JP2001155130A - Ic chip pre-alignment jig for non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pre-alignment jig which does not have any chip off of an IC chip in the case of mounting the IC chip on a non-contact IC card board by a flip chip mounting, can easily deal with size change and further performs rough positioning of the IC chip not having the chip protruding or falling from a stage. SOLUTION: This jig is provided with a pre-alignment stage 4 having a size that the IC chip 1 to be mounted is not protruded from the stage 4, and a positioning part 3 having a structure of two upper and lower stages. The chip 1 to be pre-aligned is mounted on the stage 4, then the positioning part 3 is pushed out from the four side of the pre-alignment stage, thereby positioning the IC chip.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method for mounting a semiconductor device on a substrate, and more particularly to a pre-positioning method for roughly positioning a semiconductor device on a substrate for a non-contact IC card by flip-chip mounting before mounting the IC chip. The present invention relates to a pre-alignment jig suitable for an alignment step.

[0002]

2. Description of the Related Art Conventionally, IC cards equipped with IC chips for storing and processing important and large amounts of data, such as cash cards and ID cards, have become widespread. In recent years, I
Not only a contact-type IC card that connects and uses an external terminal of a C card and an external terminal, but also a built-in antenna, and a non-contact type that exchanges data with external devices in a non-contact manner by radio waves or electrostatic coupling The use of IC cards is increasing, and the demand is increasing for reasons such as the necessity of taking out and inserting the card and the reduction of maintenance of external terminals.

In a non-contact IC card, a substrate on which an IC chip is mounted must be accommodated within the limited thickness of the card, and a polyethylene terephthalate (PET) resin or polyimide is used for cost reduction. 2. Description of the Related Art A film substrate is used in which a circuit pattern of copper, aluminum, silver paste or the like is formed on a film of a resin or the like by etching or printing.

An IC chip mounted on a film substrate is called a COF (Chip On Film). A method in which the surface of the IC chip is mounted with the surface facing the substrate side is called a flip chip mounting method. As a typical example, for example, an IC chip (1) and a circuit pattern (9) as shown in FIG. With an anisotropic conductive film (hereinafter ACF: An
isotropic Conductive Film
(7).

ACF (7) is an adhesive material in which conductive particles (8) such as plastic coated with nickel or metal are dispersed in an adhesive such as an epoxy resin, and the process of melting and curing the adhesive by heating. Conductive particles by pressurizing (8)
Are held on the bumps (2) of the IC chip (1) and the wiring pattern (9) of the substrate (10), and the conductivity is obtained in the vertical direction and the insulating property is obtained because the particles exist alone in the horizontal direction. A
Since the CF (7) also has a role of sealing between the IC chip (1) and the substrate (10), it is widely used because it can reduce the number of manufacturing steps.

Further, a liquid-like anisotropic conductive paste (ACP: Anisotropic Con
There is also a method of mounting using an underfill agent or the like that does not contain conductive particles.

In a normal flip chip mounting line, first, an adhesive material such as ACF is temporarily attached or applied to a substrate on which an IC chip is mounted, and the substrate moves to an IC chip temporary placing step. The IC chip temporary placement step is a step of accurately aligning the IC chip and the substrate in units of several μm and temporarily placing the IC chip on the substrate. Therefore, first, the IC chip is taken out from the IC chip tray storing the IC chip by the suction tool. However, I in the chip tray
The C chips are housed in grooves (12) in a chip tray (11) formed slightly larger than the size of the IC chip (1) as shown in FIG. I have. Further, in the state of being housed in the chip tray (11), the circuit surface on which the bumps (2) of the IC chip (1) are formed is placed upward so that the circuit surface is housed so as not to be damaged. Therefore, before positioning the IC chip, it is necessary to turn the IC chip upside down using an IC chip reversing mechanism so that the upward circuit surface faces downward, and then roughly position the IC chip.

[0008] After the rough positioning, the substrate on which the aligned IC chip is temporarily placed is transferred to the IC chip final pressing step. For example, when ACF is used as an adhesive material, the substrate is heated by a heater head of a mounting machine. And IC by pressure
A chip is mounted. In some cases, the IC chip is pressure-bonded while being adsorbed on the heater head side of the mounting machine. Therefore, the IC chip temporary placement step and the IC chip main pressure bonding step may be performed simultaneously.

The rough positioning in the IC chip temporary placement step is performed by, for example, a pre-alignment jig as shown in FIG. 4, and the IC chip (1) to be positioned is placed in a pre-alignment stage (4). After being mounted on the pre-alignment stage (4) as shown in FIG. There are other rough positioning methods, but the positioning method shown in FIG. 4 is a positioning jig (3).
Since it can be positioned simply by pushing it in, it has the advantage of shortening the tact time, and is widely used in mass-production machines and the like.

