JP2001155854A - Organic el element sealing method - Google Patents

Organic el element sealing method

Info

Publication number
JP2001155854A
JP2001155854A JP33264499A JP33264499A JP2001155854A JP 2001155854 A JP2001155854 A JP 2001155854A JP 33264499 A JP33264499 A JP 33264499A JP 33264499 A JP33264499 A JP 33264499A JP 2001155854 A JP2001155854 A JP 2001155854A
Authority
JP
Japan
Prior art keywords
sealing
adhesive
transparent substrate
hole
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33264499A
Other languages
Japanese (ja)
Inventor
Atsumasa Hara
淳雅 原
Kazuhide Ota
和秀 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP33264499A priority Critical patent/JP2001155854A/en
Publication of JP2001155854A publication Critical patent/JP2001155854A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide EL element sealing method that can prevent bad sealing by suppressing pressure rising of sealed space in adhering. SOLUTION: The EL element sealing method of the present invention comprises steps of coating adhesive 2 to a sealing member 1 having a recess 12 to form a sealing line, overlapping the sealing member 1 and a transparent substrate 3, and press-attaching both members. The adhesive 2 is formed with a sump 21 at a position corresponding to the recess 12, and a tunnel T is formed at the sump to communicate inside and outside spaces of a sealing line, therefore, the pressure rising according to volume reducing of a sealing space K is prevented. The tunnel T is pressed toward both members and closed by the adhesive 2 when the pressing step is carried out. A hole may be formed at a position of the sealing member where the adhesive is coated instead of recess 12, and the tunnel is formed at the hole. If both members are reversed after pressing step, the tunnel is closed as the adhesive in the hole flows toward the transparent substrate.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、有機エレクトロル
ミネセンス(EL)素子の封止方法に関する。
The present invention relates to a method for sealing an organic electroluminescence (EL) element.

【0002】[0002]

【従来の技術】有機EL素子の信頼性向上及び長寿命化
を図るためには、有機EL積層膜を構成する発光層や電
極を確実に水分や酸素(以下、「水分等」ともいう。)
から遮断することが重要である。この目的から、有機E
L積層膜の形成された透明基板と封止部材とを接着剤を
介して一体化することにより、これらの間に封止された
有機EL積層膜を水分等から保護する技術が知られてい
る。例えば、封止部材の外周部に接着剤を塗布して透明
基板を重ね合わせてこの両者と接着剤により囲まれた空
間(以下、「封止空間」ともいう。)に有機EL積層膜
を封止し、次いで封止部材と透明基板とを圧着すること
により間に挟まれた接着剤を薄く押し広げた後に接着剤
を硬化させる。
2. Description of the Related Art In order to improve the reliability and extend the life of an organic EL device, the light emitting layers and electrodes constituting the organic EL laminated film must be surely made of moisture or oxygen (hereinafter also referred to as "moisture").
It is important to block from For this purpose, organic E
A technique is known in which a transparent substrate on which an L laminated film is formed and a sealing member are integrated via an adhesive to protect the organic EL laminated film sealed therebetween from moisture and the like. . For example, an adhesive is applied to the outer peripheral portion of the sealing member, a transparent substrate is superimposed, and the organic EL laminated film is sealed in a space surrounded by the two and the adhesive (hereinafter, also referred to as a “sealing space”). Then, the adhesive sandwiched between the sealing member and the transparent substrate is compressed by pressing the sealing member and the transparent substrate, and then the adhesive is cured.

【0003】[0003]

【発明が解決しようとする課題】しかし、封止部材に透
明基板を重ねて圧着する際、封止空間の体積は接着剤が
押し潰されるにつれて減少し、これに伴って封止空間の
圧力が上昇する。この内部圧力の影響で、図10に示す
ように接着剤2の広がり具合が不均一になって封止部材
と透明基板3とを接合する封止ラインの形状に乱れが生
じたり、封止空間内の気体が接着剤に孔(気道)を作っ
て抜け出し、この気道が接着剤の硬化後まで残ってしま
ったりして、素子の封止不良が発生するという問題があ
った。
However, when a transparent substrate is overlaid on the sealing member and pressed, the volume of the sealing space decreases as the adhesive is crushed, and the pressure in the sealing space is reduced accordingly. To rise. Due to the influence of the internal pressure, the degree of spreading of the adhesive 2 becomes uneven as shown in FIG. 10 and the shape of the sealing line joining the sealing member and the transparent substrate 3 is disturbed, There is a problem in that the gas in the air escapes by forming a hole (airway) in the adhesive, and the airway remains until after the adhesive is hardened, resulting in poor sealing of the element.

【0004】この封止不良を防止するため、特開平11
−176571号公報には、封止部材と透明基板との加
圧接着を減圧下で行う有機EL素子の製造方法が開示さ
れている。しかし、この製造方法によっても封止ライン
形状の乱れを十分に防止することは困難であり、また雰
囲気圧力の調節が面倒である。
In order to prevent this sealing failure, Japanese Patent Laid-Open No.
Japanese Patent Application Publication No. 176571 discloses a method for manufacturing an organic EL device in which pressure bonding between a sealing member and a transparent substrate is performed under reduced pressure. However, even with this manufacturing method, it is difficult to sufficiently prevent the shape of the sealing line from being disordered, and it is troublesome to adjust the atmospheric pressure.

【0005】本発明の目的は、接着時における封止空間
内の圧力上昇を少なくすることにより封止不良の発生を
防止する有機EL素子の封止方法を提供することにあ
る。
An object of the present invention is to provide a method for sealing an organic EL element, which prevents the occurrence of defective sealing by reducing a pressure rise in a sealing space at the time of bonding.

【0006】[0006]

【課題を解決するための手段】本発明者は、封止部材お
よび透明基板の一方に溝または穴を設けることにより上
記課題が解決されることを見出して本発明を完成したの
である。
The present inventors have found that the above-mentioned problems can be solved by providing a groove or a hole in one of the sealing member and the transparent substrate, and have completed the present invention.

