JP2000276569A - Ic chip and memory medium having the same built in - Google Patents

Ic chip and memory medium having the same built in

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Publication number
JP2000276569A
JP2000276569A JP8345199A JP8345199A JP2000276569A JP 2000276569 A JP2000276569 A JP 2000276569A JP 8345199 A JP8345199 A JP 8345199A JP 8345199 A JP8345199 A JP 8345199A JP 2000276569 A JP2000276569 A JP 2000276569A
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Prior art keywords
antenna
chip
non
ic chip
ic
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JP8345199A
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JP4349597B2 (en
Inventor
Masao Gokami
昌夫 後上
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Dainippon Printing Co Ltd
大日本印刷株式会社
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Abstract

PROBLEM TO BE SOLVED: To reduce the cost of an IC chip for memory medium such as a non- contact IC card and a non-contact tag and to improve the reliability. SOLUTION: A dedicated chip 30 provided with an antenna is obtained by forming an antenna on a general purpose IC chip by rewiring by means of electroplating or the like. It is possible to manufacture a memory medium such as a non-contact IC card 20 and a non-contact tag simply by embedding the chip in a card and a tag without having to use a conventional antenna sheet or a dedicated mounting substrate with an antenna.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、外部装置と非接触方式でデータの送受信を行う非接触ICカード、非接触ICタグ等のメモリー媒体用のICチップ、並びにそのICチップを搭載したメモリー媒体の技術分野に属する。 The present invention relates to an external device and the non-contact IC card to transmit and receive data in a non-contact manner, IC chip for memory medium such as a non-contact IC tag, as well as memory medium mounted with the IC chip belonging to the technical fields.

【0002】 [0002]

【従来の技術】従来、種々の情報分野でICカードが利用されているが、読取り機などの外部装置と機械的な接続を行う接触式ICカードから、利便性、耐久性を向上させるため、最近では、外部装置と接触することなしに近づくだけでデータの送受信を行えるようにした非接触方式のICカードが知られている。 Conventionally, although the IC card has been used in various information fields, from the contact type IC card with external devices mechanical connection, such as a reader, in order to improve usability, durability, recently, IC cards of the non-contact scheme to allow transmission and reception of data only approaches without contacting with an external apparatus is known.

【0003】 [0003]

【発明が解決しようとする課題】上記のような非接触I THE INVENTION Problems to be Solved] contactless I as above
Cカードで当初考えられたのは、アンテナをカード基体内に形成するタイプであったため、製造工程が複雑で、 The was initially thought by C card, because of a type forming an antenna in the card body, the manufacturing process is complex,
製造物の良品率が上がらなかった。 The yield rate of the product did not go up. そこで、別の形態として、ICチップが搭載される基板にアンテナを直接形成するようにし、アンテナを備えたICモジュールをカード或いはタグに挿入する方式が考えられた。 Therefore, as another form, so as to form an antenna directly on the substrate on which the IC chip is mounted, a method of inserting the IC module with an antenna on the card or tag is considered. しかしながら、この方式の非接触ICカードや非接触ICタグなどのメモリ媒体は、部品点数が多く製造工程も長いため、コストが高いという欠点があり、本格的な普及に際して大きな障害となっていた。 However, the memory medium such as a non-contact IC card and non-contact IC tag of this method, since many longer manufacturing process parts, has the drawback of high cost, has been a major obstacle when full-scale popularization.

【0004】 [0004]

【課題を解決するための手段】上記の問題点を解決するために、本発明は、最低限度の部品点数で非接触ICカードや非接触ICタグを製造することとし、これによりコストダウンを図り、信頼性を向上させるようにした。 In order to solve the above problems SUMMARY OF THE INVENTION The present invention is directed to it to produce a non-contact IC card and contactless IC tag minimum number of components, thereby achieving cost reduction and so as to improve the reliability.

