JP2001152346A - Vacuum film deposition apparatus, and film deposition method using the apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum film deposition apparatus which uniformly controls the temperature distribution and the temperature of a synthetic resin film in an energy-saving manner and forms a physically and chemically uniform thin film without any damages or deformation on the synthetic resin film, and a film deposition method using the apparatus. SOLUTION: The vacuum deposition apparatus comprises, in a reaction vapor deposition chamber, a shower head electrode 22 comprising a process gas ejection unit and an electrode, and a flat heater 19 to heat synthetic resin film 9, the shower head electrode 22 is placed below the web-like synthetic resin film 9 with a predetermined clearance, and the heater is placed therebelow, a temperature adjusting mechanism to adjust the temperature of the heater is provided, the temperature adjusting mechanism measures the surface temperature of the synthetic resin film 9 using a thermometer having an infrared ray sensor, and controls the heater.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum film forming apparatus for forming a thin film on a substrate surface or the like in a vacuum, and more particularly, to forming a thin film on a web-like synthetic resin film surface by a chemical vapor deposition method (CVD) or the like. The present invention relates to a vacuum film forming apparatus and a film forming method using the same.

[0002]

BACKGROUND OF THE INVENTION Chemical vapor deposition (CV) is an example of the prior art.
The winding type vacuum film forming apparatus according to the method D) will be described below.

For example, as shown in the side view of FIG. 2, a winding shaft (1) having winding means capable of winding with a constant tension such as a torque motor is provided, and a torque control such as a powder clutch is performed. Means for unwinding the web-shaped synthetic resin film while applying a constant back tension by means, and restricting the running of the synthetic resin film (9) between the two axes. A tension roll (7) provided with a plurality of idle rollers (3, 4) and tension detectors (5, 6) for detecting tension and performing appropriate feedback to the winding shaft (1) or the unwinding shaft (2). ,
8) and a synthetic resin film (9), a temperature control drum (10) for controlling the temperature of the film (9) to form a film on the surface, and an electrode (11) and a plurality of process gas injection tubes (17, The web-shaped synthetic resin film (9) which is unwound while applying a predetermined tension from the unwinding shaft (2) by disposing the film forming means (18).
After a film is formed on the surface of the synthetic resin film (9) on the temperature control drum (10) by the film forming means described above, the film is wound by the winding shaft (1) with a predetermined tension. Thus, a film (13) having a thin film formed on the surface can be obtained.

[0004] However, the vacuum film forming apparatus (100) as shown in FIG. 2 has the following problems. That is, under vacuum, as shown in FIG.
The gas contained inside the synthetic resin film (9)
Since the gas is released from the front and back surfaces and a release gas layer (20) is formed between the temperature control drum (10) and the synthetic resin film (9), the temperature control drum (10) and the synthetic resin film (9)
In the vacuum where heat transfer by the atmosphere cannot be expected, the temperature distribution of the synthetic resin film (9) during film formation cannot be uniformly adjusted. Therefore, the thin film on the surface of the synthetic resin film substrate (9) is physically and chemically unstable, and there is a fear that the film thickness becomes uneven. Furthermore, since the surface of the temperature control drum (10) and the synthetic resin film (9) are in contact during film formation, there is a problem that the synthetic resin film (9) is damaged or deformed.

In order to solve the problem of floating of the synthetic resin film (9) between the temperature control drums (10), scratches and deformation, as shown in a side view of FIG. The temperature control drum (10) shown in FIG.
0) A method in which the synthetic resin film (9) does not come into contact with anything during film formation, that is, as shown in the enlarged side view of FIG. The synthetic resin film (9) is heated by a flat heater (19) in place of the above, and a plurality of process gas ejection pipes (17) supplied and ejected from the process gas supply pipe (21) above.
Vacuum deposition system (10
0).

However, the vacuum film forming apparatus (100) shown in FIG. 3 can prevent the synthetic resin film (9) from being lifted and damaged or deformed by the released gas, but it is in a vacuum to control the temperature of the film. (19)
In the case of heating, the heater (19) must be heated to a temperature higher than the film temperature. Therefore, there is a problem that a larger power is required and a longer time is required to reach a target temperature, that is, there is a problem such as an increase in energy consumption.Moreover, since cooling is hardly expected, it is difficult to control the temperature of the film surface. It was difficult. Furthermore, even in this method, the temperature distribution of the film substrate is greatly influenced by the temperature distribution of the heater itself and the distance from the film substrate, etc., and there is a great difficulty in controlling the temperature distribution.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and an object thereof is to form a thin film on the surface of a web-like synthetic resin film by a chemical vapor deposition method (CVD) or the like. In the vacuum deposition system to be formed, the temperature distribution and temperature of the synthetic resin film substrate are controlled uniformly with no energy and energy saving without causing any damage or deformation to the synthetic resin film, physically and chemically stable and uniform film thickness. It is an object of the present invention to provide a vacuum film forming apparatus for forming a thin film and a film forming method using the same.