However, the pre-alignment jig as shown in FIG. 4 directly touches the IC chip (1) when the positioning jig (3) is completely cut off, so that excessive force is applied to the IC chip (1). As a result, the IC chip (1) may be missing. In addition, IC chips used for non-contact IC cards have an outer shape of about 1 to 7 mm square depending on the specifications,
When a pre-alignment jig as shown in FIG. 4 is used, the amount of movement of the positioning unit (3) is adjusted when changing the chip size. It is difficult to adjust the moving amount of the positioning unit (3) due to the above-mentioned lacking problem. If the size of the four positioning units (3) is changed instead of adjusting the moving amount, the cost is increased. There was a problem that it would take.

For this reason, in mounting an IC chip on a non-contact IC card, for example, an alignment jig having a shape as shown in FIG. 5 is used. With the shape shown in FIG. 5, the positioning jig (3) hits the pre-alignment stage (4) when it is pushed out, so that no excessive force is applied to the IC chip (1). Also, when the size of the IC chip (1) changes, the size of the central pre-alignment stage (4) is changed, and the amount of movement of the positioning unit (3) is adjusted so as to collide with the pre-alignment stage (4). By adjusting, rough positioning of various types of IC chips is supported.

[0012]

However, in the rough positioning using the pre-alignment jig during the IC chip temporary placement step as shown in FIG. 5, the IC chip (1)
The chip alignment and chip size change can be located without any problem. However, the pre-alignment stage (4) is often several hundred μm larger than the IC chip (1), and especially the small IC. In the case of a chip, there is a problem that when the IC chip taken out of the chip tray and passed through the reversing mechanism is mounted on the pre-alignment stage (4) by the tool head, the IC chip (1) protrudes from the stage. there were.
When the IC chip (1) protrudes, it falls from the pre-alignment stage (4), or when the bump (2) of the protruded IC chip (1) is pushed in by the positioning part (3), the pre-alignment stage (4). Contact the corner)
The bump (2) was sometimes damaged or missing.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for mounting an IC chip on a non-contact IC card substrate by flip chip mounting. To provide a pre-alignment jig that can easily cope with a change in chip size without chipping, and that roughly positions the IC chip without protruding or falling off the stage. It is in.

[0014]

In order to achieve the above object, according to the present invention, first, when an IC chip is mounted on a non-contact IC card substrate by flip chip mounting, the IC chip is mounted. A pre-alignment jig for rough positioning is equipped with a pre-alignment stage with an area large enough to prevent the mounted IC chip from protruding, and an IC chip for pre-alignment with a positioning part having a two-level structure in upper and lower stages. Provided is an IC chip pre-alignment jig for a non-contact IC card, which is mounted on a pre-alignment stage and then positioned by extruding a positioning portion from all sides of the pre-alignment stage.

With this jig, it is possible to easily cope with a change in chip size without chipping the IC chip, and furthermore, the IC chip protrudes from the stage.
Rough positioning can be performed without falling.

[0016]

Embodiments of the present invention will be described below. 1A and 1B show an embodiment of an IC chip pre-alignment jig for a non-contact IC card according to the present invention, wherein FIG. 1A is a sectional view and FIG. 1B is an external view.

In a normal flip chip mounting line, an adhesive material such as an ACF is temporarily attached to a substrate on which an IC chip is mounted in a process prior to an IC chip temporary placing process in which the pre-alignment jig shown in FIG. 1 is used. Or it is applied.
The IC chip temporary placement step is a step of accurately aligning the IC chip and the substrate in units of several μm and temporarily placing the IC chip on the substrate. Therefore, first, the IC chip is taken out of the IC chip tray storing the IC chip by using a suction tool (not shown). However, as shown in FIG. 3, the IC chips in the chip tray (1) are slightly larger than the size of the IC chip (1).
Since they are housed in the grooves (12) in (1), they are slightly separated. In addition, chip tray (1
In the state accommodated in 1), the circuit surface on which the bumps (2) of the IC chip (1) are formed is placed upward and accommodated so that the circuit surface is not damaged. Therefore, the IC chip (1) is turned upside down using a reversing mechanism so that an upward circuit surface faces downward, and then a suction tool (not shown) is moved to a pre-alignment jig shown in FIG. ).

The IC chip (1) carried by the suction tool is mounted on a pre-alignment stage (4). A chip suction hole may be formed in the pre-alignment stage (4) due to the delivery of the chip to the suction tool. Usually, the material of the pre-alignment stage (4) is metal. As shown in FIG. 1B, the IC chip (1) mounted on the pre-alignment stage (4) is positioned by pushing the IC chip (1) from all sides of the pre-alignment stage (4) by the positioning portion (3). . Since the pushing of the positioning section (3) can be normally performed by opening and closing air, rough positioning can be performed with a short tact time of 1 second or less. Usually, the material of the positioning portion (3) is also metal.

