JPS6343353A - Solid-state image sensing device - Google Patents

Solid-state image sensing device

Info

Publication number
JPS6343353A
JPS6343353A JP18650786A JP18650786A JPS6343353A JP S6343353 A JPS6343353 A JP S6343353A JP 18650786 A JP18650786 A JP 18650786A JP 18650786 A JP18650786 A JP 18650786A JP S6343353 A JPS6343353 A JP S6343353A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
chip
image sensing
substrate
solid
state image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18650786A
Inventor
Tsuguo Okazaki
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To miniaturize a device by sealing the upper surface of a solid-state image sensing chip with a transparent body and unifying the upper surface of the chip together with a peripheral circuit chip.
CONSTITUTION: A solid-state image sensing chip 3 is die-bonded with the upper surface of a substrate 2 for an image sensing device 1, and a peripheral circuit chip 4 is die-bonded with a lower surface. Electrodes 5 for connecting each chip are formed to the substrate 2, a pair of external leads 6 are connected to sections where the electrodes 5 are positioned on the lower surface side of the substrate 2, and the electrodes 5 and the chip 3 are connected by bonding wires 7. The substrate 2 and the chips 3 and 4 superposed in this manner are housed in a cylindrical resin case 8, and the upper and lower surface sides of the case 8 are sealed with a light-transmitting resin 9 as a transparent body, and the resin 9 is covered with bar glass 11.
COPYRIGHT: (C)1988,JPO&Japio
JP18650786A 1986-08-08 1986-08-08 Solid-state image sensing device Pending JPS6343353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18650786A JPS6343353A (en) 1986-08-08 1986-08-08 Solid-state image sensing device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18650786A JPS6343353A (en) 1986-08-08 1986-08-08 Solid-state image sensing device
US07080567 US4777524A (en) 1986-08-08 1987-07-31 Endoscope having an electrically insulated solid-state image sensing unit

Publications (1)

Publication Number Publication Date
JPS6343353A true true JPS6343353A (en) 1988-02-24

Family

ID=16189707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18650786A Pending JPS6343353A (en) 1986-08-08 1986-08-08 Solid-state image sensing device

Country Status (1)

Country Link
JP (1) JPS6343353A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045660U (en) * 1990-04-26 1992-01-20
US5523608A (en) * 1992-09-01 1996-06-04 Sharp Kabushiki Kaisha Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package
EP0807976A2 (en) * 1996-05-17 1997-11-19 Sony Corporation Solid-state imaging apparatus and camera using the same
WO2001065836A1 (en) * 2000-02-29 2001-09-07 Matsushita Electric Industrial Co., Ltd. Image pickup device, and image pickup device assembling method
JP2005167243A (en) * 2003-12-02 2005-06-23 Samsung Electronics Co Ltd Wiring board and solid image pick-up semiconductor device utilizing same
WO2005091368A1 (en) * 2004-03-18 2005-09-29 Infineon Technologies Ag Semiconductor component with a stacked construction, comprising an optically active semiconductor chip and associated production method
JP2007311454A (en) * 2006-05-17 2007-11-29 Sony Corp Solid-state image sensing device
US7534645B2 (en) 2003-06-11 2009-05-19 Samsung Electronics Co., Ltd. CMOS type image sensor module having transparent polymeric encapsulation material

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045660U (en) * 1990-04-26 1992-01-20
US5523608A (en) * 1992-09-01 1996-06-04 Sharp Kabushiki Kaisha Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package
EP0807976A2 (en) * 1996-05-17 1997-11-19 Sony Corporation Solid-state imaging apparatus and camera using the same
EP0807976A3 (en) * 1996-05-17 1999-03-24 Sony Corporation Solid-state imaging apparatus and camera using the same
US8098309B2 (en) 1996-05-17 2012-01-17 Sony Corporation Solid-state imaging apparatus and camera using the same
EP1715526A3 (en) * 1996-05-17 2008-01-23 Sony Corporation Solid-state imaging apparatus and camera using the same
EP1715524A3 (en) * 1996-05-17 2008-01-23 Sony Corporation Solid-state imaging apparatus
EP1715524A2 (en) 1996-05-17 2006-10-25 Sony Corporation Solid-state imaging apparatus
US8564702B2 (en) 1996-05-17 2013-10-22 Sony Corporation Solid-state imaging apparatus and camera using the same
US7333147B2 (en) 2000-02-29 2008-02-19 Matsushita Electric Industrial Co., Ltd. Image pickup device with a three-dimensional circuit board and device assembly method
WO2001065836A1 (en) * 2000-02-29 2001-09-07 Matsushita Electric Industrial Co., Ltd. Image pickup device, and image pickup device assembling method
US7534645B2 (en) 2003-06-11 2009-05-19 Samsung Electronics Co., Ltd. CMOS type image sensor module having transparent polymeric encapsulation material
JP2005167243A (en) * 2003-12-02 2005-06-23 Samsung Electronics Co Ltd Wiring board and solid image pick-up semiconductor device utilizing same
WO2005091368A1 (en) * 2004-03-18 2005-09-29 Infineon Technologies Ag Semiconductor component with a stacked construction, comprising an optically active semiconductor chip and associated production method
US7759708B2 (en) 2006-05-17 2010-07-20 Sony Corporation Solid-state imaging apparatus
JP2007311454A (en) * 2006-05-17 2007-11-29 Sony Corp Solid-state image sensing device

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