[0008]

Means for Solving the Problems In order to achieve the above object in the present invention, first, according to the first aspect of the present invention, an unwinding / winding chamber for a web-like substrate and a reactive evaporation chamber for forming a film are provided.
A vacuum film forming apparatus comprising: a film forming unit including a process gas ejecting unit and an electrode; and a heating unit configured to heat the web-like substrate in the reaction deposition chamber. A vacuum, wherein a film forming means is mounted at intervals, a heating means is mounted below the film forming means, and a temperature adjusting mechanism for adjusting the temperature of the heating means is provided. This is a film forming apparatus.

Further, in the invention according to claim 2, the film forming means is a shower head electrode having a plurality of process gas ejection pipes, wherein the vacuum film forming apparatus according to claim 1 is provided. .

According to a third aspect of the present invention, in the vacuum film forming apparatus according to the first or second aspect, the heating means is a flat heater.

Further, in the invention according to claim 4, the temperature control mechanism includes a thermometer with an infrared sensor, and measures the surface temperature of the web-like substrate with the thermometer with the infrared sensor to control the heating means. A vacuum film forming apparatus according to claim 1, 2 or 3, wherein

According to the vacuum film forming apparatus of the present invention, since the heating means and the film forming means are not in contact with the web-shaped substrate at a predetermined interval, it is possible to prevent the surface of the web-shaped substrate from being damaged or deformed. Can be. The temperature adjusting mechanism measures the surface temperature of the web-like substrate with a thermometer equipped with an infrared sensor, and the measured value controls the flat heater to a desired temperature. The heat of the controlled heater is transmitted to the upper showerhead electrode, and the process gas heated to a desired constant temperature from the showerhead electrode having the plurality of process gas ejection pipes (holes) is applied to the web-like substrate surface. It is sprayed uniformly and controls the temperature of the web-shaped substrate. By repeating this cycle, it is possible to provide a vacuum film forming apparatus that becomes a web-like substrate that is uniform and controlled at a desired constant temperature in a relatively short time.

According to a fifth aspect of the present invention, a thin film is continuously formed on the surface of a web-like substrate by using the vacuum film forming apparatus according to the first, second, third, or fourth aspect. Method.

According to the fifth aspect of the present invention, by using a vacuum film forming apparatus which is controlled uniformly and at a desired constant temperature, the surface of the moving web-like substrate can be physically and continuously applied with a small amount of energy. In addition, it is possible to provide a film forming method for forming a thin film which is chemically stable and has a uniform thickness.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 3, the vacuum film forming apparatus of the present invention includes, for example, an unwinding / winding chamber (60) for a web-like synthetic resin film and a reaction vapor deposition chamber (70) for forming a film.
As shown in an enlarged side view of FIG. 1, a plurality of process gases supplied and injected from a process gas supply pipe (21) are formed in the reaction evaporation chamber (70) as a film forming means including a process gas ejection part and an electrode. Shower head electrode (22) having jet pipe (17) and web-like synthetic resin film (9)
Heater (19) as a heating means for heating the water
The showerhead electrode (22), which is a film forming means, is placed below the web-like synthetic resin film (9) at an interval of about 20 mm, and is provided below the showerhead electrode (22). A flat heater (19) serving as the heating means is mounted, and a temperature adjusting mechanism for adjusting the temperature of the flat heater (19) is provided. It is.

The temperature control mechanism comprises a thermometer (not shown) with an infrared sensor for measuring the surface temperature of the web-shaped synthetic resin film (9). Synthetic resin film (9)
Is measured, and the flat heater (19) is controlled to a desired temperature based on the measured value.

Further, the temperature control mechanism has a plurality of process gas ejection pipes (holes) (17) for transferring the heat of the heater (19) controlled as described above to the upper shower head electrode (22). The process gas heated to a desired constant temperature is sprayed from the shower head electrode (22) toward the counter electrode (24), and as a result, is uniformly sprayed on the surface of the web-shaped synthetic resin film (9). This is for controlling the temperature of the running web-shaped synthetic resin film (9). By repeating this cycle, it is a mechanism (mechanism) that becomes a web-shaped synthetic resin film (9) that is uniform and controlled at a desired constant temperature in a relatively short time with a small amount of energy.

As the flat heater (19) whose temperature is controlled, a stainless steel heater or a ceramic heater is preferable. This method can be suitably used because the amount of gas released from the synthetic resin film (9) in a vacuum is small and the heater itself does not corrode.

As a thermometer with an infrared sensor for measuring the temperature of the synthetic resin film (9), a non-contact thermometer with an infrared sensor can be suitably used. This is because the thermometer itself can be used without touching the surface of the formed film or the like, so that the film can be wound without being damaged.

However, if the temperature can be actually measured, if the temperature is measured from the back surface of the synthetic resin film (9) and the scratches on the back surface are ignored, a certain effect can be expected even if a contact-type thermometer is used. Needless to say.

The shower head electrode (22), which is a film forming means constituting the vacuum film forming apparatus of the present invention, has a plurality of process gas ejection tubes (17), that is, holes formed in the surface thereof. It is possible to intentionally change the temperature distribution by changing the number, size, and position of the holes, and positively utilizing heat transfer.

