JP2001152088A - Cationic electrodeposition coating composition - Google Patents

Cationic electrodeposition coating composition

Info

Publication number
JP2001152088A
JP2001152088A JP33350399A JP33350399A JP2001152088A JP 2001152088 A JP2001152088 A JP 2001152088A JP 33350399 A JP33350399 A JP 33350399A JP 33350399 A JP33350399 A JP 33350399A JP 2001152088 A JP2001152088 A JP 2001152088A
Authority
JP
Japan
Prior art keywords
coating composition
electrodeposition coating
cationic electrodeposition
group
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33350399A
Other languages
Japanese (ja)
Inventor
Jiro Nishiguchi
滋朗 西口
Koji Kamikado
神門  孝司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Paint Co Ltd
Original Assignee
Kansai Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Paint Co Ltd filed Critical Kansai Paint Co Ltd
Priority to JP33350399A priority Critical patent/JP2001152088A/en
Priority to US09/716,245 priority patent/US6475366B1/en
Priority to CA002326539A priority patent/CA2326539A1/en
Publication of JP2001152088A publication Critical patent/JP2001152088A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/80Masked polyisocyanates
    • C08G18/8061Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/807Masked polyisocyanates masked with compounds having only one group containing active hydrogen with nitrogen containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/64Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • C08G18/6415Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
    • C08G18/643Reaction products of epoxy resins with at least equivalent amounts of amines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • C09D5/443Polyepoxides
    • C09D5/4453Polyepoxides characterised by the nature of the curing agent
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4488Cathodic paints
    • C09D5/4496Cathodic paints characterised by the nature of the curing agents

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Molecular Biology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Paints Or Removers (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide electrodeposition coating film that shows low heating loss, excellent low-temperature curing properties and high smoothness. SOLUTION: In a block polyisocyanate curing type cationic electrodeposition coating composition, this coating composition characteristically includes blocked polyisoyanate groups, as a crosslinking agent, represented by general formula (2) (A is an isocyanine residual group and R1 is H, methyl, ethyl or propyl; R2 is methyl or ethyl), blocked with an amide represented by general formula (1): R1-CO-NH-R2 [wherein R1 and R2 are each the same meaning as stated in general formula (2)] as a crosslinking group.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】 本発明は電着塗料組成物に
関し、詳しくはブロックポリイソシアネート架橋剤を含
む電着塗料組成物で、低加熱減量(低ヤニ・スス)、低
温硬化性、かつ塗面平滑性良好な電着塗膜を形成でき
る、カチオン電着塗料組成物に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposition coating composition, and more particularly to an electrodeposition coating composition containing a blocked polyisocyanate cross-linking agent. The present invention relates to a cationic electrodeposition coating composition capable of forming an electrodeposition coating film having good smoothness.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】 アミ
ン付加エポキシ樹脂とブロックポリイソシアネートを反
応させ、熱硬化させてなるカチオン電着塗料組成物にお
いて架橋剤として用いるブロックポリイソシアネート化
合物には、ポリイソシアネート化合物とブロック化剤が
包含される。このポリイソシアネート化合物としては、
例えば、トリレンジイソシアネート、キシリレンジイソ
シイアネート、ビス(イソシアネートメチル)シクロヘ
キサン、テトラメチレンジイソシアネート、ヘキサメチ
レンジイソシアネート、メチレンジイソシアネート、イ
ソホロンジイソシアネート、フェニレンジイソシアネー
ト、ジフェニルジイソシアネートなどの芳香族、脂環
族、脂肪族のポリイソシアネート化合物が挙げられる。
2. Description of the Related Art Blocked polyisocyanate compounds used as a cross-linking agent in a cationic electrodeposition coating composition obtained by reacting an amine-added epoxy resin with a blocked polyisocyanate and heat curing include polyisocyanate. Compounds and blocking agents are included. As the polyisocyanate compound,
For example, aromatic, alicyclic, and aliphatic such as tolylene diisocyanate, xylylene diisocyanate, bis (isocyanatomethyl) cyclohexane, tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, isophorone diisocyanate, phenylene diisocyanate, and diphenyl diisocyanate. Of polyisocyanate compounds.

【0003】一方、ブロック化剤はポリイソシアネート
化合物のイソシアネート基に付加してブロックするもの
であり、そして付加によって生成するブロックイソシア
ネート化合物は、常温において安定で、かつ通常約10
0〜約200℃の範囲内の温度に加熱した際にブロック
化剤を解離して遊離のイソシアネート基を再生しうるも
のであることが重要である。このような要件を満たすブ
ロック剤としては、例えば、ε−カプロラクタム、γ−
ブチロラクタムなどのラクタム化合物;メチルエチルケ
トオキシム、シクロヘキサノンオキシムなどのオキシム
系化合物;フェノール、パラ−t−ブチルフェノール、
クレゾールなどのフェノール系化合物;n−ブタノー
ル、2−エチルヘキサノールなどの脂肪族アルコール
類;フェニルカルビノール、メチルフェニルカルビノー
ルなどの芳香族アルキルアルコール類;エチレングリコ
ールモノブチルエーテルなどのエーテルアルコール系化
合物等が挙げられる。
[0003] On the other hand, a blocking agent is one that blocks by adding to an isocyanate group of a polyisocyanate compound, and the blocked isocyanate compound formed by the addition is stable at ordinary temperature and usually about 10%.
It is important that the blocking agent can dissociate and regenerate free isocyanate groups when heated to a temperature in the range of 0 to about 200 ° C. Examples of the blocking agent satisfying such requirements include ε-caprolactam and γ-caprolactam.
Lactam compounds such as butyrolactam; oxime compounds such as methyl ethyl ketoxime and cyclohexanone oxime; phenol, para-t-butylphenol;
Phenolic compounds such as cresol; aliphatic alcohols such as n-butanol and 2-ethylhexanol; aromatic alkyl alcohols such as phenylcarbinol and methylphenylcarbinol; ether alcohol compounds such as ethylene glycol monobutyl ether; No.

【0004】従来、塗膜の防食性や塗料としての安定性
の面から、ポリイソシアネートとして芳香族系や脂肪族
系、またブロック化剤としてはエーテルアルコール系化
合物が使われていた。しかし加熱減量分(塗膜の焼き付
け硬化時の減量割合)によるところのライン乾燥機内で
のヤニ・ススの増大、またライン乾燥機焼き付け温度低
下によるコストダウンから、塗膜の低温硬化性が求めら
れておりブロック化剤としてはオキシム系化合物が有効
であった。
Conventionally, aromatic or aliphatic polyisocyanates and ether alcohol-based compounds have been used as polyisocyanates in view of the anticorrosion properties of coatings and the stability of coatings. However, low-temperature curability of the coating film is required due to an increase in the amount of dirt and soot in the line dryer due to the weight loss due to heating (the weight loss ratio during baking and curing of the coating film) and the cost reduction due to the decrease in the baking temperature of the line dryer. An oxime compound was effective as a blocking agent.