As shown in FIG. 1, the configuration of a pre-alignment stage (4) having an area of a size such that the mounted IC chip (1) does not protrude, and a positioning unit (3) having a two-stage structure in upper and lower stages. Then, when the positioning portion (3) is pushed completely, the IC chip (1) is not directly touched and the lower side collides with the pre-alignment stage (4), so that no excessive force is applied to the IC chip (1). And the IC chip (1) is not chipped.

Further, an IC used for a non-contact IC card
Since the chip has an outer shape of about 1 to 7 mm square depending on the specification, when changing the chip size, the size of the central pre-alignment stage (4) is changed, and the positioning portion (3) is brought into contact with the pre-alignment stage (4). By simply adjusting the amount of movement described in (1), rough positioning of various types of IC chips can be supported. Therefore, it is not necessary to change the size of the four positioning portions (3).

Further, a pre-alignment stage (4)
Is sufficiently larger than the area of the chip, and particularly when roughly positioning a small chip, when the IC chip having passed through the reversing mechanism is mounted on the pre-alignment stage (4) by the suction tool, the IC chip (1) Does not protrude from the stage or fall.

After the rough positioning with the pre-alignment jig is completed, the substrate on which the IC chip is temporarily placed after the accurate alignment is transferred to the IC chip final bonding step, for example, using ACF as an adhesive material. In this case, the IC chip is mounted by heating and pressurization by the heater head of the mounting machine. In some cases, the IC chip is pressure-bonded while adsorbing on the heater head side of the mounting machine.
In some cases, the C chip final pressure bonding step may be performed simultaneously.

[0023]

The present invention will be described below in detail with reference to examples. <Embodiment 1> Using the IC chip temporary placement process section of a normal non-contact IC card IC chip mounting machine, FIGS.
A rough positioning experiment of the IC chip was performed using a pre-alignment jig as shown in FIG. The size of the IC chip is 5mm × 5mm, 260μm, and the number of bumps is 4
1.5mm x 2mm, 150μ thick
m and two bumps were used. 10 samples each
Performed with 0 pieces.

In the experiment, first, the IC chip was taken out from the IC chip tray containing the IC chip by using a suction tool. However, the IC chips in the chip tray are housed in grooves (12) in the chip tray (11) formed slightly larger than the size of the IC chip (1) as shown in FIG. It is placed apart.

In the state where the IC chip (1) is housed in the chip tray (11), the circuit surface of the IC chip (1) on which the bumps (2) are formed is placed upward so that the circuit surface is not damaged. . Therefore, the IC chip (1) is turned upside down using a reversing mechanism so that the upward circuit surface faces downward, and then is moved to a pre-alignment jig for rough positioning by a suction tool (not shown). Transported.

The IC chip carried by the suction tool was mounted on a pre-alignment stage (4). The material of the pre-alignment stage (4) was made of metal. IC mounted on pre-alignment stage (4)
The chip (1) was positioned by being pushed in from all sides of the pre-alignment stage (4) by the positioning section (3). The material of the positioning part (3) is also metal.

The IC chips roughly positioned by the pre-alignment jig were not collected in the next step, but were carefully collected one by one with vacuum tweezers, and observed with a microscope.

In the experiment, 100 IC chips of 5 mm × 5 mm were positioned, and then a pre-alignment jig was adjusted, and then 1.5 mm × 2 mm was positioned. This is to compare the ease of adjusting the pre-alignment jig when changing the chip size.

First, as shown in FIG. 4, a pre-alignment stage (4) having an area larger than the IC chip (1) to be mounted and a pre-alignment jig having a positioning unit (3) composed of one stage are used. A positioning experiment was performed.

In the jig shown in FIG. 4, when the positioning jig (3) is completely pushed, it directly touches the IC chip (1).
Force is applied to the IC chip (1) more than necessary, and when observed with a microscope, 50 IC chips of 5 mm length × 5 mm width and IC chips 80 of 1.5 mm length × 2 mm width are observed.
In some cases, the IC chip (1) was missing. In addition, when the chip size is changed, the movement amount of the positioning unit (3) must be adjusted. However, it is difficult to adjust the position, and the 1.5 mm × 2 mm IC chip (1) after the movement amount is adjusted as described above. The chip of IC chip (1) has increased.

Since the pre-alignment stage (4) is sufficiently larger than the area of the chip, when the IC chip that has passed through the reversing mechanism is mounted on the pre-alignment stage (4) by the suction tool when rough positioning is performed, IC
The chip (1) did not protrude from the stage or fell.

