JP2001157664A - Image pickup element for electronic endoscope and electronic endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup element for an electronic endscope and an endscope which are manufactured easily and have a high manufacturing yield. SOLUTION: A CCD image sensor 5 has a CCD chip 51 and a microlens array 53. A plurality of bump members 55 are provided on the image pickup surface of the CCD chip 51, and leads 56 are electrically connected to these bumps respectively. Also, a cover glass 50 is bonded with the image pickup surface 52 side of the CCD chip 51 by an adhesive. Also, a frame-shaped wall part 54 which is square in plan view is provided on the image pickup surface 52 side of the CCD chip 51. The wall part 54 is arranged in the position corresponding to a light shielding region 522, and the wall part 54 prevents the adhesive 57 from entering an effective image pickup region 523 when the cover glass 50 is bonded. Furthermore, a coated layer 58 is formed on the rear surface side and the side surface side of the CCD image sensor 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device for an electronic endoscope and an electronic endoscope.

[0002]

2. Description of the Related Art Conventionally, for example, in the medical field, an electronic endoscope apparatus has been used for examination and diagnosis of a digestive tract and the like.

This electronic endoscope apparatus is detachably mounted (connected) to an endoscope light source apparatus, and has a CCD image sensor (imaging element) and an imaging optical system at its distal end. And an electronic endoscope provided with.

The CCD image sensor for the electronic endoscope includes a CCD chip (a chip of an image pickup device) and the CCD chip.
It has a microlens array provided on the imaging surface (light receiving surface) side of the chip, and a cover glass.

[0005] In this CCD image sensor, a bump material (spacer) is interposed between a CCD chip and a cover glass, and the CCD chip and the cover glass are separated from each other by a predetermined distance, and both are adhered to each other with an adhesive. Manufactured in.

However, in the CCD image sensor, in the bonding step, the adhesive may enter the effective image pickup area of the CCD chip and may not be able to use the effective pixels. That is, the yield of the conventional CCD image sensor is low.

In the case of a CCD image sensor for an electronic endoscope, the size of the CCD chip is very small, so that the work of bonding the CCD chip and the cover glass needs to be performed particularly carefully. It takes much time to manufacture (poor productivity).

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to provide an imaging device and an electronic endoscope for an electronic endoscope which are easy to manufacture and have a high yield.

[0009]

This and other objects are achieved by the present invention which is defined below as (1) to (9).

(1) An imaging device for an electronic endoscope having a microlens array on an imaging surface side, wherein a wall surrounding the effective imaging region is provided outside the effective imaging region on the imaging surface. Characteristic imaging element for electronic endoscope. Thus, when the cover member is bonded to the chip of the imaging element, it is possible to prevent the adhesive from entering the effective imaging area of the chip.

(2) For an electronic endoscope having a chip of an image pickup element, a microlens array provided on the image pickup side of the chip, and a cover member joined to the image pickup side of the chip by an adhesive. An electronic device, wherein a wall portion is provided outside the effective imaging region of the imaging surface, surrounding the effective imaging region, and preventing the adhesive from entering the effective imaging region. Imaging device for endoscope. Thereby, when bonding the cover member to the chip of the image sensor,
It is possible to prevent the adhesive from entering the effective imaging area of the chip.

(3) The imaging device for an electronic endoscope according to (1) or (2), wherein the wall is formed in a step of forming the microlens array. Thereby, the number of manufacturing steps of the image sensor can be reduced, the productivity is improved, and this is advantageous in mass production.

(4) The imaging device for an electronic endoscope according to the above (2), wherein the wall portion is joined to the chip or the cover member after the wall portion is formed. Thereby, a wall part can be provided easily and reliably.

(5) The above-mentioned (2), wherein a hollow portion is formed between the cover member and the microlens array.
Or the image sensor for an electronic endoscope according to (4). This makes it possible to relatively increase the difference in refractive index with the surface of the microlens array on the cover member side as a boundary (interface), and to reduce the amount of light irradiated (collected) to each pixel of the image sensor. Can be increased.

