JP2001157968A - Method of manufacturing super-abrasive grain electrodeposition tool, and super-abrasive grain electrodeposition tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten time required for formation of an abrasive grain layer, and facilitate adjustment of concentration degree of abrasive grains in manufacturing an electrodeposition tool for forming a multilayer structure of abrasive grain layers. SOLUTION: An upper part of a deposited abrasive grain layer deposited on a substrate 11 immersed in nickel plating liquid M in which diamond abrasive grains are dispersed is evened by moving an evening plate 12 relatively to the substrate 11 for forming a multilayer structure of abrasive grain layers, so time required for forming the abrasive grain layers can be shortened. By adjusting relative movement speed between the substrate 11 and the evening plate 12, concentration degree of abrasive grains in the abrasive grain layers can be adjusted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a diamond abrasive,
The present invention relates to an electrodeposition tool using superabrasive grains such as CBN abrasive grains, and more particularly to an electrodeposition tool having a multi-layered abrasive layer.

[0002]

2. Description of the Related Art For grinding and polishing of various materials such as cemented carbides, ceramics, glass, semiconductor materials, cast iron and various steels,
A superabrasive electrodeposition tool having an abrasive layer formed on a substrate surface by an electrodeposition method is used. This electrodeposited tool can be used to form a base material such as a total shape, a cup shape,
The abrasive layer is formed by immersing in a plating solution in which superabrasive grains such as BN abrasive grains are dispersed, and electrodepositing the superabrasive grains on a substrate.

[0003] Such a superabrasive electrodeposition tool is generally a tool in which superabrasive grains are fixed in a single layer, but a multilayer structure having a multi-layer structure is also manufactured and used depending on a special application and shape. The single-layer structure has excellent abrasive grain holding power, but the thickness of the abrasive grain layer itself that can be ground or polished is small, and when 20 to 30% of the abrasive grains are worn, the grinding resistance increases and falls off. However, there is a disadvantage that the product life is shortened. On the other hand, the multilayer structure has an advantage that when the upper abrasive layer is worn by use, a lower abrasive layer appears, and the use area of the abrasive grains increases, thereby extending the product life.

Conventionally, superabrasive electrodeposition tools having a multilayer structure have been roughly classified into the following two methods. The first method is
In the case of using abrasive grains with relatively large grain size, the abrasive grains are dispersed and arranged on the abrasive grain layer forming surface of the base material, the plating layer is deposited, the abrasive grains are fixed, and the first abrasive grain layer is formed. After that, the second layer of abrasive grains is dispersed and arranged so as to be located between the abrasive grains in the first layer of abrasive grains, the plating layer is deposited, the abrasive grains are fixed, and the second abrasive layer is formed. And forming a multi-layered abrasive layer in the same manner. The electrodeposition tool manufactured by such a method is used for applications such as a cutting wheel that applies a high load to abrasive grains, a band saw cutting operation, and heavy grinding such as deburring.

[0005] The second method is a method in which fine abrasive grains are used. The abrasive grains are stirred and dispersed in a plating solution, and the abrasive grains are settled on the base material. This is a method of forming a multilayered abrasive layer by fixing abrasive grains to the surface. The electrodeposition tool manufactured by such a method is used for applications such as precision cutting of IC chips, precision grinding and precision cutting of minute electronic components and optical components. The present invention is directed to such an abrasive layer forming technique.

[0006]

When a base material is immersed in a plating solution in which abrasive grains are dispersed and the abrasive grains are deposited on the base material to form a multi-layered abrasive layer, a low current density condition is required. It is necessary to continuously perform plating for a long time to deposit a thick plating layer, and at the same time, it is necessary to sufficiently supply a plating solution and plating metal ions through a deposited layer of abrasive grains. Here, in order to increase the plating speed, it is necessary to increase the current supply, that is, the supply of plating metal ions by increasing the current density in principle. However, if the current density is too high, the deposited abrasive grains impede the supply of the plating solution, and exchange of plating metal ions and electrons is not performed, and a state in which an oxide film is formed on the cathode surface, so-called burning, continues, Plating cannot be performed. For this reason, there is a limit to the increase in current density.

The limit of the current density is determined by the grain size of the abrasive grains, their distribution and the shape of the abrasive grains. The thicker the grain layer to be deposited and the higher the filling density, the lower the limiting current density. . In order to form a multilayered abrasive layer, it is necessary to increase the thickness of the deposited abrasive layer.Therefore, there is a limit in increasing the plating rate in the conventional electrodeposition method, and the total amount required for forming the abrasive layer is It is difficult to reduce the time.

Conventionally, in order to form a multi-layered abrasive layer under such conditions, the plating solution and the abrasive particles have been agitated and the dispersion floating and sedimentation of the abrasive particles have been repeated many times. However, in such a method, it takes a long time to suspend and disperse and settle by stirring, and it is difficult to set appropriate current conditions according to the state of dispersion and sedimentation.

