JP2001154346A - Photosensitive element, method for producing resist pattern using same and method for producing printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive element excellent in the side roughness, resolution, adhesion and flatness of a resist pattern and the developing solution resistance of the pattern after curing and having a small number of mouse bites. SOLUTION: A resin layer containing fine particles is laminated on one face of a biaxially oriented polyester film and one face of the resulting supporting film opposite to the resin layer laminated face is coated with a layer of a photosensitive resin composition and dried to obtain the objective photosensitive element. The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and including a (meth)acrylate compound having a urethane bond as an essential component and (C) a photopolymerization initiator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive element, a method for producing a resist pattern using the same, and a method for producing a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, in the fields of manufacturing printed wiring boards and precision metal processing, photosensitive resin compositions and photosensitive elements have been widely used as resist materials used for etching, plating and the like. The photosensitive element is usually composed of three layers of a light-transmitting support film, a photosensitive resin composition layer, and a protective film.
First, after peeling off the protective film, the photosensitive resin layer is pressure-bonded (laminated) so that the photosensitive resin layer is in direct contact, the patterned negative film is brought into close contact with the light-transmitting film, and irradiated with actinic rays (often using ultraviolet rays) ( Exposure), followed by spraying an organic solvent or an aqueous alkali solution to remove unnecessary portions, thereby forming (developing) a resist pattern. Particularly, from the viewpoint of environmental problems, a developing solution using an alkaline aqueous solution is required.

In recent years, the miniaturization and weight reduction of electronic devices have been promoted, the printed wiring boards have been required to have finer circuits, the resist patterns have been made finer, and the resolution of photosensitive elements has been required to be higher. I have. However, a conventional photosensitive element having a three-layer structure cannot satisfy the requirements. That is, in order to increase the resolution to expose through a light-transmitting support film, it is necessary to reduce the thickness of the film as much as possible, but on the other hand, it serves as a support when applying the photosensitive resin composition. Is required to have a certain level of self-holding property, generally needs a thickness of about 15 to 25 μm, and it is currently impossible to meet the demand for high resolution by using a conventional grade of light-transmitting support film. .

[0004] In response to these demands, various attempts have been made to achieve higher resolution. For example, there is a method in which a support film is peeled off before exposure, and a negative film is directly adhered onto the photosensitive resin composition layer. Normally, the photosensitive resin composition layer has a certain degree of tackiness so as to be in close contact with the substrate, and if this method is directly applied, the negative film and the photosensitive resin composition layer will be in intimate contact, and the negative film There were problems such as difficulty in peeling, deterioration in workability, contamination of the negative film with the photosensitive resin, and reduction in sensitivity due to air obstruction.

Therefore, as an attempt to improve this method, it has been attempted to use two or more photosensitive resin composition layers and a non-adhesive layer for a layer which is in direct contact with the negative film (Japanese Patent Laid-Open No. 61-1986). No. 31855, JP-A-1-221735
JP-A-2-230149). But,
In this method, since the photosensitive resin composition layer is multi-layered, it takes time and effort for coating, and has no effect on sensitivity reduction.

As another method, an attempt has been made to solve these disadvantages by providing an intermediate layer on a photosensitive resin composition, as disclosed in JP-B-56-40824 and JP-A-55-50.
No. 1072, JP-B-54-12215, JP-A-47-469, JP-A-59-97138, JP-A-59-216141, and JP-A-63-1.
No. 97942, and the like. However, in any case, an intermediate layer must be provided between the support film and the photosensitive resin composition layer, and the coating becomes troublesome twice,
In addition, it was difficult to handle the thin intermediate layer.

[0007]

The invention according to Claims 1 and 2 is characterized in that the resist pattern is excellent in side roughness, resolution, adhesion, flatness of the resist pattern and resistance to developing solution after curing, and that the mouth bite of the mouse bite is excellent. It is to provide a small number of photosensitive elements. The invention described in claim 3 is the invention according to claim 1.
Another object of the present invention is to provide a photosensitive element exhibiting the effects of the invention described in 2 or 2 and further exhibiting excellent side dents in the resist pattern. The invention according to claim 4 is the invention according to claim 1, 2, or 3.
It is an object of the present invention to provide a photosensitive element having the effects of the invention described in the description and further having excellent resolution. Claims 5, 6, and 7
The invention described above provides, in addition to the effects of the invention described in the first, second, third or fourth aspect, a photosensitive element having excellent dimensional change of the photosensitive element during lamination.

[0008] The invention according to claim 8 is based on claims 1, 2,
Another object of the present invention is to provide a photosensitive element having excellent film strength after curing of a resist, in addition to the effects of the invention described in 3, 4, 5, 6 or 7. The ninth aspect of the present invention provides a photosensitive element having excellent alkali developability and peelability in addition to the effects of the first, second, third, fourth, fifth, sixth, seventh and eighth aspects. It is. Claims 10 and 11
The invention according to claims 12 and 13 is claimed in claims 1, 2, 3, 4, 5,
It is intended to provide a photosensitive element having the effects of the invention described in 6, 7, 8 or 9, and further having excellent resolution, adhesion, and resistance to developing solution after curing. The invention according to claim 13 is the invention according to claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 1
Another object of the present invention is to provide a photosensitive element having excellent cold flow property during storage, in addition to the effects of the invention described in 0, 11 or 12.

According to a fourteenth aspect of the present invention, there is provided a method of manufacturing a resist pattern having excellent side surface roughness, resolution, adhesion, flatness of the resist pattern and resistance to developing solution after curing, and having a small number of mouse bits. Is provided. The invention described in claim 15 is to provide a method for manufacturing a printed wiring board in which a wiring pattern is excellent in side roughness, resolution and adhesion, and has a small number of mouse bits.