【0007】第1発明の有機EL素子の封止方法は、有
機EL積層膜が形成された透明基板と封止部材とが接着
剤により一体化された有機EL素子の封止方法であっ
て、上記透明基板および上記封止部材のいずれか一方の
部材に接着剤を塗布して封止ラインを形成する塗布工程
と、該接着剤が塗布された上記一方の部材を他方の部材
と重ね合わせる配置工程と、上記一方の部材と上記他方
の部材とを圧着する圧着工程とを備え、上記一方の部材
および上記他方の部材のうち少なくとも一方には上記配
置工程において上記封止ラインの内外空間を連通させる
トンネルを形成するための溝が設けられており、上記圧
着工程において上記内外空間の連通が上記接着剤により
遮断されることを特徴とする。
The method of sealing an organic EL element according to the first invention is a method of sealing an organic EL element in which a transparent substrate on which an organic EL laminated film is formed and a sealing member are integrated with an adhesive. An application step of applying an adhesive to one of the transparent substrate and the sealing member to form a sealing line, and an arrangement in which the one member to which the adhesive is applied is overlapped with the other member And a crimping step of crimping the one member and the other member. At least one of the one member and the other member communicates the inner and outer spaces of the sealing line in the disposing step. A groove for forming a tunnel to be formed is provided, and the communication between the inner and outer spaces is blocked by the adhesive in the pressing step.

【0008】また、第3発明の有機EL素子の封止方法
は、上記透明基板および上記封止部材のいずれか一方の
部材に接着剤を塗布して封止ラインを形成する塗布工程
と、該接着剤が塗布された上記一方の部材を他方の部材
とを重ね合わせる配置工程と、上記一方の部材と上記他
方の部材とを圧着する圧着工程と、圧着された上記一方
の部材と上記他方の部材とを上下反転させる反転工程を
備え、上記封止ラインを構成する上記接着剤の一部は上
記一方の部材に設けられた穴内に塗布されており、上記
配置工程において該穴の上に上記封止ラインの内外空間
を連通させる空隙が形成され、上記穴内に塗布された上
記接着剤が上記反転工程において流下することにより上
記内外空間の連通が遮断されることを特徴とする。
In a third aspect of the present invention, there is provided a method for sealing an organic EL element, comprising: applying an adhesive to one of the transparent substrate and the sealing member to form a sealing line; An arranging step of laminating the one member to which the adhesive is applied with the other member, a crimping step of crimping the one member and the other member, and the crimped one member and the other member A reversing step of inverting the member and upside down, a part of the adhesive forming the sealing line is applied in a hole provided in the one member, and in the disposing step, A gap is formed to communicate the inner and outer spaces of the sealing line, and the adhesive applied in the holes flows down in the reversing step, thereby interrupting the communication of the inner and outer spaces.

【0009】上記「透明基板」としては、ガラス、樹
脂、石英等の透明材料からなる板状物、シート状物、或
いはフィルム状物等を用いることができる。このうち、
水分などの遮断性に優れるガラス板を用いることが特に
好ましい。この透明基板上に、陽極、有機EL膜及び陰
極を積層して「有機EL積層膜」が構成される。有機E
L膜は、発光層のみからなってもよく、発光層に加えて
正孔輸送層及び/又は電子輸送層を有してもよく、更に
正孔注入層及び/又は電子注入層を有してもよい。陽
極、陰極及び有機EL膜を構成する材料としては、それ
ぞれ種々の公知材料を用いることができる。これらの各
層を形成する方法は、真空蒸着法、スピンコート法、キ
ャスト法、スパッタリング法、LB法等の方法から適宜
選択すればよい。
As the above-mentioned "transparent substrate", a plate-like material, a sheet-like material, a film-like material or the like made of a transparent material such as glass, resin and quartz can be used. this house,
It is particularly preferable to use a glass plate having excellent barrier properties against moisture and the like. An “organic EL laminated film” is formed by laminating an anode, an organic EL film, and a cathode on this transparent substrate. Organic E
The L film may be composed of only a light emitting layer, may have a hole transport layer and / or an electron transport layer in addition to the light emitting layer, and further has a hole injection layer and / or an electron injection layer. Is also good. Various known materials can be used for the materials constituting the anode, the cathode, and the organic EL film. A method for forming each of these layers may be appropriately selected from methods such as a vacuum evaporation method, a spin coating method, a casting method, a sputtering method, and an LB method.

【0010】上記「封止部材」としては、ステンレス、
アルミニウム又はその合金等の金属類、ソーダ石灰ガラ
ス、珪酸塩ガラス等のガラス類、アクリル系樹脂、スチ
レン系樹脂等の樹脂類等の一種又は二種以上からなるも
のを使用することができる。このうち、金属類またはガ
ラス類からなるものが好ましい。封止部材の形状は特に
限定されず、例えば板状、キャップ状等とすることがで
きる。
The "sealing member" includes stainless steel,
Metals such as aluminum or an alloy thereof, glasses such as soda-lime glass and silicate glass, and resins composed of one or more of resins such as acrylic resins and styrene resins can be used. Among them, those made of metals or glasses are preferred. The shape of the sealing member is not particularly limited, and may be, for example, a plate shape, a cap shape, or the like.

【0011】本発明の封止方法において用いる「接着
剤」としては、エポキシ樹脂系接着剤、アクリレート系
接着剤、または熱硬化性樹脂、光硬化性樹脂等からなる
ものを使用することができる。このうち、水分等の透過
性の低い硬化物を形成するものが好ましい。また、素子
への熱ストレスを低減できかつ速硬化性に優れることか
ら、光硬化性樹脂からなる接着剤が好ましく用いられ
る。特に、カチオン重合性の紫外線硬化型エポキシ樹脂
系接着剤を用いることが好ましい。
As the "adhesive" used in the sealing method of the present invention, an epoxy resin-based adhesive, an acrylate-based adhesive, a thermosetting resin, a photocurable resin, or the like can be used. Among them, those that form a cured product having low permeability to moisture and the like are preferable. In addition, an adhesive made of a photo-curable resin is preferably used because it can reduce thermal stress on the element and is excellent in rapid curability. In particular, it is preferable to use a cationically polymerizable ultraviolet-curable epoxy resin-based adhesive.