(6) The image pickup device for an electronic endoscope according to any one of (1) to (5), wherein the wall and the microlens array are formed of substantially the same constituent material. . Thereby, a wall part can be provided easily and reliably.

(7) The imaging device for an electronic endoscope according to any one of the above (1) to (6), wherein the shape of the wall portion in a plan view is substantially rectangular. Since the effective imaging region is usually substantially rectangular, the shapes of the effective imaging region and the wall substantially match (become similar to each other), whereby the size of the imaging device can be reduced.

(8) At least a part of the wall portion is located at a position corresponding to a light shielding region for detecting an optically black reference level in the imaging region. The imaging device for an electronic endoscope according to any one of (7). As a result, the size of the imaging device can be reduced.

(9) An electronic endoscope comprising the image pickup device for an electronic endoscope according to any one of the above (1) to (8) at a distal end portion. Thereby, the above (1) to
The same effect as (8) can be obtained.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an image pickup device for an electronic endoscope and an electronic endoscope according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

FIG. 1 is a block diagram showing an embodiment of an electronic endoscope according to the present invention and a configuration example of an endoscope light source device to which the electronic endoscope is attached (connected), and FIG. 3 is a block diagram showing a configuration example of a signal processing circuit of the electronic endoscope shown in FIG. 3, and FIG. 3 is a block diagram showing a configuration example of a signal processing circuit of the light source device for an endoscope shown in FIG.

As shown in FIG. 1, an electronic endoscope device (endoscope device) 300 is detachably mounted (connected) to the endoscope light source device 8 and to the endoscope light source device 8. And an electronic endoscope 1.

The electronic endoscope 1 includes a flexible (flexible) long endoscope main body 2.

The endoscope body 2 has an operation section 23 provided at a base end thereof and a plurality of function channels. That is, the endoscope body 2 includes a forceps channel, a water supply channel, and an air supply channel (all not shown) through which treatment tools such as forceps and a laser treatment tool are inserted, respectively, in the longitudinal direction of the endoscope body 2. And a pair of light guide optical fiber bundles (LC
B: light cable bundle) 44, 45 are installed along the longitudinal direction.

An imaging optical system including an objective lens 33, a plurality of lenses (not shown), and an optical low-pass filter (not shown) is provided on the distal end portion 21 of the endoscope main body 2.
The CD image sensor (imaging element) 5 is on the front end side (FIG. 1).
They are installed in this order from the center right side) to the base end side (left side in FIG. 1). The optical low-pass filter is provided on a cover glass 50 to be described later of the CCD image sensor 5,
The cover glass 50 is installed at the center. The CCD image sensor 5 will be described later in detail.

Further, a pair of light distribution lenses (illumination system lenses) 31 and 32 are provided at the end of the endoscope main body 2. The light distribution lenses 31 and 32 are installed on the distal ends of the light guide optical fiber bundles 44 and 45, respectively.

As shown in FIG. 1, one end of a cord-like connecting tube 25 is connected to the base end of the endoscope main body 2.

At the other end of the connecting tube 25, a connecting portion 26 having a connector 27 is provided. With this connector 27, the electronic endoscope 1 and the endoscope light source device 8 are detachably and electrically and optically connected.

The connection section 26 has a built-in signal processing circuit 7 electrically connected to the connector 27. The CCD image sensor 5 is connected to leads 56 and signal lines 47 and 48 to be described later. And is electrically connected to the signal processing circuit 7.

The tips of the light guide optical fiber bundles 44 and 45 are connected to the light distribution lenses 31 and 3 respectively.
2 and the proximal end is located at the distal end of the connector 27.

As shown in FIG. 2, the signal processing circuit 7 of the electronic endoscope 1 includes a sample hold / color separation circuit 71 and a CCD process circuit (clamp means) 72.
, A television timing generator 73, a CCD timing generator 74, and a buffer 75.