【0005】 [0005]

【発明の実施の形態】本発明のICチップは、非接触I IC chips of the embodiment of the present invention, the non-contact I
Cカード、非接触ICタグ等のメモリー媒体用のICチップであって、データの送受信を行うアンテナをチップ自体に設けたことを特徴とする。 C card, an IC chip for memory medium such as a non-contact IC tag, characterized in that an antenna for transmitting and receiving data to the chip itself.

【0006】すなわち、回路が形成された汎用のICチップに、電気メッキ等の再配線でアンテナを形成することで、アンテナ付きの専用チップを得るようにしたため、従来のアンテナシートや、専用のアンテナ付き実装基板を用いる必要がなく、カードやタグに埋め込むだけで、非接触ICカードや非接触ICタグなどのメモリー媒体を製造することができる。 Namely, a general-purpose IC chip having a circuit formed, by forming the antenna in redistribution of such electroplating, since to obtain a dedicated chip with an antenna, and the conventional antenna sheets, dedicated antenna it is not necessary to use a mounting board attached, only embedded in the card or tag, it is possible to produce a memory medium such as a non-contact IC card and non-contact IC tag.

【0007】チップ自体にアンテナを形成するに際しては、チップにおける回路形成のなされた部分の上に絶縁層を形成し、当該絶縁層上にメッキによる配線でアンテナを形成してもよいし、或いは、チップにおける回路面を除いた部分にメッキによる配線でアンテナを形成するようにしてもよい。 [0007] In forming the antenna on the chip itself, the insulating layer is formed on the made part of the circuit formed in the chip, it may be formed of the antenna wiring by plating is formed over the insulating layer, or, it may be formed of the antenna wiring by plating the portion excluding the circuit surface of the chip. また、アンテナは、その通信距離や外部装置の特性に応じて、それぞれ間に絶縁層を挟んだ複数のアンテナ層でアンテナを構成することも可能である。 In addition, an antenna, according to the characteristics of the communication distance and an external device, it is also possible to configure the antenna in multiple antenna layer sandwiching an insulating layer between each.

【0008】また、チップ自体に直接アンテナを形成するため、球状の半導体のような実装基板との接続方法が確立されていない将来の半導体も、容易にICカードやタグに加工することができる。 [0008] To form the antennae directly on the chip itself, the future connection to the mounting substrate such as a spherical semiconductor is not established semiconductor can also be easily processed into an IC card or tag.

【0009】本発明では、アンテナとのインターフェイス回路を有したウェファ状態の非接触ICカード用IC [0009] In the present invention, IC for non-contact IC card of the wafer state having the interface circuit of the antenna
チップ、若しくは非接触ICタグ用ICチップ上に絶縁層を介して、再度配線を形成することでアンテナを形成する。 Chip, or via an insulating layer on the non-contact IC tag IC chip, to form the antenna by forming a wiring again. その製造工程を図面を参照して以下に説明する。 The manufacturing process will be described with reference to drawings below.

【0010】第1の工程では、図1(a)に示すように、ウェファ状態のICチップ10におけるアンテナとの接続部を除いた部分、すなわちAl回路配線パターン11の上に、ポリイミド、SiN等をコーティングすることによりパッシベーション膜12を形成する。 [0010] In the first step, as shown in FIG. 1 (a), the portion excluding the connection portion between the antenna of the IC chip 10 of the wafer state, that is, on the Al circuit wiring patterns 11, polyimide, SiN, etc. to form a passivation film 12 by coating. この工程の代わりに、半導体メーカーにて予めパッシベーション膜12が形成されたウェファを購入してもよい。 Instead of this process, it may be purchased in advance wafer passivation film 12 is formed by a semiconductor manufacturer.