【0005】しかしポリイソシアネートとして芳香族系
や脂肪族系、ブロック化剤としてオキシム系を適用した
場合、塗料としての経時安定性及び防食性が問題であ
り、防食性及び塗料の安定性を備え、低加熱減量及び低
温硬化性を得るところの電着塗料組成物中の架橋剤の開
発が求められていた。
However, when an aromatic or aliphatic system is used as the polyisocyanate and an oxime system is used as the blocking agent, the coating has problems with time stability and anticorrosion, and has anticorrosion and stability of the coating. There has been a demand for the development of a crosslinking agent in an electrodeposition coating composition for obtaining low heat loss and low-temperature curability.

【0006】[0006]

【課題を解決するための手段】 本発明者らは、上記問
題を解決すべく鋭意検討した。その結果、電着塗料組成
物中の架橋剤にブロックポリイソシアネート硬化型カチ
オン電着において、架橋剤として特定の架橋剤を使用す
ることにより防食性及び安定性にも優れ上記問題点を改
善することを見出し、本発明を完成するに至った。
Means for Solving the Problems The present inventors diligently studied to solve the above problems. As a result, in the block polyisocyanate-curable cationic electrodeposition as a cross-linking agent in the electrodeposition coating composition, the use of a specific cross-linking agent as a cross-linking agent also provides excellent anticorrosion properties and stability, and improves the above-mentioned problems. And completed the present invention.

【0007】即ち本発明は、 1.ブロックポリイソシアネート硬化型カチオン電着塗
料において、架橋剤として1分子中に少なくとも1個の
イソシアネート基が一般式(1)、 R1−CO−NH−R2 (1) (式中、R1は水素原子、メチル基、エチル基又はプロピ
ル基を示し、R2はメチル基又はエチル基を示す。)で表
わされるアミド化合物でブロック化されてなる一般式
(2)、
That is, the present invention provides: In the blocked polyisocyanate-curable cationic electrodeposition coating composition, at least one isocyanate group per molecule as a cross-linking agent is represented by the general formula (1): R 1 —CO—NH—R 2 (1) (where R 1 is A hydrogen atom, a methyl group, an ethyl group or a propyl group, and R 2 represents a methyl group or an ethyl group.)

【0008】[0008]

【化2】 Embedded image

【0009】(式中、Aはイソシアネート化合物残基を
示し、R1及びR2は上記と同様の意味を示す。)で表され
る基を含有するブロック化ポリイソシアネートを架橋剤
として含むことを特徴とするカチオン電着塗料組成物、 ブロックポリイソシアネート硬化型カチオン電着塗料に
おいて、該塗料で使用される樹脂が、一般式(2)で表
わされる基が平均0.1個以上結合してなるブロック化
されたイソシアネート基を含有するカチオン性電着塗料
用樹脂であることを特徴とするカチオン電着塗料組成
物、 3.上記ポリイソシアネート化合物が、芳香族ポリイソ
シアネートであるところのカチオン電着塗料組成物、 4.アミド化合物が、n−メチルアセトアミド、n−エ
チルアセトアミド、n−メチルプロピルアミド、n−メ
チルフォルムアミドから選ばれる少なくとも1種の化合
物であることを特徴とする上記1又は2項に記載のカチ
オン電着塗料組成物、 5.上記カチオン電着塗料組成物において、電着塗料中
の樹脂固形分100重量部に対して無機ビスマス化合
物、及び/又は有機酸ビスマス塩をビスマス含有量で
0.01〜10重量部となるように配合する上記1〜4
項のいずれか1項に記載のカチオン電着塗料組成物、
(Wherein, A represents an isocyanate compound residue, and R 1 and R 2 have the same meanings as described above). In the cationic electrodeposition coating composition and the block polyisocyanate-curable cationic electrodeposition coating, the resin used in the coating has an average of 0.1 or more groups represented by the general formula (2) bonded thereto. 2. A cationic electrodeposition coating composition, which is a resin for a cationic electrodeposition coating composition containing a blocked isocyanate group. 3. a cationic electrodeposition coating composition wherein the polyisocyanate compound is an aromatic polyisocyanate; The amide compound according to claim 1 or 2, wherein the amide compound is at least one compound selected from n-methylacetamide, n-ethylacetamide, n-methylpropylamide, and n-methylformamide. 4. a coating composition, In the above cationic electrodeposition coating composition, the bismuth content of the inorganic bismuth compound and / or the organic acid bismuth salt is adjusted to 0.01 to 10 parts by weight based on 100 parts by weight of the resin solid content in the electrodeposition coating composition. The above 1-4 to mix
The cationic electrodeposition coating composition according to any one of the above items,

【0010】[0010]

【発明の実施の形態】 本発明カチオン電着塗料は、イ
ソシアネート基と反応する活性水素を含有するカチオン
性基体樹脂がブロック化されたポリイソシアネート基に
より加熱硬化するカチオン電着塗料である。
BEST MODE FOR CARRYING OUT THE INVENTION The cationic electrodeposition coating composition of the present invention is a cationic electrodeposition coating composition in which a cationic base resin containing active hydrogen that reacts with isocyanate groups is cured by heating with blocked polyisocyanate groups.

【0011】上記ブロック化されたポリイソシアネート
は、活性水素基含有カチオン性基体樹脂に外部架橋剤と
して配合(請求項1に記載の塗料組成物A)しても、も
しくは活性水素基含有カチオン性基体樹脂中に結合した
内部架橋剤として含有(請求項2に記載の塗料組成物
B)しても構わない。
The blocked polyisocyanate may be blended with an active hydrogen group-containing cationic base resin as an external crosslinking agent (coating composition A according to claim 1) or may be used as an active hydrogen group-containing cationic base resin. It may be contained as an internal crosslinking agent bonded to the resin (the coating composition B according to claim 2).

【0012】上記塗料組成物Aについて以下に述べる。
基体樹脂としては、エポキシ系、アクリル系、ポリブタ
ジエン系、アルキド系、ポリエステル系などのいずれの
樹脂でも使用することができるが、エポキシ樹脂が好ま
しく、そのものにアミンを付加してカチオン電着塗料組
成物として用いられる。
The coating composition A is described below.
As the base resin, any resin such as an epoxy resin, an acrylic resin, a polybutadiene resin, an alkyd resin, and a polyester resin can be used, but an epoxy resin is preferable, and an amine is added to the resin to form a cationic electrodeposition coating composition. Used as

【0013】上記アミン付加エポキシ樹脂としては、例
えば、(I)ポリエポキシ化合物と1級モノ−及びポリ
アミン、2級モノ−及びポリアミン又は1、2級混合ポ
リアミンとの付加物(例えば、米国特許第3,984,299号
明細書参照);(II)ポリエポキシド化合物とケチミン
化された1級アミノ基を有する2級モノ−及びポリアミ
ンとの付加物(例えば、米国特許第4,017,438号 明細書
参照);(III)ポリエポキシド化合物とケチミン化さ
れた1級アミノ基を有するヒドロキシ化合物とのエーテ
ル化により得られる反応物(例えば、特開昭59−43013
号公報参照)等を挙げることができる。
Examples of the amine-added epoxy resin include, for example, adducts of (I) polyepoxy compounds with primary mono- and polyamines, secondary mono- and polyamines, or primary and secondary mixed polyamines (for example, US Pat. (II) polyepoxide compounds and adducts of polyepoxide compounds with ketiminated secondary mono- and polyamines having primary amino groups (see, for example, U.S. Pat. No. 4,017,438); (III) polyepoxides A reaction product obtained by etherification of a compound with a ketiminated hydroxy compound having a primary amino group (for example, JP-A-59-43013)
Reference) can be cited.