[0010]

According to the present invention, there is provided a biaxially oriented polyester film in which a resin layer containing fine particles is laminated on one side of a support film, and a photosensitive resin composition is formed on the opposite side of the support film on which the resin layer is formed. In a photosensitive element obtained by applying a layer of a product and drying, the photosensitive resin composition is
(A) a binder polymer, (B) a (meth) acrylate compound having a urethane bond as an essential component, a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in a molecule, and (C) photopolymerization The invention relates to a photosensitive element comprising an initiator.

In the present invention, the fine particles have an average particle size of 0.1.
The photosensitive element having a thickness of from 0.01 to 5.0 μm. The present invention also relates to the photosensitive element, wherein the resin layer containing the fine particles has a thickness of 0.01 to 5.0 μm. Further, the present invention, the haze of the support film is 0.0
1 to 5.0%. In addition, the present invention relates to a method in which 105 ° C.
The present invention relates to the photosensitive element, wherein the heat shrinkage in 0 minute is 0.30 to 0.60%.

Further, according to the present invention, the heat shrinkage of the support film in the longitudinal direction at 150 ° C. for 30 minutes is from 1.00 to 1.00.
1.90% for the photosensitive element. In addition, the present invention relates to a method in which the temperature of 200 ° C.
The invention relates to the photosensitive element, wherein the heat shrinkage in 0 minute is from 3.00 to 6.50%. Also, the present invention
(A) the weight average molecular weight of the binder polymer is 20,000
Between 0.00 and 300,000. The present invention also relates to the photosensitive element (A), wherein the acid value of the binder polymer is 50 to 300 mgKOH / g.

In the present invention, the (meth) acrylate compound having a urethane bond has a general formula (I)

Embedded image (Wherein, R ¹ and R ² each independently represent a hydrogen atom or a methyl group, X ¹ and X ² each independently represent an alkylene group having 2 to 6 carbon atoms, and Z represents a carbon atom having 2 to 16 carbon atoms. Represents a hydrogen group, and m and n are each independently an integer of 1 to 30). The present invention also relates to the photosensitive element, wherein X ¹ and X ² are an ethylene group. Further, the present invention relates to the photosensitive element, wherein X ¹ is an ethylene group and a propylene group, and X ² is an ethylene group and a propylene group.

Further, the present invention relates to the present invention, wherein the components (A), (B) and (C) are mixed in an amount of 100 parts by weight based on 100 parts by weight of the total of components (A) and (B). And 40-8
0 parts by weight, the component (B) is 20 to 60 parts by weight, the total amount of the component (A) and the component (B) is 100 parts by weight,
The present invention relates to the photosensitive element, wherein the component is 0.01 to 20 parts by weight based on 100 parts by weight of the total of the components (A) and (B).

Further, according to the present invention, the photosensitive element is laminated on a circuit-forming substrate so that a layer of a photosensitive resin composition is in close contact with the photosensitive element, and is irradiated with an actinic ray in an image-like manner. The present invention relates to a method for producing a resist pattern, which comprises curing and removing an unexposed portion by development. Also,
The present invention relates to a method for manufacturing a printed wiring board, wherein a circuit forming substrate on which a resist pattern is manufactured is etched or plated by the method for manufacturing a resist pattern.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. In the present invention, the (meth) acrylic acid is
Means acrylic acid and its corresponding methacrylic acid,
(Meth) acrylate means acrylate and its corresponding methacrylate.

The photosensitive element of the present invention comprises a biaxially oriented polyester film, on one side of which a resin layer containing fine particles is laminated, and a photosensitive resin composition on the opposite side of the support film on which the resin layer is formed. It is necessary to apply and dry a layer, and the photosensitive resin composition comprises (A) a binder polymer and (B) a (meth) acrylate compound having a urethane bond as essential components.
It comprises a photopolymerizable compound having two polymerizable ethylenically unsaturated groups and (C) a photopolymerization initiator.

The support film in the present invention is obtained by laminating a resin layer containing fine particles on one surface of a biaxially oriented polyester film. The average particle size of the fine particles is 0.0
It is preferably from 1 to 5.0 μm, and from 0.02 to 4.0 μm.
0 μm, more preferably 0.03 to 3.0 μm.
m is particularly preferred. This average particle size is 0.01
If it is less than μm, workability tends to be inferior, and if it exceeds 5.0 μm, resolution and sensitivity tend to decrease. The preferred amount of the fine particles varies depending on, for example, the base resin constituting the resin layer, the type and average particle size of the fine particles, desired physical properties, and the like.

Examples of the fine particles include inorganic particles such as silica, kaolin, talc, alumina, calcium phosphate, titanium dioxide, calcium carbonate, barium sulfate, calcium fluoride, lithium fluoride, zeolite and molybdenum sulfide, and crosslinked polymer particles. And organic particles such as calcium oxalate. From the viewpoint of transparency, silica particles are preferable. These are used alone or in combination of two or more. Examples of the base resin constituting the resin layer containing the fine particles include a polyester resin, a polyurethane resin, an acrylic resin, a mixture thereof, and a copolymer thereof.

The thickness of the resin layer is 0.01 to 5.0 μm.
m, more preferably 0.05 to 3.0 μm, particularly preferably 0.1 to 2.0 μm, and particularly preferably 0.1 to 1.0 μm. If the thickness is less than 0.01 μm, the effects of the present invention tend not to be obtained, and if it exceeds 5.0 μm, the transparency of the polyester film is poor, and the sensitivity and resolution tend to be poor.

The method for laminating the resin layer on one side of the biaxially oriented polyester film is not particularly limited, and examples thereof include coating. As the polyester resin constituting the biaxially oriented polyester film, for example, polyethylene terephthalate,
Aromatic linear polyesters containing aromatic dicarboxylic acids such as polybutylene terephthalate and polyethylene naphthalate and diols as constituents, aliphatic linear polyesters containing aliphatic dicarboxylic acids and diols as constituents, Examples include polyester-based resins mainly composed of polyesters such as polymers. These are used alone or in combination of two or more.