【0011】第2の工程では、チップ回路の接続部との導通確保と、次工程で形成する絶縁層の密着性を高めるため、図1(b)に示すように、パッシベーション膜1 [0011] In the second step, to increase the conduction ensured between the connection portion of the chip circuitry, the adhesion of the insulating layer formed in the next step, as shown in FIG. 1 (b), a passivation film 1
2を覆うようにしてウェファ上にシード層13を形成する。 To cover 2 to form a seed layer 13 on the wafer by. これは具体的には、スパッタ装置を使用して、T It is specifically using a sputtering apparatus, T
i、Ta、TiN、TaN、Cu等の金属薄膜を0.2 i, Ta, TiN, TaN, a metal thin film such as Cu 0.2
μm程度の厚さで形成する。 It formed in the order of μm thick.

【0012】第3の工程では、図1(c)に示すように、シード層13の上にフォトレジスト14をパターニングする。 [0012] In a third step, as shown in FIG. 1 (c), patterning the photoresist 14 on the seed layer 13. 手順としては、まず、フォトレジストをスピンコーターにより全面塗布する。 The procedure, first, the entire surface coated with a photoresist by a spin coater. 使用するフォトレジストは必要とされる膜厚に応じて最適な粘度のものを選択する。 The photoresist is chosen for an optimal viscosity depending on the film thickness required to use. 次いで、必要な機能を有するアンテナのパターンを形成したフォトマスクを使用し、アライメント露光によりフォトレジストの焼付けを行う。 Then, using a photomask formed with a pattern of an antenna having the required functionality, subjected to baking of the photoresist by the alignment exposure. フォトレジストは、解像度、安定性を考慮して、ポジ型を用いるのが好ましい。 Photoresist resolution, taking into account the stability, it is preferable to use a positive type. 露光後、現像によりフォトレジストの未硬化部分を除去する。 After exposure, to remove the uncured portion of the photoresist by development.

【0013】第4の工程では、図1(d)に示すように、電解銅メッキによりパターン状のアンテナ15を形成し、メッキ後にフォトレジスト14を水酸化ナトリウム等のアルカリにより剥離する。 [0013] In the fourth step, as shown in FIG. 1 (d), by electrolytic copper plating to form a patterned antenna 15, the photoresist 14 after plating is removed by an alkali such as sodium hydroxide. メッキ厚は10μm以上とする。 Plating thickness shall not be less than 10μm. レジスト剥離は、酸素プラズマ等のドライプロセスで行ってもよい。 Resist stripping may be performed in a dry process such as oxygen plasma.

【0014】第5の工程では、図1(e)に示すように、シード層12をハロゲン系のガスを用いて反応性イオンエッチングにより除去する。 [0014] In the fifth step, as shown in FIG. 1 (e), it is removed by reactive ion etching using the seed layer 12 of the halogen-containing gas. この際、アンテナ15 In this case, the antenna 15
のパターンも同時にエッチングされるが、厚みが10μ Of but patterns are etched at the same time, 10 [mu] thickness
m以上あるため機能上は問題ない。 Function on there is no problem because there is more than m.

【0015】また、通信距離や外部装置の特性によっては、上記で形成したアンテナのみでは通信ができない場合があるが、このような場合は、上記の工程を繰り返して行うことにより、2層以上のアンテナ層でアンテナを構成するとよい。 Further, the characteristics of the communication distance and the external device, with only an antenna formed in the above it may not be communicating, but such cases, by repeating the above process, two or more layers You may configure the antenna in the antenna layer. 具体的には、各アンテナ層の接続と導通を行うために、下となるアンテナ層の上にスピンコーター等により絶縁層を形成してから、例えば炭酸ガスレーザーを用いたレーザー加工により当該絶縁層を一部除去して下のアンテナ層を露出させた後、上述した工程を再度行って上のアンテナ層を形成する。 More specifically, in order to perform the continuity and connection of the antenna layer, after forming the insulating layer by a spin coater or the like on the antenna layer serving as a lower, for example, the insulating layer by laser processing using a carbon dioxide laser after exposing the antenna layers below partially removed to form an antenna layer above by performing the above steps again. このようなアンテナ層間の接続部は、レーザー加工以外にも切削などの機械的な加工方法で形成してもよいし、或いは、レジストなどで接続部となる部位をマスクし、絶縁層を塗布形成した後に、レジストを剥離することで形成してもよい。 Connection of such an antenna layers may be formed by mechanical processing methods such as even cutting in addition to the laser processing, or the resist mask the site to which the connection portion or the like, coating an insulating layer after it may be formed by removing the resist.