【0012】この接着剤の硬化前における粘度は、常温
において通常50〜20,000Pa・s程度である。
本発明の封止方法のうち、第1発明の方法は、比較的高
粘度の(例えば3,000〜20,000Pa・s、よ
り好ましくは5,000〜10,000Pa・s)接着
剤を用いる場合に好ましく適用される。また、第3発明
の方法は、比較的低粘度の(例えば50〜3,000P
a・s、より好ましくは100〜500Pa・s)接着
剤を用いる場合に好ましく適用される。接着剤の塗布長
さに対する塗布量は、通常0.2〜200mg/cm
(好ましくは1.5〜120mg/cm)であり、圧着
前における接着剤の塗布幅は通常0.2〜5mm(好ま
しくは0.5〜3mm)、高さ(塗布厚さ)は通常0.
1〜3mm(好ましくは0.2〜2mm)である。溝の
幅方向の中央部における接着剤の上端は溝の上端よりも
低いことが好ましいが、接着剤の上端が溝の上端より高
い場合にも、封止ラインの他の箇所と比較して溝上の接
着剤が窪んでおれば、圧着工程の初期においてトンネル
を形成することは可能であり、本発明の効果を得ること
ができる。
The viscosity of the adhesive before curing is usually about 50 to 20,000 Pa · s at room temperature.
Among the sealing methods of the present invention, the method of the first invention uses an adhesive having a relatively high viscosity (for example, 3,000 to 20,000 Pa · s, more preferably 5,000 to 10,000 Pa · s). It is preferably applied in cases. Further, the method of the third invention has a relatively low viscosity (for example, 50 to 3,000P).
a · s, more preferably 100 to 500 Pa · s) It is preferably applied when an adhesive is used. The application amount of the adhesive to the application length is usually 0.2 to 200 mg / cm.
(Preferably 1.5 to 120 mg / cm), the application width of the adhesive before press bonding is usually 0.2 to 5 mm (preferably 0.5 to 3 mm), and the height (application thickness) is usually 0.1.
It is 1 to 3 mm (preferably 0.2 to 2 mm). The upper end of the adhesive at the center in the width direction of the groove is preferably lower than the upper end of the groove, but even when the upper end of the adhesive is higher than the upper end of the groove, If the adhesive is depressed, it is possible to form a tunnel in the initial stage of the pressure bonding step, and the effect of the present invention can be obtained.

【0013】この接着剤は、封止部材および透明基板の
少なくとも一方にディスペンサ等を用いて塗布される。
通常は、有機EL積層膜の形成された透明基板に比べて
取り扱いが容易な封止部材側に接着剤を塗布することが
好ましい。第1発明の封止方法においては、この溝を有
する部材と接着剤を塗布する部材とは必ずしも同じでな
くてもよいが、同じ部材であることが好ましい。また、
第3発明の封止方法では、穴を有する部材と接着剤を塗
布する部材とは同じとする。この接着剤を塗布する部材
(一方の部材)は、第2発明および第4発明のように、
封止部材であることが好ましい。
The adhesive is applied to at least one of the sealing member and the transparent substrate using a dispenser or the like.
Normally, it is preferable to apply an adhesive to the sealing member which is easier to handle than the transparent substrate on which the organic EL laminated film is formed. In the sealing method of the first invention, the member having the groove and the member to which the adhesive is applied are not necessarily the same, but are preferably the same member. Also,
In the sealing method of the third invention, the member having the hole and the member to which the adhesive is applied are the same. The member (one member) to which this adhesive is applied is, as in the second and fourth inventions,
Preferably, it is a sealing member.

【0014】上記透明基板および上記封止部材のいずれ
か一方には、溝または穴が形成されている。ここで、
「溝」とは上端以外の箇所にも開口部を有する凹部をい
い、「穴」とは上端以外に開口部をもたない凹部をい
う。通常は封止部材側に溝または穴を形成することが好
ましく、この封止部材が金属類からなる場合には、通常
はガラス等からなる透明基板に比べて溝または穴の形成
が容易であるためより好ましい。溝または穴の形成方法
としては金属プレス等を用いることができる。なお、ガ
ラス類等からなる封止部材や透明基板に溝または穴を形
成する場合には切削等の方法によればよい。以下、溝ま
たは穴が封止部材側に形成されている場合を例として説
明する。
A groove or a hole is formed in one of the transparent substrate and the sealing member. here,
The “groove” refers to a concave portion having an opening at a position other than the upper end, and the “hole” refers to a concave portion having no opening at a position other than the upper end. Usually, it is preferable to form a groove or a hole on the side of the sealing member. When the sealing member is made of a metal, it is easier to form the groove or the hole than a transparent substrate usually made of glass or the like. Therefore, it is more preferable. A metal press or the like can be used as a method for forming the grooves or holes. When forming a groove or a hole in a sealing member made of glass or the like or a transparent substrate, a method such as cutting may be used. Hereinafter, a case where a groove or a hole is formed on the sealing member side will be described as an example.

【0015】上記「溝」は、通常は上記配置工程におい
て封止ラインと交叉(好ましくは直交)するように形成
されている。図2(a)のように封止部材1が平板状で
ある場合には、封止部材の所定位置からこの封止部材の
外周端に至るまで、片末端開放型の溝12を設けること
が好ましい。また、図2(b)のように封止部材1の外
周部に側壁14が形成されている場合、あるいは図2
(c)のように封止部材1の外周に鍔部11が形成され
ている場合には、この側壁14または鍔部11を幅方向
に貫通するように、両末端開放型の溝12を設けること
が好ましい。なお、図2(a)および図2(b)は封止
部材がガラス類からなる場合に、図2(c)は封止部材
が金属類からなる場合に適した形状の例である。
The above-mentioned "groove" is usually formed so as to intersect (preferably orthogonally) with the sealing line in the above-mentioned arrangement step. When the sealing member 1 has a flat plate shape as shown in FIG. 2A, a groove 12 having an open end is provided from a predetermined position of the sealing member to an outer peripheral end of the sealing member. preferable. Further, when the side wall 14 is formed on the outer peripheral portion of the sealing member 1 as shown in FIG.
In the case where the flange 11 is formed on the outer periphery of the sealing member 1 as shown in (c), a double-ended groove 12 is provided so as to penetrate the side wall 14 or the flange 11 in the width direction. Is preferred. 2A and 2B are examples of shapes suitable for a case where the sealing member is made of glass, and FIG. 2C is an example of a shape suitable for a case where the sealing member is made of metal.