【0014】上記アミン付加エポキシ樹脂の製造に使用
されるポリエポキシド化合物は、エポキシ基を1分子中
に2個以上有する化合物であり、一般に少なくとも20
0、好ましくは400〜4000、更に好ましくは80
0〜2000の範囲内の数平均分子量を有するものが適
しており、特にポリフェノール化合物とエピクロルヒド
リンとの反応によって得られるものが好ましい。該ポリ
エポキシド化合物の形成のために用い得るポリフェノー
ル化合物としては、例えば、ビス(4−ヒドロキシフェ
ニル)−2,2−プロパン、4,4−ジヒドロキシベン
ゾフェノン、ビス(4−ヒドロキシフェニル)−1,1
−エタン、ビス(4−ヒドロキシフェニル)−1,1−
イソブタン、ビス(4−ヒドロキシ−tert−ブチル−フ
ェニル)−2,2−プロパン、ビス(2−ヒドロキシナ
フチル)メタン、テトラ(4−ヒドロキシフェニル)−
1,1,2,2−エタン、4,4−ジヒドロキシジフェ
ニルスルホン、フェノールノボラック、クレゾールノボ
ラック等を挙げることができる。
The polyepoxide compound used for producing the amine-added epoxy resin is a compound having two or more epoxy groups in one molecule, and generally has at least 20 epoxy groups.
0, preferably 400-4000, more preferably 80
Those having a number average molecular weight in the range of 0 to 2,000 are suitable, and particularly those obtained by reacting a polyphenol compound with epichlorohydrin are preferable. Examples of the polyphenol compound that can be used for forming the polyepoxide compound include bis (4-hydroxyphenyl) -2,2-propane, 4,4-dihydroxybenzophenone, and bis (4-hydroxyphenyl) -1,1.
-Ethane, bis (4-hydroxyphenyl) -1,1-
Isobutane, bis (4-hydroxy-tert-butyl-phenyl) -2,2-propane, bis (2-hydroxynaphthyl) methane, tetra (4-hydroxyphenyl)-
Examples thereof include 1,1,2,2-ethane, 4,4-dihydroxydiphenylsulfone, phenol novolak, and cresol novolak.

【0015】該ポリエポキシド化合物は、ポリオール、
ポリエーテルポリオール、ポリエステルポリオール、ポ
リアミドアミン、ポリカルボン酸、ポリイソシアネート
化合物などと一部反応させたものであってもよく、更に
また、ε−カプロラクトン、アクリルモノマーなどをグ
ラフト重合させたものであってもよい。塗料組成物Aの
架橋剤として用いるブロック化ポリイソシアネートとし
ては、例えば、トリレンジイソシアネート、キシリレン
ジイソシアネート、フェニレンジイソシアネート、ビス
(イソシアネートメチル)シクロヘキサン、テトラメチ
レンジイソシアネート、ヘキサメチレンジイソシアネー
ト、メチレンジイソシアネート、イソホロンジイソシア
ネートなどの芳香族、脂肪族又は脂環族のポリイソシア
ネート化合物、及びこれらのイソシアネート化合物の過
剰量にエチレングリコール、プロピレングリコール、ト
リメチロールプロパン、ヘキサントリオール、ヒマシ油
などの低分子活性水素含有化合物を反応させて得られる
末端イソシアネート含有化合物を一般式(1)で表わさ
れるアミド化合物と反応させたものである。
The polyepoxide compound is a polyol,
Polyether polyol, polyester polyol, polyamidoamine, polycarboxylic acid, may be partially reacted with a polyisocyanate compound and the like, furthermore, ε-caprolactone, and those obtained by graft polymerization of acrylic monomers, etc. Is also good. Examples of the blocked polyisocyanate used as a crosslinking agent for the coating composition A include, for example, tolylene diisocyanate, xylylene diisocyanate, phenylene diisocyanate, bis (isocyanatomethyl) cyclohexane, tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, and isophorone diisocyanate. Aromatic, aliphatic or alicyclic polyisocyanate compounds, and an excess amount of these isocyanate compounds are reacted with a low-molecular-weight active hydrogen-containing compound such as ethylene glycol, propylene glycol, trimethylolpropane, hexanetriol, or castor oil. Is obtained by reacting the terminal isocyanate-containing compound thus obtained with the amide compound represented by the general formula (1).

【0016】この中で特に芳香族ジイソシアネート、な
かでもジフェニルメタン−2,4'−ジイソシアネー
ト、ジフェニルメタン−4,4'−ジイソシアネート
(通常、MDIと呼ばれる)、及びジフェニルメタン−
4,4'−ジイソシアネートとジフェニルメタン−2,
4'−ジイソシアネートとポリメチレンポリフェニルイ
ソシアネートとの混合物(通常、クルードMDIと呼ば
れる)などのようなポリイソシアネート化合物が好まし
い。
Among them, aromatic diisocyanates, especially diphenylmethane-2,4'-diisocyanate, diphenylmethane-4,4'-diisocyanate (commonly called MDI), and diphenylmethane-
4,4'-diisocyanate and diphenylmethane-2,
Polyisocyanate compounds such as a mixture of 4'-diisocyanate and polymethylene polyphenylisocyanate (usually called crude MDI) are preferred.

【0017】ブロック化剤はポリイソシアネート化合物
のイソシアネート基に付加してブロックするものであ
り、そして付加によって生成するブロックポリイソシア
ネート化合物は常温において安定で且つ約100〜20
0℃、好ましくは120〜150℃に加熱した際、ブロ
ック剤を解離して遊離のイソシアネート基を再生しうる
ものであることが望ましい。また解離するブロック剤と
しては分子量が小さい程、形成した加熱減量が少なく、
またそのことにより乾燥炉の低ヤニ・ススに寄与する。
The blocking agent is one that blocks by adding to the isocyanate group of the polyisocyanate compound, and the blocked polyisocyanate compound formed by the addition is stable at room temperature and is about 100 to 20.
When heated to 0 ° C, preferably 120 to 150 ° C, it is desirable that the blocking agent be dissociated to regenerate free isocyanate groups. Also, as the molecular weight of the dissociating blocking agent is smaller, the formed heating loss is smaller,
In addition, this contributes to low drying and soot in the drying furnace.