The biaxially oriented polyester film on which the resin layer is laminated may contain fine particles. Examples of the fine particles include those similar to the fine particles contained in the resin layer. . Its content is 0
It is preferably 80 ppm, more preferably 0 to 60 ppm, and particularly preferably 0 to 40 ppm. If this content exceeds 80 ppm, the transparency of the entire polyester film is reduced, and the resolution and sensitivity tend to be reduced.

The method for producing the biaxially oriented polyester film is not particularly limited, and for example, a biaxial stretching method can be used. Further, after forming the resin layer on one surface of the unstretched film or the uniaxially stretched film, the film may be further stretched to form a support film.

The biaxially oriented polyester film preferably has a thickness of 1 to 100 μm,
m, more preferably 1 to 30 μm, and particularly preferably 10 to 30 μm. When the thickness is less than 1 μm, the ease of manufacture and availability tends to be poor, and when it exceeds 100 μm, the cost tends to be poor.

The haze of the support film is from 0.01 to
It is preferably 5.0%, more preferably 0.01 to 3.0%, particularly preferably 0.01 to 2.0%, and 0.01 to 1.0%. It is highly preferred. If the haze is less than 0.01%, the ease of production tends to be poor, and if it exceeds 5.0%, the sensitivity and resolution tend to deteriorate. The haze in the present invention is measured according to JIS K 7105, and is, for example, NDH-1001DP (Nippon Denshoku Industries Co., Ltd.)
The product can be measured with a commercially available turbidity meter such as a product (trade name).

At 105 ° C. in the longitudinal direction of the support film,
The heat shrinkage in 30 minutes is preferably 0.30 to 0.60%, more preferably 0.35 to 0.55%, and particularly preferably 0.40 to 0.50%. . If the heat shrinkage is less than 0.30%, the polyester film tends to become brittle, and if it exceeds 0.60%, the dimensional change of the photosensitive element during lamination tends to occur.

At 150 ° C. in the longitudinal direction of the support film,
The heat shrinkage in 30 minutes is preferably 1.00 to 1.90%, more preferably 1.10 to 1.70%, and particularly preferably 1.20 to 1.60%. . If the heat shrinkage is less than 1.00%, the polyester film tends to become brittle, and if it exceeds 1.90%, the dimensional change of the photosensitive element tends to occur during lamination.

200 ° C. in the longitudinal direction of the support film,
The heat shrinkage in 30 minutes is preferably from 3.00 to 6.50%, more preferably from 3.30 to 5.00%, and particularly preferably from 3.60 to 4.70%. . If the heat shrinkage is less than 3.00%, the polyester film tends to become brittle, and if it exceeds 6.50%, the dimensional change of the photosensitive element during lamination tends to occur.

In the present invention, the heat shrinkage ratio is 20 width.
mm, 150mm long test specimens each taken from the longitudinal direction and width direction of the film, with a mark at the center of each specimen at a distance of about 100mm, hot air circulating type maintained at the above temperature ± 3 ° C The test specimen was suspended vertically in a thermostatic chamber, heated for 30 minutes, taken out, left at room temperature for 30 minutes, measured for the distance between gauge points, calculated by the following equation (1), and determined by calculating the average. it can.

[0030]

(Equation 1)

Examples of available support films include, for example, A2100-16 and A4100 manufactured by Toyobo Co., Ltd.
-25 and the like.

The thickness of the support film is 1 to 100 μm.
m, more preferably 1 to 50 μm, particularly preferably 1 to 30 μm,
It is extremely preferred that it is 10 to 30 μm. If the thickness is less than 1 μm, the mechanical strength tends to decrease, and problems such as breakage of the polymer film during coating tend to occur,
If it exceeds 100 μm, the resolution tends to decrease and the price tends to increase.

The photosensitive element of the present invention comprises a biaxially oriented polyester film having a polyester film in which a resin layer containing fine particles is laminated on one surface as a support film, and a photosensitive film on the opposite surface on which the resin layer is formed. It can be obtained by applying and drying a layer of the resin composition. The coating can be performed by a known method such as a roll coater, a comma coater, a gravure coater, an air knife coater, a die coater, and a bar coater. Moreover, drying is 80-150.
C., about 5 to 30 minutes.

The photosensitive element of the present invention comprising the two layers of the photosensitive resin composition layer and the support film thus obtained is, for example, a protective film as it is or on the other surface of the photosensitive resin composition layer. It is further laminated, wound up in a roll shape and stored. Examples of the protective film include an inactive polyolefin film such as polyethylene and polypropylene. From the viewpoint of releasability from the photosensitive resin composition layer, a polyethylene film is preferable.

As the binder polymer (A) in the present invention, for example, an acrylic resin, a styrene resin,
Epoxy resins, amide resins, amide epoxy resins, alkyd resins, phenol resins, and the like can be given. From the viewpoint of alkali developability, an acrylic resin is preferred. These can be used alone or in combination of two or more.

The (A) binder polymer in the present invention can be produced, for example, by subjecting a polymerizable monomer to radical polymerization. Examples of the polymerizable monomer include, for example, styrene, vinyl toluene, a polymerizable styrene derivative substituted at the α-position or an aromatic ring such as α-methylstyrene, acrylamide such as diacetone acrylamide, acrylonitrile, and vinyl. −
Esters of vinyl alcohol such as n-butyl ether, alkyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, (meth) acrylate ) Acrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, (meth) acrylic acid, α-bromo (meth) acrylic acid , Α-chloro (meth) acrylic acid, β-furyl (meth) acrylic acid, β-
Styryl (meth) acrylic acid, maleic acid, maleic anhydride, monomethyl maleate such as monomethyl maleate, monoethyl maleate, monoisopropyl maleate, fumaric acid, cinnamic acid, α-cyanocinnamic acid,
Examples include itaconic acid, crotonic acid and propiolic acid.