【0016】封止部材の外周部に接着剤を塗布して封止
ラインを形成するとき、封止ラインの各部における接着
剤の塗布量は通常ほぼ一定であることから、封止ライン
が溝を横断する箇所では接着剤に窪みが生じる。この封
止部材に透明基板を重ね合わせると、この接着剤の窪み
と透明基板との間に、封止ラインの内外空間に連通する
トンネルが形成される。圧着工程の初期には、封止空間
の体積減少につれて封止空間内の気体がこのトンネルを
通じて抜け出すことにより、封止空間内の圧力上昇が防
止される。圧着が進むと、封止部材と透明基板との間で
押しつぶされた接着剤によりトンネルが次第に縮小し、
ついには消滅する(トンネルが塞がれる)。これにより
封止空間内外の連通が遮断される。
When an adhesive is applied to the outer peripheral portion of the sealing member to form a sealing line, the amount of the adhesive applied to each portion of the sealing line is generally substantially constant. At the crossing point, the adhesive has depressions. When a transparent substrate is superimposed on the sealing member, a tunnel is formed between the recess of the adhesive and the transparent substrate, the tunnel communicating with the inner and outer spaces of the sealing line. At the beginning of the compression bonding step, the gas in the sealed space escapes through the tunnel as the volume of the sealed space decreases, thereby preventing the pressure in the sealed space from rising. As crimping progresses, the tunnel gradually shrinks due to the adhesive crushed between the sealing member and the transparent substrate,
Eventually disappears (the tunnel is closed). Thereby, communication between the inside and outside of the sealed space is cut off.

【0017】溝の断面形状は、コの字状、U字状、V字
状等のいずれでもよいが、圧着工程において接着剤を隅
々まで充填しやすいことからU字状が好ましい。溝の大
きさは、使用する接着剤の粘度や塗布量、接着剤硬化後
における封止ラインの幅等に応じて適宜設定される。通
常は、上端における幅3〜10mm、長さ2〜10m
m、深さ0.5〜3mm(より好ましくは幅3〜5m
m、長さ3〜5mm、深さ0.5〜2mm)とすること
が好ましい。溝が小さすぎる場合には、封止空間の体積
が十分に小さくなる前にトンネルが塞がれてしまう。一
方、溝が大きすぎる場合には、得られた有機EL素子が
水分等の遮断性の低いものとなりやすい。
The cross-sectional shape of the groove may be any of a U-shape, a U-shape, a V-shape, and the like, but is preferably a U-shape because the adhesive is easily filled in every corner in the pressure bonding step. The size of the groove is appropriately set according to the viscosity and application amount of the adhesive to be used, the width of the sealing line after the adhesive is cured, and the like. Normally, the upper end has a width of 3 to 10 mm and a length of 2 to 10 m
m, depth 0.5 to 3 mm (more preferably 3 to 5 m in width)
m, a length of 3 to 5 mm, and a depth of 0.5 to 2 mm). If the groove is too small, the tunnel will be closed before the volume of the sealed space becomes sufficiently small. On the other hand, when the groove is too large, the obtained organic EL element tends to have a low barrier property against moisture and the like.

【0018】また、上記「穴」は、図3(a)および図
3(b)に示すように、封止部材1のうち接着剤2が塗
布される位置の一部に、好ましくはこの塗布方向を長辺
とする長方形状の穴13として形成されることが好まし
い。なお、図3(a)は封止部材がガラス類からなる場
合に、図3(b)は封止部材が金属類からなる場合に適
した形状の例である。
As shown in FIGS. 3 (a) and 3 (b), the "hole" is formed at a part of the sealing member 1 where the adhesive 2 is to be applied, preferably at the position where the adhesive 2 is applied. It is preferably formed as a rectangular hole 13 having a long side in the direction. FIG. 3A shows an example of a shape suitable for a case where the sealing member is made of glass, and FIG. 3B shows an example of a shape suitable for a case where the sealing member is made of metal.

【0019】上記塗布工程において、封止ラインを構成
する接着剤の一部はこの穴内に入り込んで塗布される。
このため、封止部材の上から透明基板を重ねると、穴が
形成された位置の封止部材と透明基板との間に、封止ラ
インの内外空間に連通するトンネルが形成される。圧着
工程において、封止空間の体積減少につれて封止空間内
の気体がこのトンネルを通じて抜け出すことにより、封
止空間内の圧力上昇が防止される。圧着工程の終了後、
封止部材と透明基板とを上下反転させると、穴内に塗布
された接着剤が透明基板側へと流下して上記空隙を塞
ぐ。これにより封止空間内外の連通が遮断される。
In the above-mentioned application step, a part of the adhesive constituting the sealing line enters the hole and is applied.
Therefore, when the transparent substrate is overlaid on the sealing member, a tunnel is formed between the sealing member at the position where the hole is formed and the transparent substrate and communicates with the inner and outer spaces of the sealing line. In the pressure bonding step, the gas in the sealed space escapes through the tunnel as the volume of the sealed space decreases, thereby preventing the pressure in the sealed space from rising. After the crimping process,
When the sealing member and the transparent substrate are turned upside down, the adhesive applied in the hole flows down to the transparent substrate side to close the gap. Thereby, communication between the inside and outside of the sealed space is cut off.