【0018】そのようなブロック化剤として、低分子ポ
リアミドが挙げられ、特に好ましいものとしてn−メチ
ルアセトアミド、n−エチルアセトアミド、n−メチル
プロピオンアミド、n−メチルホルムアミドなどのアミ
ド系が挙げられ、単独でも併用してもかまわない。また
従来から用いられているブロックを一部併用してもかま
わない。このようなブロック剤としては、例えば、ε−
カプロラクタム、γ−ブチロラクタムなどのラクタム系
化合物;メチルエチルケトオキシム、シクロヘキサノン
オキシムなどのオキシム系化合物;フェノール、パラ−
t−ブチルフェノール、クレゾールなどのフェノール系
化合物;n−ブタノール、2−エチルヘキサノールなど
の脂肪族アルコール類;フェニルカルビノール、メチル
フェニルカルビノールなどの芳香族アルキルアルコール
類;エチレングリコールモノブチルエーテルなどのエー
テルアルコール系化合物等を挙げることができる。
Examples of such a blocking agent include low molecular polyamides, and particularly preferred are amides such as n-methylacetamide, n-ethylacetamide, n-methylpropionamide and n-methylformamide. It may be used alone or in combination. Some of the blocks used conventionally may be used in combination. As such a blocking agent, for example, ε-
Lactam compounds such as caprolactam and γ-butyrolactam; oxime compounds such as methyl ethyl ketoxime and cyclohexanone oxime; phenol, para-
Phenolic compounds such as t-butylphenol and cresol; aliphatic alcohols such as n-butanol and 2-ethylhexanol; aromatic alkyl alcohols such as phenylcarbinol and methylphenylcarbinol; ether alcohols such as ethylene glycol monobutyl ether And the like.

【0019】このブロック剤の配合量としては、イソシ
アネートのNCO基に対して1:1〜1:1.3で反応
させることが好ましい。比率が1.3を越えるとブロッ
ク剤が残存して塗膜の防食性を低下させ、1.0未満で
はNCO基が残存して塗料組成物の安定性を損なうので
好ましくない。
The amount of the blocking agent is preferably 1: 1 to 1: 1.3 with respect to the NCO group of the isocyanate. If the ratio exceeds 1.3, the blocking agent remains to lower the corrosion resistance of the coating film, and if the ratio is less than 1.0, NCO groups remain to impair the stability of the coating composition, which is not preferable.

【0020】ブロック化ポリイソシアネートにおいて、
ジフェニルメタン−4,4'−ジイソシアネート(MD
I)を例にとると下記した構造となる。
In the blocked polyisocyanate,
Diphenylmethane-4,4'-diisocyanate (MD
Taking I) as an example, the following structure is obtained.

【0021】[0021]

【化3】 Embedded image

【0022】(式中、R1は水素原子、メチル基、エチ
ル基又はプロピル基を示し、R2はメチル基又はエチル
基を示し。Aはイソシアネート化合物残基を示す。)基
体樹脂の中和・水性化は、通常、該樹脂を脂肪族カルボ
ン酸、特に酢酸及び/又はギ酸などの水溶性有機酸で中
和して水溶化・水分散化することによって行われる。中
和剤として酢酸及び/又はギ酸を用いると、仕上がり
性、つきまわり性、低温硬化性などに優れるので好まし
い。
(Wherein R 1 represents a hydrogen atom, a methyl group, an ethyl group or a propyl group, R 2 represents a methyl group or an ethyl group, and A represents a residue of an isocyanate compound). -Water-solubilization is usually carried out by neutralizing the resin with an aliphatic carboxylic acid, particularly a water-soluble organic acid such as acetic acid and / or formic acid, and solubilizing and dispersing in water. It is preferable to use acetic acid and / or formic acid as the neutralizing agent because they are excellent in finishing properties, throwing power, low-temperature curability, and the like.

【0023】次に、塗料組成物Bについて述べる。塗料
組成物Bは、ブロックポリイソシアネート硬化型カチオ
ン電着塗料であって、該塗料で使用される樹脂は、一般
式(2)で表わされる基が平均0.1個以上結合してな
るブロック化されたイソシアネート基とカチオン性基を
含有するカチオン性電着塗料用樹脂である。該塗料用樹
脂は、例えば、エポキシ樹脂とポリアミン化合物を反応
させて得られる活性水素基(1級、2級等のアミノ基や水
酸基(エポキシ樹脂中))を含有する基体樹脂とハーフ
ブロック化したポリイソシアネート化合物とを反応させ
ることによって得られる。該樹脂はブロック化されたポ
リイソシアネート成分とカチオン性基(アミノ基、第4
級アミノ基等)とを含有する内部架橋型カチオン性基体
樹脂である。該樹脂中に一般式(2)で表される基が平
均0.1個以上、好ましくは0.2〜1.2個含有する
ことが好ましい。0.1個未満になると架橋密度が低下
し防食性が悪くなる。
Next, the coating composition B will be described. The coating composition B is a block polyisocyanate-curable cationic electrodeposition coating composition. The resin used in the coating composition is a blocked polyisocyanate formed by bonding an average of 0.1 or more groups represented by the general formula (2). It is a resin for a cationic electrodeposition coating composition containing an isocyanate group and a cationic group. The coating resin is, for example, half-blocked with a base resin containing an active hydrogen group (primary or secondary amino group or hydroxyl group (in the epoxy resin)) obtained by reacting an epoxy resin with a polyamine compound. It is obtained by reacting with a polyisocyanate compound. The resin comprises a blocked polyisocyanate component and a cationic group (amino group,
Crosslinked cationic base resin containing a quaternary amino group). It is preferable that the resin has an average of 0.1 or more, preferably 0.2 to 1.2 groups represented by the general formula (2) in the resin. If the number is less than 0.1, the crosslink density decreases and the corrosion resistance deteriorates.

【0024】塗料組成物Bの中和・水性化は、通常、該
樹脂を脂肪族カルボン酸、特に酢酸及び/又はギ酸など
の水溶性有機酸で中和して水溶化・水分散化することに
よって行われる。中和剤として酢酸及び/又はギ酸を用
いると、仕上がり性、つきまわり性、低温硬化性などに
優れるので好ましい。
In general, the coating composition B is neutralized and made water-soluble by neutralizing the resin with an aliphatic carboxylic acid, in particular, a water-soluble organic acid such as acetic acid and / or formic acid. Done by It is preferable to use acetic acid and / or formic acid as the neutralizing agent because they are excellent in finishing properties, throwing power, low-temperature curability, and the like.