As shown in FIG. 1, a light source device 8 for an endoscope is provided.
Is a lamp power supply 81, a light source lamp (light source) 82,
A condenser lens 83, a diaphragm device 84, a system control circuit (control means) 85, a dimming circuit 86,
It is composed of a signal processing circuit 9 and a casing (not shown) for accommodating them.

As shown in FIG. 3, the signal processing circuit 9 of the endoscope light source device 8 includes a matrix circuit 91, a gamma correction circuit 92, an aperture correction circuit 93, an A / D converter 94, a timing Generator 95 and memory 96
, A D / A converter 97, a buffer 98, and a matrix encoder / buffer circuit 99.

A television monitor (display means) 400 for displaying an image of an observation site is detachably connected to the endoscope light source device 8.

Next, a first embodiment of the image pickup device of the present invention will be described. FIG. 4 is a cross-sectional view showing a first embodiment in which the image pickup device of the present invention is applied to a CCD image sensor. FIG. 5 shows a state where a cover glass (cover member) of the CCD image sensor shown in FIG. 4 is removed. FIG.

As shown in these figures, a CCD (Charge
Coupled Device) Image Sensor (Imaging Device) 5
CCD chip (imaging element chip) 51 and this CCD
A microlens array 53 provided on an imaging surface (light receiving surface) 52 of the chip 51. The entire shape of the CCD image sensor 5 except for the leads 56 described later is substantially a rectangular parallelepiped.

The shape of the image pickup area 521 of the CCD chip 51 is rectangular. The central part of the imaging region 521 is a square effective imaging region 523, and the remaining portion, that is, the effective imaging region 5 of the imaging region 521.
The portion outside 23 is a rectangular frame-shaped light-shielding region 522 for optically detecting a black reference level. This light-shielding region 522 is usually called “optical black (optical black portion)”.

The microlens array 53 is composed of a plurality of microlenses 531 arranged in a matrix (lattice). Each micro lens 531 has a C
It is arranged at a position corresponding to each pixel in the effective imaging area 523 of the CD chip 51.

The micro lens array 53 increases the amount of light applied to each pixel. That is,
The light use efficiency of the CCD chip 51 is improved.

A plurality of bump members 55 are provided on the imaging surface 52 side of the CCD chip 51. One end of each bump material 55 is electrically connected to a predetermined circuit of the CCD chip 51. And each bump material 5
L-shaped corresponding leads 5 are provided at the other end of
One end of 6 is electrically connected.

A light-transmissive (transparent) plate-like cover glass (cover member) 50 is bonded (adhered) to the imaging surface 52 side of the CCD chip 51 by an adhesive 57.

The imaging surface 52 of the CCD chip 51 is provided with a frame-shaped wall portion 54 having a square shape in plan view (the shape in FIG. 5).

The wall portion 54 is arranged at a position corresponding to the light-shielding region 522, and has a substantially rectangular effective imaging region 52.
3 is surrounded by the wall 54.

When the CCD image sensor 5 is manufactured, that is, when the cover glass 50 is bonded, the wall portion 54 prevents the adhesive 57 from entering the effective imaging area 523.

The wall 54 and the microlens array 53 are formed of the same constituent material.

The wall 54 and the micro lens array 53
Examples of the constituent material include various resins and various glasses.

The wall 54 is formed in the step of forming the micro lens array 53.

In the CCD image sensor 5, a hollow portion (gap) 59 is formed between the cover glass 50 and the microlens array 53. In this case, the walls 54 and the like function as spacers.

By providing the hollow portion 59, the difference in the refractive index between the surface of the microlens array 53 on the side of the cover glass 50 and the boundary (interface) can be made relatively large. The amount of light to be irradiated (collected) can be increased.

On the back side (lower side in FIG. 4) and side surfaces of the CCD image sensor 5, a coating layer 58 made of a resin material is formed.