【0020】穴の形状は特に限定されないが、封止ライ
ンに垂直な断面における好ましい形状としてはコの字状
またはU字状、封止ラインに平行かつ封止部材に垂直な
断面における好ましい形状としてはコの字状、円弧状ま
たはU字状等が挙げられる。穴の大きさは、使用する接
着剤の粘度や塗布量、接着剤硬化後における封止ライン
の幅等に応じて適宜設定される。通常は、封止部材の表
面への開口部の幅は1〜6mm、長さは3〜10mmで
あり、深さは0.5〜3mm、(より好ましくは幅2〜
4mm、長さ4〜8mm、深さ0.5〜2mm)とする
ことが好ましい。穴の幅が小さすぎると、封止ラインの
幅方向において接着剤が穴からはみ出して、圧着工程に
おいてトンネルを形成できなくなる恐れがある。穴の長
さまたは深さが小さすぎると、封止空間の体積が十分に
小さくなる前にトンネルが塞がれてしまう場合がある。
一方、穴が大きすぎる場合には、反転工程において接着
剤を流下させて連通を遮断する際に長時間を要すること
となり、また得られた有機EL素子が水分等の遮断性の
低いものとなりやすい。
Although the shape of the hole is not particularly limited, a preferred shape in a section perpendicular to the sealing line is a U-shape or a U-shape, and a preferred shape in a section parallel to the sealing line and perpendicular to the sealing member. May be U-shaped, arc-shaped, U-shaped, or the like. The size of the hole is appropriately set according to the viscosity and application amount of the adhesive to be used, the width of the sealing line after the adhesive is cured, and the like. Usually, the width of the opening to the surface of the sealing member is 1 to 6 mm, the length is 3 to 10 mm, the depth is 0.5 to 3 mm, (more preferably the width is 2 to 3 mm).
(4 mm, length 4 to 8 mm, depth 0.5 to 2 mm). If the width of the hole is too small, the adhesive may protrude from the hole in the width direction of the sealing line, making it impossible to form a tunnel in the pressure bonding process. If the length or depth of the hole is too small, the tunnel may be closed before the volume of the sealed space becomes sufficiently small.
On the other hand, when the hole is too large, it takes a long time to cut off the communication by flowing down the adhesive in the reversing step, and the obtained organic EL element tends to have low barrier properties against moisture and the like. .

【0021】圧着工程または反転工程終了後における接
着剤層の幅および厚さは、接着剤の硬化後における封止
ラインの幅および厚さとほぼ同等であり、幅1〜5mm
(より好ましくは2〜4mm)、厚さ1〜200μm
(より好ましくは5〜100μm)とすることが好まし
い。その後、紫外線照射等の手段により接着剤を硬化さ
せて、封止部材と透明基板とを一体に接着すればよい。
なお、上記溝および穴は、封止ラインの一箇所に設けて
もよく、二箇所以上に設けてもよい。通常は、成形が容
易でありかつ水分等の遮断性の高い有機EL素子を得や
すいことから、一箇所に設けることが好ましい。
The width and thickness of the adhesive layer after completion of the pressure bonding step or the reversing step are substantially equal to the width and thickness of the sealing line after the adhesive is cured, and the width is 1 to 5 mm.
(More preferably 2-4 mm), thickness 1-200 μm
(More preferably 5 to 100 μm). Then, the adhesive may be cured by means such as ultraviolet irradiation, and the sealing member and the transparent substrate may be integrally bonded.
In addition, the said groove | channel and a hole may be provided in one place of a sealing line, and may be provided in two or more places. Usually, since it is easy to mold and it is easy to obtain an organic EL element having a high barrier property against moisture and the like, it is preferable to provide the organic EL element at one place.

【0022】[0022]

【発明の実施の形態】以下、実施例により本発明を更に
具体的に説明する。 (実施例1)図4に示すように、封止部材1は金属プレ
スにより成形され、厚さ0.5mmのステンレス板から
なり、縦30mm×横50mm×高さ10mmの角形キ
ャップ状であって外周部に幅3mmの鍔部11を有す
る。この封止部材1の一方の短辺に位置する鍔部11に
は、長さ方向のほぼ中央に、鍔部11を幅方向に貫通す
る両末端開放型の溝12が形成されている。溝12の断
面形状はU字状であり、その上端における幅は3mm、
深さは0.8mmである。この鍔部11の外周端から
1.5mm内側に、カチオン重合性の紫外線硬化型エポ
キシ樹脂系接着剤(チバガイギー社製、商品名「XNR
5493T」)2をディスペンサにより塗布して、環状
の封止ラインを形成した。この接着剤の粘度は5,50
0Pa・s/25℃、ディスペンサ移動量に対する接着
剤の塗布量は20mg/cm、塗布された接着剤2の断
面形状は幅0.8mm、高さ0.5mmの略半円状であ
った。このとき、溝12の形成された位置では接着剤2
に窪み21が形成された。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described more specifically by way of examples. (Example 1) As shown in FIG. 4, the sealing member 1 is formed by a metal press, is made of a stainless steel plate having a thickness of 0.5 mm, and has a square cap shape of 30 mm long × 50 mm wide × 10 mm high. The outer peripheral portion has a flange portion 3 having a width of 3 mm. The flange 11 located on one short side of the sealing member 1 has a double-ended groove 12 that penetrates the flange 11 in the width direction substantially at the center in the length direction. The cross-sectional shape of the groove 12 is U-shaped, the width at the upper end is 3 mm,
The depth is 0.8 mm. 1.5 mm inward from the outer peripheral end of the flange portion 11, a cationically polymerizable ultraviolet-curable epoxy resin-based adhesive (trade name “XNR” manufactured by Ciba-Geigy)
5493T ") 2 was applied with a dispenser to form an annular sealing line. The viscosity of this adhesive is 5,50
At 0 Pa · s / 25 ° C., the applied amount of the adhesive with respect to the dispenser movement amount was 20 mg / cm, and the applied adhesive 2 had a substantially semicircular cross section of 0.8 mm in width and 0.5 mm in height. At this time, at the position where the groove 12 is formed, the adhesive 2
A depression 21 was formed in the substrate.