【0025】このハーフブロック化されたポリイソシア
ネート化合物を基体樹脂に付加した樹脂の製造方法とし
ては、例えば、上記塗料組成物Aに記載のアミン付加エ
ポキシ樹脂と部分ブロック化 架橋剤の遊離イソシアネ
ート基が実質的になくなる(赤外吸収スペクトルに分析
で確認することが出来る)まで反応させることによって
得られる。該部分ブロック化架橋剤はMDIを、必要に
応じてMDI及びアミド化合物と実質的に反応しない不
活性有機溶剤(例えばエステル系溶剤、ケトン系溶剤、
芳香族系溶剤、エーテル系溶剤等)で希釈し、次いで、
例えば約20〜150℃、好ましくは30〜100℃で
約10分間〜24時間、好ましくは約20分間〜15時
間反応させることにより得られる。MDIとアミド化合
物を含むブロック剤との配合割合はMDI1モルに対し
て約1.0〜1.98モル、好ましくは約1.05〜
1.95モルの範囲である。
As a method for producing a resin in which the half-blocked polyisocyanate compound is added to the base resin, for example, the amine-added epoxy resin described in the coating composition A and the free isocyanate group of the partially blocked crosslinking agent are used. It is obtained by reacting until it is substantially eliminated (it can be confirmed by analysis in an infrared absorption spectrum). The partially blocked cross-linking agent converts the MDI into an inert organic solvent (eg, an ester solvent, a ketone solvent, or the like) that does not substantially react with the MDI and the amide compound as required.
Aromatic solvents, ether solvents, etc.)
For example, it can be obtained by reacting at about 20 to 150 ° C, preferably 30 to 100 ° C, for about 10 minutes to 24 hours, preferably for about 20 minutes to 15 hours. The mixing ratio of MDI and a blocking agent containing an amide compound is about 1.0 to 1.98 moles, preferably about 1.05 to 1.98 moles per mole of MDI.
It is in the range of 1.95 mol.

【0026】このハーフブロック化されたポリイソシア
ネート化合物を基体樹脂に付加した、樹脂の模式図を以
下に示す。
A schematic diagram of a resin obtained by adding the half-blocked polyisocyanate compound to a base resin is shown below.

【0027】[0027]

【化4】 Embedded image

【0028】(式中、A、R1及びR2は前記と同様の意
味を示す。)本発明の電着塗料組成物は、さらに錫化合
物を含有することができる。該錫化合物としては、例え
ば、ジブチル錫オキサイド、ジオクチル錫オキサイドな
どの有機錫酸化物;ジブチル錫ジラウレート、ジオクチ
ル錫ジラウレート、ジブチル錫ジアセテート、ジオクチ
ル錫ベンゾエートオキシ、ジブチル錫ベンゾエートオキ
シ、ジオクチル錫ジベンゾエート、ジブチル錫ジベンゾ
エートなどのジアルキル錫の脂肪酸または芳香族カルボ
ン酸塩等を挙げることができ、このうち低温硬化性の点
からジアルキル錫芳香族カルボン酸塩などが好適であ
る。
(In the formula, A, R 1 and R 2 have the same meanings as described above.) The electrodeposition coating composition of the present invention may further contain a tin compound. Examples of the tin compound include organic tin oxides such as dibutyltin oxide and dioctyltin oxide; dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin diacetate, dioctyltin benzoateoxy, dibutyltin benzoateoxy, dioctyltin dibenzoate, Examples thereof include fatty acids or aromatic carboxylate salts of dialkyltin such as dibutyltin dibenzoate. Of these, dialkyltin aromatic carboxylate salts are preferred from the viewpoint of low-temperature curability.

【0029】電着塗料組成物中での錫化合物の含有量
は、厳密に規定されるものではなく、電着塗料に要求さ
れる性能等に応じて広範囲にわたって変えることができ
るが、通常、電着塗料中の樹脂固形分100重量部あた
りの錫含有量が0〜8重量部、好ましくは0.05〜5
重量部の範囲内となるようにするのが好適である。
The content of the tin compound in the electrodeposition coating composition is not strictly defined, and can be varied over a wide range according to the performance required for the electrodeposition coating. The tin content per 100 parts by weight of the resin solid content in the coating material is 0 to 8 parts by weight, preferably 0.05 to 5 parts by weight.
It is preferred to be within the range of parts by weight.

【0030】本発明の電着塗料組成物には、さらに必要
に応じて、着色顔料、体質顔料、有機溶剤、顔料分散
剤、塗面調整剤などの塗料添加物を配合することができ
る。
The electrodeposition coating composition of the present invention may further contain, if necessary, coating additives such as a coloring pigment, an extender pigment, an organic solvent, a pigment dispersant, and a coating surface modifier.

【0031】本発明の電着塗料組成物は、電着塗装によ
って所望の基材表面に塗装することができる。電着塗装
は、一般には、固形分濃度が約5〜40重量%となるよ
うに脱イオン水などで希釈し、さらにpHを5.5〜
9.0の範囲内に調整した本発明の電着塗料組成物から
なる電着浴を、通常、浴温15〜35℃に調整し、負荷
電圧100〜400Vの条件で行うことができる。
The electrodeposition coating composition of the present invention can be applied to a desired substrate surface by electrodeposition coating. The electrodeposition coating is generally diluted with deionized water or the like so that the solid content concentration is about 5 to 40% by weight, and the pH is further adjusted to 5.5 to 5.5% by weight.
The electrodeposition bath comprising the electrodeposition coating composition of the present invention adjusted to the range of 9.0 can be usually adjusted to a bath temperature of 15 to 35 ° C. and a load voltage of 100 to 400 V.

【0032】本発明の電着塗料組成物を用いて形成しう
る電着塗膜の膜厚は、特に制限されるものではないが、
一般的には、乾燥塗膜に基づいて10〜40μm、好ま
しくは15〜30μmの範囲がよい。また、塗膜の焼き
付け硬化温度は、一般に100〜200℃、好ましくは
120〜160℃の範囲が適している。
The thickness of the electrodeposition coating film that can be formed using the electrodeposition coating composition of the present invention is not particularly limited,
Generally, the range is 10 to 40 μm, preferably 15 to 30 μm based on the dry coating film. The baking and curing temperature of the coating film is generally in the range of 100 to 200C, preferably in the range of 120 to 160C.

【0033】[0033]

【発明の効果】 本発明によれば、電着塗料組成物中の
架橋剤として用いるブロックポリイソシアネートにおい
て、ブロック化剤として低分子アミド化合物を用いるこ
とにより低加熱減量、低温硬化性に優れた電着塗膜が得
られる。
According to the present invention, in a blocked polyisocyanate used as a cross-linking agent in an electrodeposition coating composition, a low-molecular weight amide compound is used as a blocking agent to achieve low heat loss and excellent low-temperature curability. A coating film is obtained.

【0034】[0034]

【実施例】 以下、実施例を挙げて本発明をさらに詳細
に説明する。本発明はこれによって限定されるものでは
ない。尚、「%」は「重量%」を示す。
EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. The present invention is not limited by this. Note that “%” indicates “% by weight”.