The coating layer 58 allows the CCD chip 51
Of the CCD chip 51 (the opposite side of the imaging surface 52)
And the portion between one end and the other end of each bump material 55 is entirely covered. That is, the coating layer 58
The cover glass 50 hermetically seals the inside of the CCD image sensor 5.

Next, an example of a method of forming the micro lens array 53 and the wall portion 54 when forming the wall portion 54 in the step of forming the micro lens array 53 will be described.

First, a predetermined amount of uncured ultraviolet-curable resin is applied on the imaging surface 52 of the CCD chip 51.

Next, the mold for the microlens array 53 and the wall portion 54 is pressed against the imaging surface 52 of the CCD chip 51, and the shape of the ultraviolet curable resin on the imaging surface 52 is set to a desired shape. At this time, the mold is accurately positioned at a predetermined position with respect to the CCD chip 51 by a jig (not shown). The mold is made of a material that can transmit ultraviolet rays.

Next, in this state, the ultraviolet-curable resin is irradiated with ultraviolet rays through the mold to cure the ultraviolet-curable resin. Then, after the UV-curable resin is cured, the mold is removed.

In this manner, the microlens array 53 and the wall 54 made of the ultraviolet curing resin are formed at predetermined positions on the imaging surface 52 of the CCD chip 51, respectively.

Thereafter, the cover glass 50 is adhered to the imaging surface 52 side of the CCD chip 51 by the adhesive 57, but the effective imaging area 5 of the adhesive 57 is
Intrusion into 23 is prevented.

Next, the operation of the electronic endoscope 300 will be described. As shown in FIG. 1, when the power is turned on, the power is supplied from the lamp power supply 81 to the light source lamp 82, and the illumination light (from the light source lamp 82 toward the incident end faces of the optical fiber bundles 44 and 45 for light guides). Luminous flux) is emitted.

The illumination light is converged (condensed) by the condenser lens 83, adjusted to a predetermined light amount by the diaphragm device 84, and is incident on the entrance end faces of the light guide optical fiber bundles 44 and 45. The operation (control) of the expansion device 84 will be described later.

The illumination light passes through the light guide optical fiber bundles 44 and 45 and passes through the light distribution lens 31.
The light is irradiated to the observation site (subject) through the steps 32 and 32.

The reflected light from the observation site forms an image on the image pickup surface 52 of the CCD chip 51 of the CCD image sensor 5 by the image pickup optical system (the objective lens 33 and a plurality of lenses not shown) and the microlens array 53. (See FIGS. 1 and 4). At this time, a high-frequency component is removed from the reflected light by an optical low-pass filter (not shown).

On the other hand, as shown in FIG. 2, in the television timing generator 73 of the signal processing circuit 7 of the electronic endoscope 1, the horizontal synchronizing signal (HD) and the vertical synchronizing signal (VD)
Are generated. The horizontal synchronizing signal (HD) and the vertical synchronizing signal (VD) are supplied to the CCD process circuit 72 and the CCD
It is input to the timing generator 74.

The television timing generator 73
1, a synchronization signal (Sync) is generated. As shown in FIGS. 1 and 3, the synchronization signal (Sync) is supplied to the timing generator 95 and the system control circuit 85 of the signal processing circuit 9 of the endoscope light source device 8. Is input to

As shown in FIG. 2, in the CCD timing generator 74, each drive signal for driving the CCD image sensor 5 based on the horizontal synchronizing signal (HD) and the vertical synchronizing signal (VD) from the television timing generator 73. Are generated, and these drive signals are output from the signal processing circuit 7 via the buffer 75.

The CCD timing generator 74
Then, a sample hold signal (SHP) is generated and input to the sample hold color separation circuit 71.

As shown in FIG. 1, the drive signal output from the signal processing circuit 7 is input to the CCD image sensor 5 via a signal line 47, and the CCD image sensor 5 is driven based on the drive signal. . By driving the CCD image sensor 5, an image of the observation site, that is, an image of the observation site formed on the imaging surface 52 is captured.
A CCD signal is output from the CD image sensor 5. This CCD signal is input to the signal processing circuit 7 via the signal line 48.