Examples of the alkyl (meth) acrylate include those represented by the general formula (II)

Embedded image (Wherein, R ³ represents a hydrogen atom or a methyl group, and R ⁴ represents an alkyl group having 1 to 12 carbon atoms), and the alkyl group of these compounds includes a hydroxyl group, an epoxy group, a halogen group, and the like. And the like. Examples of the alkyl group having 1 to 12 carbon atoms represented by R ⁴ in the general formula (II) include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group,
Examples include an octyl group, a nonyl group, a decyl group, an undecyl group, a dodecyl group, and structural isomers thereof.

Examples of the monomer represented by the general formula (II) include (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid propyl ester, and (meth) acrylic acid Butyl ester,
Pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth)
Nonyl acrylate, decyl (meth) acrylate, undecyl (meth) acrylate,
And (meth) acrylic acid dodecyl ester. These can be used alone or in combination of two or more.

The binder polymer (A) in the present invention preferably contains a carboxyl group from the viewpoint of alkali developability. For example, a polymerizable monomer having a carboxyl group and another polymerizable monomer may be used. Can be produced by radical polymerization. Also,
The binder polymer (A) in the present invention preferably contains styrene or a styrene derivative as a polymerizable monomer from the viewpoint of flexibility.

In order to improve both the adhesion and the peeling property by using the styrene or styrene derivative as a copolymer component, the content is preferably from 0.1 to 30% by weight, and from 1 to 28% by weight.
%, More preferably 1.5 to 27% by weight. If the content is less than 0.1% by weight, the adhesion tends to be poor, and if it exceeds 30% by weight, the peeled pieces tend to be large and the peeling time tends to be long. These binder polymers are used alone or in combination of two or more. When two or more kinds are used in combination, examples of the binder polymer include two or more kinds of binder polymers composed of different copolymer components, two or more kinds of binder polymers having different weight average molecular weights, and two or more kinds of different dispersion degrees. Binder polymers and the like.

The weight average molecular weight of the binder polymer (A) in the present invention is preferably from 20,000 to 300,000, and more preferably from 25,000 to 200,000, from the viewpoint of coating properties and resolution. More preferably, it is particularly preferably 30,000 to 150,000. If the weight average molecular weight is less than 20,000, the developer resistance tends to decrease, and if it exceeds 300,000, the development time tends to be long. In the present invention, the weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

The acid value of the binder polymer (A) in the present invention is preferably from 50 to 300 mgKOH / g, more preferably from 60 to 250 mgKOH / g, particularly preferably from 70 to 200 mgKOH / g. preferable.
When the acid value is less than 50 mgKOH / g, the developing time tends to be delayed, and when it exceeds 300 mgKOH / g, the developing solution resistance of the photocured resist tends to decrease.

The (B) photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule in the present invention must contain a (meth) acrylate compound having a urethane bond as an essential component. The (meth) acrylate compound having a urethane bond is not particularly limited as long as it has a urethane bond in the molecule. For example, a (meth) acrylic monomer having an OH group at the β-position and isophorone diisocyanate, 2,6 An addition reaction product with a diisocyanate compound such as toluene diisocyanate, 2,4-toluene diisocyanate, 1,6-hexamethylene diisocyanate, tris ((meth)
Acryloxyisocyanate) hexamethylene isocyanurate, EO-modified urethane di (meth) acrylate,
PO-modified urethane di (meth) acrylate, EO, PO
Modified urethane di (meth) acrylate, EO-modified tris ((meth) acryloxyisocyanate) hexamethylene isocyanurate, PO-modified tris ((meth) acryloxyisocyanate) hexamethylene isocyanurate, EO, PO-modified tris ((meth) acryloxy) Isocyanate) hexamethylene isocyanurate and the like. EO indicates ethylene oxide, and EO
The modified compound has a block structure of an ethylene oxide group. PO represents propylene oxide, and the PO-modified compound has a block structure of a propylene oxide group.

The EO-modified urethane di (meth) acrylate, PO-modified urethane di (meth) acrylate and E
Examples of the O, PO-modified urethane di (meth) acrylate include the compound represented by the general formula (I). In the general formula (I), R ¹ and R ² each independently represent a hydrogen atom or a methyl group, and is preferably a methyl group. In the general formula (I), X ¹ and X ² each independently represent an alkylene group having 2 to 6 carbon atoms. The above carbon number 2
Examples of the alkylene group 6 include an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, an isopentyl group, a neopentyl group, a hexyl group, and the like. And an ethyl group, an n-propyl group or an isopropyl group is preferable.

In the above general formula (I), Z represents 2 to 16 carbon atoms.
Represents a hydrocarbon group. Examples of the hydrocarbon group having 2 to 16 carbon atoms include a hexamethylene group, a 2,4,4-trimethylhexamethylene group, and a tolylene group. When m and n are each 2 or more, two or more-
(X ¹ —O) — and two or more — (X ² —O) — may be the same or different, and X ¹ and X ² are two alkylene groups (such as an ethylene group and a propylene group). When composed of two types of-(X ¹ -O)-and two types of-(X ² -O)-are
They may exist randomly or in blocks. Examples of the combination of the alkylene groups constituting X ¹ and X ² include the following.