【0023】次いで、図1(a)に示すように、有機E
L積層膜を形成した透明基板3を封止部材1の上から重
ね、この封止部材1、透明基板3および接着剤2(封止
ライン)により、有機EL積層膜を封止する封止空間K
を区画した。このとき、窪み21と透明基板3との間
に、封止空間Kおよび外部空間に連通するトンネルTが
形成される。この状態から封止部材1と透明基板3とを
圧着すると、接着剤2が次第に押しつぶされて封止空間
Kの体積が減少するとともに、封止空間K内の気体がト
ンネルTを通じて外部空間に押し出される。これにより
封止空間Kの圧力上昇が防止される。圧着が進むと、押
しつぶされた接着剤2によりトンネルTが次第に圧縮さ
れ、最終的には図1(b)に示すようにトンネルTが消
滅して封止空間Kと外部空間とが遮断される。その後、
紫外線を照射して接着剤2を硬化させた。硬化後の接着
剤2の幅は2.5mm、厚さは100μmであった。
Next, as shown in FIG.
The transparent substrate 3 on which the L laminated film is formed is overlaid on the sealing member 1, and the sealing member 1, the transparent substrate 3 and the adhesive 2 (the sealing line) seal the organic EL laminated film. K
Was partitioned. At this time, a tunnel T communicating with the sealing space K and the external space is formed between the depression 21 and the transparent substrate 3. When the sealing member 1 and the transparent substrate 3 are pressed against each other in this state, the adhesive 2 is gradually crushed, the volume of the sealing space K is reduced, and the gas in the sealing space K is pushed out to the external space through the tunnel T. It is. This prevents the pressure in the sealed space K from rising. As the pressing proceeds, the tunnel T is gradually compressed by the crushed adhesive 2, and finally the tunnel T disappears as shown in FIG. 1B, and the sealing space K and the external space are shut off. . afterwards,
The adhesive 2 was cured by irradiating ultraviolet rays. The width of the adhesive 2 after curing was 2.5 mm, and the thickness was 100 μm.

【0024】なお、この実施例1では溝を設けた部材と
接着剤が塗布される部材とは同一であるが、例えば図5
に示すように、透明基板側3に溝31を設け、封止部材
側1に接着剤2を塗布してもよい。この場合には、接着
剤2と溝31との間にトンネルTが形成され、圧着が進
行すると押しつぶされた接着剤2が溝31内に充填され
てトンネルTが塞がれる。
In the first embodiment, the member provided with the groove and the member to which the adhesive is applied are the same.
As shown in (1), a groove 31 may be provided on the transparent substrate side 3, and the adhesive 2 may be applied to the sealing member side 1. In this case, a tunnel T is formed between the adhesive 2 and the groove 31, and as the pressing proceeds, the crushed adhesive 2 is filled in the groove 31 to close the tunnel T.

【0025】(実施例2)図6に示すように、縦30m
m×横50mm×厚さ1.1mmのガラス板からなる封
止部材1を用い、その一方の短辺から2mm内側に入っ
た箇所に、この短辺と平行に長さ5mm、幅2mm、深
さ0.8mmの穴13を切削法により形成した。この穴
13の断面形状は、封止ラインに垂直な断面および封止
ラインに平行かつ封止部材に垂直な断面のいずれにおい
てもコの字状である。封止部材1の外周端から2mm内
側に、実施例1で使用したものと同じ接着剤を同じ条件
で塗布して、環状の封止ラインを作成した。この封止ラ
インは穴13を縦断しており、この箇所の接着剤2は穴
13内に塗布される。
(Embodiment 2) As shown in FIG.
A sealing member 1 made of a glass plate having a size of mx 50 mm wide x 1.1 mm thick is used, and a portion 5 mm inside, 2 mm wide and 2 mm deep in parallel with this short side is placed at a position 2 mm inside from one short side. A hole 13 having a thickness of 0.8 mm was formed by a cutting method. The cross-sectional shape of the hole 13 is a U-shape in both a cross section perpendicular to the sealing line and a cross section parallel to the sealing line and perpendicular to the sealing member. The same adhesive as that used in Example 1 was applied on the inner side of 2 mm from the outer peripheral end of the sealing member 1 under the same conditions to form an annular sealing line. This sealing line extends through the hole 13, and the adhesive 2 at this point is applied in the hole 13.

【0026】接着剤2の塗布幅は穴13の幅よりも狭
く、また図7(a)に示すように、穴13内に塗布され
た穴内接着剤22の上端は穴13の上端よりも低くなっ
ている。したがって、この封止部材1の上から透明基板
3を重ねると、穴13の上に位置する封止部材1と透明
基板3との間に封止空間Kおよび外部空間に連通するト
ンネルTが形成される。この状態から封止部材1と透明
基板3とを圧着すると、接着剤2が次第に押しつぶされ
て封止空間Kの体積が減少するとともに、封止空間K内
の気体がトンネルTを通じて外部空間に押し出される。
これにより封止空間Kの圧力上昇が防止される。図7
(b)に示すように、実施例1とは異なりこのトンネル
Tは圧着終了まで維持される。次いで、封止部材1と透
明基板2とを上下反転させると、穴内接着剤22が流下
し、図7(c)に示すように透明基板3に密着するとと
もに、図8に示すように一部は毛管現象により穴13の
両側へと広がる。これによりトンネルTが塞がれて封止
空間Kと外部空間とが遮断される。その後、紫外線を照
射して接着剤2を硬化させた。硬化後の接着剤2の幅は
2.5mm、厚さは100μmであった。
The application width of the adhesive 2 is smaller than the width of the hole 13, and the upper end of the in-hole adhesive 22 applied in the hole 13 is lower than the upper end of the hole 13 as shown in FIG. Has become. Therefore, when the transparent substrate 3 is overlaid on the sealing member 1, a tunnel T communicating with the sealing space K and the external space is formed between the sealing member 1 located on the hole 13 and the transparent substrate 3. Is done. When the sealing member 1 and the transparent substrate 3 are pressed against each other in this state, the adhesive 2 is gradually crushed to reduce the volume of the sealing space K, and the gas in the sealing space K is pushed out to the external space through the tunnel T. It is.
This prevents the pressure in the sealed space K from rising. FIG.
As shown in (b), unlike the first embodiment, the tunnel T is maintained until the end of the crimping. Next, when the sealing member 1 and the transparent substrate 2 are turned upside down, the adhesive 22 in the hole flows down and adheres to the transparent substrate 3 as shown in FIG. 7C, and partially as shown in FIG. Is spread on both sides of the hole 13 by capillary action. Thereby, the tunnel T is closed, and the sealed space K and the external space are shut off. Thereafter, the adhesive 2 was cured by irradiating ultraviolet rays. The width of the adhesive 2 after curing was 2.5 mm, and the thickness was 100 μm.