Next, as shown in FIG. 5, a pre-alignment stage (4) having an outer shape 300 μm larger than the outer shape of the IC chip (1) to be mounted and a pre-alignment stage (3) having a one-stage structure. A positioning experiment was performed using the alignment stage (4).

In the configuration as shown in FIG. 5, when the positioning portion (3) is completely pushed, it does not directly touch the IC chip (1) but hits the pre-alignment stage (4).
No force is applied to the IC chip (1) more than necessary,
The IC chip (1) was not missing.

When the chip size is changed, the size of the center pre-alignment stage (4) is changed, and the amount of movement of the positioning portion (3) is adjusted so as to hit the pre-alignment stage (4). Was able to respond to. There was no need to change the size of the four positioning parts (3).

However, the pre-alignment stage (4)
Is not sufficiently larger than the chip area,
When roughly positioning an IC chip having a size of 2 mm × 2 mm, when the IC chip having passed through the reversing mechanism is mounted on the pre-alignment stage (4) by a suction tool, I
The C chip (1) protruded from the stage, and 20 bumps were scratched or missing, and 5 bumps were dropped.

Finally, as shown in FIG. 1, a pre-alignment stage (4) having an area four times or more the size of an IC chip to be mounted, and a positioning unit (3) having a two-stage structure in upper and lower stages
A positioning experiment was performed using a pre-alignment jig having the above configuration.

In this case, when the positioning jig (3) is pushed completely, the IC chip (1) is not directly touched, and the lower side collides with the pre-alignment stage (4). No IC chip (1) was missing without force.

When the chip size is changed, it is only necessary to change the size of the central pre-alignment stage (4) and adjust the amount of movement of the positioning unit (3) so as to hit the pre-alignment stage (4). , And could easily respond to chip size changes. There was no need to change the size of the four positioning parts (3).

Further, a pre-alignment stage (4)
Is sufficiently larger than the area of the chip, so that when roughly positioning a 1.5 mm × 2 mm chip, the IC chip that has passed through the reversing mechanism is mounted on the pre-alignment stage (4) by the suction tool. Also, the IC chip (1) did not protrude from the stage or fell.

Therefore, the pre-alignment jig according to the present invention does not chip the IC chip and can cope with a change in the size of the IC chip as compared with the pre-alignment jig of another configuration. It was confirmed that rough positioning could be performed without damaging the bumps of the IC chip.

[0041]

According to the present invention, when an IC chip is mounted on a non-contact IC card substrate by flip chip mounting,
A pre-alignment jig for roughly positioning an IC chip includes a pre-alignment stage having an area four times or more the size of an IC chip to be mounted, and a positioning portion having a two-stage structure in a vertical direction. After the IC chip to be aligned is mounted on the pre-alignment stage, the positioning can be performed by pushing out the positioning portion from all sides of the pre-alignment stage, so that the IC chip is not chipped and the size of the pre-alignment stage is reduced. It is possible to easily respond to a change in chip size by simply changing the size of the IC chip, and it is possible to roughly position the IC chip without protruding or falling off the stage.

[Brief description of the drawings]

FIGS. 1A and 1B are cross-sectional views illustrating one embodiment of a pre-alignment jig according to the present invention, and FIG. 1B is a plan view.

FIG. 2 is an explanatory sectional view showing a method of mounting an IC chip on a non-contact IC card substrate by flip-chip mounting using a conventional anisotropic conductive film.

FIG. 3 is an explanatory view showing the appearance of a chip tray in which IC chips are stored.

FIG. 4 shows an example of a conventional pre-alignment jig.
(A) is a sectional explanatory view, and (b) is a plan explanatory view.

5A and 5B show another example of a conventional pre-alignment jig. FIG. 5A is a sectional view and FIG. 5B is a plan view.

[Explanation of symbols]

1 IC chip 2 IC chip bump 3 Preposition alignment jig positioning section 4 Prealignment jig prealignment stage 5 Operation direction of prealignment jig positioning section 6の 下 Lower end of positioning portion of pre-alignment jig 7 ‥‥ ACF 8 ‥‥ ACF conductive particles 9 粒子 Circuit pattern of non-contact IC card substrate 10 ‥‥ Non-contact IC card substrate 11 ‥‥ Chip Tray 12 ‥‥ Groove of chip tray

Claims (1)

[Claims] 1. A pre-alignment jig for roughly positioning an IC chip when the IC chip is mounted on a non-contact IC card substrate by flip chip mounting.
It has a pre-alignment stage with a size that does not protrude the IC chip to be mounted, and a positioning part having a two-stage structure in the upper and lower stages. After mounting the IC chip to be pre-aligned on the pre-alignment stage, IC for non-contact IC card, characterized in that it is positioned by pushing out a positioning portion from
Chip pre-alignment jig.