X ¹ = X ² = ethylene group X ¹ = X ² = propylene group or isopropylene group X ¹ = ethylene group, X ² = propylene group or isopropylene group X ¹ = ethylene group and propylene group or isopropylene group X ² = ethylene group X ¹ = ethylene group and propylene group or isopropylene group, X ² = propylene group or isopropylene group X ¹ = ethylene group and propylene group or isopropylene group, X ² = ethylene group and propylene group or Isopropylene group

Examples of the EO-modified urethane di (meth) acrylate represented by the general formula (I) include UA-11 (manufactured by Shin-Nakamura Chemical Co., Ltd., product name: R ¹ = R ² = methyl group, X ¹ = X ² = ethylene group, m = n = 5) and the like. Examples of the EO, PO-modified urethane di (meth) acrylate include, for example, UA-13 (R ¹ = R ² = methyl group, X ¹ = ethylene group (m ¹ = 1) manufactured by Shin-Nakamura Chemical Co., Ltd.) ) And propylene or isopropylene groups (m ² = 9), X ² = ethylene groups (n ¹ = 1) and propylene or isopropylene groups (n ² = 9), m = m ¹ + m
² = 10, n = n ¹ + n ² = 10). These are used alone or in combination of two or more.
Note that the m ^1, X ¹ is an ethylene group - (X ¹ -O) -
And m ² represents the number of repeating units of — (X ¹ —O) — in which X ¹ is a propylene group or an isopropylene group. Similarly, the n ^1, X ² is an ethylene group - (X ² -O) - indicates the number of repeating units of the n ^2, X
² is a propylene group or an isopropylene group-(X ^2-
O)-indicates the number of repeating units.

Examples of the photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in a molecule other than the (meth) acrylate compound having a urethane bond include, for example, polyhydric alcohols having α, β-unsaturation. A compound obtained by reacting a carboxylic acid, 2,2-bis (4-
((Meth) acryloxypolyethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypolypropoxy) phenyl) propane, 2,2-bis (4-
((Meth) acryloxypolyethoxypolypropoxy)
Bisphenol A (meth) acrylate compounds such as phenyl) propane and glycidyl group-containing compounds have α, β-
Compound obtained by reacting unsaturated carboxylic acid, nonylphenyldioxylene (meth) acrylate, γ-chloro-β-hydroxypropyl-β ′-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β '-(Meth) acryloyloxyethyl-o-
Phthalate, β-hydroxypropyl-β ′-(meth)
Acryloyloxyethyl-o-phthalate, (meth)
Examples thereof include alkyl acrylates, and it is preferable to use a bisphenol A (meth) acrylate compound in combination. These are used alone or in combination of two or more.

Compounds obtained by reacting the polyhydric alcohol with an α, β-unsaturated carboxylic acid include, for example,
Polyethylene glycol di (meth) acrylate having 2 to 14 ethylene groups, 2 to 1 propylene groups
4, polypropylene glycol di (meth) acrylate, trimethylolpropane di (meth) acrylate, trimethylolpropanetri (meth) acrylate, trimethylolpropaneethoxytri (meth) acrylate, trimethylolpropanediethoxytri (meth) acrylate, Trimethylolpropane triethoxytri (meth) acrylate, trimethylolpropanetetraethoxytri (meth) acrylate, trimethylolpropanepentaethoxytri (meth) acrylate, tetramethylolmethanetri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate , Polypropylene glycol di (meth) acrylate having 2 to 14 propylene groups, dipentaerythritol penta (meth) Rate, dipentaerythritol hexa (meth) acrylate. Examples of the α, β-unsaturated carboxylic acid include (meth) acrylic acid.

The 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane includes, for example, 2,2-bis (4-((meth) acryloxydiethoxy) phenyl) propane, 2,2-bis (4-
((Meth) acryloxytriethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytetraethoxy) phenyl) propane, 2,2-bis (4-
((Meth) acryloxypentaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyhexaethoxy) phenyl) propane, 2,2-bis (4
-((Meth) acryloxyheptaethoxy) phenyl)
Propane, 2,2-bis (4-((meth) acryloxyoctaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxynonaethoxy) phenyl) propane, 2,2-bis ( 4-((meth) acryloxydecaethoxy) phenyl) and the like;
Bis (4- (methacryloxypentaethoxy) phenyl) propane is BPE-500 (Shin Nakamura Chemical Co., Ltd.)
(Product name).

Examples of the 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane include, for example, 2,2-bis (4-((meth) acryloxydiethoxyoctapropoxy) Phenyl) propane, 2,2-bis (4-((meth) acryloxytetraethoxytetrapropoxy) phenyl) propane,
2,2-bis (4-((meth) acryloxyhexaethoxyhexapropoxy) phenyl) propane and the like. These are used alone or in combination of two or more. Examples of the glycidyl group-containing compound include, for example, trimethylolpropane triglycidyl ether tri (meth) acrylate, 2,2-bis (4- (meth)
Acryloxy-2-hydroxy-propyloxy) phenyl and the like. Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and (meth) acrylic acid 2
-Ethylhexyl ester and the like. These are used alone or in combination of two or more.

Examples of the photopolymerization initiator (C) in the present invention include benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N'-tetraethyl-4, 4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2
-Methyl-1- [4- (methylthio) phenyl] -2-
Aromatic ketones such as morpholino-propanone-1, 2-
Ethyl anthraquinone, phenanthrenequinone, 2-te
rt-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-
Diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenantaraquinone, 2-methyl1,4
Quinones such as naphthoquinone and 2,3-dimethylanthraquinone; benzoin ether compounds such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; benzoin compounds such as benzoin, methyl benzoin and ethyl benzoin; and benzyl derivatives such as benzyl dimethyl ketal. 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2-
(O-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2-
(O-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5
2,4,5-triarylimidazole dimer such as -diphenylimidazole dimer, acridine derivative such as 9-phenylacridine, 1,7-bis (9,9'-acridinyl) heptane, N-phenylglycine, N-phenylglycine derivatives, coumarin-based compounds and the like can be mentioned.

The substituents of the aryl groups of the two 2,4,5-triarylimidazoles may be the same to give a target compound, or different asymmetric compounds may be given. Further, a thioxanthone-based compound and a tertiary amine compound may be combined like a combination of diethylthioxanthone and dimethylaminobenzoic acid. Also,
From the viewpoints of adhesion and sensitivity, 2,4,5-triarylimidazole dimer is more preferable. These are used alone or in combination of two or more.

The amount of the component (A) in the present invention is as follows:
It is preferably 50 to 70 parts by weight, preferably 55 to 6 parts by weight, based on 100 parts by weight of the total of the components (A) and (B).
More preferably, it is 5 parts by weight. When this blending amount is 4
If less than 0 parts by weight, when used as a photosensitive element,
When the amount exceeds 80 parts by weight, the photocurability tends to be insufficient.