【0035】製造例1 エピコート828EL(油化シェル社製、商品名、エポ
キシ樹脂)1010g、ビスフェノールA390g、ジ
メチルベンジルアミノ0.2gを加え、130℃でエポ
キシ当量800になるまで反応させた。次にε−カプロ
ラクトン260g、テトラブトキシチタン0.03gを
加え、170℃に昇温し、この温度を保ちながら経時で
サンプリングを行い、赤外吸収スペクトル測定において
未反応のε−カプロラクトン量を追跡し、反応率が98
%以上になった時点で120℃に温度を下げた。次にジ
エタノールアミン160g、ジエチレントリアミンのメ
チルイソブチルジケチミン化物65gを加え、120℃
で4時間反応させ、ブチルセルソルブ420gを加え、
アミン価58、樹脂固形分80%の樹脂NO.1(可塑
変性エポキシ樹脂)を得た。
Production Example 1 1010 g of Epicoat 828EL (trade name, epoxy resin, manufactured by Yuka Shell Co., Ltd.), 390 g of bisphenol A, and 0.2 g of dimethylbenzylamino were added and reacted at 130 ° C. until the epoxy equivalent reached 800. Next, 260 g of ε-caprolactone and 0.03 g of tetrabutoxytitanium were added, the temperature was raised to 170 ° C., sampling was performed over time while maintaining this temperature, and the amount of unreacted ε-caprolactone was traced in the infrared absorption spectrum measurement. , The reaction rate is 98
%, The temperature was lowered to 120 ° C. Next, 160 g of diethanolamine and 65 g of methyl isobutyl diketimine of diethylenetriamine were added,
For 4 hours, and add 420 g of butyl cellosolve,
Resin NO. Having an amine value of 58 and a resin solid content of 80%. 1 (plastic modified epoxy resin) was obtained.

【0036】製造例2 MDI 250g、メチルイソブチルケトン40gを加え
70℃に昇温した。メチルアセトアミド110gをゆっ
くり加えた後90℃に昇温した。この温度を5時間保つ
ことにより、固形分90%の部分ブロック化架橋剤A
(MDI架橋剤(部分ブロックイソシアネート化合物))
を得た。
Production Example 2 250 g of MDI and 40 g of methyl isobutyl ketone were added, and the temperature was raised to 70.degree. After slowly adding 110 g of methylacetamide, the temperature was raised to 90 ° C. By maintaining this temperature for 5 hours, the partially blocked crosslinking agent A having a solid content of 90% is obtained.
(MDI crosslinking agent (partially blocked isocyanate compound))
I got

【0037】製造例3 エピコート828EL(油化シェル社製、商品名、エポ
キシ樹脂)1010g、ビスフェノールA 390g、ジ
メチルベンジルアミン0.2gを加え、130℃でエポ
キシ当量800になるまで反応させた。次にε−カプロ
ラクトン 260g、テトラブトキシチタン0.03g
を加え170℃に昇温し、この温度を保ちながら経時で
サンプリングし、赤外吸収スペクトル測定にて未反応の
ε−カプロラクトン量を追跡し、反応率が98%以上に
なった時点で100℃に温度を下げた。次に製造例2で
作成した、部分ブロック化架橋剤Aを399g加え、1
00℃を保ちながら経時でサンプリングし、赤外吸収ス
ペクトル測定にて未反応のイソシアネートの吸収がなく
なったことを確認するまで反応させた。次にジエタノー
ルアミン160g、ジエチレントリアミンのケチミン化
物65gを加え、120℃で4時間反応させ、ブチルセ
ロソルブ447gを加え、アミン価48、樹脂固形分8
0%の樹脂NO.2(硬化剤付加型可塑変性エポキシ樹
脂)を得た。
Production Example 3 1010 g of Epicoat 828EL (trade name, epoxy resin, manufactured by Yuka Shell Co., Ltd.), 390 g of bisphenol A, and 0.2 g of dimethylbenzylamine were added and reacted at 130 ° C. until the epoxy equivalent reached 800. Next, 260 g of ε-caprolactone and 0.03 g of tetrabutoxytitanium
Was added, and the temperature was raised to 170 ° C. Sampling was conducted over time while maintaining this temperature, and the amount of unreacted ε-caprolactone was traced by measuring the infrared absorption spectrum. The temperature was lowered. Next, 399 g of the partially blocked crosslinking agent A prepared in Production Example 2 was added, and 1
Sampling was performed over time while maintaining the temperature at 00 ° C., and the reaction was performed until infrared absorption spectrometry confirmed that the absorption of unreacted isocyanate had disappeared. Next, 160 g of diethanolamine and 65 g of a ketimine compound of diethylenetriamine were added and reacted at 120 ° C. for 4 hours, 447 g of butyl cellosolve was added, and an amine value of 48 and a resin solid content of 8 were added.
0% resin NO. 2 (hardening agent-added plastically modified epoxy resin) was obtained.

【0038】製造例4 M−200(三井化学社製、商品名、クルードMDI) 2
70g、メチルイソブチルケトン 46gを加え、70
℃に昇温した。メチルアセトアミド146g、をゆっく
り加えた後、90℃に昇温した。この温度を保ちなが
ら、経時でサンプリングし、赤外吸収スペクトル測定に
て未反応のイソシアネートの吸収がなくなったことを確
認することにより、固形分90%の架橋剤B(クルード
MDI架橋剤)を得た。
Production Example 4 M-200 (trade name, Crude MDI, manufactured by Mitsui Chemicals, Inc.) 2
70 g and 46 g of methyl isobutyl ketone were added.
The temperature was raised to ° C. After slowly adding 146 g of methylacetamide, the temperature was raised to 90 ° C. Sampling was performed over time while maintaining this temperature, and by confirming that the absorption of unreacted isocyanate had disappeared by infrared absorption spectrum measurement, the crosslinking agent B (crude) having a solid content of 90% was obtained.
MDI crosslinking agent).

【0039】製造例5 M−200(三井化学社製、商品名、クルードMDI) 2
70g、メチルイソブチルケトン45gを加え70℃に
昇温した。メチルアセトアミド73g次いでメチルフォ
ルムアミド59gをゆっくり加えた後、90℃に昇温し
た。この温度を保ちながら、経時でサンプリングし、赤
外吸収スペクトル測定にて未反応のイソシアネートの吸
収がなくなったことを確認することにより、固形分90
%の架橋剤C(クルードMDI架橋剤)を得た。
Production Example 5 M-200 (trade name, Crude MDI, manufactured by Mitsui Chemicals, Inc.) 2
70 g and 45 g of methyl isobutyl ketone were added, and the temperature was raised to 70 ° C. After slowly adding 73 g of methylacetamide and then 59 g of methylformamide, the temperature was raised to 90 ° C. While maintaining this temperature, sampling was conducted over time, and by confirming that the absorption of unreacted isocyanate had disappeared by infrared absorption spectrum measurement, the solid content was 90%.
% Crosslinker C (crude MDI crosslinker) was obtained.

【0040】製造例6 MDI250g、メチルイソブチルケトン44gを加え
70℃に昇温した。メチルアセトアミド146gをゆっ
くり加えた後、90℃に昇温した。この温度を保ちなが
ら、経時でサンプリングし赤外吸収スペクトル測定にて
未反応のイソシアネートの吸収がなくなったことを確認
することにより、固形分90%の架橋剤D( MDI
[ジフェニルメタン−4,4'−ジイソシアネート]架
橋剤)を得た。
Production Example 6 250 g of MDI and 44 g of methyl isobutyl ketone were added, and the temperature was raised to 70.degree. After slowly adding 146 g of methylacetamide, the temperature was raised to 90 ° C. While maintaining this temperature, sampling was conducted over time, and infrared absorption spectrum measurement confirmed that the absorption of unreacted isocyanate had disappeared.
[Diphenylmethane-4,4'-diisocyanate] crosslinking agent) was obtained.