As shown in FIG. 2, in the sample hold / color separation circuit 71 of the signal processing circuit 7, C
The CCD signal is separated into signals for each of R (red), G (green), and B (blue) by a sample hold signal (SHP) from the CD timing generator 74. The R, G, and B signals are input to the CCD process circuit 72, respectively.

The CCD timing generator 74
The R, G, and B signals from pixels in a portion corresponding to one of the light-shielding regions 522 shown on the left and right sides in FIG. 4 (for example, the light-shielding region 522 on the left side in FIG. A clamp signal (Clamp) is generated in synchronism with the timing of input to the CCD process circuit 72 and input to the CCD process circuit 72.

In the CCD process circuit 72, the clamp process is performed once in one horizontal scan in synchronization with the clamp signal (Clamp).

In the clamp process, the clamp signal (C
R, G, and B signals are sampled in synchronization with (lamp). That is, by sampling the R, G, and B signals from the pixels in the portion corresponding to the light-shielding region 522, an optically black reference level is detected and held.

In this embodiment, the CCD process circuit 72
Has a capacitor (not shown) as holding means for holding the reference level, and charges (voltage) having a magnitude corresponding to the reference level are stored in this capacitor. The reference level can be grasped from the voltage value of the capacitor.

As shown in FIG. 2, in the CCD process circuit 72, the reference level is subtracted from the R, G, and B signals from the pixels in the portion corresponding to the effective imaging region 523, and R, G, B signals are obtained, and two color difference signals (RY, B-
Y) and a luminance signal (Y) are generated. in this way,
By subtracting the reference level from each of the R, G, and B signals, unnecessary signal components such as a dark current component of the CCD image sensor 5 are removed from these signals, whereby an appropriate image can be obtained. Obtainable.

As shown in FIG. 3, these color difference signals (R-
Y), the color difference signal (BY) and the luminance signal (Y)
The signal is output from the CD process circuit 72 and is input to the matrix circuit 91 of the signal processing circuit 9 of the endoscope light source device 8.

As shown in FIG. 1, the luminance signal (Y) is also input to the dimming circuit 86 and used for adjusting the amount of illumination light in the diaphragm device 84. That is, a reference voltage (Vref) for dimming is input from the system control circuit 85 to the dimming circuit 86, and the dimming circuit 86
A control signal is generated based on the reference voltage (Vref) and the luminance signal (Y).
4 is controlled.

As shown in FIG. 3, in the matrix circuit 91, the chrominance signal (RY), the chrominance signal (BY), and the luminance signal (Y) are converted into R, G, and B signals. You.

The R signal, G signal and B signal are corrected by a gamma correction circuit 92, further corrected by an aperture correction circuit 93, and input to an A / D converter 94.

The A / D converter 94 converts the R, G and B signals supplied in the form of analog signals into digital signal forms.

The R signal, G signal and B signal are once written in the memory 96.

The memory 96 can also perform, for example, freeze processing on the R, G and B signals.

From the memory 96, the R signal, G signal
The signal and the B signal are read and input to the D / A converter 97.

The D / A converter 97 converts the R, G, and B signals supplied in digital signal form into analog signal form.

The R signal, G signal and B signal are input to a buffer 97 and a matrix encoder / buffer circuit 98, respectively.

Matrix encoder / buffer circuit 9
8, a luminance signal (Y), a luminance signal (Y) based on an R signal, a G signal, and a B signal from the D / A converter 97 and a synchronization signal (Sync) from the timing generator 95.
Chroma signal (C) and composite signal (Compo)
site) are generated and output to an output terminal (not shown).

The R signal, G signal and B signal from the D / A converter 97 and the synchronization signal (Sync) from the timing generator 95 are stored in a buffer 98.
Via the TV monitor 400.

On the television monitor 400, a color image (electronic image) captured by the CCD image sensor 5, that is, an endoscope image of a color moving image is displayed.