【0027】上記実施例1および実施例2により得られ
た有機EL素子を目視により評価したところ、図9に示
すように、いずれも封止ラインを形成する接着剤2の形
状に乱れは見られず、接着剤内外の空間を連通させるよ
うな気道は全く存在しなかった。また、封止ラインの幅
は、有機EL素子の周方向のどの位置でもほぼ同一であ
った。なお、図9は得られた有機EL素子を透明基板側
から見た状態を示す模式的平面図であって、符号3は透
明基板、符号4は有機EL積層膜を示す。
When the organic EL devices obtained in Examples 1 and 2 were visually evaluated, as shown in FIG. 9, the shape of the adhesive 2 forming the sealing line was disturbed. There was no airway at all that allowed the space inside and outside the adhesive to communicate. Further, the width of the sealing line was almost the same at any position in the circumferential direction of the organic EL element. FIG. 9 is a schematic plan view showing the obtained organic EL element as viewed from the transparent substrate side. Reference numeral 3 denotes a transparent substrate, and reference numeral 4 denotes an organic EL laminated film.

【0028】[0028]

【発明の効果】本発明の封止方法では、封止部材または
透明基板に溝または穴を設け、この溝または穴を利用し
て、封止部材と透明基板との圧着時に封止空間内の気体
を外へ逃がすための連通孔(トンネル)を形成する。こ
のトンネルにより、圧着時の封止空間の減少に伴う圧力
上昇が防止される。圧着が進行すると、あるいは圧着後
の反転工程において、この連通孔は接着剤により塞が
れ、封止ラインの内外空間が遮断される。
According to the sealing method of the present invention, a groove or a hole is provided in the sealing member or the transparent substrate, and the groove or the hole is used to pressurize the sealing member and the transparent substrate when the sealing member is pressed. A communication hole (tunnel) for allowing gas to escape to the outside is formed. This tunnel prevents a pressure increase due to a decrease in the sealing space at the time of crimping. As the press-bonding progresses or in a reversing step after the press-bonding, the communication holes are closed by the adhesive, and the inner and outer spaces of the sealing line are shut off.

【0029】なお、溝または穴を設ける本発明とは異な
り、例えば接着剤を塗布する際に途中でディスペンサか
らの接着剤の供給を一時的に停止することにより封止ラ
インの一部に接着剤の途切れ部を設けた場合にも、透明
基板と封止部材とを重ねた時点ではこの途切れ部により
トンネルが形成される。しかしこの方法によると、また
圧着時における接着剤の広がりを制御することが困難で
あるため、圧着時または圧着後にトンネルを確実に塞ぐ
ことができず封止不良が多発する。本発明の方法による
と、封止部材または透明基板に溝または穴を設けるとい
う簡単な方法により、内外空間を連通させるトンネルの
形成およびその遮断の時期を容易に制御し、さらにこの
遮断を確実に行うことができる。
Note that, unlike the present invention in which a groove or a hole is provided, for example, when the adhesive is applied, the supply of the adhesive from the dispenser is temporarily stopped in the middle to apply the adhesive to a part of the sealing line. When the transparent substrate and the sealing member are overlapped with each other, a tunnel is formed by the discontinuity. However, according to this method, it is difficult to control the spread of the adhesive at the time of crimping, so that the tunnel cannot be reliably closed at or after crimping, and sealing failure frequently occurs. According to the method of the present invention, by a simple method of providing a groove or a hole in the sealing member or the transparent substrate, it is possible to easily control the formation of the tunnel for communicating the inner and outer spaces and the timing of the blocking, and furthermore, to ensure the blocking. It can be carried out.

【図面の簡単な説明】[Brief description of the drawings]

【図1】図4のI−I線断面からみた実施例1の封止方
法を示すもので、(a)は配置工程、(b)は圧着工程
終了時を示す。
FIGS. 1A and 1B show a sealing method of Example 1 viewed from a cross section taken along line II of FIG. 4, wherein FIG. 1A shows an arrangement step and FIG.

【図2】(a)〜(c)は、本発明において封止部材に
設けられる溝の形状を例示する斜視図である。
FIGS. 2A to 2C are perspective views illustrating the shape of a groove provided in a sealing member in the present invention.

【図3】(a)および(b)は、本発明において封止部
材に設けられる穴の形状を例示する斜視図である。
FIGS. 3A and 3B are perspective views illustrating the shape of a hole provided in a sealing member in the present invention.

【図4】実施例1の封止方法に用いる封止部材を示す斜
視図である。
FIG. 4 is a perspective view illustrating a sealing member used in the sealing method according to the first embodiment.

【図5】実施例1の封止方法の他の例における配置工程
を示す断面図である。
FIG. 5 is a cross-sectional view illustrating an arrangement step in another example of the sealing method according to the first embodiment.

【図6】実施例2の封止方法に用いる封止部材を示す斜
視図である。
FIG. 6 is a perspective view illustrating a sealing member used in a sealing method according to a second embodiment.

【図7】図6の VII−VII 線断面からみた実施例2の封
止方法を示すもので、(a)は配置工程、(b)は圧着
工程終了時、(c)は反転工程終了時を示す。
7A and 7B show a sealing method according to the second embodiment viewed from a cross section taken along the line VII-VII in FIG. 6, wherein FIG. 7A shows an arrangement step, FIG. Is shown.

【図8】図7のVIII−VIII線断面図である。8 is a sectional view taken along line VIII-VIII in FIG.

【図9】実施例により得られた有機EL素子の封止ライ
ンを示す模式的平面図である。
FIG. 9 is a schematic plan view showing a sealing line of an organic EL element obtained in an example.

【図10】比較例により得られた有機EL素子の封止ラ
インを示す模式的平面図である。
FIG. 10 is a schematic plan view showing a sealing line of an organic EL element obtained in a comparative example.