【0041】製造例7 M−200(三井化学社製、商品名、クルードMDI)
270g、メチルイソブチルケトン 92gを加え70
℃に昇温した。オレイン酸アミド562gをゆっくり加
えた後90℃に昇温した。この温度を保ちながら、経時
でサンプリングし赤外吸収スペクトル測定にて未反応の
イソシアネートの吸収がなくなったことを確認すること
により、固形分90%の架橋剤E(クルードMDI架橋
剤)を得た。
Production Example 7 M-200 (trade name, Crude MDI, manufactured by Mitsui Chemicals, Inc.)
270 g and 92 g of methyl isobutyl ketone
The temperature was raised to ° C. After slowly adding 562 g of oleic acid amide, the temperature was raised to 90 ° C. While maintaining this temperature, sampling was performed over time, and infrared absorption spectrum measurement confirmed that the absorption of unreacted isocyanate had disappeared, thereby obtaining a crosslinking agent E (crude MDI crosslinking agent) having a solid content of 90%. .

【0042】製造例8 M−200(三井化学社製、商品名、クルードMDI)
270g、メチルイソブチルケトン 40gを加え70
℃に昇温した。エタノール92gをゆっくり加えた後9
0℃に昇温した。この温度を保ちながら経時でサンプリ
ングし、赤外スペクトル測定にて未反応のイソシアネー
トの吸収がなくなったことにより、固形分90%の架橋
剤F(クルードMDI架橋剤)を得た。
Production Example 8 M-200 (trade name, Crude MDI, manufactured by Mitsui Chemicals, Inc.)
270 g and methyl isobutyl ketone 40 g
The temperature was raised to ° C. After slowly adding 92 g of ethanol, 9
The temperature was raised to 0 ° C. Sampling was performed over time while maintaining this temperature, and the absorption of unreacted isocyanate disappeared by infrared spectrum measurement, whereby a crosslinking agent F (crude MDI crosslinking agent) having a solid content of 90% was obtained.

【0043】クリアーエマルションの製造 上記、製造例1で得られた樹脂NO.1 87.5g
(樹脂固形分で70g)、及び製造例2で得られた架橋
剤A(クルードMDIのメチルアセトアミドブロック化
物)33.3g(樹脂固形分で30g)、LSN−105
(三共有機合成社製、商品名、ジブチル錫ジベンゾエー
ト、固形分40%) 2.5g、10%酢酸15gを配
合し、均一に攪拌した後、脱イオン水156gを強く攪
拌しながら約15分かけて滴下し、固形分34.0%の
カチオン電着用クリアーエマルションaを得た。同様に
表1に示すような組み合わせで、エマルションb、c、
d、e、fを得た。
Production of Clear Emulsion The resin NO. 187.5 g
(70 g resin solids), 33.3 g (30 g resin solids) of cross-linking agent A (crude MDI methylacetamide blocked product) obtained in Production Example 2, LSN-105
(Trade name, dibutyltin dibenzoate, solid content 40%, manufactured by Sankyoki Gosei Co., Ltd.) 2.5 g, 15 g of 10% acetic acid were blended, and the mixture was stirred uniformly. The resulting mixture was dropped over a period of minutes to obtain a clear emulsion a having a solids content of 34.0% for cationic electrodeposition. Similarly, in the combinations shown in Table 1, the emulsions b, c,
d, e, and f were obtained.

【0044】[0044]

【表1】 [Table 1]

【0045】顔料分散ペーストの製造 60%第4級塩化エポキシ樹脂5.83g、チタン白
14.5g、カーボンブラック0.4g、体質顔料
7.0g、ケイ酸鉛 2.0g、脱イオン水22.4g
を加え、固形分55.0%の顔料分散ペーストを得た。
Preparation of Pigment Dispersion Paste 5.83 g of 60% quaternary chlorinated epoxy resin, titanium white
14.5 g, carbon black 0.4 g, extender pigment
7.0 g, lead silicate 2.0 g, deionized water 22.4 g
Was added to obtain a pigment-dispersed paste having a solid content of 55.0%.

【0046】実施例及び比較例 実施例1 カチオン電着用エマルションa 297gに、
顔料分散ペーストを49.8g、及び脱イオン水29
5.2gを加え固形分20%のカチオン電着塗料を得
た。
Examples and Comparative Examples Example 1 A cationic electrodeposition emulsion a was added to 297 g.
49.8 g of pigment dispersion paste and 29 deionized water
5.2 g was added to obtain a cationic electrodeposition paint having a solid content of 20%.

【0047】実施例2〜5及び比較例1、2 カチオン
電着用エマルションb、c、d、及びe、f、それぞれ
に顔料分散ペースト、及び脱イオン水を、実施例1と同
様の配合量を加え固形分20%のカチオン電着塗料を得
た。
Examples 2 to 5 and Comparative Examples 1 and 2 Each of the cationic electrodeposition emulsions b, c, d, e, and f, a pigment-dispersed paste and deionized water, were mixed in the same amounts as in Example 1. In addition, a cationic electrodeposition paint having a solid content of 20% was obtained.

【0048】塗装試験 上記、実施例及び比較例で得た各カチオン電着塗料中
に、パルボンド#3020(日本パーカラジジング社
製、商品名、リン酸亜鉛処理剤)で化成処理した。0.
8×150×70mmの冷延ダル鋼板を浸漬し、これを
カソードとして電着塗装を行った。焼き付けは雰囲気温
度を2段階とし、焼き付け時間を20分間として電気熱
風乾燥機を用いて行った。得られた塗装板の性能試験結
果を表2に示す。性能試験は下記の方法に従って実施し
た。
Coating Test Each of the cationic electrodeposition paints obtained in the above Examples and Comparative Examples was subjected to a chemical conversion treatment with Palbond # 3020 (trade name, manufactured by Nippon Parkerazing Co., Ltd., zinc phosphate treating agent). 0.
An 8 × 150 × 70 mm cold-rolled dull steel plate was immersed and electrodeposited using this as a cathode. The baking was performed using an electric hot-air drier with an atmosphere temperature of two stages and a baking time of 20 minutes. Table 2 shows the performance test results of the obtained coated plates. The performance test was performed according to the following method.