The amount of the component (B) in the present invention is as follows:
Preferably, the amount is 30 to 50 parts by weight based on 100 parts by weight of the total of the components (A) and (B).
More preferably, it is 5 parts by weight. This blending amount is 2
If the amount is less than 0 parts by weight, the photocurability tends to be insufficient,
If it exceeds 60 parts by weight, the coating properties tend to deteriorate.

The component (B) preferably contains 5 to 100% by weight of the (meth) acrylate compound having a urethane bond, more preferably 10 to 100% by weight, and more preferably 15 to 95% by weight. Is particularly preferred, the content is very preferably 20 to 90% by weight, and most preferably 30 to 90% by weight.

The amount of the component (C) in the present invention is as follows:
The amount is preferably 0.01 to 20 parts by weight based on 100 parts by weight of the total of the components (A) and (B).
More preferably, the amount is from 0.05 to 10 parts by weight, and 0.1 to 10 parts by weight.
Particularly preferred is 5 parts by weight. When the blending amount is 0.
If the amount is less than 01 parts by weight, the sensitivity tends to be insufficient.
If the amount exceeds 0 parts by weight, the resolution tends to deteriorate.

In the photosensitive resin composition of the present invention, a dye such as malachite green, a photo-coloring agent such as leuco crystal violet, a thermo-coloring inhibitor, and a plasticizer such as p-toluenesulfonic acid amide may be used, if necessary. Agents, pigments,
Fillers, defoamers, flame retardants, stabilizers, adhesion promoters, leveling agents, release accelerators, antioxidants, fragrances, imaging agents, thermal crosslinking agents, etc. The total amount of components (A) and (B) About 0.01 to 20 parts by weight can be contained for each 100 parts by weight. These are used alone or in combination of two or more.

The photosensitive resin composition of the present invention may contain, if necessary, methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve,
It can be dissolved in a solvent such as toluene or N-dimethylformamide or a mixed solvent thereof and applied as a solution having a solid content of about 30 to 60% by weight.

The thickness of the photosensitive resin composition layer varies depending on the application, but is preferably from 1 to 200 μm, more preferably from 1 to 100 μm, and more preferably from 1 to 30 μm in terms of thickness after drying. Is particularly preferred. If the thickness is less than 1 μm, it tends to be difficult to coat industrially,
If it exceeds 00 μm, the photocurability at the bottom of the resist tends to deteriorate.

In producing a resist pattern using the photosensitive element, if the protective film is present, the protective film is removed, and the photosensitive resin composition layer is heated while heating the photosensitive resin composition layer. And a method of laminating by pressure bonding, and it is preferable to laminate under reduced pressure from the viewpoint of adhesion and followability. The surface to be laminated is usually a metal surface, but is not particularly limited. The heating temperature of the photosensitive resin composition layer is preferably 70 to 130 ° C., and the pressing pressure is 0.1 to 1 MPa (1 to 10 kgf).
/ cm ² ), but these conditions are not particularly limited. In addition, if the photosensitive resin composition layer is heated to 70 to 130 ° C. as described above, it is not necessary to pre-heat the circuit forming substrate in advance. Preheating of the substrate can also be performed.

The photosensitive resin composition layer thus laminated is irradiated imagewise with actinic rays through a negative or positive mask pattern called an artwork. At this time, when the polymer film present on the photosensitive resin composition layer is transparent, it may be irradiated with actinic light as it is, and when it is opaque, it is necessary to remove it naturally. As a light source of the actinic ray, a known light source, for example, a carbon arc lamp, a mercury vapor arc lamp, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a xenon lamp, or the like that effectively emits ultraviolet rays is used. In addition, those that effectively emit visible light, such as a flood light bulb for photography and a sun lamp, are also used.

Next, after the exposure, if a support is present on the photosensitive resin composition layer, the support is removed.
Unexposed portions are removed by wet development, dry development, or the like, and developed to produce a resist pattern. In the case of wet development, using a developer corresponding to a photosensitive resin composition such as an alkaline aqueous solution, an aqueous developer, or an organic solvent, for example, developing by a known method such as spraying, rocking immersion, brushing, and scraping. I do.

As the developing solution, a safe and stable one having good operability, such as an alkaline aqueous solution, is used.
As the base of the alkaline aqueous solution, for example, alkali hydroxides such as lithium, sodium or potassium hydroxide, alkali carbonates such as lithium, sodium, potassium or ammonium carbonate or bicarbonate, potassium phosphate, phosphoric acid Alkali metal phosphates such as sodium and alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate are used. The alkaline aqueous solution used for development is 0.1 to 5% by weight.
A dilute solution of sodium carbonate, a dilute solution of 0.1 to 5% by weight of potassium carbonate, a dilute solution of 0.1 to 5% by weight of sodium hydroxide, a dilute solution of 0.1 to 5% by weight of sodium tetraborate and the like are preferable. . The pH of the alkaline aqueous solution used for development is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive resin composition layer. A surfactant, an antifoaming agent, a small amount of an organic solvent for promoting development, and the like may be mixed in the alkaline aqueous solution.

The aqueous developer comprises water or an aqueous alkali solution and one or more organic solvents. Here, as the alkaline substance, in addition to the above substances, for example, borax or sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-2-hydroxymethyl-1,
3-propanediol, 1,3-diaminopropanol-2, morpholine and the like. The pH of the developing solution is preferably as low as possible within a range where the development of the resist can be sufficiently performed.
More preferably, it is set to 9 to 10.

Examples of the organic solvent include triacetone alcohol, acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, and the like.
Examples thereof include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether. These are used alone or in combination of two or more. Usually, the concentration of the organic solvent is preferably 2 to 90% by weight,
The temperature can be adjusted according to the developability.
Further, a small amount of a surfactant, an antifoaming agent and the like can be mixed in the aqueous developer.