【0016】以上の工程で、ウェファ上の個々のICチップ10にパターン状のアンテナ15が形成されたわけであるが、本発明では、チップ保護のため、図1(f) [0016] In the above process, but not a pattern of the antenna 15 to each of the IC chips 10 on the wafer is formed, in the present invention, for chip protection, FIG 1 (f)
に示すように、封止樹脂16によるモールドを行う。 As shown in, performing the molding by the sealing resin 16. 具体的には、ウェファの表面にメタル孔版によるシルクスクリーン印刷方式によりエポキシ樹脂を塗布する。 Specifically, applying the epoxy resin by the screen printing method using a metal stencil to the surface of the wafer. これにより、カード、タグ等にICチップを実装したときに、外部応力やチップ回路の腐蝕に対する耐久性が向上する。 Thus, the card, when mounting the IC chip to the tag or the like, thereby improving durability against corrosion of the external stress and chip circuits. ここで、ICチップを内蔵するメモリー媒体の厚み上の制約が許せば、トランスファーモールドによりウェファの表裏を樹脂封止することで、樹脂の硬化収縮の際のそりや残留応力を防止して一層の信頼性向上を期待できる。 Here, permitting restrictions on the thickness of the memory medium having a built-in IC chip, the front and back of the wafer by a transfer molding by resin sealing, further to prevent warping and residual stress during resin cure shrinkage It can be expected to improve the reliability.

【0017】最後に、それぞれにアンテナの形成されたICチップをウェファから切り出して、カード、タグ等のメモリー媒体に実装する。 [0017] Finally, an IC chip formed of the antenna on each excised from the wafer, be mounted card, the memory medium such as a tag.

【0018】図2は本発明のICチップをカードに実装して非接触ICカードを構成する例を示す分解斜視図である。 [0018] FIG. 2 is an exploded perspective view showing an example of configuring a non-contact IC card and an IC chip mounted on the card of the present invention. この非接触ICカード20のように携帯時の外部応力に対する信頼性を求められる用途の場合は、図示のように、ICチップ30を補強シート31と共にカード20内に実装することが有効である。 In this case of applications requiring the reliability of the cellular when an external stress as non-contact IC card 20, as shown, it is effective to mount the card 20 in the IC chip 30 with the reinforcing sheet 31. この補強シート3 The reinforcing sheet 3
1としては、ステンレス、チタン等の金属板やポリカーボネート等の機械的強度の高いプラスチック板をチップサイズと同等もしくはそれ以上のサイズに加工したものが使用される。 The 1, stainless steel, those obtained by processing high plastic plate having mechanical strength such as metal plate or a polycarbonate such as titanium chip size equal to or more sizes are used. そして、中央の塩ビシート41にチップ大の孔41aが設けられており、その孔41aに下方から補強シート31付きのICチップ30が挿入され、上下両側からそれぞれ塩ビシート42,43でサンドイッチした状態でICチップを実装したカードCが構成されている。 State and, at the center of the PVC sheet 41 is provided a chip-sized hole 41a is, the IC chip 30 with the reinforcing sheet 31 from below are inserted into the holes 41a, it is sandwiched respectively from upper and lower sides PVC sheet 42, 43 cards C mounted with the IC chip in is configured.

