layer to expose the second core wiring layer; and a second via formed on an inner wall of the second via, and
A second metal layer for electrically connecting the core wiring layer and the upper surface side of the second inner insulating layer; a second inner wiring layer formed on the upper surface of the second inner insulating layer; A second outer insulating layer formed on the second inner insulating layer, a second outer wiring layer formed on the second outer insulating layer, and a second outer insulating layer. A second conductive bump group formed to electrically connect the second inner wiring layer and the second outer wiring layer. 7. Three insulating layers, two wiring layers formed between the insulating layers, and a first core wiring layer and a second wiring layer formed on both outer sides of the three insulating layers, respectively. Forming a core material having a core wiring layer and a through-hole plating layer for electrically connecting the wiring layer and the core wiring layer; and laminating a first inner insulating layer on the first core wiring layer Laminating a second inner insulating layer on the second core wiring layer, and forming a first via for exposing the first core wiring layer by piercing the first inner insulating layer. Forming a second via for exposing the second core wiring layer by piercing the second inner insulating layer; and forming a metal layer in the first via to form the exposed first via.
Electrically connecting the upper core wiring layer to the upper surface of the first inner insulating layer, forming a metal layer in the second via, and connecting the exposed second core wiring layer to the second inner insulating layer. Forming a first inner wiring layer on the first inner insulating layer and forming a second inner wiring layer on the second inner insulating layer; Placing a first outer insulating layer on the first inner insulating layer and placing a second outer insulating layer on the second inner insulating layer; A first conductor plate on which a substantially conical first conductor bump group is formed is placed on the outer insulating layer, and a substantially conical second conductor bump is placed on the second outer insulating layer. Placing the second conductor plate on which the group is formed, and pressing the first conductor plate and the second conductor plate,
The first conductor bump group is made to penetrate through the first outer insulating layer to electrically connect the first inner wiring layer and the first conductor plate, and the second conductor bump group is A step of penetrating through the second outer insulating layer to electrically connect the second inner wiring layer and the second conductor plate; and patterning the first conductor plate to form a first outer wiring Forming a layer and patterning the second conductor plate to form a second outer wiring layer. 8. A heat-dissipating metal plate, a first insulating layer disposed on the heat-dissipating substrate, a first wiring layer formed on the first insulating layer, A first conductive bump group formed in the insulating layer so as to electrically or thermally connect the heat dissipating metal plate and the first wiring layer; and disposing the first conductive bump group on the first insulating layer. A second insulating layer provided with a via for exposing the first wiring layer; and an exposed first wiring layer formed on an inner wall of the via and an upper surface side of the second insulating layer. A second wiring layer formed on an upper surface of the second insulating layer; a third insulating layer formed on the second insulating layer; A third wiring layer formed on the insulating layer, and a third wiring layer formed in the third insulating layer so as to electrically connect the second wiring layer and the third wiring layer. A semiconductor device comprising: a second group of conductive bumps formed; and a semiconductor chip disposed on the heat-dissipating metal plate and connected to the third wiring layer. 9. A heat dissipating metal plate, a first insulating layer disposed on the heat dissipating substrate, a first wiring layer formed on the first insulating layer, A first conductive bump group formed in the insulating layer so as to electrically or thermally connect the heat dissipating metal plate and the first wiring layer; and disposing the first conductive bump group on the first insulating layer. A second insulating layer provided with a via for exposing the first wiring layer; and an exposed first wiring layer formed on an inner wall of the via and an upper surface side of the second insulating layer. A second wiring layer formed on an upper surface of the second insulating layer; a third insulating layer formed on the second insulating layer; A third wiring layer formed on the insulating layer, and a third wiring layer formed in the third insulating layer so as to electrically connect the second wiring layer and the third wiring layer. And a second conductive bump group formed. 10. A step of forming a substantially conical first conductive bump group on a conductive plate; a step of placing a first insulating layer on a heat-dissipating metal plate; Placing the conductor plate with the surface on which the conductor bump group is formed facing; and pressing the heat dissipating metal plate and the conductor plate to the first position.
A step of electrically or thermally connecting the conductive plate and the heat-dissipating metal plate to the first insulating layer, and patterning the conductive plate to form a first wiring layer. Forming; laminating a second insulating layer on the first insulating layer; and forming a via hole on the second insulating layer to expose the first wiring layer. Forming a metal layer in the via to electrically connect the exposed first wiring layer to an upper surface of the second insulating layer, and form a second wiring layer on the second insulating layer; Forming a third insulating layer on the second insulating layer; and forming a substantially conical second conductive bump group on the third insulating layer. Placing a second conductor plate with the surface on which the conductor bump group is formed facing; and disposing the heat-dissipating metal plate and the second Pressing a conductive plate so that the second conductive bump group penetrates through the third insulating layer;
A step of electrically connecting the second wiring layer and the second conductor plate; and a step of patterning the second conductor plate to form a third wiring layer. Production method.