As described above, according to the CCD image sensor 5 and the electronic endoscope 1, the cover glass 5
0 is adhered to the CCD chip 51 by the wall portion 54.
It is possible to prevent the adhesive 57 from entering the effective imaging area 523 of the CCD chip 51. Thereby, the yield of the CCD image sensor 5 can be improved.

Since the wall 54 is provided, the CCD image sensor 5 can be easily manufactured.

Since the wall portion 54 is formed in the step of forming the microlens array 53, the number of manufacturing steps of the CCD image sensor 5 can be reduced as compared with the case where these are formed in a separate step. Thus, the productivity is improved, which is advantageous in mass production.

The CCD image sensor 5 has a C
CC with CD chip stored in package
This is advantageous for miniaturization as compared with the D image sensor.

With the downsizing of the CCD image sensor 5,
For example, since the length of the diagonal line on the front surface (upper surface in FIG. 4) of the CCD image sensor 5 is shortened, the diameter of the endoscope main body 2 can be reduced, thereby reducing the burden on the patient. it can.

Next, a second embodiment of the image pickup device of the present invention will be described. FIG. 6 shows a second embodiment in which the imaging device of the present invention is applied to a CCD image sensor.
It is sectional drawing which shows a chip | tip, a micro lens array, and a wall part. The description of the common points with the CCD image sensor 5 of the first embodiment will be omitted, and the main differences will be described.

As shown in the figure, in the CCD image sensor 5, the wall 54 is formed in a step different from the step of forming the microlens array 53.

That is, in the CCD image sensor 5, the wall portion 54 is joined to the imaging surface 52 of the CCD chip 51 after its formation.

According to the CCD image sensor 5, the same effects as those of the above-described CCD image sensor 5 of the first embodiment can be obtained.

Next, a third embodiment of the image sensor according to the present invention will be described. FIG. 7 is a cross-sectional view illustrating a cover glass and a wall according to a third embodiment in which the imaging device of the present invention is applied to a CCD image sensor. The description of the common points with the CCD image sensor 5 of the first embodiment will be omitted, and the main differences will be described.

As shown in the figure, in the CCD image sensor 5, the wall 54 is formed in a step different from the step of forming the microlens array 53.

That is, in the CCD image sensor 5, the wall portion 54 is bonded to the back surface (the surface facing the CCD chip 51) of the cover glass 50 after the formation.

According to the CCD image sensor 5, the same effects as those of the CCD image sensor 5 of the first embodiment can be obtained.

The image pickup device and electronic endoscope for an electronic endoscope according to the present invention have been described based on the embodiments shown in the drawings. However, the present invention is not limited to these embodiments. Can be replaced with any configuration having a similar function.

For example, in the present invention, any configurations of the above embodiments may be appropriately combined.

In each of the above embodiments, the wall portion 54 is located at a position corresponding to the light-shielding region 522. However, in the present invention, the position of the wall portion 54 may be any position outside the effective imaging region 523. For example, the wall portion 54 may be located outside the light-shielding region 522, and a part of the wall portion 54 may be located at a position corresponding to the light-shielding region 522, and the remaining portion may be located at the light-shielding region 522. It may be located outside.

In each of the above embodiments, the micro lens array 53 is provided on the imaging surface 52 of the CCD chip 51. In the present invention, the micro lens array 53 is provided.
May be provided, for example, on the back surface (the surface facing the CCD chip 51) of the cover glass (cover member) 50. That is, in the present invention, the microlens array 53 may be provided on the imaging surface (light receiving surface) 52 side of the CCD chip (chip of the imaging device) 51.

In each of the above embodiments, the wall 54 and the microlens array 53 are formed of the same constituent material. However, in the present invention, the wall 54 and the microlens array 53 are formed of different constituent materials. It may be formed.

Further, in the present invention, the type of the image pickup device is not particularly limited.
Various types of image sensors (imaging devices) such as an OS type image sensor and a CPD may be used.
Any of a monochrome image sensor may be used.