The organic solvent-based developer used alone includes:
For example, 1,1,1-trichloroethane, N-methylpyrrolidone, N, N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, γ-butyrolactone and the like can be mentioned. It is preferable to add water to these organic solvents in a range of 1 to 20% by weight to prevent ignition. If necessary, two or more developing methods may be used in combination. Development methods include dip method, battle method,
There are spray method, brushing, slapping, etc.
The high pressure spray method is most suitable for improving the resolution.

As processing after development, if necessary,
The resist pattern may be further cured by heating at about 250 ° C. or exposure at about 0.2 to 10 mJ / cm ² .

For the etching of the metal surface after the development, a cupric chloride solution, a ferric chloride solution, an alkaline etching solution or a hydrogen peroxide-based etching solution can be used. It is desirable to use a ferric solution.

When a printed wiring board is manufactured using the photosensitive element of the present invention, the surface of the circuit forming substrate is treated by a known method such as etching or plating using the developed resist pattern as a mask. Examples of the plating method include copper plating such as copper sulfate plating and copper pyrophosphate, solder plating such as high-throw solder plating,
There are nickel plating such as Watt bath (nickel sulfate-nickel chloride) plating and nickel sulfamate plating, and gold plating such as hard gold plating and soft gold plating. Next, the resist pattern can be stripped with, for example, a more alkaline aqueous solution than the alkaline aqueous solution used for development. As this strongly alkaline aqueous solution,
For example, a 1 to 10% by weight aqueous sodium hydroxide solution,
A 10% by weight aqueous solution of potassium hydroxide or the like is used. Examples of the peeling method include an immersion method and a spray method. The immersion method and the spray method may be used alone or in combination. Further, the printed wiring board on which the resist pattern is formed may be a multilayer printed wiring board.

[0071]

Next, the present invention will be described by way of examples.

Examples 1 to 4 and Comparative Examples 1 to 3 The components (A) were synthesized in the amounts shown in Table 1, the solution was adjusted, and the components (B), (C), other components and the solvent were added thereto. The mixture was mixed to obtain a solution of the photosensitive resin composition.

[0073]

[Table 1]

The components used in Table 1 are shown below. * 1 UA-11: In the general formula (I), R ¹ = R ²
= Methyl group, X ¹ = X ² = ethylene group, Z = (CH ₂ ) ₆ and a compound in which m + n = 10 * 2 UA-13: In the general formula (I), R ¹ = R ²
= Methyl group, X ¹ and X ² are each an ethylene group: propylene group = 1: 9, and Z = (CH ₂ ) ₆ and m + n = 20.

The solution of the obtained photosensitive resin composition was coated on a support film (A2100-16 and A4100-
25 (having a resin layer containing fine particles): Toyobo
Co., Ltd., G2-16, G2-19 and V-20 (having no resin layer containing fine particles): Teijin Limited; For 10 minutes to obtain a photosensitive element. The film thickness of the photosensitive resin composition layer after drying was 20 μm.

The haze of the support film shown in Table 2 was determined according to JIS.
K 7105, Haze Meter (Tokyo Denshoku
It was measured using TC-H3DP (manufactured by Corporation).

In addition, five test pieces having a width of 20 mm and a length of 150 mm were taken from the longitudinal direction of the support film, and a mark was formed at a central portion of each of the test pieces at a distance of 100 mm.
The specimen was suspended vertically in a hot-air circulating thermostat kept at 150 ± 3 ° C. and 200 ± 3 ° C., heated for 30 minutes, taken out, left at room temperature for 30 minutes, and then measured for the distance between gauge points. The average was calculated by the above formula (1).

Next, a copper-clad laminate (Hitachi Kasei Kogyo Co., Ltd.) which is a glass epoxy material in which copper foil (thickness: 35 μm) is laminated on both sides
Copper surface of # 600 manufactured by MCL-E-61)
Polishing is performed using a polishing machine (manufactured by Yamakei Co., Ltd.) having a considerable brush, washed with water, and dried in an air stream.
The mixture was heated to 0 ° C., and the photosensitive resin composition layer was laminated on the copper surface at 120 ° C. and 0.4 MPa (4 kgf / cm ² ).

Then, using an exposure machine (manufactured by Oak Co., Ltd.) HMW-201B having a 3 KW ultra-high pressure mercury lamp, a photo tool having a 21-step stofer tablet as a negative and a line width as a negative for evaluating adhesion were used. /
Space width is 30/400 to 250/400 (unit: μ)
Using a photo tool having the wiring pattern of m), exposure was performed at an energy amount such that the number of remaining steps after development was 8.0. Next, the support film was removed, and development was performed by spraying a 1.0% by weight aqueous solution of sodium carbonate at 30 ° C. Here, the adhesiveness was evaluated based on the smallest value of the line width of the fine line that had adhered after the development. In the evaluation of the adhesion, the smaller the value, the better the value. Also,
After the substrate used for the evaluation of the adhesion was immersed in the above-mentioned developer for 30 seconds, the minimum line width of the adhesion was measured to evaluate the developer resistance.

Then, using a 5 μm comb pattern,
A resist pattern was obtained in the same manner as in the evaluation of adhesion, and the resolution (μm) was determined from the remaining resist pattern.
The smaller the numerical value, the better the resolution evaluation.

Next, exposure was performed at a line width / space width of 50 μm / 50 μm with the above energy amount, development was performed for 20 seconds, and the shape of the obtained resist pattern was observed with a scanning electron microscope. The sex was examined.
The side edge of the resist pattern refers to an unpreferable state in which the shape of the resist pattern is not straight, but has a jagged surface.
A shallower one is preferred. Deep: When the unevenness of the side pattern of the resist pattern exceeds 2 μm Shallow: When the unevenness of the side pattern of the resist pattern is 2 μm or less The results are summarized in Table 2. Examples 1 to 4 were also superior to Comparative Examples 1 to 3 in plating resistance and photosensitivity.