FIG. 5 is a diagram showing an example of the relationship between the current density and the total time required for forming the abrasive layer. This measurement data is a measurement result in the case where synthetic diamond # 3000 is used as abrasive grains, dispersed in a bright nickel plating solution, and electrodeposited while repeating stirring and precipitation. As can be seen from the figure, when the current density is low, the plating time is long, and when the current density is high, the precipitation time is long. Under these conditions, the total time required for forming the abrasive layer is about 1 A At / dm ² , the shortest time is about 30 hours, and no further time reduction can be expected.

The degree of concentration of the abrasive grains in the abrasive layer is an important factor affecting the grinding performance of the electrodeposition tool. The degree of concentration is determined by the number of abrasive grains deposited on the substrate in the plating solution. In the conventional electrodeposition method, there is no means for adjusting the number of deposited abrasive grains, so that it was not possible to adjust the degree of concentration to an optimum concentration according to the required grinding performance of the electrodeposition tool.

An object of the present invention is to reduce the time required for forming an abrasive layer and easily adjust the degree of concentration of abrasive grains in the production of an electrodeposited tool for forming an abrasive layer having a multilayer structure. Is to do.

[0012]

According to the present invention, there is provided a method of manufacturing a super-abrasive electrodeposited tool, comprising the steps of: Electrodeposition is performed while leveling the upper part of the superabrasive particles deposited on the substrate immersed in a plating solution in which the superabrasive particles are dispersed.

[0013] This is not a conventional method in which the abrasive grains dispersed in the plating solution are agitated and deposited on the substrate sequentially, but a part of the abrasive grains on the abrasive grain deposited layer is leveled (scraped). ) Makes it possible to omit the time required for floating and sedimentation of the abrasive grains in the conventional method, and to efficiently supply the plating metal ions to the lower portion of the abrasive grain deposition layer, thereby forming the abrasive grain layer. Can be shortened.

It is desirable to use a leveling plate to level the upper part of the deposited superabrasive grains. As the leveling plate, for example, a rubber plate material is used, and the leveling plate is moved relative to the base material to level a part of the abrasive grains above the deposited abrasive layer (scraping). Take). By using a rubber leveling plate, the force applied to the deposited abrasive layer becomes gentle, and no large force is applied to the already adhered abrasive grains, and unnecessary accumulated abrasive grains are applied. Can be eliminated. In addition, it is possible to continuously cope with the electrodeposition surface height that is gradually increased.

As the relative movement between the leveling plate and the substrate, the method of rotating the leveling plate with respect to the substrate is the most reliable and easy method. The rotation of the leveling plate may be continuous or intermittent. Here, by adjusting the relative moving speed (rotational speed of the leveling plate) between the leveling plate and the base material, the degree of concentration of the abrasive grains in the abrasive layer can be adjusted. When the rotating speed of the leveling plate is increased, the insufficiently adhered abrasive grains among the abrasive grains that are being fixed are removed from the surface together with the flow of the deposited abrasive layer, so that the plating in an originally stationary state An abrasive layer having a low degree of concentration relative to the degree of concentration of the abrasive obtained under the conditions can be obtained. By adjusting the rotation speed, the degree of concentration of the abrasive grains in the fixed abrasive layer can be adjusted.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be specifically described based on experimental examples. FIG. 1 is a schematic configuration diagram of an apparatus used in the experiment. In FIG. 1, 10 is a plating tank, 11 is a base material,
Reference numeral 12 denotes a leveling plate, and D denotes a group of diamond abrasive grains composed of a fixed abrasive layer D1 and a deposited abrasive layer D2, which will be described later. Plating tank 1
0 is filled with a nickel plating solution M, and a substrate 11 as an electrodeposition tool is disposed in a cylindrical container 13. Leveling board 1
Reference numeral 2 denotes a rubber plate member, which is rotationally driven by a driving device (not shown).

FIG. 2 is an explanatory view of the leveling operation of the deposited abrasive layer D2 on the base material 11. In the figure, two fixed abrasive grain layers D1 already fixed are formed on a base material 11,
The deposited abrasive layer D2 exists on the fixed abrasive layer D1.
In the deposited abrasive layer D2, abrasive grains dispersed in the plating solution M precipitate and abrasive grains corresponding to several layers are deposited. In this experimental apparatus, as shown in FIG. 2, the lower end of the leveling plate 12 is positioned in the middle of the deposited abrasive layer D2, and the leveling plate 12 is rotated to remove the abrasive particles on the upper side of the deposited abrasive layer D2. Is moved and eliminated.

FIG. 3 shows a leveling plate 1 using the experimental apparatus of FIG.
Current density and plating continuation when the rotation speed of 2 is changed
It is a graph which shows the result of having investigated the relation with possible time.
The horizontal axis in the figure is the current density (A / dm²), Vertical axis is plating joint
The continuation time (hr) is shown.
3 min^-1, □ mark is 5min^-1, ● mark is 7 min
^-1Indicates that no leveling plate was used (conventional
2) is a plot of each method.