【符号の説明】[Explanation of symbols]

1;封止部材、11;鍔部、12;溝、13;穴、2;
接着剤、21;窪み、22;穴内接着剤、3;透明基
板、4;有機EL積層膜
1; sealing member, 11; flange, 12; groove, 13; hole, 2;
Adhesive, 21; dent, 22; adhesive in hole, 3: transparent substrate, 4: organic EL laminated film

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 有機EL積層膜が形成された透明基板と
封止部材とが接着剤により一体化された有機EL素子の
封止方法であって、上記透明基板および上記封止部材の
いずれか一方の部材に接着剤を塗布して封止ラインを形
成する塗布工程と、該接着剤が塗布された上記一方の部
材を他方の部材と重ね合わせる配置工程と、上記一方の
部材と上記他方の部材とを圧着する圧着工程とを備え、 上記一方の部材および上記他方の部材のうち少なくとも
一方には上記配置工程において上記封止ラインの内外空
間を連通させるトンネルを形成するための溝が設けられ
ており、上記圧着工程において上記内外空間の連通が上
記接着剤により遮断されることを特徴とする有機EL素
子の封止方法。
1. A method for sealing an organic EL element in which a transparent substrate on which an organic EL laminated film is formed and a sealing member are integrated by an adhesive, wherein the transparent substrate and any of the sealing members are provided. A coating step of forming a sealing line by applying an adhesive to one of the members, an arranging step of superimposing the one member to which the adhesive has been applied on the other member, and the one member and the other of the other members A crimping step of crimping the member and at least one of the one member and the other member is provided with a groove for forming a tunnel communicating the inner and outer spaces of the sealing line in the disposing step. Wherein the communication between the inner and outer spaces is interrupted by the adhesive in the pressing step.
【請求項2】 上記一方の部材は上記封止部材であり、
上記溝は該封止部材に設けられている請求項1記載の有
機EL素子の封止方法。
2. The one member is the sealing member,
The method according to claim 1, wherein the groove is provided in the sealing member.
【請求項3】 有機EL積層膜が形成された透明基板と
封止部材とが接着剤により一体化された有機EL素子の
封止方法であって、上記透明基板および上記封止部材の
いずれか一方の部材に接着剤を塗布して封止ラインを形
成する塗布工程と、該接着剤が塗布された上記一方の部
材を他方の部材とを重ね合わせる配置工程と、上記一方
の部材と上記他方の部材とを圧着する圧着工程と、圧着
された上記一方の部材と上記他方の部材とを上下反転さ
せる反転工程を備え、 上記封止ラインを構成する上記接着剤の一部は上記一方
の部材に設けられた穴内に塗布されており、上記配置工
程において該穴の上に上記封止ラインの内外空間を連通
させる空隙が形成され、上記穴内に塗布された上記接着
剤が上記反転工程において流下することにより上記内外
空間の連通が遮断されることを特徴とする有機EL素子
の封止方法。
3. A method for sealing an organic EL element in which a transparent substrate on which an organic EL laminated film is formed and a sealing member are integrated by an adhesive, wherein the transparent substrate and one of the sealing members are provided. An application step of applying an adhesive to one member to form a sealing line, an arranging step of overlapping the one member coated with the adhesive with the other member, and the one member and the other And a reversing step of reversing the crimped one member and the other member up and down, and a part of the adhesive forming the sealing line is the one member Is formed in the hole provided in the hole, and a gap is formed on the hole in the arrangement step to communicate the inner and outer spaces of the sealing line, and the adhesive applied in the hole flows down in the inversion step. By doing the above Method of sealing the organic EL element characterized in that the communication of the outer space is blocked.
【請求項4】 上記一方の部材は上記封止部材である請
求項3記載の有機EL素子の封止方法。
4. The method according to claim 3, wherein the one member is the sealing member.
JP33264499A 1999-11-24 1999-11-24 Organic el element sealing method Pending JP2001155854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33264499A JP2001155854A (en) 1999-11-24 1999-11-24 Organic el element sealing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33264499A JP2001155854A (en) 1999-11-24 1999-11-24 Organic el element sealing method

Publications (1)

Publication Number Publication Date
JP2001155854A true JP2001155854A (en) 2001-06-08

Family

ID=18257271

Family Applications (1)

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Country Link
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002050925A1 (en) * 2000-12-20 2002-06-27 Koninklijke Philips Electronics N.V. Device, particularly an electroluminescent display device, and method of manufacturing such a device
JP2004103337A (en) * 2002-09-06 2004-04-02 Semiconductor Energy Lab Co Ltd Light-emitting device and its manufacturing method
JP2006286412A (en) * 2005-03-31 2006-10-19 Sanyo Electric Co Ltd Manufacturing method for light emitting panel and manufacturing method for display panel
JP2010238678A (en) * 2010-07-28 2010-10-21 Semiconductor Energy Lab Co Ltd Method of manufacturing light emitting device, and light emitting device
JP2012043582A (en) * 2010-08-17 2012-03-01 Shin-Etsu Engineering Co Ltd Lamination body and method of manufacturing the same
US8383455B2 (en) 2005-12-23 2013-02-26 E I Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002050925A1 (en) * 2000-12-20 2002-06-27 Koninklijke Philips Electronics N.V. Device, particularly an electroluminescent display device, and method of manufacturing such a device
JP2004103337A (en) * 2002-09-06 2004-04-02 Semiconductor Energy Lab Co Ltd Light-emitting device and its manufacturing method
JP2006286412A (en) * 2005-03-31 2006-10-19 Sanyo Electric Co Ltd Manufacturing method for light emitting panel and manufacturing method for display panel
JP4592476B2 (en) * 2005-03-31 2010-12-01 三洋電機株式会社 Manufacturing method of light emitting panel and manufacturing method of display panel
US8383455B2 (en) 2005-12-23 2013-02-26 E I Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
JP2010238678A (en) * 2010-07-28 2010-10-21 Semiconductor Energy Lab Co Ltd Method of manufacturing light emitting device, and light emitting device
JP2012043582A (en) * 2010-08-17 2012-03-01 Shin-Etsu Engineering Co Ltd Lamination body and method of manufacturing the same

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