[0082]

[Table 2]

[0083]

According to the first and second aspects of the present invention, there is provided a photosensitive element, wherein the resist pattern has a rugged side surface, a resolution, an adhesion, and the like.
The flatness of the resist pattern and the resistance to developing solution after curing are excellent, and the number of mouth bits is small. The photosensitive element according to the third aspect has the effects of the invention according to the first or second aspect, and furthermore has excellent lateral ruggedness of the resist pattern. The photosensitive element according to claim 4 is the photosensitive element according to claim 1, 2, or 3.
The effects of the described invention are exhibited, and the resolution is further improved. The photosensitive element according to any one of claims 5, 6 and 7 has the following features.
In addition to the effects of the invention described in 2, 3 or 4, the dimensional change of the photosensitive element during lamination is further excellent.

The photosensitive element according to the eighth aspect has excellent film strength after curing the resist, in addition to the effects of the first, second, third, fourth, fifth, sixth or seventh aspect of the invention. The photosensitive element according to claim 9 is a photosensitive element according to claims 1, 2, 3, 4,
In addition to the effects of the invention described in 5, 6, 7 or 8, the alkali developability and the peelability are further excellent. The photosensitive element according to Claims 10, 11 and 12 is characterized in that:
The effect of the invention described in 4, 5, 6, 7, 8 or 9 is exhibited, and further, the resolution, the adhesion, and the resistance of the developing solution after curing are excellent.
The photosensitive element according to claim 13 is characterized in that:
In addition to the effects of the invention described in 3, 4, 5, 6, 7, 8, 9, 10, 11 or 12, the cold flow property during storage is further excellent.

The method for producing a resist pattern according to the fourteenth aspect is excellent in the side roughness of the resist pattern, the resolution, the adhesion, the flatness of the resist pattern and the developing solution resistance after curing, and the number of mouth bits is small. In the method for manufacturing a printed wiring board according to the fifteenth aspect, the side pattern of the wiring pattern, the resolution and the adhesion are excellent, and the number of mouse bits is small.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) G03F 7/032 G03F 7/032 H05K 3/06 H05K 3/06 H 3/18 3/18 D

Claims (15)

[Claims] 1. A layer of a photosensitive resin composition is applied to one side of a biaxially oriented polyester film, and a layer of a photosensitive resin composition is applied to the opposite side of the support film in which a resin layer containing fine particles is laminated and the resin layer is formed. A photosensitive element comprising: (A) a binder polymer;
(B) a photopolymerizable compound having a (meth) acrylate compound having a urethane bond as an essential component and having at least one polymerizable ethylenically unsaturated group in a molecule, and (C) a photopolymerization initiator. Photosensitive element. 2. The fine particles have an average particle size of 0.01 to 5.0 μm.
The photosensitive element according to claim 1, wherein m is m. 3. The resin layer containing fine particles having a thickness of 0.0
3. The photosensitive element according to claim 1, which has a thickness of 5 to 5.0 [mu] m. 4. The support film has a haze of 0.01 to 5.
4. The photosensitive element according to claim 1, wherein the content is 0%. 5. A film at 105.degree.
5. The photosensitive element according to claim 1, wherein the heat shrinkage in 0 minute is 0.30 to 0.60%. 6. The temperature of 150 ° C. in the longitudinal direction of the supporting film,
The photosensitive element according to claim 1, wherein the heat shrinkage in 0 minute is 1.00 to 1.90%. 7. 200 ° C. in the longitudinal direction of the support film, 3
7. The photosensitive element according to claim 1, wherein the heat shrinkage in 0 minute is 3.00 to 6.50%. 8. The method according to claim 1, wherein the weight average molecular weight of (A) the binder polymer is from 20,000 to 300,000.
8. The photosensitive element according to 2, 3, 4, 5, 6, or 7. 9. An acid value of the binder polymer (A) is 50.
1, 2, 3, 4, 5, 5 to 300 mgKOH / g.
9. The photosensitive element according to 6, 7, or 8. 10. The (meth) acrylate compound having a urethane bond has the general formula (I): (Wherein, R ¹ and R ² each independently represent a hydrogen atom or a methyl group, X ¹ and X ² each independently represent an alkylene group having 2 to 6 carbon atoms, and Z represents a carbon atom having 2 to 16 carbon atoms. The photosensitive element according to Claim 1, 2, 3, 4, 5, 6, 7, 8 or 9, wherein m represents a hydrogen group, and m and n each independently represent an integer of 1 to 30. 11. The photosensitive element according to claim 10, wherein X ¹ and X ² are ethylene groups. 12. The photosensitive element according to claim 10, wherein X ¹ is an ethylene group and a propylene group, and X ² is an ethylene group and a propylene group. 13. The compounding amount of the component (A), the component (B) and the component (C) is 40 to 40 parts by weight based on 100 parts by weight of the total amount of the component (A) and the component (B). 80 parts by weight,
The component (B) has a total amount of 100 of the components (A) and (B).
20 to 60 parts by weight relative to parts by weight, the component (C)
The amount of 0.01 to 20 parts by weight based on 100 parts by weight of the total of the components (A) and (B).
The photosensitive element according to 4, 5, 6, 7, 8, 9, 10, 11 or 12. 14. The method of claim 1, 2, 3, 4, 5, 6, 7,
The photosensitive element according to 8, 9, 10, 11, 12 or 13 is laminated on a circuit-forming substrate so that a layer of the photosensitive resin composition is in close contact with the photosensitive element, and is irradiated with actinic rays imagewise.
A method for producing a resist pattern, comprising: exposing exposed portions to light and removing unexposed portions by development. 15. A method for manufacturing a printed wiring board, comprising etching or plating a substrate for circuit formation on which a resist pattern has been manufactured by the method for manufacturing a resist pattern according to claim 14.