As can be seen from FIG. 3, when the leveling plate 12 is used to remove the abrasive grains on the upper side of the deposited abrasive layer, the limit current density is greatly increased as compared with the conventional method, and As the rotational speed of the plate 12 increases, the limit current density further increases. That is, in the conventional method, the current density is 0.5 A / dm ²
When the leveling plate 12 is rotated at a rotation speed of 7 min ^-1 , plating can be continued for only 8 hours at the time of the above, and plating can be performed for 8 hours or more even at a high current density of 5.5 A / dm ^2. It can be seen that plating can be performed at a speed 10 times or more as compared with the conventional method.

FIG. 4 is a graph showing the relationship between the rotation speed of the leveling plate 12 and the degree of concentration of the abrasive grains of the formed multilayer abrasive layer.
As can be seen from FIG. 4, the abrasive concentration decreases as the rotation speed of the leveling plate 12 increases. In the conventional method (rotation speed 0), the degree of concentration is 220, while the rotation speed is 20 mi.
At the time of n- ^1, the degree of concentration is 30, and the degree of concentration is greatly reduced. However, in the case of # 3000 diamond abrasive grains used in this experiment, the rotation speed of the leveling plate 12 was 20
Min ^-1 is the upper limit, and when the rotation speed is higher than this, the floating and flow of the abrasive grains become too intense, and the dispersion of the abrasive grains in the fixed abrasive layer tends to be uneven and unstable.

As can be seen from the above experimental results, the abrasive layer is formed by performing electrodeposition while leveling the upper part of the superabrasive particles deposited on the substrate immersed in the plating solution in which the superabrasive particles are dispersed. Can be reduced, and the degree of concentration of abrasive grains in the fixed abrasive layer can be adjusted.

[0022]

According to the present invention, the following effects can be obtained.

(1) Electrodeposition is performed while leveling the upper part of the superabrasive particles deposited on the substrate immersed in a plating solution in which the superabrasive particles are dispersed, so that the floating and sedimentation of the abrasive particles in the conventional method can be reduced. The required time can be omitted, the plating metal ions can be efficiently supplied continuously to the lower part of the abrasive grain deposition layer, and the time required for forming the abrasive grain layer can be reduced.

(2) By using, for example, a rubber plate material as the leveling plate, the force applied to the deposited abrasive grain layer becomes gentle, and a large force is applied to the already fixed abrasive grains. Unnecessary elimination of the deposited abrasive grains can be performed without the need. In addition, it is possible to continuously cope with the electrodeposition surface height that is gradually increased.

(3) The degree of concentration of the abrasive grains in the abrasive layer can be adjusted by adjusting the relative moving speed of the leveling plate and the base material.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an apparatus used for an experiment.

FIG. 2 is an explanatory view of an operation for leveling a deposited abrasive layer on a substrate.

FIG. 3 is a graph showing experimental results.

FIG. 4 is a graph showing experimental results.

FIG. 5 is a diagram showing an example of a relationship between a current density and a total time required for forming an abrasive layer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Plating tank 11 Base material 12 Leveling plate 13 Cylindrical container D Diamond abrasive grain group D1 Fixed abrasive layer D2 Deposited abrasive layer M Nickel plating liquid

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Keizo Takeuchi 1 at Nominake Daiya Co., Ltd. Nagoya Plant, No. 16 at Jinomori-cho, Tsushima-shi, Aichi F-term (reference) 3C063 AA10 BA37 BB02 BB23 CC13 EE10 EE31 FF08

Claims (4)

[Claims] 1. A method for manufacturing an electrodeposition tool in which superabrasive grains are electrodeposited in multiple layers on a substrate to form an abrasive layer, wherein the superabrasive grains are deposited on a substrate immersed in a plating solution in which the superabrasive grains are dispersed. A method for manufacturing a superabrasive electrodeposited tool, comprising performing electrodeposition while leveling the upper part of the superabrasive. 2. A smoothing operation, wherein a smoothing plate is used to smooth the surface layer of the superabrasive grains, and the smoothing operation is performed while moving the smoothing plate relative to a base material. 2. The method for producing a superabrasive electrodeposited tool according to 1. 3. The superabrasive electrodeposition tool according to claim 2, wherein the degree of concentration of the abrasive grains in the abrasive layer is adjusted by adjusting the relative moving speed of the base material and the leveling plate. Method. 4. An electrodeposition tool in which superabrasive grains are electrodeposited in multiple layers on a substrate to form an abrasive layer, wherein the superabrasive particles are deposited on a substrate immersed in a plating solution in which the superabrasive grains are dispersed. A superabrasive electrodeposition tool in which a multi-layered abrasive layer is formed by performing electrodeposition while leveling the top of the abrasive grains.