The electronic endoscope of the present invention can be applied to, for example, a medical electronic endoscope and an industrial electronic endoscope.

[0105]

As described above, according to the present invention,
When the cover member is adhered to the chip of the image sensor, the wall portion can prevent the adhesive from entering the effective imaging area of the chip. As a result, the yield of the image sensor can be improved.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an embodiment of an electronic endoscope according to the present invention and a configuration example of an endoscope light source device to which the electronic endoscope is attached (connected).

FIG. 2 is a block diagram showing a configuration example of a signal processing circuit of the electronic endoscope shown in FIG.

3 is a block diagram illustrating a configuration example of a signal processing circuit of the endoscope light source device illustrated in FIG. 1;

FIG. 4 is a cross-sectional view showing a first embodiment in which the imaging device of the present invention is applied to a CCD image sensor.

5 is a plan view showing a state where a cover glass (cover member) of the CCD image sensor shown in FIG. 4 is removed.

FIG. 6 is a second embodiment in which the imaging device of the present invention is applied to a CCD image sensor, and includes a CCD chip,
It is sectional drawing which shows a micro lens array and a wall part.

FIG. 7 is a third embodiment in which the imaging device of the present invention is applied to a CCD image sensor, and includes a cover glass,
It is sectional drawing which shows a wall part.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic endoscope 2 Endoscope main body 21 End part 23 Operation part 25 Connecting pipe 26 Connection part 27 Connector 31, 32 Light distribution lens 33 Objective lens 44, 45 Optical fiber bundle 47, 48 for light guide Signal line 5 CCD image sensor Reference Signs List 50 cover glass 51 CCD chip 52 imaging surface 521 imaging region 522 light shielding region (optical black portion) 523 effective imaging region 53 microlens array 531 microlens 54 wall portion 55 bump material 56 lead 57 adhesive 58 covering layer 59 hollow portion 7 signal Processing circuit 8 Endoscope light source device 9 Signal processing circuit 300 Electronic endoscope device 400 TV monitor

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H040 BA00 GA03 4C061 AA00 BB02 CC06 DD00 JJ01 JJ06 LL02 MM02 NN01 PP01 5C022 AA09 AC42 AC54 AC55 AC69 5C024 AX02 BX02 CX41 CY47 CY48 EX43 EX51 GY01 HX09 HXX

Claims (9)

[Claims] An imaging device for an electronic endoscope having a microlens array on an imaging surface side, wherein a wall surrounding the effective imaging region is provided outside an effective imaging region on the imaging surface. Imaging device for an electronic endoscope. 2. An electronic endoscope comprising: a chip of an imaging element; a microlens array provided on the imaging surface side of the chip; and a cover member joined to the imaging surface of the chip by an adhesive. An electronic device, comprising: an imaging element, provided outside the effective imaging region of the imaging surface, surrounding the effective imaging region and providing a wall for preventing the adhesive from entering the effective imaging region. Image sensor for endoscope. 3. The imaging device for an electronic endoscope according to claim 1, wherein the wall portion is formed in a step of forming the microlens array. 4. The imaging device for an electronic endoscope according to claim 2, wherein said wall portion is joined to said chip or said cover member after being formed. 5. A hollow portion is formed between the cover member and the micro lens array.
4. An image pickup device for an electronic endoscope according to claim 1. 6. The imaging device for an electronic endoscope according to claim 1, wherein said wall portion and said microlens array are formed of substantially the same constituent material. 7. The imaging device for an electronic endoscope according to claim 1, wherein a shape of the wall portion in a plan view is substantially rectangular. 8. The image forming apparatus according to claim 1, wherein at least a part of the wall is located at a position corresponding to a light shielding area for detecting an optically black reference level in the imaging area. An imaging device for an electronic endoscope according to any one of the above. 9. An electronic endoscope comprising the image pickup device for an electronic endoscope according to claim 1 at a distal end portion.