【0049】[0049]

【表2】 [Table 2]

【0050】(*1)加熱減量 電着後、105℃−3時間プレヒートを行った。そのの
ち焼き付け乾燥を行い減量の割合を示す。以下の計算式
によって計算を行った。 被塗物の重量 プレヒート後の塗板重量 焼き付け乾燥後の塗板重量 (( − )/( − )) × 100 重量
% (*2)低温硬化性 各焼き付け温度で得られた電着
塗板の塗面をアセトンをしみこませた4枚重ねのガーゼ
で圧力3.92mPa(約4kgf/cm2)で約3〜
4cmの長さを20往復こすった時の塗面外観を目視で
以下の条件で評価した。○は、塗面に傷が認められな
い、△は、塗面に傷が認められるが素地は見えない。×
は、塗膜が溶解し素地がみえる。
(* 1) Heating loss After electrodeposition, preheating was performed at 105 ° C. for 3 hours. Thereafter, baking and drying are performed, and the ratio of weight loss is shown. The calculation was performed by the following formula. Weight of object to be coated Weight of coated plate after preheating Weight of coated plate after baking and drying ((-) / (-)) x 100 weight
% (* 2) Low-temperature curing property The coated surface of the electrodeposition coated plate obtained at each baking temperature is applied with a gauze of four layers soaked with acetone at a pressure of 3.92 mPa (about 4 kgf / cm 2 ) for about 3 to 3 times.
The appearance of the coated surface after rubbing the length of 4 cm for 20 reciprocations was visually evaluated under the following conditions. ○ indicates no scratch on the painted surface, and △ indicates a scratch on the painted surface but the substrate is not visible. ×
For, the coating film dissolves and the substrate is visible.

【0051】(*3)防食性 各焼き付け温度で得ら
れた塗板に、素地に達するように電着塗膜にナイフでク
ロスカット傷を入れ、これをJIS Z−2371に準じて
840時間耐塩水噴霧試験を行い、ナイフ傷からの傷、
フクレ幅によって以下の基準で評価した。 ○は、錆、
フクレの最大幅がカット部より2mm未満(片側)。△
は、錆、フクレの最大幅がカット部より2mm以上、3
mm未満(片側)でかつ平面部にブリスターがかなり目
立つ。×は、錆、フクレの最大幅がカット部より3mm
以上でかつ塗面全面にブリスターの発生がみられる。
(* 3) Corrosion resistance The coated plate obtained at each baking temperature was cross-cut with a knife to the electrodeposited coating so as to reach the substrate, and this was subjected to salt water resistance for 840 hours in accordance with JIS Z-2371. Spray test, scratch from knife wound,
The blister width was evaluated according to the following criteria. ○ indicates rust,
The maximum width of the blister is less than 2 mm from the cut (one side). △
Means that the maximum width of rust and blisters is at least 2 mm
mm (one side) and blisters are considerably conspicuous on the flat surface. × indicates that the maximum width of rust and blisters is 3 mm from the cut part
As described above, blisters are observed on the entire coated surface.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 ブロックポリイソシアネート硬化型カチ
オン電着塗料において、架橋剤として1分子中に少なく
とも1個のイソシアネート基が一般式(1) R1−CO−NH−R2 (1) (式中、R1は水素原子、メチル基、エチル基又はプロピ
ル基を示し、R2はメチル基又はエチル基を示す。)で表
わされるアミド化合物でブロック化されてなる一般式
(2) 【化1】 (式中、Aはイソシアネート化合物残基を示し、R1及びR
2は上記と同様の意味を示す。)で表される基を含有す
るブロック化ポリイソシアネートを架橋剤として含むこ
とを特徴とするカチオン電着塗料組成物。
In a blocked polyisocyanate-curable cationic electrodeposition coating composition, at least one isocyanate group per molecule as a crosslinking agent has the general formula (1) R 1 —CO—NH—R 2 (1) , R 1 represents a hydrogen atom, a methyl group, an ethyl group or a propyl group, and R 2 represents a methyl group or an ethyl group.) The amide compound represented by the general formula (2) (Wherein A represents an isocyanate compound residue, and R 1 and R
2 has the same meaning as above. A cationic electrodeposition coating composition comprising a blocked polyisocyanate containing a group represented by the formula (I) as a crosslinking agent.
【請求項2】 ブロックポリイソシアネート硬化型カチ
オン電着塗料において、該塗料で使用される樹脂が、一
般式(2)で表わされる基が平均0.1個以上結合して
なるブロック化されたイソシアネート基を含有するカチ
オン性電着塗料用樹脂であることを特徴とするカチオン
電着塗料組成物。
2. A blocked polyisocyanate-curable cationic electrodeposition paint, wherein the resin used in the paint is a blocked isocyanate comprising an average of 0.1 or more groups represented by the general formula (2) bonded to the resin. A cationic electrodeposition coating composition characterized by being a cationic electrodeposition coating resin containing a group.
【請求項3】 請求項1乃至請求項2におけるポリイソ
シアネート化合物が、芳香族ポリイソシアネートである
ところのカチオン電着塗料組成物。
3. The cationic electrodeposition coating composition according to claim 1, wherein the polyisocyanate compound according to claim 1 is an aromatic polyisocyanate.
【請求項4】 アミド化合物が、n−メチルアセトアミ
ド、n−エチルアセトアミド、n−メチルプロピルアミ
ド、n−メチルフォルムアミドから選ばれる少なくとも
1種の化合物であることを特徴とする請求項1に記載の
カチオン電着塗料組成物。
4. The amide compound according to claim 1, wherein the amide compound is at least one compound selected from n-methylacetamide, n-ethylacetamide, n-methylpropylamide, and n-methylformamide. Cationic electrodeposition coating composition.
【請求項5】上記カチオン電着塗料組成物において、電
着塗料中の樹脂固形分100重量部に対して無機ビスマ
ス化合物、及び/又は有機酸ビスマス塩をビスマス含有
量で0.01〜10重量部となるように配合することを
特徴とする請求項1乃至請求項4のいずれか1項に記載
のカチオン電着塗料組成物。
5. The cationic electrodeposition coating composition, wherein the bismuth content of the inorganic bismuth compound and / or the organic acid bismuth salt is 0.01 to 10 parts by weight based on 100 parts by weight of the resin solid content in the electrodeposition coating composition. The cationic electrodeposition coating composition according to any one of claims 1 to 4, wherein the cationic electrodeposition coating composition is blended so as to be a part.
JP33350399A 1999-11-24 1999-11-24 Cationic electrodeposition coating composition Pending JP2001152088A (en)

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CA002326539A CA2326539A1 (en) 1999-11-24 2000-11-23 Cationically electrodepositable coating composition

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JP2008208339A (en) * 2007-01-29 2008-09-11 Kansai Paint Co Ltd Cationic electrodeposition coating composition and coated article coated with electrodeposition coating material

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US7666971B2 (en) * 2006-11-14 2010-02-23 Bayer Materialscience Llc Amide/urea-modified liquid diphenylmethane diisocyanates
DE102008022464A1 (en) * 2008-05-07 2009-11-12 Basf Coatings Ag Cathodic electrodeposition paint containing vinylpyrrolidone copolymer
JP6441126B2 (en) 2015-03-06 2018-12-19 日本ペイント・オートモーティブコーティングス株式会社 Method for preparing cationic electrodeposition coating composition
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JP2008208339A (en) * 2007-01-29 2008-09-11 Kansai Paint Co Ltd Cationic electrodeposition coating composition and coated article coated with electrodeposition coating material

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