The web-shaped substrate applied to the vacuum film forming apparatus of the present invention is a synthetic resin film, for example, a polyester film such as a polyethylene terephthalate film, a polyester ether film, a polyarylate film, a polyimide film, a polyether sulfone. Examples include, but are not limited to, films having relatively heat resistance, such as films, polyetherimide films, polycarbonate films, fluororesin films, and triacetate films.

The temperature control mechanism according to the vacuum film forming apparatus of the present invention includes a chemical vapor deposition method (CVD method) using a process gas or a mixed gas thereof and an inert gas, and a plasma CVD method using a gas reaction during plasma discharge. In addition to application to the method, application to a general vacuum deposition method is also possible.

[0024]

As described above, the present invention has the following effects. That is, in a vacuum film forming apparatus including a film forming unit including a process gas ejection unit and an electrode in a reaction deposition chamber, and a heating unit configured to heat the web-like substrate,
A showerhead electrode is mounted as a film forming means at a predetermined interval below the web-like substrate, and a heater is mounted as a heating means below the showerhead electrode, and a temperature for adjusting the temperature of the heater is set. The temperature control mechanism is equipped with a thermometer equipped with an infrared sensor to control the heater by measuring the surface temperature of the web-like substrate. It is possible to provide a vacuum film forming apparatus which is a web-shaped substrate which is uniform in a short time and controlled to a desired constant temperature.

Further, by the film forming method of continuously forming a thin film on the surface of the web-like substrate by using the above-mentioned vacuum film-forming apparatus, the temperature distribution and the temperature of the web-like substrate can be controlled uniformly with energy saving, and the physical A film formation method for forming a thin film having a uniform thickness, which is chemically and chemically stable.

As an additional effect, it has become possible to use a material having a low vapor pressure, which has conventionally been difficult to use as a process gas.

Furthermore, in the case of plasma CVD, since the temperature distribution of the web-like substrate and the gas temperature distribution in the process space are close to each other, the gas distribution in the plasma, which has been conventionally difficult to measure, can be obtained by measuring the temperature distribution of the substrate. It became possible to measure.

Accordingly, the present invention is directed to a vacuum film forming apparatus for forming a thin film on a substrate surface or the like in a vacuum, in particular, a chemical vapor deposition (CV) method.
As a vacuum film forming apparatus for forming a thin film on the surface of a web-like synthetic resin film by D) or the like, it exhibits excellent practical effects.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a vacuum film forming apparatus of the present invention, and is an enlarged side view of a film forming means constituting the apparatus.

FIG. 2 is a side view illustrating an example of a conventional vacuum film forming apparatus.

FIG. 3 is a side view illustrating another example of a conventional vacuum film forming apparatus.

4 is a partially enlarged side view illustrating an example of the conventional vacuum film forming apparatus shown in FIG.

5 is a partially enlarged side view illustrating an example of the conventional vacuum film forming apparatus shown in FIG.

[Explanation of symbols]

 1 roll-up shaft 2 roll-up shaft 3, 4 idle roll 5, 6 tension detector 7, 8 tension roller 9 synthetic resin film 10 temperature control drum 11 electrode 13 Web-formed film 14, 15 Nip roll 16 Dancer roll 17, 18 Process gas ejection pipe 19 Heater 20 Emission gas layer 21 Process gas supply pipe 22 Shower head electrode 24 ° Counter electrode 60 ° Unwinding / winding room 70 ° Reaction vapor deposition room 100 ° Vacuum film forming device

Continuation of the front page (72) Inventor Kyo Yamamoto 1-5-1, Taito, Taito-ku, Tokyo Letterpress Printing Co., Ltd. F-term (reference) 4F006 AA18 AA35 AA36 AA39 AA40 AB61 DA01 4K030 CA07 FA10 HA13 JA10 KA01 KA08 KA14 KA24 KA39 KA41

Claims (5)

[Claims] 1. A web deposition and unwinding chamber and a reaction vapor deposition chamber for forming a film, a film forming means comprising a process gas ejection section and an electrode in the reaction vapor deposition chamber, and heating the web substrate. A vacuum film forming apparatus, comprising: a heating unit that performs heating; and a heating unit that is mounted below the film-shaped substrate at a predetermined interval. And a temperature adjusting mechanism for adjusting the temperature of the heating means. 2. A vacuum film forming apparatus according to claim 1, wherein said film forming means is a shower head electrode having a plurality of process gas ejection pipes. 3. The vacuum film forming apparatus according to claim 1, wherein said heating means is a flat heater. 4. The temperature control mechanism includes a thermometer with an infrared sensor, and measures the surface temperature of the web-like substrate with the thermometer with the infrared sensor and controls the heating means. The vacuum film forming apparatus according to claim 1, 2, or 3. 5. A film forming method, wherein a thin film is continuously formed on the surface of a web-like substrate using the vacuum film forming apparatus according to claim 1, 2, 3 or 4.