【0019】 [0019]

【発明の効果】以上説明したように、本発明によれば、 As described in the foregoing, according to the present invention,
データの送受信を行うアンテナをチップ自体に設けるようしたので、回路が形成された汎用ICチップにアンテナを電気メッキ等の再配線で形成するだけで、アンテナ付きの専用チップを簡単に得ることができ、このアンテナ付きの専用チップをカードやタグに埋め込むことにより、非接触ICカードや非接触ICタグなどのメモリー媒体を製造することができることから、部品点数を減らしてコストダウンを図ることができる。 Since an antenna for transmitting and receiving data was provided in the chip itself, only the antenna is formed in a general-purpose IC chip on which a circuit is formed by rewiring such electroplating, it is possible to obtain a dedicated chip with antenna easily , by embedding a dedicated chip with the antenna to the card or tag, since it is possible to manufacture a memory medium such as a non-contact IC card and contactless IC tag, it is possible to reduce the cost by reducing the number of parts.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明に係るICチップの製造手順を示す工程図である。 Is a process diagram showing the manufacturing procedure of the IC chip according to the present invention; FIG.

【図2】本発明のICチップをカードに実装して非接触ICカードを構成する例を示す分解斜視図である。 2 is an exploded perspective view showing an example of configuring a non-contact IC card and an IC chip mounted on the card of the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

10 ICチップ 11 回路配線パターン 12 パッシベーション膜 13 シード層 14 フォトレジスト 15 アンテナ 16 封止樹脂 20 非接触ICカード 30 ICチップ 31 補強シート 41,42,43 塩ビシート 10 IC chip 11 circuit wiring pattern 12 passivation film 13 seed layer 14 photoresist 15 antenna 16 sealing resin 20 non-contact IC card 30 IC chip 31 reinforcing sheet 41, 42 and 43 PVC sheet

Claims (8)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 非接触ICカード、非接触ICタグ等のメモリー媒体用のICチップであって、データの送受信を行うアンテナをチップ自体に設けたことを特徴とするICチップ。 1. A non-contact IC card, an IC chip for memory medium such as a non-contact IC tag, an IC chip, characterized in that an antenna for transmitting and receiving data to the chip itself.
  2. 【請求項2】 チップにおける回路形成のなされた部分の上に絶縁層を形成し、当該絶縁層上にメッキによる配線でアンテナを形成した請求項1に記載のICチップ。 Wherein an insulating layer is formed on the made part of the circuit formed in the chip, IC chip according to claim 1 formed with the antenna wiring by plating is formed over the insulating layer.
  3. 【請求項3】 チップにおける回路面を除いた部分にアンテナを形成した請求項1に記載のICチップ。 3. IC chip according to claim 1 formed with the antenna in the portion except the circuit surface of the chip.
  4. 【請求項4】 それぞれ間に絶縁層を挟んだ複数のアンテナ層でアンテナを構成した請求項2又は3に記載のI 4. I according to claim 2 or 3 An antenna with multiple antenna layer sandwiching an insulating layer between each
    Cチップ。 C chip.
  5. 【請求項5】 アンテナ層間の絶縁層を一部除去して形成されてなる接続端子部を介して上下のアンテナ層を接続した請求項4に記載のICチップ。 5. The IC chip of claim 4, via the connection terminal portion is formed by partially removing the insulating layer of the antenna layers formed by connecting the upper and lower antenna layer.
  6. 【請求項6】 絶縁層の一部除去がレーザー加工によりなされた請求項5に記載のICチップ。 6. The IC chip of claim 5, part of the insulating layer removal is made by laser processing.
  7. 【請求項7】 ICチップが球状である請求項1〜6のいずれかに記載のICカード用ICチップ。 7. The IC card IC chip according to any one of claims 1 to 6 IC chips are spherical.
  8. 【請求項8】 請求項1〜7のいずれかに記載のICチップを内蔵したことを特徴とする非接触ICカード、非接触ICタグ等のメモリー媒体。 8. The non-contact IC card, characterized in that a built-in IC chip according to claim 1, the non-contact IC tag or the like of the memory medium.
JP8345199A 1999-03-26 1999-03-26 IC chip manufacturing method and memory medium manufacturing method incorporating the same Expired - Fee Related JP4349597B2 (en)

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