JP2001164200A - Jig for pasting heat sensitive adhesive resin film and method for pasting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jig enabling to easily paste a heat sensitive adhesive resin film to an adherend having a complicated shape. SOLUTION: The jig for pasting an adhesive resin film comprises a supporting mechanism for supporting an adherend from the side surface or the back surface thereof and a heating mechanism having a pressing surface for pressing the heat sensitive adhesive resin film onto the surface to be coated of the adherend, the heating mechanism comprising a heating element and, formed thereon, a heat-resistant rubbery sheet, or a heat-resistant spongy sheet whose surface being optionally covered with a heat-resistant resin film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sticking jig used for sticking a heat-adhesive resin film to an automobile part, for example, an object having a complicated shape such as a door frame, for the purpose of decoration or the like, and a sticking jig for the same. The present invention relates to an attaching method using the method.

[0002]

2. Description of the Related Art Conventionally, in order to attach a resin film having an adhesive layer previously cut into a desired shape to an object for the purpose of decoration or the like, it is necessary to use a squeegee or the like at room temperature to apply the surface of the adherend. By pressing the pressure-sensitive adhesive layer of the resin film with a force of about 0.1 to 0.5 MPa.

However, since the pressure-sensitive adhesive layer applied to the resin film has a property of sticking to the surface of an object to be adhered when pressed, the film is manufactured in a long roll form and stored. In order to obtain a product cut into a desired shape or a product cut into a desired shape, it is necessary to laminate a release film treated with a polyethylene film or a silicone resin as a temporary protective film on the surface of the pressure-sensitive adhesive layer. This temporary protective film must be discarded when applying the resin film, which is not preferable from the viewpoint of economic and environmental protection. Also, if a silicone resin is used for the temporary protective film, if paint is applied in the vicinity, paint phenomena such as cissing will occur. There are problems such as strict management.

Further, the viscosity of the pressure-sensitive adhesive layer is remarkably reduced by heating, and the adhesive force is rapidly decreased. Therefore, the adhesive force is insufficient in applications exposed to a temperature environment of several tens of degrees or more.
Even when a small force is applied, problems such as displacement of the adhesive film and wrinkling of the surface often occur. In order to solve these problems, it is also conceivable to use an adhesive that is crosslinked and hardened by enclosing a curing agent instead of an adhesive in a capsule that is broken by pressure and breaking it by pressure to make it active when used. When a film coated with such an adhesive is wound into a roll and stored, the capsule is destroyed by the winding pressure of the roll and a curing reaction occurs. Problems arise, such as the inability to attach, or the adhesive strength is significantly reduced.

To solve the above problem, an adhesive having a high thermal softening temperature may be used. However, when a resin having a high thermal softening temperature is used for the adhesive, it is necessary to press the film with a high pressure on an article. Since it cannot be stuck and its adhesive strength is not enough, it cannot be stuck with a normal squeegee technique or the like.

[0006]

The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, provided a hot-melt type adhesive layer on the back surface of the resin film, which was used for the purpose of the present invention. Using a jig having a heating body that can be heated to a temperature equal to or higher than the softening temperature of the hot-melt adhesive on the body, 0.1 to 0.1 as in the case of a normal adhesive resin film
They found that the problem could be solved by pressing with a pressure of about 0.5 MPa, and completed the present invention.

Thus, according to the present invention, there is provided: "1. A heat-adhesive resin film sticking jig for sticking a heat-adhesive resin film previously cut into a desired shape to an adherend surface of an adherend; And a heating mechanism having a support mechanism for providing the adherend from the side surface or the back surface of the adherend, and a pressing surface capable of pressing a thermo-adhesive resin film having an adhesive layer against the adherend surface of the adherend. And the heating mechanism is characterized in that a heat-resistant rubber-like sheet or a heat-resistant sponge-like sheet whose surface may be covered with a heat-resistant resin film is provided on a heating element. Jig for attaching a heat-adhesive resin film.

[0008] 2. 2. The bonding jig according to claim 1, wherein the heating element is formed by embedding a heating substance in a metal plate, a heat-resistant rubber-like sheet, or a heat-resistant sponge-like sheet. 3. A thermo-adhesive resin characterized in that a thermo-adhesive resin film having an adhesive layer previously cut into a desired shape is attached to an adherend by using the attaching jig according to item 1 or 2 and pressed. How to stick the film. 4. 3. The bonding method according to item 3, wherein the heat-adhesive resin film is bonded to an adherend and then heated. Is provided.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION As the heat-adhesive resin film used in the present invention, for example, a transparent film such as a PVC, polyolefin, polystyrene, polycarbonate, polyester, acrylic resin-based film used for an ordinary adhesive resin film is used. And those obtained by kneading pigments or the like, or those having their surfaces further colored or patterned by means such as painting or printing can be used arbitrarily.

As the hot-melt adhesive, those having a softening point of 40 ° C. or more, preferably 50 ° C. to 150 ° C., more preferably 50 ° C. to 120 ° C. can be used. The hot melt adhesive may be appropriately selected in consideration of the adhesiveness between the resin film substrate to be mounted and the adherend to be bonded.
The hot-melt type adhesive is not particularly limited except for the above-mentioned conditions, but is mainly composed of, for example, ethylene-vinyl acetate resin, acrylic resin, polyester resin, polyamide resin, epoxy resin, urethane resin and the like. Can be used.

When the use environment temperature exceeds the softening temperature of the hot-melt adhesive, it is desirable to use a hot-melt adhesive which can be crosslinked and cured by heating. The heat-curable type is not particularly limited as long as it is stable in a film state at room temperature for a long period of time, and a system that can be used for a general thermosetting paint or the like can be used. For example, a combination of a polymer containing a hydroxyl group or a carboxyl group with an amino resin, an epoxy compound or a blocked isocyanate, a combination of a polyamide resin or an epoxy resin with a blocked curing agent, and the like can be given. It is also preferable to combine these with a heat-activated catalyst or curing agent. The cross-linking and curing reaction does not need to be completed at the time of application, and may be left for a certain period of time after application to complete the cross-linking reaction, or may be completed by heating after application.

[0012] The bonding jig is preferably a heating member capable of obtaining a surface temperature higher than the thermal softening temperature of the hot melt adhesive, preferably 20 to 10 from the thermal softening temperature of the hot melt adhesive.
It is necessary to have a heating surface that is about 0 ° C. higher. When the temperature of the heated surface is lower than this temperature, the viscosity of the hot-melt adhesive does not decrease sufficiently at the time of application, making application difficult. On the other hand,
If the surface temperature of the heating element becomes too high, the film layer on the surface may be fused to the heating surface of the jig during the pasting, which is not preferable.

In the jig of the present invention, the heating mechanism is movable against the target adherend and is pressed against the adherend at a constant pressure. Crimping can be performed with a constant pressure. The resin film may be adhered by moving the jig along the surface of the adherend, or by heating the jig using a jig whose heating surface is shaped according to the shape of the adherend. The surface may be pressed against the entire adherend. Moving the heating mechanism and pressing it against the adherend with a constant pressure can be easily performed by a known method, for example, by attaching an air syringe, a spring, or the like to the back surface of the heating element.

In the heating mechanism, a heat-resistant rubber-like sheet or a heat-resistant sponge-like sheet is provided on the heating element so that the resin film can be uniformly pressed on the adherend. The heat-resistant rubber-like sheet or sponge-like sheet is preferably covered with a heat-resistant flexible film. Heating elements include those with a heat source embedded in a metal plate, those with a heat source embedded in heat-resistant rubber or a heat-resistant sponge-like sheet, and those in which metal powder or carbon powder is dispersed in heat-resistant rubber, etc. A heating element can be used. The shape of the heating mechanism does not need to be a flat surface, but may be any shape as long as it substantially conforms to the surface shape of the adherend. There is no particular limitation on the material forming the housing of the jig that attaches the heating mechanism and the movable mechanism of the heating mechanism and the support mechanism of the adherend to a predetermined position, and acts as a grip of the jig at the time of sticking work. If the temperature of the housing becomes too high, it will be difficult to grasp and work on the housing,
At least the surface is preferably covered with a material having low thermal conductivity such as a foamable resin.

Hereinafter, the present invention will be described with reference to FIG. The hot-melt adhesive layer of the heat-adhesive resin film 12 previously cut into a desired shape is applied to the heat-sensitive adhesive film 12 so as to face a heating mechanism A7 composed of the heating element 4, the heat-resistant sponge 5, and the heat-resistant film 6. Is inserted between the jig housing 1 and the resin film guide 9, and the heating element 4 is adjusted in advance so that the heat-resistant film 6 of the heating mechanism 7 has a predetermined temperature (an adjusting device is not shown). 7 is moved by the movable rod 2 connected to the air syringe 3, and the adhesive resin film 12 is pressed against the surface of the adherend 11 with a constant pressure (a pressure adjusting device is not shown). The heat-adhesive resin film 1 is moved along the surface of the body 11
2 is pressed against the surface of the adherend 11 by heating and then the air of the air syringe 3 is released, the movable rod 2 is moved backward, and the jig is removed from the adherend 11, whereby the adhesive resin film 12 is attached. 11 is attached to the surface.

The spring 8 is provided to keep a space for inserting the adhesive resin film 12 between the jig housing 1 and the resin film guide 9 and to facilitate the mounting of the adhesive resin film 12.

[0017]

According to the jig of the present invention, a pressure-sensitive adhesive resin film having a hot-melt type adhesive layer can be applied to an adherend having a complicated shape without losing adhesiveness and without causing displacement or wrinkles. Pasting can be performed easily.

[Brief description of the drawings]

FIG. 1 is a sectional view of an adhesive resin film sticking jig according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Jig housing 2 Movable rod 3 Air syringe 4 Heating element 5 Heat resistant sponge 6 Heat resistant film 7 Heating mechanism A 8 Spring 9 Adhesive resin film guide 10 Adherend support 11 Adherend 12 Adhesive resin film

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Nariki Muroseki 3-13-7 Nishitenma, Kita-ku, Osaka F-Term in Fugaku Shokai Co., Ltd. 4J040 DA051 DE031 DF041 EC001 ED001 EF001 EG001 JA09 JB01 JB09 LA08 NA16 PB05 PB08 PB09 PB21

Claims (4)

[Claims] 1. A jig for attaching a thermo-adhesive resin film, which has been cut into a desired shape in advance, to an adherend surface of an adherend, comprising: a side surface of the adherend. Or a support mechanism for providing an adherend from the back surface, and a heating mechanism having a pressing surface capable of pressing a thermo-adhesive resin film having an adhesive layer against the adherend surface of the adherend, the heating mechanism is Characterized in that a heat-resistant rubber-like sheet or a heat-resistant sponge-like sheet whose surface may be covered with a heat-resistant resin film is provided on a heating element, and a heat-adhesive resin film sticking jig is provided. Utensils. 2. The bonding jig according to claim 1, wherein the heating element is formed by embedding a heat source in a metal plate, a heat-resistant rubber-like sheet, or a heat-resistant sponge-like sheet. 3. A heat-adhesive resin film having an adhesive layer previously cut into a desired shape is attached to an adherend by pressing it using the attaching jig according to claim 1 or 2. A method for attaching a heat-adhesive resin film. 4. The bonding method according to claim 3, wherein the heating is performed after the heat-adhesive resin film is bonded to the adherend.